CNY17F2300W_NL [FAIRCHILD]
Transistor Output Optocoupler, 1-Element, 5300V Isolation, LEAD FREE, DIP-6;型号: | CNY17F2300W_NL |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Transistor Output Optocoupler, 1-Element, 5300V Isolation, LEAD FREE, DIP-6 输出元件 光电 |
文件: | 总15页 (文件大小:583K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
October 2005
CNY171, CNY172, CNY173, CNY174, CNY17F1, CNY17F2,
CNY17F3, CNY17F4, MOC8101, MOC8102, MOC8103,
MOC8104, MOC8105, MOC8106, MOC8107, MOC8108
Phototransistor Optocouplers
Features
Applications
■ CNY171/2/3/4 and CNY17F1/2/3/4 are also available in
■ Power supply regulators
white package by specifying M suffix (eg. CNY17F2M)
■ Digital logic inputs
■ UL recognized (File # E90700)
■ Microprocessor inputs
■ Appliance sensor systems
■ Industrial controls
■ VDE recognized
– Add option V for white package (e.g., CNY17F2VM)
– File #102497
– Add option ‘300’ for black package (e.g., CNY17F2300)
– File #94766
Description
The CNY17, CNY17F and MOC810X devices consist of a
Gallium Arsenide IRED coupled with an NPN phototransistor
in a dual in-line package.
■ Current transfer ratio in select groups
■ High BV
—70V minimum (CNY17X/M, CNY17FX/M,
CEO
MOC8106/7/8)
■ Closely matched current transfer ratio (CTR) minimizes unit-
to-unit variation.
■ Very low coupled capacitance along with no chip to pin 6
base connection for minimum noise susceptability
(CNY17FX/M, MOC810X)
White Package (-M Suffix)
Black Package (No -M Suffix)
6
6
1
6
6
1
1
1
6
6
1
1
Schematic
1
2
6
1
2
6
BASE
ANODE
NC
ANODE
CATHODE
5 COLLECTOR
4 EMITTER
CATHODE
5 COLLECTOR
4 EMITTER
3
3
NC
NC
CNY17F1/2/3/4
CNY171/2/3/4
CNY17F1M/2M/3M/4M
CNY17F1M/2M/3M/4M
MOC8101/2/3/4/5/6/7/8
©2004 Fairchild Semiconductor Corporation
CNY17X, CNY17FX, MOC810X Rev. 1.0.5
1
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Absolute Maximum Ratings
Parameters
Symbol
Device
Value
Units
°C
TOTAL DEVICE
Storage Temperature
T
M
non M
M
-40 to +150
-55 to +150
-40 to +100
-55 to +100
260 for 10 sec
250
STG
Operating Temperature
T
°C
OPR
non M
All
Lead Solder Temperature
T
°C
SOL
Total Device Power Dissipation @ 25°C (LED plus detector)
P
M
mW
D
non M
M
250
Derate Linearly From 25°C
2.94
mW/°C
mA
non M
3.30
EMITTER
Continuous Forward Current
I
M
non M
All
60
100
6
F
Reverse Voltage
V
V
A
R
Forward Current - Peak (1 µs pulse, 300 pps)
I (pk)
M
1.5
1.0
120
150
1.41
1.8
F
non M
M
LED Power Dissipation 25°C Ambient
Derate Linearly From 25°C
P
mW
D
non M
M
mW/°C
non M
DETECTOR
Continuous Collector Current
Collector-Emitter Voltage
I
All
50
70
mA
V
C
V
V
CNY17X/M,CNY17FX/M,
MOC8106/7/8
CEO
MOC8101/2/3/4/5
30
7
V
V
Emitter Collector Voltage
All
M
ECO
Detector Power Dissipation @ 25°C
P
150
150
1.76
2.0
mW
D
non M
M
Derate Linearly from 25°C
mW/°C
non M
(1)
Electrical Characteristics (T = 25°C Unless otherwise specified.)
