FAN1112SX_NL [FAIRCHILD]
Fixed Positive LDO Regulator, 1.2V, 1.2V Dropout, BIPolar, PDSO4, PLASTIC, SOT-223, 4 PIN;
| 型号： | FAN1112SX_NL |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Fixed Positive LDO Regulator, 1.2V, 1.2V Dropout, BIPolar, PDSO4, PLASTIC, SOT-223, 4 PIN 稳压器 |
| 文件： | 总8页 (文件大小：41K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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FAN1 1 1 2
1 A 1 .2 V Lo w Dro p o u t Lin e a r Re g u la t o r
Features
Description
• Low dropout voltage
• Load regulation: 0.05% typical
• Trimmed current limit
• On-chip thermal limiting
• Standard SOT-223 and TO-252 packages
• Three-terminal fixed 1.2V
The FAN1112 is a 1.2V low dropout three-terminal
regulator with 1A output current capability. The device has
been optimized for low voltage where transient response and
minimum input voltage are critical.
Current limit is trimmed to ensure specified output current
and controlled short-circuit current. On-chip thermal limiting
provides protection against any combination of overload and
ambient temperatures that would create excessive junction
temperatures.
Applications
• Post regulator for switching supplies
• Supply for low-voltage processors
Unlike PNP type regulators where up to 10% of the output
current is wasted as quiescent current, the quiescent current
of the FAN1112 flows into the load, increasing efficiency.
The FAN1112 regulator is available in the industry-standard
SOT-223 and TO-252 (DPAK) power packages.
Typical Application
FAN1112
VIN = 3.3V
VIN
VOUT
1.2V at 1A
+
+
10µF
22µF
GND
REV. 1.0.1 9/27/01
PRODUCT SPECIFICATION
FAN1112
Pin Assignments
Front View
Tab is VOUT
Front View
3
2
IN
Tab is
VOUT
1
2
3
OUT
1
GND
GND OUT IN
4-Lead Plastic SOT-223
3-Lead Plastic TO-252
ΘJC = 15°C/W*
ΘJC = 3°C/W*
*With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane., ΘJA can vary from
30°C/W to more than 50°C/W. Other mounting techniques may provide better thermal resistance than 30°C/W.
Absolute Maximum Ratings
Parameter
Min.
Max.
18
Unit
VIN
V
(VIN – VOUT) * IOUT
See Figure 1
125
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
0
°C
°C
°C
-65
150
300
1.2
1.0
0.8
0.6
0.4
0.2
0
0
2
4
6
8
10
12
14
16
18
20
VIN – VOUT (V)
Figure 1. Absolute Maximum Safe Operating Area
2
REV. 1.0.1 9/27/01
FAN1112
PRODUCT SPECIFICATION
Electrical Characteristics
Operating Conditions: VIN ≤ 7V, TJ = 25°C unless otherwise specified.
The • denotes specifications which apply over the specified operating temperature range.
Parameter
Output Voltage3
Conditions
10mA ≤ IOUT ≤ 1A
Min.
Typ.
Max. Units
FAN1112, 3.0V ≤ VIN ≤ 7.2V
3.0V ≤ VIN ≤ 12V, IOUT = 10mA
(VIN – VOUT) = 2V, 10mA ≤ IOUT ≤ 1A
∆VREF = 1%, IOUT = 1A
•
•
•
•
•
•
•
•
•
1.140
1.200
0.005
0.05
1.100
1.5
1.260
0.2
V
%
Line Regulation1,2
Load Regulation1,2
Dropout Voltage
0.5
%
1.200
V
Current Limit
(VIN – VOUT) = 2V
1.1
A
GND Pin Current
GND Pin Current Change
Minimum Load Current
Quiescent Current
Ripple Rejection
35
120
5
µA
µA
mA
mA
dB
3.0V ≤ VIN ≤ 7V, 10mA ≤ IOUT ≤ 1A
3.0V ≤ VIN ≤ 15V
0.2
10
60
VIN = 7V
4
13
f = 120Hz, COUT = 22µF Tantalum,
(VIN – VOUT) = 3V, IOUT = 1A
72
Thermal Regulation
Temperature Stability
Long-Term Stability
RMS Output Noise
TA = 25°C, 30ms pulse
0.004
0.5
0.02
1.0
%/W
%
•
TA = 125°C, 1000hrs.
0.03
0.003
%
TA = 25°C, 10Hz ≤ f ≤ 10kHz
%
(% of VOUT
)
Thermal Resistance, Junction SOT-223
15
3
°C/W
°C/W
°C
to Case
TO-252
Thermal Shutdown
Junction Temperature
155
10
Thermal Shutdown
Hysteresis
°C
Notes:
1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are
measured at a constant junction temperature by low duty cycle pulse testing.
