BS270D26Z [FAIRCHILD]

Small Signal Field-Effect Transistor, 0.4A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-92;
BS270D26Z
型号: BS270D26Z
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Small Signal Field-Effect Transistor, 0.4A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-92

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April 1995  
BS270  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
400mA, 60V. RDS(ON) = 2W @ VGS = 10V.  
High density cell design for low RDS(ON)  
These N-Channel enhancement mode field effect transistors  
are produced using Fairchild's proprietary, high cell density,  
DMOS technology. These products have been designed to  
minimize on-state resistance while provide rugged, reliable,  
and fast switching performance. They can be used in most  
applications requiring up to 500mA DC. These products are  
particularly suited for low voltage, low current applications such  
as small servo motor control, power MOSFET gate drivers,  
and other switching applications.  
.
Voltage controlled small signal switch.  
Rugged and reliable.  
High saturation current capability.  
________________________________________________________________________________  
D
G
S
Absolute Maximum Ratings  
TA = 25°C unless otherwise noted  
Symbol Parameter  
BS270  
60  
Units  
V
VDSS  
VDGR  
Drain-Source Voltage  
60  
V
Drain-Gate Voltage (RGS < 1MW)  
VGSS  
Gate-Source Voltage - Continuous  
V
±20  
±40  
- Non Repetitive (tp < 50µs)  
ID  
Drain Current - Continuous  
- Pulsed  
400  
2000  
625  
mA  
PD  
Maximum Power Dissipation  
Derate Above 25°C  
mW  
mW/°C  
°C  
5
TJ,TSTG  
TL  
Operating and Storage Temperature Range  
-55 to 150  
300  
Maximum Lead Temperature for Soldering  
Purposes, 1/16" from Case for 10 Seconds  
°C  
THERMAL CHARACTERISTICS  
Thermal Resistacne, Junction-to-Ambient  
200  
°C/W  
RqJA  
© 1997 Fairchild Semiconductor Corporation  
BS270.SAM  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
BVDSS  
IDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 10 µA  
VDS = 60 V, VGS = 0 V  
60  
V
Zero Gate Voltage Drain Current  
1
µA  
µA  
nA  
nA  
TJ = 125oC  
500  
10  
Gate - Body Leakage, Forward  
Gate - Body Leakage, Reverse  
IGSSF  
IGSSF  
VGS = 20 V, VDS = 0 V  
VGS = -20 V, VDS = 0 V  
-10  
ON CHARACTERISTICS (Note 1)  
Gate Threshold Voltage  
1
2.1  
1.2  
2
2.5  
2
V
VGS(th)  
VDS = VGS, ID = 250 µA  
VGS = 10 V, ID = 500 mA  
Static Drain-Source On-Resistance  
RDS(ON)  
W
TJ = 125oC  
3.5  
3
1.8  
0.6  
0.14  
VGS = 4.5 V, ID = 75 mA  
VGS = 10 V, ID = 500 mA  
VGS = 4.5 V, ID = 75 mA  
VGS = 10 V, VDS > 2 VDS(on)  
VGS = 4.5 V, VDS > 2 VDS(on)  
VDS > 2 VDS(on), ID = 200 mA  
VDS(ON)  
ID(ON)  
gFS  
Drain-Source On-Voltage  
On-State Drain Current  
Forward Transconductance  
1
V
0.225  
2000 2700  
mA  
mS  
400  
100  
600  
320  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
20  
11  
4
50  
25  
5
pF  
pF  
pF  
Ciss  
Coss  
Crss  
VDS = 25 V, VGS = 0 V,  
f = 1.0 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS (Note 1)  
Turn-On Time  
Turn-Off Time  
10  
10  
ns  
ns  
ton  
toff  
VDD = 30 V, ID = 500 m A,  
VGS = 10 V, RGEN = 25 W  
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
400  
2000  
1.2  
mA  
mA  
V
IS  
ISM  
Drain-Source Diode Forward Voltage  
0.88  
VSD  
VGS = 0 V, IS = 400 mA (Note 1)  
Note:  
1. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.  
BS270.SAM  
Typical Electrical Characteristics  
2
3
2.5  
2
VGS =4.0V  
VGS = 10V  
9.0  
4.5  
8.0  
5.0  
7.0  
1.5  
1
6.0  
6.0  
7.0  
8.0  
5.0  
1.5  
1
9.0  
10  
0.5  
0
4.0  
3.0  
0.5  
0
1
2
3
4
5
0
0.4  
0.8  
1.2  
1.6  
2
V
, DRAIN-SOURCE VOLTAGE (V)  
I
, DRAIN CURRENT (A)  
DS  
D
Figure 2. On-Resistance Variation with Gate Voltage  
and Drain Current.  