A
Individual Component Characteristics
Parameters
EMITTER
Test Conditions
Symbol
Device
Min
Typ Max Units
Input Forward Voltage
I = 60 mA
V
CNY17FX/M
CNY17X/M
1.0
1.0
1.35
1.65
1.50
V
F
F
I = 10 mA
MOC810X
1.15
18
F
Capacitance
V = 0 V, f = 1.0 MHz
C
All
All
pF
µA
F
J
Reverse Leakage Current
V
= 6 V
I
0.001
10
R
R
2
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Individual Component Characteristics (Continued)
Parameters
Test Conditions
Symbol
Device
Min
Typ Max Units
DETECTOR
Breakdown Voltage
Collector to Emitter
MOC8101/2/3/4/5
30
70
100
100
V
I
= 1.0 mA, I = 0
BV
C
F
CEO
MOC8106/7/8
CNY17F1/2/3/4/M
CNY171/2/3/4/M
Collector to Base
I
I
= 10 µA, I = 0
BV
BV
CNY171/2/3/4/M
All
70
7
120
10
C
E
F
CBO
ECO
Emitter to Collector
= 100 µA, I = 0
F
Leakage Current
Collector to Emitter
V
V
= 10 V, I = 0
I
I
All
1
50
20
nA
nA
CE
CB
F
CEO
CBO
Collector to Base
= 10 V, I = 0
CNY171/2/3/4/M
F
Capacitance
Collector to Emitter
V
V
V
= 0, f = 1 MHz
= 0, f = 1 MHz
= 0, f = 1 MHz
C
All
8
pF
pF
pF
CE
CB
EB
CE
CB
EB
Collector to Base
Emitter to Base
C
CNY171/2/3/4/M
CNY171/2/3/4/M
20
10
C
Isolation Characteristics
Characteristic
Test Conditions Symbol
Device
Black Package
‘M’ White Package
All
Min Typ** Max
Units
Vac(rms)*
Vac(pk)
Ω
Input-Output Isolation Voltage f = 60 Hz, t = 1 min. (4)
f = 60 Hz, t = 1 sec. (4)
V
5300
ISO
7500
11
Isolation Resistance
Isolation Capacitance
V
V
= 500 VDC (4)
R
C
10
I-O
I-O
ISO
ISO
= Ø, f = 1 MHz (4)
Black Package
‘M’ White Package
0.5
0.2
pF
Note
* 5300 Vac(rms) for 1 minute equates to approximately 9000 Vac (pk) for 1 second
** Typical values at T = 25°C
A
3
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
(1)
Transfer Characteristics (T = 25°C Unless otherwise specified.)
A
DC Characteristics
Coupled
Test Conditions Symbol Min Typ Max Units
(2)
Output Collector
Current
MOC8101
(I = 10 mA, V = 10 V) (CTR)
50
73
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
80
%
F
CE
MOC8102
117
173
256
133
150
300
600
80
MOC8103
108
160
65
MOC8104
MOC8105
MOC8106
50
MOC8107
100
250
40
MOC8108
CNY17F1/1M
CNY17F2/2M
CNY17F3/3M
CNY17F4/4M
CNY171/1M
CNY172/2M
CNY173/3M
CNY174/4M
CNY17XM/FXM
(I = 10 mA, V = 5 V)
F CE
63
125
200
320
80
100
160
40
63
125
200
320
0.4
100
160
—
Collector-Emitter
Saturation Voltage
(I = 2.5 mA, I = 10 mA)
V
CE(sat)
V
V
C
F
MOC8101/2/3/4/5/
6/7/8
(I = 500 µA, I = 5.0 mA)
C F
CNY17X/FX
(I = 10 mA, I = 2.5 mA)
—
—
0.3
F
C
(3)
AC Characteristics
Test Conditions Symbol Min Typ* Max Units
Non-Saturated Switching Time
Turn-On Time
MOC8101/2/3/4/5
MOC8106/7/8
CNY17X/FX
(I = 2.0 mA, V = 10 V, R = 100 Ω)
t
—
2
20
—
µs
C
CC
L
on
10
20
—
Turn-Off Time
MOC8101/2/3/4/5
MOC8106/7/8
CNY17X/FX
(I = 2.0 mA, V = 10 V, R = 100 Ω)
C CC L
t
—
3
off
10
5.6
—
Delay Time
Rise Time
(I = 10 mA, V = 5 V, R = 75 Ω)
t
t
—
—
—
—
—
—
—
1
µs
µs
CNY17XM/FXM
All Devices
F
CC
L
d
(I = 2.0 mA, V = 10 V, R = 100 Ω)
t
C
CC
L
r
(I = 10 mA, V = 5 V, R = 75 Ω)
—
—
2
4.0
4.1
—
CNY17XM/FXM
CNY17XM/FXM
All Devices
F
CC
L
Storage Time
Fall Time
(I = 10 mA, V = 5 V, R = 75 Ω)
F CC L
µs
µs
s
(I = 2.0 mA, V = 10 V, R = 100 Ω)
t
f
C
CC
L
CNY17XM/FXM
(I = 10 mA, V = 5 V, R = 75 Ω)
—
3.5
F
CC
L
4
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
(1)
Transfer Characteristics (continued) (T = 25°C Unless otherwise specified.)
