FAN5019MTCX_NL [FAIRCHILD]
Switching Controller, Voltage-mode, 4000kHz Switching Freq-Max, PDSO28, LEAD FREE, TSSOP-28;
| 型号： | FAN5019MTCX_NL |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Switching Controller, Voltage-mode, 4000kHz Switching Freq-Max, PDSO28, LEAD FREE, TSSOP-28 控制器 |
| 文件： | 总30页 (文件大小：779K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
www.fairchildsemi.com
FAN5 0 1 9
6 -Bit VID Co n t ro lle r 2 -4 P h a s e VRM1 0 .X Co n t ro lle r
Features
General Description
• Pin and Function Backward Compatible with FAN53168
and FAN53180 Controllers
The FAN5019 is a multi-phase DC-DC controller for imple-
menting high-current, low-voltage, CPU core power regula-
tion circuits. It is part of a chipset that includes external
MOSFET drivers and power MOSFETS. The FAN5019
drives up to four synchronous-rectified buck channels in par-
allel. The multi-phase buck converter architecture uses inter-
leaved switching to multiply ripple frequency by the number
of phases and reduce input and output ripple currents. Lower
ripple results in fewer components, lower component cost,
reduced power dissipation, and smaller board area.
• Precision Multi-Phase DC-DC Core Voltage Regulation
– ±10mV Output Voltage Accuracy Over Temperature
• Differential Remote Voltage Sensing
• Selectable 2, 3, or 4 Phase Operation
• Selectable VRM9 or VRM10 Operation
• Up to 1MHz per Phase Operation (4MHz ripple
Frequency)
• Lossless Inductor Current Sensing for Loadline
Compensation
– External Temperature Compensation
• Accurate Load-Line Programming (Meets Intel®
VRM/VRD10.0 and 10.X CPU Specifications)
• Accurate Channel-Current Balancing for Thermal
Optimization and Layout Compensation
• Convenient 12V Supply Biasing
The FAN5019 features a high bandwidth control loop to
provide optimal response to load transients. The FAN5019
senses current using lossless techniques: Phase current is
measured through each of the output inductors. This current
information is summed, averaged and used to set the loadline
of the output via programmable "droop". The droop is tem-
perature compensated to achieve precise loadline character-
istics over the entire operating range. Additionally,
• 6-bit Voltage Identification (VID) Input
– .8375V to 1.600V in 12.5mV Steps
– Dynamic VID Capability with Fault-Blanking for
glitch-less Output voltage Changes
• Adjustable Over Current Protection with Programmable
Latch-Off Delay. Latch-Off Function may be Disabled
• Over-Voltage Protection – Internal OVP Crowbar
Protection
individual phase current is measured using the RDS(ON) of
the low-side MOSFETs. This information is used to dynam-
ically balance/steer per-phase current. The phase currents
are also summed and averaged for over-current detection.
Dynamic-VID technology allows on-the-fly VID changes
with controlled, glitch-less output. Additionally, short-circuit
protection, adjustable current limiting, over-voltage protec-
tion and power-good circuitry combine to ensure reliable and
safe operation. The operating temperature range is 0°C to
+85°C and the operating voltage is a single +12V supply,
which simplifies the design. The FAN5019 is available in a
TSSOP-28 package.
Applications
• Computer DC/DC Converter VRM/VRD10.0
• Computer DC/DC Converter VRM/VRD10.X
• Computer DC/DC Converter VRM/VRD9.X
• High Current, Low Voltage DC/DC Rail
Block Diagram
VIN
Φ1
FAN5009
Φ2
VOUT
FAN5019
VIN
Φ3
Φ4
FAN5009
REV. 1.0.7 1/5/04
FAN5019
PRODUCT SPECIFICATION
Pin Assignments
VCC
27 PWM1
1
2
28
VID4
VID3
VID2
VID1
3
26
25
24
PWM2
PWM3
PWM4
4
5
VID0
VID5/SEL
6
23 SW1
22
21 SW3
7
FBRTN
FB
SW2
FAN5019
TSSOP-28
8
COMP
SW4
9
20
19
18
17
16
15
PWRGD
EN
GND
10
11
12
13
14
CSCOMP
DELAY
RT
CSSUM
CSREF
ILIMIT
RAMPADJ
Pin Definitions
Pin Number Pin Name Pin Function Description
1–5
VID [4:0]
VID inputs. Determines the output voltage via the internal DAC. These inputs
comply to VRM10/VRD10 specifications for static and dynamic operation. All have
internal pull-ups (1.25V for VRM10 and 2.5V for VRM9) so leaving them open
results in logic high. Leaving VID[4:0] open results in a "No CPU" condition
disabling the PWM outputs.
6
VID5/SEL
VID5 Input/DAC Select. Dual function pin that is either the 12.5mV DAC LSB for
VRM10 or selects the VRM9 DAC codes when forced higher than Vtblsel(VRM9)
voltage. The truth table is as follows:
VVID5/SEL held > Vtblsel(VRM9); VRM9 DAC table is selected (See Table 3)
VViD5/SEL < Vtblsel(VRM10); VRM10 DAC table is selected (See Table 2) and
V
ViD5/SEL pin is used as VID5 input.
7
8
FBRTN
FB
Feedback Return. Error Amp and DAC reference point.
Feedback Input. Inverting input for Error Amp this pin is used for external
compensation. This pin can also be used to introduce DC offset voltage to the
output.
9
COMP
Error Amp output. This pin is used for external compensation.
10
PWRGD
Power Good output. This is an open-drain output that asserts when the output
voltage is within the specified tolerance. It is expected to be pulled up to an external
voltage rail.
11
12
EN
Enable. Logic signal that enables the controller when logic high.
DELAY
Soft-start and Current Limit Delay. An external resistor and capacitor sets the
softstart ramp rate and the over-current latch off delay.
13
14
15
RT
Switching Frequency Adjust. This pin adjusts the output PWM switching
frequency via an external resistor.
RAMPADJ PWM Current Ramp Adjust. An external resistor to Vcc will adjust the amplitude of
the internal PWM ramp.
ILIMIT
Current Limit Adjust. An external resistor sets the current limit threshold for the
regulator circuit. This pin is internally pulled low when EN is low or the UVLO circuit
is active. It is also used to enable the drivers.
2
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Pin Definitions (continued)
Pin Number Pin Name Pin Function Description
16
CSREF
Current Sense Reference. Non-Inverting input of the current sense amp. Sense
point for the output voltage used for OVP and PWRGD.
17
18
CSSUM
Current Sense Summing node. Inverting input of the current sense amp.
CSCOMP
Current Sense Compensation node. Output of the current sense amplifier. This
pin is used, in conjunction with CSSUM to set the output droop compensation and
current loop response.
19
GND
Ground. Signal ground for the device.
20–23
SW[4:1]
Phase Current Sense/Balance inputs. Phase-to-phase current sense and
balancing inputs. Unused phases should be left open.
24–27
28
PWM[4:1]
VCC
PWM outputs. CMOS outputs for driving external gate drivers such as the
FAN53418 or FAN5009. Unused phases should be grounded.
Chip Power. Bias supply for the chip. Connect directly to a +12V supply. Bypass
with a 1µF MLCC capacitor.
REV. 1.0.7 1/5/04
3
FAN5019
PRODUCT SPECIFICATION
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life
impaired. Functional operation under these conditions is not implied.
Parameter
Min.
-0.3
-0.3
-5
Max.
+15
Units
Supply Voltage: VCC to GND
Voltage on FBRTN pin
V
V
V
V
V
V
+0.3
Voltage on SW1-SW4 (<250ns duration)
Voltage on SW1-SW4 (>=250ns duration)
Voltage on RAMPADJ, CSSUM
Voltage on any other pin
+25
-0.3
-0.3
-0.3
+15
VCC+0.3
+5.5
Thermal Information
Parameter
Min.
Typ
Max.
Units
Operating Junction Temperature (TJ)
Storage Temperature
0
+150
+150
+300
+215
+220
2
°C
°C
–65
Lead Soldering Temperature, 10 seconds
Vapor Phase, 60 seconds
Infrared, 15 seconds
°C
°C
°C
Power Dissipation (PD) @ TA = 25°C
Thermal Resistance (ΘJA)*
W
50
°C/W
Recommended Operating Conditions (See Figure 8)
Parameter
Conditions
Min.
10.2
0
Typ.
Max.
13.8
+85
Units
V
Supply Voltage VCC
VCC to GND
12
Ambient Operating Temperature
Operating Junction Temperature (TJ)
°C
0
+125
Note:
2
1: Θ is defined as 1 oz. copper PCB with 1 in pad.
JA
4
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Electrical Specifications
(VCC = 12V, TA = 0°C to +85°C and FBRTN=GND, using circuit in Figure 1, unless otherwise noted.)
The • denotes specifications which apply over the full operating temperature range.