2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by
input/output differential and the output current. Guaranteed maximum output power will not be available over the full input/
output voltage range.
3. Output current must be limited to meet the absolute maximum ratings of the part.
REV. 1.0.1 9/27/01
3
PRODUCT SPECIFICATION
FAN1112
Typical Performance Characteristics
1.5
1.4
0.10
0.05
0
∆I = 1A
1.3
1.2
1.1
T = 0°C
1.0
0.9
0.8
0.7
0.6
0.5
0
J
-0.05
-0.10
T = 25°C
J
T = 125°C
J
-0.15
-0.20
0
0.2
0.4
0.6
0.8
1.0
-75 -50 -25
0
25 50 75 100 125150 175
OUTPUT CURRENT (A)
JUNCTION TEMPERATURE (°C)
Figure 2. Dropout Voltage vs. Output Current
Figure 3. Load Regulation vs. Temperature
1.225
1.220
1.215
1.210
1.205
1.200
1.195
1.190
1.185
1.180
1.175
5
4
3
2
1
0
-75 -50 -25
0
25 50 75 100 125150 175
-75 -50 -25
0
25 50 75 100 125150 175
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 4. Reference Voltage vs. Temperature
Figure 5. Minimum Load Current vs. Temperature
100
90
80
70
60
50
40
30
20
10
0
2.0
1.75
1.5
1.25
1.0
-75 -50 -25
-75 -50 -25
0
25 50 75 100 125150 175
0
25 50 75 100 125150 175
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 6. GND Pin Current vs. Temperature
Figure 7. Short-Circuit Current vs. Temperature
4
REV. 1.0.1 9/27/01
FAN1112
PRODUCT SPECIFICATION
Typical Performance Characteristics (continued)
90
80
70
60
50
10
7.5
5
TO-252
40
30
SOT-223
2.5
(VIN - VOUT) = 3V
0.5 < VRIPPLE < 2V
IOUT = 1A
20
10
0
0
25
10
100
1K
FREQUENCY (Hz)
Figure 8. Ripple Rejection vs. Frequency
10K
100K
45
CASE TEMPERATURE (°C)
Figure 9. Maximum Power Dissipation
65
85
105
125
REV. 1.0.1 9/27/01
5
PRODUCT SPECIFICATION
FAN1112
Mechanical Dimensions
4-Lead SOT-223 Package
Inches
Millimeters
Symbol
Notes
Min.
Max.
Min.
Max.
A
A1
B
c
—
—
.071
.181
.033
.090
.264
.148
.124
.041
.287
—
—
—
1.80
4.80
.840
2.29
6.71
3.71
3.15
1.04
7.29
—
.025
—
.640
—
D
E
e
.248
.130
.115
.033
.264
.012
—
6.30
3.30
2.95
.840
6.71
.310
—
F
H
I
10°
10°
J
10°
16°
10°
16°
K
L
.0008
10°
.0040
16°
.0203
10°
.1018
16°
M
N
.010
.014
.250
.360
D
e
K
A
E
H
N
J
I
M
L
B
A1
c
F
6
REV. 1.0.1 9/27/01
FAN1112
PRODUCT SPECIFICATION
Mechanical Dimensions (continued)
3-Lead TO-252 Package
Notes:
Inches
Millimeters
Symbol
Notes
1. Dimensions are exclusive of mold flash, metal burrs or interlead
protrusion.
Min.
Max.
Min.
Max.
A
.086
.025
.030
.205
.018
.018
.094
.035
2.19
0.64
0.76
5.21
0.46
0.46
2.39
0.89
2. Stand off-height is measured from lead tip with ref. to Datum -B-.
3. Foot length is measured with ref. to Datum -A- with lead surface.
4. Thermal pad contour optional within dimension b3 and L3.
b
b2
b3
c
.045
.215
.024
.023
1.14
5.46
0.61
0.58
4
5. Formed leads to be planar with respect to one another at seating
place -C-.
c2
D
.210
.250
.245
.265
5.33
6.35
6.22
6.73
1
1
E
6. Dimensions and tolerances per ASME Y14.5M-1994.
e
.090 BSC
2.29 BSC
H
.370
.055
.410
.070
9.40
1.40
10.41
1.78
L
3
4
.108 REF
2.74 REF
L1
L3
L4
.035
.025
.080
.040
0.89
0.64
2.03
1.02
E
@PKG/
@HEATSINK
b3
L3
c2
D
E-PIN
L4
H
b2
L1
L
b
e
α = 0° – 10°
-B- -A-
A
-C-
REV. 1.0.1 9/27/01
7
PRODUCT SPECIFICATION
FAN1112
Ordering Information
Product Number
FAN1112D
Package
TO-252
FAN1112S
SOT-223
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
9/27/01 0.0m 007
Stock#DS30001112
2001 Fairchild Semiconductor Corporation
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