A
(3)
AC Characteristics
Test Conditions Symbol Min Typ Max Units
Saturated Switching Times
Turn-on Time
CNY171/F1
(I = 20 mA, V = 0.4 V)
t
on
—
—
—
—
5.5
8.0
µs
F
CE
CNY172/F2
CNY173/F3
CNY174/F4
(I = 10 mA, V = 0.4 V)
F CE
Rise Time
CNY171/F1
(I = 20 mA, V = 0.4 V)
t
r
—
—
—
—
4.0
6.0
µs
F
CE
CNY172/F1
CNY173/F3
CNY174/F4
(I = 10 mA, V = 0.4 V)
F CE
CNY171M/F1M
(I = 20 mA, V = 5 V, R = 1 KΩ)
—
—
—
—
4.0
6.0
F
CC
L
CNY172M/3M/4M
(I = 10 mA, V
= 5 V, R = 1 KΩ)
F
CC
L
CNY17F2M/F3M/F4M
Delay Time
CNY171M/F1M
(I = 20 mA, V = 5 V, R =1 KΩ)
—
—
—
—
5.5
8.0
µs
µs
F
CC
L
t
CNY172M/3M/4M
CNY17F2M/F3M/F4M
(I = 10 mA, V = 5 V, R =1 KΩ)
F CC L
d
Turn-off Time
CNY171/F1
(I = 20 mA, V = 0.4 V)
t
—
—
—
—
34
39
F
CE
off
CNY172/F2
CNY173/F3
CNY174/F4
(I = 10 mA, V = 0.4 V)
F CE
Fall Time
CNY171/F1
(I = 20 mA, V = 0.4 V)
t
f
—
—
—
—
20
24
µs
F
CE
CNY172/F2
CNY173/F3
CNY174/F4
(I = 10 mA, V = 0.4 V)
F CE
CNY171M/F1M
(I = 20 mA, V = 5V, R = 1KΩ)
—
—
—
—
20.0
24.0
F
CC
L
µs
µs
CNY172M/3M/4M
(I = 10 mA, V = 5V, R = 1KΩ)
F CC L
CNY17F2M/F3M/F4M
Storage Time
CNY171M/F1M
(I = 20 mA, V = 5V, R = 1KΩ)
—
—
—
—
34.0
39.0
F
CC
L
t
CNY172M/3M/4M
(I = 10 mA, V = 5V, R = 1KΩ)
F CC L
s
CNY17F2M/F3M/F4M
** All typicals at T = 25°C
A
Notes:
1. Always design to the specified minimum/maximum electrical limits (where applicable).
2. Current Transfer Ratio (CTR) = I /I x 100%.
C
F
3. For test circuit setup and waveforms, refer to Figures 20.
4, For this test, Pins 1 and 2 are common, and Pins 4 are 5 are common.
5
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Fig.1 Normalized CTR vs. Forward Current
(Black Package)
Fig.2 Normalized CTR vs. Forward Current
(White Package)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
V
T
= 5.0V
CE
= 25˚C
V
T
= 5.0V
CE
= 25˚C
Normalized to
= 10 mA
Normalized to
I = 10 mA
F
I
A
A
F
0
5
10
15
20
0
2
4
6
8
10
12
14
16
18
20
I
- FORWARD CURRENT (mA)
I - FORWARD CURRENT (mA)
F
F
Fig. 3 Normalized CTR vs. Ambient Temperature
(Black Package)
Fig. 4 Normalized CTR vs. Ambient Temperature
(White Package)
1.6
1.4
1.4
1.2
1.0
0.8
0.6
0.4
1.2
1.0
0.8
0.6
0.4
0.2
I
= 5 mA
I = 5 mA
F
F
I
= 10 mA
F
I
= 10 mA
F
I
= 20 mA
F
Normalized to
= 10 mA
Normalized to
I = 10 mA
F
I
= 20 mA
25
F
I
F
T
= 25˚C
T
= 25˚C
A
A
-75
-50
-25
0
50
75
100
125
-60
-40
-20
0
20
40
60
80
100
T
- AMBIENT TEMPERATURE (˚C)
T - AMBIENT TEMPERATURE (˚C)
A
A
Fig. 5 CTR vs. RBE (Unsaturated)
(Black Package)
Fig. 6 CTR vs. RBE (Unsaturated)
(White Package)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
I
= 20 mA
F
V
= 5.0 V
CE
I
= 10 mA
F
I
I
= 20 mA
= 10 mA
F
F
I
= 5 mA
F
I
= 5 mA
F
V
= 5.0 V
CE
10
100
1000
10
100
1000
R
- BASE RESISTANCE (kΩ)
R
BE
- BASE RESISTANCE (kΩ)
BE
6