Min. Typ. Max. Units
Parameter
Symbol
Conditions
Error Amplifier
Output Voltage Range
Accuracy
V
V
•
0.5
3.5
V
COMP
Relative to DAC Setting,
referenced to FBRTN,
CSSUM = CSCOMP,
Test Circuit 3
VRM10
VRM9
•
•
-10
-12
+10
+12
mV
FB
Line Regulation
Input Bias Current
FBRTN Current
Output Current
Gain Bandwidth Product
DC Gain
∆V
VCC=10V to 14V
0.05
-15
150
500
20
%
µA
FB
I
FB
•
•
-13
-17
I
180
µA
FBRTN
O(ERR)
I
FB forced to V – 3%
OUT
300
µA
GBW
COMP = FB
MHz
dB
C
COMP
= 10pF
77
VID Inputs
Input Low Voltage
V
IL(VID)
VRM10
VRM9
•
•
0.4
0.8
V
V
Input High Voltage
V
I
VRM10
VRM9
•
•
0.8
2.0
V
V
IH(VID)
Input Current, VID Low
Input Current, VID High
Pull-up Resistance
VID(X) = 0V
•
•
•
-30
-2
-20
60
µA
µA
kΩ
IL(VID)
IH(VID)
I
VID(X) = 1.25V
Internal
2
R
35
115
VID
Internal Pull-up Voltage
VRM10
VRM9
•
•
1.0
2.2
1.15 1.26
V
V
2.4
2.6
2
VIDTransition DelayTime
VID Code Change to FB Change
•
•
400
400
ns
ns
“No CPU” Detection
VID Code Change to 11111X to PWM
going low
2
Turn-off Delay Time
VID Table Select
Vtblsel
To select VRM9 table
To select VRM10 table (becomes VID5)
•
•
4
V
V
3.5
Oscillator
Frequency
f
•
•
200
155
4000
245
kHz
OSC
Frequency Variation
f
T = +25°C, R = 250kΩ, 4-Phase
200
400
600
kHz
kHz
kHz
PHASE
A
T
T = +25°C, R = 115kΩ, 4-Phase
A
T
T = +25°C, R = 75kΩ, 4-Phase
A
T
Output Voltage
V
R = 100kΩ to GND
T
•
•
1.9
-50
2.0
2.1
V
RT
RAMPADJ Pin Accuracy
V
V
= Vdac = +2K • (Vin–Vdac)/
RAMPADJ
+50
mV
RAMPADJ
(Rr+2k)
RAMPADJ Input Current
I
Current into RAMPADJ pin
0
100
µA
RAMPADJ
Current Sense Amplifier
Offset Voltage
V
CSSUM–CSREF, Test Circuit 1
COMP = FB
•
•
-1.5
-50
+1.5
+50
mV
nA
OS(CSA)
Input Bias Current
I
BIAS(CSA)
Gain Bandwidth Product
GBW
10
MHz
Notes:
1. All limits at operating temperature extremes are guaranteed by design, characterization and statistical quality control
2. Guaranteed by design – NOT tested in production.
REV. 1.0.7 1/5/04
5
FAN5019
PRODUCT SPECIFICATION
Electrical Specifications (continued)
(VCC = 12V, TA = 0°C to +85°C and FBRTN=GND, using circuit in Figure 1, unless otherwise noted.)
The • denotes specifications which apply over the full operating temperature range.
Min. Typ. Max. Units
Parameter
Symbol
Conditions
DC Gain
77
dB
V
Input Common Mode
Range
CSSUM and CSREF
•
0
3
Positioning Accuracy
Output Voltage Range
Output Current
∆V
COMP = FB, Test Circuit 2
= ±100µA
•
•
-84
0.1
-80
-76
3.3
mV
V
FB
I
CSCOMP
I
FB forced to V
– 3% Source/Sink
300
375
µA
O(CSA)
OUT
Current Balance Circuit
Input Operating Range
Input Resistance
V
•
•
•
•
-600
20
4
+200
40
mV
kΩ
µA
%
SW(X)CM
R
SW(X) = 0V
SW(X) = 0V
SW(X) = 0V
30
7
SW(X)
Input Current
I
10
SW(X)
Input Current Matching
Current Limit Comparator
∆I
SW(X)
-5
+5
ILIMIT Output Voltage
Normal Mode
In Shutdown
V
V
R
= 250kΩ
= -100µA
ILIMIT(NM)
ILIMIT(SD)
ILIMIT
•
•
2.9
3
3.1
400
V
mV
I
ILIMIT
Output Current, Normal
Mode
I
R = 250kΩ
ILIMIT
12
µA
ILIMIT(NM)
Maximum Output Current
V
= 3V
–V
•
•
60
µA
IILIMIT
Current Limit Threshold
Voltage
V
V
, R
= 250kΩ
105
125
150
1.9
mV
CL
CSREF
CSCOMP ILIMIT
Current Limit Setting Ratio
Latch-off Delay Threshold
Latch-off Delay Time
Soft Start
V
/I
10.4
1.8
mV/µA
V
CL ILIMIT
V
t
In Current Limit
= 250kΩ, C = 4.7nF
DELAY
•
•
1.7
15
DELAY
R
600
µs
DELAY
DELAY
Output Current,
Soft start Mode
I
During Start-up, DELAY < 2.8V
R = 250kΩ, C = 4.7nF,
DELAY
20
25
µA
µs
DELAY(SS)
Soft Start Delay Time
T
400
DELAY(SS)
DELAY
VID = 011111 (1.475V)
Enable Input
Input Low Voltage
V
V
I
•
•
•
•
0.4
V
V
IL(EN)
Input High Voltage
0.8
-1
IH(EN)
Input Current, EN Low
Input Current, EN High
Power Good Comparator
Under voltage Threshold
Over voltage Threshold
Output Low Voltage
EN = 0V
1
µA
µA
IL(EN)
IH(EN)
I
EN = 1.25V
10
25
V
V
V
Relative to DAC Output
Relative to DAC Output
•
•
•
-325 -250 -200
mV
mV
mV
PWRGD(UV)
90
150
225
200
400
PWRGD(OV)
I
= 4mA
PWRGD(SINK)
OL(PWRGD)
Notes:
1. All limits at operating temperature extremes are guaranteed by design, characterization and statistical quality control
2. Guaranteed by design – NOT tested in production.
6
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Electrical Specifications (continued)
(VCC = 12V, TA = 0°C to +85°C and FBRTN=GND, using circuit in Figure 1, unless otherwise noted.)
The • denotes specifications which apply over the full operating temperature range.
Min. Typ. Max. Units
Parameter
Symbol
Conditions
Power Good Delay Time
Initial Start Up
VID Code Changing
VID Code Static
•
1
100
10
ms
µs
ns
250
200
Crowbar Trip Point
V
Relative to Nominal DAC Output
Relative to FBRTN
•
•
90
150
550
200
650
mV
mV
CROWBAR
t
CROWBAR
Crowbar Reset Point
450
Crowbar Delay Time
VID Code Changing
VID Code Static
Over voltage to PWM Going Low
•
100
4
250
400
500
600
µs
ns
PWM Outputs
Output Voltage Low
Output Voltage High
Input Supply
V
I
I
= 400µA
•
•
160
5
500
5.5
mV
V
OL(PWM)
PWM(SINK)
V
= 400µA
OH(PWM)
PWM(SOURCE)
DC Supply Current
UVLO Threshold
UVLO Hysteresis
UVLO Threshold
EN = Logic High
•
•
•
•
5
10
mA
V
V
UVLO
Vcc Rising (Vcc = 12V input)
6.5
0.7
5.6
6.9
7.8
V
Falling
7.0
Notes:
1. All limits at operating temperature extremes are guaranteed by design, characterization and statistical quality control
2. Guaranteed by design – NOT tested in production.
REV. 1.0.7 1/5/04
7
FAN5019
PRODUCT SPECIFICATION
Internal Block Diagram
VCC
28
RT
14
RAMPADJ
13
2K
UVLO
Shutdown
& Bias
11
19
EN
Oscillator
GND
CMP
SET
EN
DAC
+150mV
27
26
RESET
PWM1
PWM2
CMP
CSREF
Phase
Current
Balancing
Circuit
CMP
CMP
RESET
2/3/4 Phase Driver
Logic
CMP
DAC
-250mV
25
24
PWM3
PWM4
RESET
CMP
RESET
CURRENT
LIMIT
CROWBAR
23
22
21
20
17
16
18
SW1
SW2
10
15
PWRGD
ILIMIT
Delay
SW3
SW4
CSSUM
CSREF
CSCOMP
Current
Limit
Circuit
EN
CSA
12
DELAY
COMP
Soft
Start
8
FB
Error
Amp
+
9
-
Sel VRM9 Table
VID
DAC
3.75V
REF
7
1
2
3
4
5
6
FBRTN
VID4 VID3 VID2
VID1 VID0 VID5
8
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Typical Characteristics
4
3.5
3
5.3
5.2
5.1
5.0
4.9
4.8
4.7
T
= 25°C
A
4-Phase Operation
2.5
2
1.5
1
0.5
0
4.6
0
100
200
300
400
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
RESISTOR’S RT VALUE (kΩ)
MASTER CLOCK FREQUENCY (MHz)
TPC 1. Master Clock Frequency
TPC 2. Supply Current vs. Master Clock Frequency
Test Circuits
VCC
28
18
17
16
19
+12V
FAN5019
CSCOMP
VID4
1
2
3
4
5
6
7
8
9
VID4
VID3
VID2
VID1
VID0
VID5
FBRTN
FB
VCC 28
PWM1 27
PWM2 26
PWM3 25
PWM4 24
SW1 23
+12V
39kΩ
CSA
100nF
1µF
100nF
CSSUM
VID3
VID2
VID1
VID0
VID5
1kΩ
CSREF
GND
1V
CSCOMP–1V
40
VOS
=
Test Circuit 1. Current Sense Amplifier V
OS
SW2 22
SW3 21
VCC
+12V
28
8
COMP
SW4 20
1kΩ
FB
10 PWRGD
11 EN
GND 19
10kΩ
COMP
9
CSCOMP 18
20kΩ
100nF
200k
Ω
CSCOMP
CSSUM
18
17
16
19
12 DELAY CSSUM 17
13 RT CSREF 16
14 RAMPADJ ILIMIT 15
200kΩ
100nF
250kΩ
CSA
4.7nF
CSREF
GND
80mV
∆VFB = FB−V
250kΩ
VID
1V
Test Circuit 2. Voltage Positioning
Test Circuit 3. Closed Loop Output Voltage Accuracy
REV. 1.0.7 1/5/04
9
FAN5019
PRODUCT SPECIFICATION
Application Circuit
U4 FAN5019
10
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Bill of Materials
Table 1. FAN5019 VRM/VRD10 Application Bill of Materials for Figure 1
Ref
Qty
1
Description
VRM10, Multi-Phase Controller
Sync MOSFET Driver, 12V/12V
N-MOSFET, 30V, 50A, 8mΩ
N-MOSFET, 30V, 75A, 5mΩ
Inductor, 650nH, 26A, 1.6mΩ
Inductor, 630nH, 15A, 1.7mΩ
10Ω, 5%
Manufacturer/Number
Fairchild FAN5019
U4
U1–3
Q1–3
Q4–9
L1–3
L4
3
Fairchild FAN5009
3
Fairchild FDD6696
6
Fairchild FDD6682
3
Micrometals T50-8B/90, 5T, 16AWG
1
Inter-Technical AK1418160052A-R63M
R1
1
RR RDLY, RT
R5
3
301kΩ, 1%
1
15.0kΩ, 1%
RPH1–3
RA, RCS2
RB1
3
100kΩ, 1%
2
24.9kΩ, 1%
1
10Ω, 1%
RB
1
1.33kΩ, 1%
RSW1–3
RCS1
RLIM
3
0Ω, 5%
1
37.4kΩ, 1%
1
200kΩ, 1%
R19–21
RTH
3
1.5Ω, 5%
1
NTC Thermistor, 100kΩ, 5%
1.0µF, 25V, 10% X7R
0.1µF, 50V, 10% X7R
4700pF, 25V, 10% X7R
0.047µF, 25V, 10% X7R
2200pF, 25V, 10% X7R
470pF, 50V, 10% X7R
100pF, 50V, 5% NPO
820µF, 2.5V, 20% 7mΩ, POLY
10µF, 6.3V, 20% X5R
Panasonic ERT-J1V V104J
C1–7
C8–10
C12–14, CCS
CDLY
CB
7
3
4
1
1
CA
1
CFB
1
CX
8
Fujitsu FP-2R5RE821M
CZ
22
6
CIN
470µF, 16V, 20%, 36mΩ, Alum-Elec Rubycon 16MBZ470M
Note:
The design shown in this datasheet should be used as a reference only. Please contact your Fairchild sales representative
for the latest information.
REV. 1.0.7 1/5/04
11
FAN5019
PRODUCT SPECIFICATION
Table 2. VRM10 VID Codes
VID4
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
VID3
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
VID2
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
VID1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
VID0
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
VID5
X
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
VOUT (nominal)
No CPU
0.8375 V
0.8500 V
0.8625 V
0.8750 V
0.8875 V
0.9000 V
0.9125 V
0.9250 V
0.9375 V
0.9500 V
0.9625 V
0.9750 V
0.9875 V
1.0000 V
1.0125 V
1.0250 V
1.0375 V
1.0500 V
1.0625 V
1.0750 V
1.0875 V
1.1000 V
1.1125 V
1.1250 V
1.1375 V
1.1500 V
1.1625 V
1.1750 V
1.1875 V
1.2000 V
1.2125 V
1.2250 V
1.2375 V
1.2500 V
1.2625 V
1.2750 V
1.2875 V
1.3000 V
1.3125 V
1.3250 V
12
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Table 2. VRM10 VID Codes (continued)
VID4
1
VID3
0
VID2
1
VID1
0
VID0
1
VID5
0
VOUT (nominal)
1.3375 V
1.3500 V
1.3625 V
1.3750 V
1.3875 V
1.4000 V
1.4125 V
1.4250 V
1.4375 V
1.4500 V
1.4625 V
1.4750 V
1.4875 V
1.5000 V
1.5125 V
1.5250 V
1.5375 V
1.5500 V
1.5625 V
1.5750 V
1.5875 V
1.6000 V
1
0
1
0
0
1
1
0
1
0
0
0
1
0
0
1
1
1
1
0
0
1
1
0
1
0
0
1
0
1
1
0
0
1
0
0
1
0
0
0
1
1
1
0
0
0
1
0
1
0
0
0
0
1
1
0
0
0
0
0
0
1
1
1
1
1
0
1
1
1
1
0
0
1
1
1
0
1
0
1
1
1
0
0
0
1
1
0
1
1
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
0
0
0
1
0
1
1
1
0
1
0
1
1
0
0
1
0
1
0
1
REV. 1.0.7 1/5/04
13
FAN5019
PRODUCT SPECIFICATION
Table 3. VRM9 VID Codes
VID4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VID3
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
VID2
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
VID1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
VID0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
VOUT (nominal)
No CPU
1.100 V
1.125 V
1.150 V
1.175 V
1.200 V
1.225 V
1.250 V
1.275 V
1.300 V
1.325 V
1.350 V
1.375 V
1.400 V
1.425 V
1.450 V
1.475 V
1.500 V
1.525 V
1.550 V
1.575 V
1.600 V
1.625V
1.650V
1.675V
1.700V
1.725V
1.750V
1.775V
1.800V
1.825V
1.850V
14
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
General Description
Note: The information in this section is intended to assist the
user in their design and understanding of the FAN5019
functionality. For clarity and ease of understanding, device
parameters have been included in the text. In the event of
discrepancies between values stated in this section and the
actual specification tables, the specification tables shall be
deemed correct.
normal operation. After this time, if the PWM output was not
grounded, then it will operate normally. If the PWM output
was grounded, then it will remain off.
The PWM outputs become logic-level output devices once
normal operation starts, and are intended for driving external
gate drivers. Since each phase is monitored independently,
operation approaching 100% duty cycle is possible. Also,
more than one output can be on at a time for overlapping
phases.
Theory of Operation
The FAN5019 combines a multi-mode, fixed frequency
PWM control with multi-phase logic outputs for use in
2, 3 and 4 phase synchronous buck CPU core supply power
converters. If VID5 is pulled up to a voltage greater than
VTBLSEL, then the DAC code corresponds to VRM9.
Master Clock Frequency
The clock frequency of the FAN5019 is set with an external
resistor connected from the RT pin to ground. The frequency
follows the graph shown in TPC 1. To determine the fre-
quency per phase, the clock is divided by the number of
phases in use. If PWM4 is grounded, then divide the master
clock by 3 and if both PWM3 and 4 are grounded, then
divide by 2. If all phases are in use, divide by 4.
Multi-phase operation is important for producing the high
currents and low voltages demanded by today’s microproces-
sors. Handling the high currents in a single-phase converter
would place high thermal demands on the components in the
system such as the inductors and MOSFETs. The internal
6-bit VID DAC conforms to Intel’s VRD/VRM 10
specifications.
Output Voltage Differential Sensing
The FAN5019 combines differential sensing with a high
accuracy VID DAC and reference and a low offset error
amplifier to maintain a worst-case specification of ±10 mV
differential sensing error with a VID input of 1.600 V over its
full operating output voltage and temperature range. The
output voltage is sensed between the FB and FBRTN pins.
FB should be connected through a resistor to the regulation
point, usually the remote sense pin of the microprocessor.
FBRTN should be connected directly to the remote sense
ground point. The internal VID DAC and precision reference
are referenced to FBRTN, which has a typical current of
150µA, to allow accurate remote sensing. The internal error
amplifier compares the output of the DAC to the FB pin to
regulate the output voltage.
The multi-mode control of the FAN5019 ensures a stable,
high performance topology for:
• Balancing currents and thermals between phases
• High speed response at the lowest possible switching
frequency and output decoupling
• Minimizing thermal switching losses due to lower
frequency operation
• Tight load line regulation and accuracy
• High current output from having up to 4 phase operation
• Reduced output ripple due to multi-phase cancellation
• PC board layout noise immunity
• Ease of use and design due to independent component
selection
• Flexibility in operation for tailoring design to low cost or
high performance
Output Current Sensing
The FAN5019 provides a dedicated current sense amplifier
(CSA) to monitor the total output current for proper voltage
positioning versus load current and for current limit detec-
tion. Sensing the load current at the output gives the total
average current being delivered to the load, which is an
inherently more accurate method than peak current detection
or sampling the current across a sense element such as the
low side MOSFET. This amplifier can be configured several
ways depending on the objectives of the system:
Number of Phases
The number of operational phases and their phase relation-
ship is determined by internal circuitry which monitors the
PWM outputs. Normally, the FAN5019 operates as a 4-phase
PWM controller. Grounding the PWM4 pin programs three
phase operation; grounding the PWM3 and PWM4 pins
programs 2-phase operation.
• Output inductor DCR sensing without thermistor for
lowest cost
• Output inductor DCR sensing with thermistor for
improved accuracy with tracking of inductor temperature
• Sense resistors for highest accuracy measurements
When the FAN5019 is initially enabled, the controller out-
puts a voltage on PWM3 and PWM4 that is approximately
550 mV. An internal comparator checks each pin’s voltage
versus a threshold of 400mV. If the pin is grounded, then it
will be below the threshold and the phase will be disabled.
The output impedance of the PWM pin is approximately
5kΩ. Any external pull-down resistance connected to the
PWM pin should not be less than 25kΩ to ensure proper
operation. The phase detection is made prior to starting
The positive input of the CSA is connected to the CSREF
pin, which is connected to the output voltage. The inputs to
the amplifier are summed together through resistors from the
sensing element (such as the switch node side of the output
REV. 1.0.7 1/5/04
15
FAN5019
PRODUCT SPECIFICATION
inductors) to the inverting input, CSSUM. The feedback
resistor between CSCOMP and CSSUM sets the gain of the
amplifier, and a filter capacitor is placed in parallel with this
resistor. The gain of the amplifier is programmable by adjust-
ing the feedback resistor to set the load line required by the
microprocessor. The current information is then given as the
difference of CSREF –CSCOMP. This difference signal is
used internally to offset the VID DAC for voltage positioning
and as a differential input for the current limit comparator.
will make a substantial increase in phase current. Increase
each RSW value by small amounts to achieve balance,
starting with the coolest phase first.