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Fig. 7 CTR vs. RBE (Saturated)
(Black Package)
Fig. 8 CTR vs. RBE (Saturated)
(White Package)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
V
CE
= 0.3 V
V
CE
= 0.3 V
I
I
= 20 mA
= 10 mA
F
I
= 20 mA
= 10 mA
F
F
I
F
I
F
= 5 mA
I
F
= 5 mA
10
100
1000
10
100
1000
R
- BASE RESISTANCE (k Ω)
BE
R
- BASE RESISTANCE (k Ω)
BE
Fig. 10 Switching Speed vs. Load Resistor
(White Package)
Fig. 9 Switching Speed vs. Load Resistor
(Black Package)
1000
100
10
1000
100
10
I
V
T
= 10 mA
= 10 V
I
V
T
= 10 mA
= 10 V
F
F
CC
CC
= 25˚C
= 25˚C
A
A
T
T
T
T
off
off
T
f
T
f
on
on
T
r
1
T
r
1
0.1
0.1
0.1
1
10
100
0.1
1
10
100
R-LOAD RESISTOR (kΩ)
R-LOAD RESISTOR (kΩ)
Fig. 11 Normalized t vs. R
on
Fig. 12 Normalized t vs. R
on
BE
BE
(Black Package)
(White Package)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
V
10 V
= 2 mA
= 100 Ω
V
10 V
= 2 mA
= 100 Ω
CC =
CC =
I
I
C
L
C
L
R
R
10
100
1000
10000
100000
10
100
1000
10000
100000
R
- BASE RESISTANCE (k Ω)
BE
R
- BASE RESISTANCE (k Ω)
BE
7
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Fig. 13 Normalized t vs. R
off
Fig. 14 Normalized t vs. R
off
BE
BE
(Black Package)
(White Package)
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
V
I
10 V
= 2 mA
= 100 Ω
V
10 V
CC =
= 2 mA
= 100 Ω
CC =
I
C
C
L
R
R
L
10
100
1000
10000
100000
10
100
1000
10000
100000
R
BE
- BASE RESISTANCE (k Ω)
R
BE
- BASE RESISTANCE (k Ω)
Fig. 15 LED Forward Voltage vs. Forward Current
(Black Package)
Fig. 16 LED Forward Voltage vs. Forward Current
(White Package)
1.8
1.7
1.6
1.5
1.4
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
T
T
= -55°C
= 25°C
T
T
T
= -55°C
= 25°C
= 100°C
A
A
A
1.3
1.2
1.1
1.0
A
A
T
= 100°C
A
1
10
100
1
10
100
I
F
- LED FORWARD CURRENT (mA)
I
- LED FORWARD CURRENT (mA)
F
Fig. 18 Collector-Emitter Saturation Voltage vs Collector Current
(White Package)
Fig. 17 Collector-Emitter Saturation Voltage vs Collector Current
(Black Package)
100
10
1
100
T
= 25˚C
A
10
1
I
= 2.5 mA
I = 2.5 mA
F
F
0.1
0.01
0.1
I
= 20 mA
F
I
= 10 mA
F
I
= 20 mA
F
0.01
I
= 5 mA
0.1
F
I
= 5 mA
F
I
= 10 mA
F
T
= 25˚C
A
0.001
0.001
0.01
1
10
0.01
0.1
1
10
I
- COLLECTOR CURRENT (mA)
C
I
- COLLECTOR CURRENT (mA)
C
8
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Fig. 19 Dark Current vs. Ambient Temperature
(Black Package)
1
0
10
V
CE
= 10 V
10
-1
10
10
10
10
10
10
-2
-3
-4
-5
-6
0
25
50
75
100
125
T
- AMBIENT TEMPERATURE (°C)
A
VCC
INPUT PULSE
10%
RL
OUTPUT PULSE
IC
IF
90%
td
ts
INPUT
OUTPUT (V
)
CE
tf
tr
ton
toff
Figure 21. Switching Time Test Circuit
Figure 20. Switching Time Test Circuit
9
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Black Package (No -M Suffix)
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
PIN 1
ID.