Voltage Control Mode
A high gain-bandwidth voltage mode error amplifier is used
for the voltage-mode control loop. The control input voltage
to the positive input is set via the VID 6-bit logic code
according to the voltages listed in Table 1. This voltage is
also offset by the droop voltage for active positioning of the
output voltage as a function of current, commonly known as
active voltage positioning. The output of the amplifier is the
COMP pin, which sets the termination voltage for the inter-
nal PWM ramps.
To provide the best accuracy for the sensing of current, the
CSA has been designed to have a low offset input voltage.
Also, the sensing gain is determined by external resistors so
that it can be made extremely accurate and flexible.
Active Impedance Control Mode
The negative input (FB) is tied to the output sense location
with a resistor RB and is used for sensing and controlling the
output voltage at this point. A current source from the FB pin
flowing through RB is used for setting the no-load offset
voltage from the VID voltage. The no-load voltage will be
negative with respect to the VID DAC. The main loop com-
pensation is incorporated in the feedback network between
FB and COMP.
For controlling the output voltage droop as a function of
output current, a voltage signal proportional to the total
inductor currents is created by the current sense amplifier
(CSA). The ratio of this voltage to the output current is
determined by external components to allow it to be adjusted
to set the required load line. Inside the chip the CSA output
voltage is subtracted from the DAC voltage which then is
used for the reference to the error amplifier. As the output
current increases the reference to the error amp decreases
causing the output voltage to decrease accordingly.
Soft-Start
The power-on ramp up time of the output voltage is set with
a capacitor and resistor in parallel from the DELAY pin to
ground. The RC time constant also determines the current
limit latch off time as explained in the following section. In
UVLO or when EN is a logic low, the DELAY pin is held at
ground. After the UVLO threshold is reached and EN is a
logic high, the DELAY cap is charged up with an internal
20µA current source. The output voltage follows the ramp-
ing voltage on the DELAY pin, limiting the inrush current.
The soft-start time depends on the value of VID DAC and
Current Control Mode and Thermal Balance
The FAN5019 has individual inputs for each phase which are
used for monitoring the current in each phase. This informa-
tion is combined with an internal ramp to create a current
balancing feedback system that has been optimized for initial
current balance accuracy and dynamic thermal balancing
during operation. This current balance information is inde-
pendent of the average output current information used for
positioning described previously.
C
DLY, with a secondary effect from RDLY. Refer to the appli-
cations section for detailed information on setting CDLY
.
The magnitude of the internal ramp can be set to optimize
the transient response of the system. It also monitors the sup-
ply voltage for feed-forward control for changes in the sup-
ply. A resistor connected from the power input voltage to the
RAMPADJ pin determines the slope of the internal PWM
ramp. Detailed information about programming the ramp is
given in the applications section.
If EN is taken low or VCC drops below UVLO, the DELAY
cap is reset to ground to be ready for another soft start cycle.
Figure 1 shows a typical start-up sequence for the FAN5019.
Over Current Limit and Latch-off Protection
The FAN5019 compares a programmable current limit set
point to the voltage from the output of the current sense
amplifier. The level of current limit is set with the resistor
from the ILIMIT pin to ground. During normal operation,
the voltage on ILIMIT is 3V. The current through the exter-
nal resistor is internally scaled to give a current limit thresh-
old of approximately 10.4mV/µA. If the difference in
voltage between CSREF and CSCOMP rises above the cur-
rent limit threshold, the internal current limit amplifier will
control the internal COMP voltage to maintain the average
output current at the limit.
External resistors can be placed in series with individual
phases to create an intentional current imbalance if desired,
such as when one phase may have better cooling and can
support higher currents. Resistors RSW1 through RSW4
(see the typical application circuit in Figure 4) can be used
for adjusting FET thermal and current balance. Zero ohm
placeholder resistors should be provided in the initial layout
to allow the phase balance to be adjusted during design fine
tuning.
To increase the current in any given phase, make RSW for
that phase larger (make RSW = 0 for the hottest phase and do
not change during balancing). Increasing RSW to only 500Ω
16
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Figure 2. Start-Up Waveforms
Figure 3. Overcurent Latch Off Waveform
Circuit of Figure 5
Circuit of Figure 5
Channel 1 – Vout, Channel 2 – Vcc
Channel 3 – OD, Channel 4 – Delay pin
Channel 1 – Vcc, Channel 2 – Vout
Channel 3 – OD, Channel 4 – Delay pin
After the limit is reached, the 3V pull-up on the DELAY pin
is disconnected, and the external delay capacitor is dis-
charged through the external resistor. A comparator monitors
the DELAY voltage and shuts off the controller when the
voltage drops below 1.8V. The current limit latch off delay
time is therefore set by the RC time constant discharging
from 3V to 1.8V. The application section discusses the
Dynamic VID
The FAN5019 incorporates the ability to dynamically
change the VID input while the controller is running. This
allows the output voltage to change while the supply is run-
ning and supplying current to the load. This is commonly
referred to as VID-on-the-fly (OTF). A VID-OTF can occur
under either light load or heavy load conditions. The proces-
sor signals the controller by changing the VID inputs in mul-
tiple steps from the start code to the finish code. This change
can be either positive or negative.
selection of CDLY and RDLY
.
Because the controller continues to cycle the phases during
the latch-off delay time, if the short is removed before the
1.8V threshold is reached, the controller will return to nor-
mal operation. The recovery characteristic depends on the
state of PWRGD. If the output voltage is within the PWRGD
window, the controller resumes normal operation. However,
if short circuit has caused the output voltage to drop below
the PWRGD threshold, then a soft-start cycle is initiated.
When a VID input changes state, the FAN5019 detects the
change and ignores the DAC inputs for a minimum of 400ns.
This time is to prevent a false code due to logic skew while
the six VID inputs are changing. Additionally, the first VID
change initiates the PWRGD and CROWBAR blanking
functions for a minimum of 250µs to prevent a false
PWRGD or CROWBAR event. Each VID change will reset
the internal timer. Figure 4 shows the VID on-the-fly perfor-
mance when the output voltage is stepping up and the output
current is switching between minimum and maximum values
which is the worst-case situation.
The latch-off function can be reset by either cycling VCC to
the FAN5019, or by cycling the Enable pin low for a short
time. To disable the short circuit latch off function, the
external resistor to ground should be left open, and a 1MΩ
resistor should be connected from VCC to the DELAY pin.
This prevents the DELAY capacitor from discharging, so the
1.8V threshold is never reached. The resistor will have an
impact on the soft-start time because the current through it
will add to the internal 20µA current source.
During start-up when the output voltage is below 200mV, a
secondary current limit is active. This is necessary because
the voltage swing of CSCOMP cannot go below ground.
This secondary current limit controls the internal COMP
voltage to the PWM comparators to 2V. This will limit the
voltage drop across the low side MOSFETs through the
current balance circuitry.
There is also an inherent per phase current limit that will pro-
tect individual phases in the case where one or more phases
may stop functioning because of a faulty component. This
limit is based on the maximum normal-mode COMP voltage.
Figure 4. VID On-the-Fly Waveforms, Circuit of Figure 5,
VID Change = 5mV, 5µs, 50 steps, I
Change = 5A to 65A
OUT
REV. 1.0.7 1/5/04
17
FAN5019
PRODUCT SPECIFICATION
Power Good Monitoring
Application Information
The design parameters for a typical Intel VRD10.x
compliant CPU application are as follows:
The Power Good comparator monitors the output voltage via
the CSREF pin. The PWRGD pin is an open drain output
whose high level (when connected to a pull-up resistor) indi-
cates that the output voltage is within the nominal limits
specified in the specifications table based on the VID volt-
age setting. PWRGD will go low if the output voltage is out-
side of this specified range. PWRGD is blanked during a
VID OTF event for a period of 250µs to prevent false signals
during the time the output is changing.
• Input voltage (VIN) = 12V
• VID setting voltage (VVID) = 1.500V
• Duty cycle (D) = 0.125
• Nominal output voltage at no load (VONL) = 1.480V
• Nominal output voltage at 65 A load (VOFL) = 1.3955V
• Static output voltage drop based on a 1.3 mΩ load line
(RO) from no load to full load
• (VD) = VONL – VOFL = 1.480V – 1.3955V = 84.5mV
• Maximum Output Current (IO) = 65A
• Maximum Output Current Step (∆IO) = 60A
• Number of Phases (n) = 3
Output Crowbar
As part of the protection for the load and output components
of the supply, the PWM outputs will be driven low (turning
on the low-side MOSFETs) when the output voltage exceeds
the upper Power Good threshold. This crowbar action will
stop once the output voltage has fallen below the release
threshold of approximately 550mV.
• Switching frequency per phase (fSW) = 228 kHz
Setting the Clock Frequency
The FAN5019 uses a fixed-frequency control architecture
with the frequency being set by an external timing resistor
(RT). The clock frequency and the number of phases deter-
mine the switching frequency per phase, which relates
directly to switching losses and the sizes of the inductors and
input and output capacitors. With n = 3 for three phases, a
clock frequency of 684kHz sets the switching frequency of
each phase, fSW, to 228kHz, which represents a practical
trade-off between the switching losses and the sizes of the
output filter components. TPC 1 shows that to achieve a
684kHz oscillator frequency, the correct value for RT is
301kΩ. Alternatively, the value for RT can be calculated
using:
Turning on the low-side MOSFETs pulls down the output
voltage as the reverse current builds up in the inductors.