PIN 1
ID.
3
1
0.270 (6.86)
0.240 (6.10)
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
6
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
0.200 (5.08)
0.115 (2.92)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
MIN
0.016 (0.40) MIN
0.020 (0.51)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
MIN
0.100 (2.54)
TYP
0.315 (8.00)
MIN
0.016 (0.40)
0.008 (0.20)
0.405 (10.30)
MAX
0.300 (7.62)
TYP
0.022 (0.56)
0.016 (0.41)
0° to 15°
Lead Coplanarity : 0.004 (0.10) MAX
0.100 (2.54)
TYP
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
(Black Package Only)
PIN 1 ID
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.200 (5.08)
0.135 (3.43)
0.030 (0.76)
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.004 (0.10)
MIN
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
TYP
0.100 (2.54) TYP
NOTE
All dimensions are in inches (millimeters)
10
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
White Package (-M Suffix)
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
Pin 1 ID
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.100 (2.54)
0.015 (0.38)
0.025 (0.63)
0.020 (0.51)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
15°
0.035 (0.88)
0.012 (0.30)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
(White Package Only)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.200 (5.08)
0.115 (2.93)
0.030 (0.76)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
11
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Ordering Information
Black Package Part
Number Example
(No Suffix)
White Package Part
Number Example
(M Suffix)
Description
CNY171S
CNY171SD
CNY171W
CNY171SM
CNY171SR2M
CNY171TM
Surface Mount Lead Bend
Surface Mount; Tape and reel
0.4" Lead Spacing
CNY171300
CNY171300W
CNY1713S
CNY1713SD
CNY171VM
VDE Approved
CNY171TVM
CNY171SVM
CNY171SR2VM
VDE Approved, 0.4" Lead Spacing
VDE Approved, Surface Mount
VDE Approved, Surface Mount, Tape & Reel
Carrier Tape Specifications (Black Package, No Suffix)
12.0 0.1
4.85 0.20
4.0 0.1
Ø1.55 0.05
1.75 0.10
0.30 0.05
4.0 0.1
7.5 0.1
16.0 0.3
9.55 0.20
13.2 0.2
Ø1.6 0.1
10.30 0.20
0.1 MAX
User Direction of Feed
Carrier Tape Specifications (White Package, M Suffix)
12.0 0.1
4.5 0.20
2.0 0.05
Ø1.5 MIN
1.75 0.10
0.30 0.05
4.0 0.1
11.5 1.0
24.0 0.3
9.1 0.20
21.0 0.1
Ø1.5 0.1/-0
10.1 0.20
0.1 MAX
User Direction of Feed
12
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Marking Information (Black package non ‘M’ suffix)
1
2
6
CNY17-1
V XX YY K
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
Two digits year code, e.g., ‘03’; One digit year code for ‘M’
version, e.g. ‘5’
5
6
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
Reflow Profile (Black Package, No Suffix)
300
215°C, 10–30 s
250
200
150
100
50
225 C peak
Time above 183°C, 60–150 sec
Ramp up = 3C/sec
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
13
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
Marking Information (White package M suffix)
1
2
6
CNY17-1
V X YY Q
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
Single digit year code, e.g. ‘5’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
Reflow Profile (White Package, M Suffix)
300
280
260
240
220
200
180
260°C
>245°C = 42 Sec
Time above
160
°C
183°C = 90 Sec
140
120
1.822°C/Sec Ramp up rate
100
80
60
40
20
0
33 Sec
0
60
120
180
270
360
Time (s)
14
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
PowerSaver™
SuperSOT™-8
SyncFET™
TinyLogic
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
FAST
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
PowerTrench
FASTr™
FPS™
FRFET™
GlobalOptoisolator™
GTO™
QFET
QS™
TINYOPTO™
TruTranslation™
UHC™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
SILENT SWITCHER
SMART START™
SPM™
UltraFET
HiSeC™
I2C™
UniFET™
VCX™
Wire™
MSXPro™
OCX™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
OCXPro™
OPTOLOGIC
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerEdge™
FACT Quiet Series™
Stealth™
Across the board. Around the world.™
SuperFET™
SuperSOT™-3
SuperSOT™-6
The Power Franchise
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I16
15
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CNY17X, CNY17FX, MOC810X Rev. 1.0.5
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