If the output overvoltage is due to a short of the high side
MOSFET, this action will current limit the input supply
or blow its fuse, protecting the microprocessor from
destruction.
Output Enable and UVLO
The input supply (VCC) to the controller must be higher than
the UVLO threshold and the EN pin must be higher then its
logic threshold for the FAN5019 to begin switching. If
UVLO is less than the threshold or the EN pin is a logic low,
the FAN5019 is disabled. This holds the PWM outputs at
ground, shorts the DELAY capacitor to ground, and holds
the ILIMIT pin at ground.
1
(1)
RT =
(
n × fSW × 5pF −110nS
)
In the application circuit, the ILIMIT pin should be con-
nected to the output disable pins of the FAN5009 drivers.
Because ILIMIT is grounded, this disables the drivers such
that both DRVH and DRVL are grounded. This feature is
important to prevent discharging of the output capacitors
when the controller is shut off. If the driver outputs were not
disabled, then a negative voltage could be generated on the
output due to the high current discharge of the output
capacitors through the inductors.
where 5.0pF and 110nS are internal IC component values.
For good initial accuracy and frequency stability, it is recom-
mended to use a 1% resistor.
Soft-Start and Current Limit Latch-Off Delay
Times
Because the soft-start and current limit latch off delay
functions share the DELAY pin, these two parameters must
be considered together. The first step is to set CDLY for the
soft-start ramp. This ramp is generated with a 20µA internal
current source. The value of RDLY will have a second order
impact on the soft-start time because it sinks part of the cur-
rent source to ground. However, as long as RDLY is kept
greater than 200kΩ, this effect is minor. The value for CDLY
can be approximated using:
18
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
The smallest possible inductor should be used to minimize
the number of output capacitors. Choosing a 650nH inductor
is a good choice for a starting point and gives a calculated
ripple current of 8.86A. The inductor should not saturate at
the peak current of 26.1A and should be able to handle the
sum of the power dissipation caused by the average current
of 21.7A in the winding and core loss.
VVID
tSS
(2)
CDLY = 20µA −
×
2× RDLY
VVID
Where tSS is the desired soft-start time. Assuming an RDLY
of 301kΩ and a desired a soft-start time of 3ms, CDLY is
35nF. A close standard value for CDLY is 47nF. Once CDLY
has been chosen, RDLY can be calculated for the current limit
latch-off time using:
Another important factor in the inductor design is the DC
Resistance (DCR), which is used for measuring the phase
currents. A large DCR will cause excessive power losses,
while too small a value will lead to increased measurement
error. A good rule of thumb is to have the DCR be about
1 to 1 1/2 times the droop resistance (RO). For our example,
we are using an inductor with a DCR of 1.6 mΩ.
1.96 ×tDELAY
(3)
RDLY
=
CDLY
If the result for RDLY is less than 200kΩ, then a smaller soft-
start time should be considered by recalculating the equation
for CDLY or a longer latch-off time should be used. In no
case should RDLY be less than 200kΩ. In this example, a
delay time of 8ms gives RDLY = 334kΩ. A close
standard 1% value is 301kΩ.
Designing an Inductor
Once the inductance and DCR are known, the next step is
either to design an inductor or find a standard inductor that
comes as close as possible to meeting the overall design
goals. It is also important to have the inductance and DCR
tolerance specified to keep the accuracy of the system con-
trolled. Using 15% for the inductance and 8% for the DCR
(at room temperature) are reasonable tolerances that most
manufacturers can meet.
Inductor Selection
The choice of inductance value for the inductor determines
the ripple current in the inductor. Less inductance leads to
more ripple current, which increases the output ripple volt-
age and conduction losses in the MOSFETs, but allows using
smaller-size inductors and, for a specified peak-to-peak
transient deviation, less total output capacitance. Conversely,
a higher inductance means lower ripple current and reduced
conduction losses, but requires larger-size inductors and
more output capacitance for the same peak-to-peak transient
deviation. In any multi-phase converter, a practical value for
the peak-to-peak inductor ripple current is less than 50% of
the maximum DC current in the same inductor. Equation 4
shows the relationship between the inductance, oscillator
frequency, and peak-to-peak ripple current in the inductor.
Equation 5 can be used to determine the minimum induc-
tance based on a given output ripple voltage:
The first decision in designing the inductor is to choose the
core material. There are several possibilities for providing
low core loss at high frequencies. Two examples are the
powder cores (e.g., Kool-Mm® from Magnetics, Inc. or
Micrometals) and the gapped soft ferrite cores (e.g., 3F3
or 3F4 from Philips). Low frequency powdered iron cores
should be avoided due to their high core loss, especially
when the inductor value is relatively low and the ripple
current is high.
The best choice for a core geometry is a closed-loop types,
such as pot cores, PQ, U, and E cores, or toroids. A good
compromise between price and performance are cores with a
toroidal shape.
VO ×
(
1− D
)
(4)
(5)
IR
=
fSW × L
There are many useful references for quickly designing a
power inductor, such as:
VVID × RO ×
(
1−
(n × D))
L ≥
fSW ×VRIPPLE
Magnetics Design References
1. Magnetic Designer Software Intusoft
(www.intusoft.com)
Solving Equation 5 for a 10 mVp-p output ripple voltage
yields:
1.5V ×1.3mΩ ×
(
1− 0.375
)
= 534nH
2. Designing Magnetic Components for High-Frequency
DC-DC Converters, by William T. McLyman,
Kg Magnetics, Inc. ISBN 1883107008
L ≥
228kHz ×10mV
If the ripple voltage ends up less than that designed for, the
inductor can be made smaller until the ripple value is met.
This will allow optimal transient response and minimum
output decoupling.
REV. 1.0.7 1/5/04
19
FAN5019
PRODUCT SPECIFICATION
It is best to have a dual location for CCS in the layout so stan-
dard values can be used in parallel to get as close to the value
desired. For this example, choosing CCS to be 4.7nF is a
good choice. For best accuracy, CCS should be a 5% or 10%
NPO capacitor. A close standard 1% value for RPH(X) is
100kΩ.
Selecting a Standard Inductor
The companies listed below can provide design consultation
and deliver power inductors optimized for high power
applications upon request.
Power Inductor Manufacturers
• Coilcraft
Inductor DCR Temperature Correction
(847)639-6400
www.coilcraft.com
With the inductor’s DCR being used as the sense element,
and copper wire being the source of the DCR, one needs to
compensate for temperature changes of the inductor’s wind-
ing. Fortunately, copper has a well-known temperature coef-
ficient (TC) of 0.39%/°C.
• Coiltronics
(561)752-5000
www.coiltronics.com
• Sumida Electric Company
(510) 668-0660
If RCS is designed to have an opposite and equal percentage
change in resistance to that of the wire, it will cancel the
temperature variation of the inductor’s DCR. Due to the non-
linear nature of NTC thermistors, resistors RCS1 and RCS2
are needed (see Figure 5) to linearize the NTC and produce
the desired temperature tracking.
www.sumida.com
• Vishay Intertechnology
(402) 563-6866
www.vishay.com
Place as close as
possible to nearest
To VOUT
sense
To Switch Nodes
Output Droop Resistance
inductor or low-side
RTH
MOSFET
The design requires that the regulator output voltage
measured at the CPU pins drops when the output current
increases. The specified voltage drop corresponds to a DC
output resistance (RO).
RCS2
RCS1
RPH3
RPH2
RPH1
CSCOMP
CSSUM
CSREF
18
17
16
CCS
1.8nF
Keep this path as
short as possible
and well away from
Switch Node lines
CSA
The output current is measured by summing together the
voltage across each inductor and then passing the signal
through a low-pass filter. This summer-filter is the CS
amplifier configured with resistors RPH(X) (summers), and
Figure 5. Temperature Compensation Circuit
R
CS and CCS (filter). The output resistance of the regulator is
The following procedure and expressions will yield values to
use for RCS1, RCS2, and RTH (the thermistor value at 25°C)
for a given RCS value.
set by the following equations, where RL is the DCR of the
output inductors:
RCS
(6)
RO =
× RL
1. Select an NTC to be used based on type and value. Since
we do not have a value yet, start with a thermistor with a
value close to RCS. The NTC should also have an initial
tolerance of better than 5%.
RPH ( X )
L
(7)
CCS
=
RL × RCS
2. Based on the type of NTC, find its relative resistance
value at two temperatures. The temperatures to use that
work well are 50°C and 90°C. We will call these resis-
tance values A (A is RTH(50°C)/RTH(25°C)) and B (B is
RTH(90°C)/RTH(25°C)). Note that the NTC’s relative value
is always 1 at 25°C.
One has the flexibility of choosing either RCS or RPH(X)
It is best to select RCS equal to 100kΩ, and then solve for
RPH(X) by rearranging Equation 6.
.
RL
RPH ( X )
=
=
× RCS
RO
3. Next, find the relative value of RCS required for each of
these temperatures. This is based on the percentage
change needed, which we will initially make 0.39%/°C.
We will call these r1 and r2 where:
1.6mΩ
1.3mΩ
RPH ( X )
×100kΩ = 123kΩ
Next, use Equation 7 to solve for CCS
:
1
r =
1
(
1+TC ×
(
T − 25))
650nH
1
TC = 0.0039
T1 = 50°C
T2 = 90°C
CCS
=
= 4.06nF
1.6mΩ ×100kΩ
1
r =
2
(
1+TC ×
(
T2 − 25))
20
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
4. Compute the relative values for RCS1, RCS2, and RTH
using:
COUT Selection
The required output decoupling for the regulator is typically
recommended by Intel for various processors and platforms.
One can also use some simple design guidelines to determine
what is required. These guidelines are based on having both
bulk and ceramic capacitors in the system.
(A−B)×r ×r − A×(1−B)×r +B×(1− A)×r
1
1
2
2
r
=
=
CS2
A×(1−B)×r −B×(1− A)×r −(A−B)
1
2
(8)
(1− A)
rCS1
The first thing is to select the total amount of ceramic capac-
itance. This is based on the number and type of capacitor to
be used. The best location for ceramics is inside the socket,
with 12 to 18 of size 1206 being the physical limit. Others
can be placed along the outer edge of the socket as well.
1
A
−
1− rCS2 r − rCS 2
1
1
rTH
=
1
1
−
1 − rCS
rCS
2
1
Combined ceramic values of 200µF–300µF are recom-
mended, usually made up of multiple 10µF or 22µF
capacitors. Select the number of ceramics and find the total
ceramic capacitance (CZ).
5. Calculate RTH = rTH x RCS, then select the closest value
of thermistor available. Also compute a scaling factor k
based on the ratio of the actual thermistor value used
relative to the computed one:
Next, there is an upper limit imposed on the total amount of
bulk capacitance (CX) when one considers the VID on-the-
fly voltage stepping of the output (voltage step VV in time tV
with error VERR) and a lower limit based on meeting the crit-
ical capacitance for load release for a given maximum load
step ∆IO:
RTH (ACTUAL)
(9)
k =
RTH (CALCULATED)
6. Finally, calculate values for RCS1 and RCS2 using the
following:
L×∆IO
(12)
CX (MIN)
≥
− CZ
(10)
RCS1 = RCS ×k × r
CS1
n×RO ×V
VID
RCS 2 = RCS ×((1− k
) (
+ k × rCS 2 ))
2
(13)
L
VV
V
nKR
O
VID
CX (MAX)
≤
×
×
1+ tV
×
− 1 − CZ
nK2RO2
V
VV
L
VID
For this example, RCS has been chosen to be 100kΩ, so we
start with a thermistor value of 100kΩ. Looking through
available 0603 size thermistors, we find a Panasonic
ERT-J1VV104J NTC thermistor with A = 0.2954 and
B = 0.05684. From these we compute RCS1 = 0.3304,
RCS2 = 0.7426 and RTH = 1.165. Solving for RTH yields
116.5 kΩ, so we choose 100kΩ, making k = 0.8585. Finally,
we find RCS1 and RCS2 to be 28.4kΩ and 77.9kΩ. Choosing
the closest 1% resistor values yields a choice of 35.7kΩ and
73.2kΩ.
where
VVERR
VV
K = −ln
To meet the conditions of these expressions and transient
response, the ESR of the bulk capacitor bank (RX) should be
less than two times the droop resistance, RO. If the CX(MIN)
is larger than CX(MAX), the system will not meet the VID
on-the-fly specification and may require the use of a smaller
inductor or more phases (and may have to increase the
switching frequency to keep the output ripple the same).
Output Offset
Intel’s specification requires that at no load the nominal out-
put voltage of the regulator be offset to a lower value than
the nominal voltage corresponding to the VID code. The off-
set is set by a constant current source flowing out of the FB
pin (IFB) and flowing through RB. The value of RB can be
found using Equation 11:
For our example, 22 10µF 1206 MLC capacitors
(CZ = 220µF) were used. The VID on-the-fly step change is
250mV in 150µs with a setting error of 2.5mV. Solving for
the bulk capacitance yields:
VVID −VONL
(11)
RB =
IFB
1.5V −1.480V
RB =
=1.33kΩ
15µA
The closest standard 1% resistor value is 1.33 kΩ.
REV. 1.0.7 1/5/04
21
FAN5019
PRODUCT SPECIFICATION
2
150µs×1.5V ×3×4.6×1.3mΩ
250mV×650nH
650nH×250mV
3×4.62 × 1.3mΩ 2
×1.5V
CX (MAX)
≤
×
1+
−1 −220µF = 23.9mF
(
)
650nH ×60A
CX (MIN)
≥
− 220µF = 6.45mF
3×1.3mΩ×1.5V
where K=4.6
(per MOSFET) < 8.7mΩ. This RDS(SF) is also at a junction
temperature of about 125ºC, so we need to make sure we
account for this when making this selection. For our exam-
ple, we selected two lower side MOSFETs at 8.6mΩ each at
room temperature, which gives 8.4mΩ at high temperature.
Using eight 820µF A1-Polys with a typical ESR of 8mΩ,
each yields CX = 6.56µF with an RX = 1.0mΩ. One last
check should be made to ensure that the ESL of the bulk
capacitors (LX) is low enough to limit the initial high-
frequency transient spike. This can be tested using:
Another important factor for the synchronous MOSFET is
the input capacitance and feedback capacitance. The ratio
of the feedback to input needs to be small (less than 10% is
recommended), to prevent accidental turn-on of the synchro-
nous MOSFETs when the switch node goes high.
LX ≤ CZ ×R2
(14)
O
2
LX ≤ 220µF ×
(
1.3mΩ = 372 pH
)
Also, the time to switch the synchronous MOSFETs off
should not exceed the non-overlap dead time of the
MOSFET driver (40ns typical for the FAN5009). The
output impedance of the driver is about 2Ω and the typical
MOSFET input gate resistances are about 1Ω–2Ω, so a total
gate capacitance of less than 6000pF should be adhered to.
Since there are two MOSFETs in parallel, we should limit
the input capacitance for each synchronous MOSFET to
3000pF.
In this example, LX is 375pH for the eight A1-Poly capaci-
tors, which satisfies this limitation. If the LX of the chosen
bulk capacitor bank is too large, the number of MLC capaci-
tors must be increased. One should note for this multi-mode
control technique, “all-ceramic” designs can be used as
long as the conditions of Equations 11, 12 and 13 are
satisfied.
Power MOSFETs
The high-side (main) MOSFET has to be able to handle two
main power dissipation components; conduction and switch-
ing losses. The switching loss is related to the amount of
time it takes for the main MOSFET to turn on and off, and to
the current and voltage that are being switched. Basing the
switching speed on the rise and fall time of the gate driver
impedance and MOSFET input capacitance, the following
expression provides an approximate value for the switching
loss per main MOSFET, where nMF is the total number of
main MOSFETs:
For this example, the N-channel power MOSFETs have been
selected for one high-side switch and two low-side switches
per phase. The main selection parameters for the power
MOSFETs are VGS(TH), QG, CISS, CRSS and RDS(ON)
.
The minimum gate drive voltage (the supply voltage to the
FAN5009) dictates whether standard threshold or logic-level
threshold MOSFETs must be used. With VGATE ~10V,
logic-level threshold MOSFETs (VGS(TH) < 2.5V) are
recommended. The maximum output current IO determines
the RDS(ON) requirement for the low-side (synchronous)
MOSFETs. With the FAN5019, currents are balanced
between phases, thus the current in each low-side MOSFET
is the output current divided by the total number of
MOSFETs (nSF). With conduction losses being dominant,
the following expression shows the total power being
dissipated in each synchronous MOSFET in terms of the
ripple current per phase (IR) and average total output
current (IO):
VCC × IO
nMF
nMF
n
(16)
P
= 2 × fSW
×
× RG ×
×CISS
S(MF )
Here, RG is the total gate resistance (2Ω for the FAN5009
and about 1Ω for typical high speed switching MOSFETs,
making RG = 3Ω) and CISS is the input capacitance of the
main MOSFET. It is interesting to note that adding more
main MOSFETs (nMF) does not really help the switching
loss per MOSFET since the additional gate capacitance
slows down switching. The best way to reduce switching
loss is to use lower gate capacitance devices.
2
2
IO
1
n×IR
(15)
P =
(
1− D
)
×
+
×
×RDS(SF)
SF
nSF
12
nSF
Knowing the maximum output current being designed for
and the maximum allowed power dissipation, one can find
the required RDS(ON) for the MOSFET. For D-PAK
MOSFETs up to an ambient temperature of 50ºC, a safe
limit for PSF is 1W–1.5W at 125ºC junction temperature.
Thus, for our example (65A maximum), we find RDS(SF)
The conduction loss of the main MOSFET is given by the
following, where RDS(MF) is the ON-resistance of the
MOSFET:
2
2
IO
1
n× IR
(17)
P
= D×
+
×
× RDS(MF)
C(MF)
nMF
12
nMF
22
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Typically, for main MOSFETs, one wants the highest
speed (low CISS) device, but these usually have higher
ON-resistance. One must select a device that meets the total
power dissipation (about 1.5 W for a single D-PAK) when
combining the switching and conduction losses.
AR ×
(
1− D
)
×VVID
(20)
VR =
VR =
RR ×CR × fSW
0.2×
(1− 0.125
)
×1.5V
= 0.765V
301kΩ×5pF ×228kHz
For our example, we have selected a Fairchild FD6696 as the
main MOSFET (three total; nMF = 3), with a Ciss = 2058 pF
(max) and RDS(MF) = 15m (max at TJ = 125ºC) and an
Fairchild FDD6682 as the synchronous MOSFET (six total;
nSF = 6), with Ciss = 2880pF (max) and RDS(SF) = 11.9mΩ
(max at TJ = 125ºC). The synchronous MOSFET Ciss is less
than 3000 pF, satisfying that requirement. Solving for the
power dissipation per MOSFET at IO = 65A and IR = 8.86A
yields 1.24W for each synchronous MOSFET and 1.62W for
each main MOSFET. These numbers work well considering
there is usually more PCB area available for each main
MOSFET versus each synchronous MOSFET.
The size of the internal ramp can be made larger or smaller.
If it is made larger, stability and transient response will
improve, but thermal balance will degrade. Likewise, if the
ramp is made smaller, thermal balance will improve at the
sacrifice of transient response and stability. The factor of
three in the denominator of equation 19 sets a ramp size that
gives an optimal balance for good stability, transient
response, and thermal balance.
COMP Pin Ramp
There is a ramp signal on the COMP pin due to the droop
voltage and output voltage ramps. This ramp amplitude adds
to the internal ramp to produce the following overall ramp
signal at the PWM input.
One last thing to look at is the power dissipation in the driver
for each phase. This is best described in terms of the QG for
the MOSFETs and is given by the following, where QGMF is
the total gate charge for each main MOSFET and QGSF is the
total gate charge for each synchronous MOSFET:
VR
(21)
VRT
=
2 ×
(
1− n × D
)
1−
fSW
n × fSW ×CX × RO
P
=
×
(
nMF ×QGMF + nSF ×QGSF + ICC ×VCC
)
(18)
DRV
2×n
For this example, the overall ramp signal is found to be
0.974V.
Also shown is the standby dissipation factor (ICC times the
VCC) for the driver. For the FAN5009, the maximum dissipa-
tion should be less than 400 mW. For our example, with
ICC = 7 mA, QGMF = 24nC (max) and QGSF = 31nC (max),
we find 202 mW in each driver, which is below the 400 mW
dissipation limit. See the FAN5009 data sheet for more
details.
Current Limit Set Point
To select the current limit set point, we need to find the
resistor value for RLIM. The current limit threshold for the
FAN5019 is set with a 3V source (VLIM) across RLIM with
a gain of 10.4mV/mA (ALIM). RLIM can be found using the
following:
Ramp Resistor Selection
ALIM ×VLIM
ILIM × RO
(22)
The ramp resistor (RR) is used for setting the size of the
internal PWM ramp. The value of this resistor is chosen to
provide the best combination of thermal balance, stability,
and transient response. The following expression is used for
determining the optimum value:
RLIM
=
For values of RLIM greater than 500kΩ, the current limit may
be lower than expected, so some adjustment of RLIM may be
needed. Here, ILIM is the average current limit for the output
of the supply. For our example, choosing 120A for ILIM, we
find RLIM to be 200kΩ, for which we chose 200kΩ as the
nearest 1% value.
AR × L
(19)
RR =
3× AD × RDS ×CR
0.2×650nH
RR =
= 291kΩ
The per phase current limit described earlier has its limit
determined by the following:
3×5×5.95mΩ×5pF
VCOMP(MAX ) −VR −VBIAS
AD × RDS(MAX )
IR
(23)
where AR is the internal ramp amplifier gain, AD is the
current balancing amplifier gain, RDS is the total low-side
MOSFET ON-resistance, and CR is the internal ramp
capacitor value. A close standard 1% resistor value is 301kΩ.
IPHLIM
−
2
For the FAN5019, the maximum COMP voltage
(VCOMP(MAX)) is 3.3 V, the COMP pin bias voltage (VBIAS
is 1.2V, and the current balancing amplifier gain (AD) is 5.
Using VR of 0.765V, and RDS(MAX) of 5.95mΩ (low-side
)
The internal ramp voltage magnitude can be calculated
using:
ON-resistance at 125°C), we find a per-phase limit of 40.44A.
REV. 1.0.7 1/5/04
23
FAN5019
PRODUCT SPECIFICATION
This limit can be adjusted by changing the ramp voltage VR.
But make sure not to set the per-phase limit lower than the
average per-phase current (ILIM/n).
TB =
TC =
(
1.0mΩ + 0.6mΩ −1.3mΩ
)
×6.56mF = 1.97µs
AD ×RDS
2× fSW
VRT × L −
There is also a per phase initial duty cycle limit determined
by:
(28)
(29)
VVID ×RE
V
COMP(MAX ) −VBIAS
5×6.95mΩ
2 ×228kHz
1.5V ×55.3mΩ
(24)
DMAX = D ×
0.974V × 650nH −
VRT
TC =
TD =
= 6.86µs
For this example, the maximum duty cycle is found to be
0.2696.
CX ×CZ ×RO2
CX ×
(
RO − R' + CZ × RO
)
Feedback Loop Compensation Design
2
6.56mF ×220µF ×
6.56mF × 1.3mΩ − 0.6mΩ
1.3mΩ
( )
Optimized compensation of the FAN5019 allows the best
possible response of the regulator’s output to a load change.
The basis for determining the optimum compensation is to
make the regulator and output decoupling appear as an
output impedance that is entirely resistive over the widest
possible frequency range, including DC, and equal to the
droop resistance (RO). With the resistive output impedance,
the output voltage will droop in proportion with the load
current at any load current slew rate; this ensures the optimal
positioning and allows the minimization of the output
decoupling.
TD =
= 500ns
(
)
+ 220µF ×1.3mΩ
where, for the FAN5019, R’ is the PCB resistance from the
bulk capacitors to the ceramics and where RDS is approxi-
mately the total low-side MOSFET ON resistance per phase
at 25ºC. For this example, AD is 5, VRT equals 0.974V, R’ is
approximately 0.6mΩ (assuming a 4-layer motherboard) and
LX is 375pH for the eight Al-Poly capacitors.
The compensation values can then be solved for using the
following:
With the multimode feedback structure of the FAN5019, one
needs to set the feedback compensation to make the con-
verter’s output impedance work in conjunction with the out-
put decoupling to meet this goal. There are several poles and
zeros created by the output inductor and decoupling capaci-
tors (output filter) that need to be compensated for.
n× RO ×TA
(30)
CA =
RE ×RB
3×1.3mΩ×4.79µs
CA =
RA =
= 253pF
55.3mΩ×1.33kΩ
A type-III compensator on the voltage feedback is adequate
for proper compensation of the output filter. The expressions
given in Equations 25–29 are intended to yield an optimal
starting point for the design; some adjustments may be nec-
essary to account for PCB and component parasitic effects
(see the Tuning Procedure for the FAN5019 section).
TC 6.86µs
(31)
(32)
(33)
=
= 27.1kΩ
CA 253pF
TB 1.97µs
CB =
=
=1.48nF
RB 1.33kΩ
TD
500ns
CFB
=
=
= 18.5pF
The first step is to compute the time constants for all of the
poles and zeros in the system:
RA 27.1kΩ
R ×V
2×L×
(
1−n×D
n×CX ×R ×V
VID
)
×V
(25)
L
RT
RT
R =n×R +A ×RDS +
+
E
O
D
V
VID
O
1.6mΩ × 0.974V 2 × 650nH ×
(
1− 0.375 × 0.974V
)
RE = 3×1.3mΩ + 5×5.95mΩ +
+
= 55.3mΩ
1.5V
3× 6.56mF ×1.3mΩ ×1.5V
LX RO − R'
(26)
TA = CX ×
(
RO − R'
)
+
×
RO
RX
375pH 1.3mΩ − 0.6mΩ
TA = 6.56mF ×
(
1.3mΩ − 0.6mΩ
)
+
×
= 4.79µs
1.3mΩ
1.0mΩ
(27)
TB =
(
RX + R'−RO ×CX
)
24
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Choosing the closest standard values for these components
Tuning Procedure for the FAN5019
yields: CA = 390pF, RA = 16.9kΩ, CB = 1.5nF, and CFB
=
33pF.
DC Load line Setting
1. Build circuit based on compensation values computed
from design spreadsheet.
CIN Selection and Input Current di/dt Reduction
In continuous inductor-current mode, the source current of
the high-side MOSFET is approximately a square wave with
a duty ratio equal to n (VOUT/VIN) and an amplitude of one-
nth of the maximum output current. To prevent large voltage
transients, a low ESR input capacitor sized for the maximum
rms current must be used. The maximum rms capacitor cur-
rent is given by:
2. Hook up DC load to circuit, turn on and verify opera-
tion. Also check for jitter at no-load and full-load.
3. Measure output voltage at no-load (VNL). Verify it is
within tolerance.
100
80
60
40
20
0
0
10
20
30
40
50
60
OUTPUT CURRENT (A)
Figure 7. Efficiency vs. Output Current
(Circuit of Figure 5)
Figure 6. Typical Transient Response for Design Example
4. Measure output voltage at full-load cold (VFLCOLD).
Let board soak for ~10 minutes at full-load and measure
output (VFLHOT). If there is a change of more than a
couple of millivolts, adjust RCS1 and RCS2 using
Equations 35 and 37.
1
(34)
ICRMS = D × IO ×
−1
n × D
1
ICRMS = 0.125×65A×
−1 = 10.5A
3×0.125
5. Repeat Step 4 until cold and hot voltage measurements
remain the same.
Note that the capacitor manufacturer’s ripple current ratings
are often based on only 2000 hours of life. This makes it
advisable to further derate the capacitor, or to choose a
capacitor rated at a higher temperature than required. Several
capacitors may be placed in parallel to meet size or height
requirements in the design. In this example, the input
capacitor bank is formed by three 2200µF, 16V Nichicon
capacitors with a ripple current rating of 3.5A each.
6. Measure output voltage from no-load to full-load using
5 Amp steps. Compute the loadline slope for each
change and then average to get overall loadline slope
(ROMEAS).
7. If ROMEAS is off from RO by more than 0.05 mΩ,
use the following to adjust the RPH values:
ROMEAS
(36)
RPH (NEW ) = RPH (OLD)
×
To reduce the input-current di/dt to below the recommended
maximum of 0.1A/µs, an additional small inductor (L > 1µH
@ 15A) should be inserted between the converter and the
supply bus. That inductor also acts as a filter between the
converter and the primary power source.
RO
8. Repeat Steps 6 and 7 to check loadline and repeat
adjustments if necessary.
9. Once complete with DC loadline adjustment, do not
change RPH, RCS1, RCS2, or RTH for rest of procedure.
(
(
VNL −VFLCOLD
)
)
(35)
RCS2(NEW ) = RCS2(OLD)
×
VNL −VFLHOT
REV. 1.0.7 1/5/04
25
FAN5019
PRODUCT SPECIFICATION
1
RCS(NEW )
=
RCS(OLD) + RTH (25o C)
(37)
1
−
RCS1(OLD) ×RTH(25o C)
+
(
RCS 2(OLD) − RCS2(NEW )
)
×
(
RCS1(OLD) − RTH (25o C)
)
RTH (25o
C)
10. Measure the output ripple at no-load and full-load with
scope and make sure it is within spec.
18. Set dynamic load step to maximum step size (do not use
a step size larger than needed) and verify that the output
waveform is square (which means VACDRP and
VDCDRP are equal). NOTE: MAKE SURE LOAD
STEP SLEW RATE AND TURN-ON ARE SET FOR A
SLEW RATE OF ~150–250A/µs (for example, a load
step of 50A should take 200ns–300ns) WITH NO
OVERSHOOT. Some dynamic loads will have an
excessive turn-on overshoot if a minimum current is not
set properly (this is an issue if using a VTT tool).
AC Loadline Setting
11. Remove DC load from circuit and hook up dynamic
load.
12. Hook up scope to output voltage and set to DC coupling
with a time scale at 100µs/div.
13. Set dynamic load for a transient step of about 40A at
1kHz with 50% duty cycle.
Initial Transient Setting
19. With dynamic load still set at maximum step size,
expand scope time scale to see 2µs/div to 5µs/div. You
will see a waveform that may have two overshoots and
one minor undershoot (see Figure 9). Here, VDROOP is
the final desired value.
14. Measure output waveform (may have to use DC offset
on scope to see waveform). Try to use vertical scale of
100 mV/div or finer.
15. You will see a waveform that looks something like
Figure 8. Use the horizontal cursors to measure VACDRP
and VDCDRP as shown.
DO NOT MEASURE THE UNDERSHOOT OR OVER-
SHOOT THAT HAPPENS IMMEDIATELY AFTER THE
STEP.
Figure 9. Transient Setting Waveform
20. If both overshoots are larger than desired, try making the
following adjustments in this order. (NOTE: If these
adjustments do not change the response, you are limited
by the output decoupling.) Check the output response
each time you make a change as well as the switching
nodes (to make sure it is still stable).
Figure 8. AC Loadline Waveform
a. Make ramp resistor larger by 25% (RRAMP).
16. If the VACDRP and VDCDRP are different by more than a
couple of millivolts, use Equation 38 to adjust CCS. You
may need to parallel different values to get the right one
since there are limited standard capacitor values avail-
able (it is a good idea to have locations for two capaci-
tors in the layout for this).
b. For VTRAN1, increase CB or increase switching fre-
quency.
c. For VTRAN2, increase RA and decrease CA by 25%.
21. For load release (see Figure 10), if VTRANREL is larger
than VTRAN1 (see Figure 9), you do not have enough
output capacitance. You will either need more capaci-
tance or to make the inductor values smaller (if you
change inductors, you need to start the design over using
the spreadsheet and this tuning procedure).
VACDRP
VDCDRP
(38)
CCS(NEW ) = CCS(OLD)
×
17. Repeat Steps 11 to 13 and repeat adjustments if
necessary. Once complete, do not change CCS for the
rest of the procedure.
26
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
General Recommendations
• For good results, at least a four-layer PCB is
recommended. This should allow the needed versatility
for control circuitry interconnections with optimal
placement, power planes for ground, input, and output
power, and wide interconnection traces in the rest of the
power delivery current paths. Keep in mind that each
square unit of 1 ounce copper trace has a resistance of
~0.53 mΩ at room temperature.
• Whenever high currents must be routed between PCB
layers, vias should be used liberally to create several
parallel current paths so that the resistance and inductance
introduced by these current paths is minimized and the via
current rating is not exceeded.
Figure 10. Transient Setting Waveform
• If critical signal lines (including the output voltage sense
lines of the FAN5019) must cross through power circuitry,
it is best if a signal ground plane can be interposed
between those signal lines and the traces of the power
circuitry to serves as a shield to minimize noise injection
into the signals..
Since the FAN5019 turns off all of the phases (switches
inductors to ground), there is no ripple voltage present
during load release. Thus, you do not have to add headroom
for ripple, allowing your load release VTRANREL to be larger
than VTRAN1 by that amount and still be meeting spec. If
VTRAN1 and VTRANREL are less than the desired final droop,
this implies that capacitors can be removed. When removing
capacitors, make sure to check the output ripple voltage as
well to make sure it is still within spec.
• An analog ground plane should be used both around and
under the FAN5019 for ground connections to the
components associated with the controller. This plane
should be tied to the nearest output decoupling capacitor
ground and should not tie to any other power circuitry to
prevent power currents from flowing in it.
Layout and Component Placement
The following guidelines are recommended for optimal
performance of a switching regulator in a PC system.
Key layout issues are illustrated in Figure 11.
• The components around the FAN5019 should be located
close to the controller with short traces. The most
important traces to keep short and away from other traces
are the FB and CSSUM pins.
• The output capacitors should be connected as close as
possible to the load (or connector) that receives the power
(e.g., a microprocessor core). If the load is distributed, the
capacitors should also be distributed, and generally in
proportion to where the load tends to be more dynamic.
Power Circuitry
• The switching power path should be routed on the PCB to
encompass the shortest possible length in order to
minimize radiated switching noise energy (i.e., EMI) and
conduction losses in the board. Failure to take proper
precautions often results in EMI problems for the entire
PC system as well as noise related operational problems
in the power converter control circuitry. The switching
power path is the loop formed by the current path through
the input capacitors and the power MOSFETs including
all interconnecting PCB traces and planes. The use of
short and wide interconnection traces is especially critical
in this path for two reasons: it minimizes the inductance in
the switching loop, which can cause high-energy ringing,
and it accommodates the high current demand with
minimal voltage loss. Avoid crossing any signal lines over
the switching power path loop, described below.
Figure 11. Layout Recommendations
REV. 1.0.7 1/5/04
27
FAN5019
PRODUCT SPECIFICATION
• Whenever a power dissipating component (e.g., a power
MOSFET) is soldered to a PCB, the liberal use of vias,
both directly on the mounting pad and immediately
surrounding it, is recommended. Two important reasons
for this are: improved current rating through the vias, and
improved thermal performance from vias extended to the
opposite side of the PCB where a plane can more readily
transfer the heat to the air. Make a mirror image of any
pad being used to heatsink the MOSFETs on the opposite
side of the PCB to achieve the best thermal dissipation to
the air around the board. To further improve thermal
performance, the largest possible pad area should be used.
Signal Circuitry
• The output voltage is sensed and regulated between the
FB pin and the FBRTN pin (which connects to the signal
ground at the load). In order to avoid differential mode
noise pickup in the sensed signal, the loop area should be
small. Thus the FB and FBRTN traces should be routed
adjacent to each other atop the power ground plane back
to the controller.
• The feedback traces from the switch nodes should be
connected as close as possible to the inductor. The CSREF
signal should be connected to the output voltage at the
nearest inductor to the controller.
• The output power path should also be routed to
encompass a short distance. The output power path is
formed by the current path through the inductor, the
output capacitors, and the load.
• For best EMI containment, a solid power ground plane
should be used as one of the inner layers extending fully
under all the power components.
28
REV. 1.0.7 1/5/04
PRODUCT SPECIFICATION
FAN5019
Mechanical Dimensions
28-Pin TSSOP
9.7 ± 0.1
0.51 TYP
28
15
– B –
0.2
B A
0.65
0.42
14
ALL Lead Tips
PIN # 1 IDENT
LAND PATTERN RECOMMENDATION
1.2 MAX
0.1 C
+0.15
–0.10
0.90
See Detail A
ALL LEAD TIPS
0.09–0.20
– C –
0.10 ± 0.05
0.65
0.19–0.30
0.13
A B
C
12.00° Top & Botom
R0.16
R0.31
GAGE PLANE
.025
DIMENSIONS ARE IN MILLIMETERS
0°–8°
0.61 ± 0.1
NOTES:
SEATING PLANE
A. Conforms to JEDEC registration MO-153, variation AB,
Ref. Note 6, dated 7/93.
1.00
B. Dimensions are in millimeters.
C. Dimensions are exclusive of burrs, mold flash, and tie bar extensions.
D Dimensions and Tolerances per ANsI Y14.5M, 1982
DETAIL A
REV. 1.0.7 1/5/04
29
FAN5019
PRODUCT SPECIFICATION
Ordering Information
Part Number
FAN5019MTC
FAN5019MTCX
Temperature Range
0°C to +85°C
Package
TSSOP-28
TSSOP-28
Packing
Rail
0°C to +85°C
Tape and Reel
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
1/5/04 0.0m 005
Stock#DS30005019
2003 Fairchild Semiconductor Corporation
相关型号：
FAN5026MTCX_NL
Dual Switching Controller, Current-mode, 345kHz Switching Freq-Max, PDSO28, LEAD FREE, MO-153AB, TSSOP-28
FAIRCHILD
©2020 ICPDF网 联系我们和版权申明