Figure 1. On-Region Characteristics.  
2
3
VGS = 10V  
V GS = 10V  
1.75  
1.5  
2.5  
2
ID = 500mA  
T
= 125°C  
J
1.25  
1
1.5  
1
25°C  
-55°C  
0.75  
0.5  
0.5  
0
-50  
-25  
0
T
25  
50  
75  
100  
125  
150  
0
0.4  
0.8  
1.2  
1.6  
2
, JUNCTION TEMPERATURE (°C)  
J
I
D
, DRAIN CURRENT (A)  
Figure 3. On-Resistance Variation  
with Temperature.  
Figure 4. On-Resistance Variation with Drain  
Current and Temperature.  
2
1.6  
1.2  
0.8  
0.4  
0
1.1  
T
= -55°C  
J
VDS = 10V  
25°C  
VDS = VGS  
125°C  
1.05  
1
I D = 1 mA  
0.95  
0.9  
0.85  
0.8  
-50  
-25  
0
T
25  
50  
75  
100  
125  
150  
0
2
4
6
8
10  
, JUNCTION TEMPERATURE (°C)  
V
, GATE TO SOURCE VOLTAGE (V)  
J
GS  
Figure 6. Gate Threshold Variation with  
Figure 5. Transfer Characteristics.  
Temperature.  
BS270.SAM  
Typical Electrical Characteristics (continued)  
2
1
1.1  
ID = 10µA  
VGS = 0V  
1.075  
1.05  
1.025  
1
0.5  
T
= 125°C  
J
0.1  
25°C  
0.05  
-55°C  
0.01  
0.975  
0.95  
0.925  
0.005  
0.001  
-50  
-25  
0
T
25  
50  
75  
100  
125  
150  
0.2  
0.4  
V
0.6  
0.8  
1
1.2  
1.4  
, JUNCTION TEMPERATURE (°C)  
J
, BODY DIODE FORWARD VOLTAGE (V)  
SD  
Figure 8. Body Diode Forward Voltage Variation with  
Current and Temperature.  
Figure 7. Breakdown Voltage Variation  
with Temperature.  
60  
40  
10  
VDS = 25V  
ID =500mA  
C
iss  
8
6
4
2
0
20  
10  
5
C
oss  
C
rss  
f = 1 MHz  
VGS = 0V  
2
1
1
2
3
5
10  
20  
30  
50  
0
0.4  
0.8  
1.2  
1.6  
2
V
, DRAIN TO SOURCE VOLTAGE (V)  
Q
g
, GATE CHARGE (nC)  
DS  
Figure 9. Capacitance Characteristics.  
Figure 10. Gate Charge Characteristics.  
ton  
toff  
VDD  
td(off)  
r
t
tf  
t d(on)  
90%  
90%  
RL  
VIN  
D
VOUT  
Output, V  
Input, V  
out  
10%  
90%  
10%  
VGS  
Inverted  
RGEN  
DUT  
G
50%  
in  
50%  
10%  
S
Pulse Width  
Figure 11. Switching Test Circuit.  
Figure 12. Switching Waveforms.  
BS270.SAM  
Typical Electrical Characteristics (continued)  
3
2
1
0.5  
0.1  
0.05  
V GS = 10V  
SINGLE PULSE  
TA = 25°C  
0.01  
0.005  
1
2
5
10  
20  
30  
60 80  
V
, DRAIN-SOURCE VOLTAGE (V)  
DS  
Figure 13. Maximum Safe Operating  
Area.  
1
D = 0.5  
0.2  
0.5  
R
(t) = r(t) * R  
qJA  
qJA  
= (See Datasheet)  
R
0.2  
0.1  
qJA  
0.1  
P(pk)  
0.05  
t1  
0.05  
t 2  
0.02  
T
- T = P * R  
(t)  
0.01  
J
A
q
JA  
Single Pulse  
0.02  
0.01  
Duty Cycle, D = t1 /t2  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
300  
t , TIME (sec)  
1
Figure 14. Transient Thermal Response Curve.  
BS270.SAM  
TO-92 Tape and Reel Data  
TO-92 Packaging  
Configuration: Figure 1.0  
TAPE and REEL OPTION  
See Fig 2.0 for various  
Reeling Styles  
FSCINT Label sample  
FAIRCHILD SEMICONDUCTOR CORPORATION  
HTB:B  
QTY:  
10000  
LOT:  
CBVK741B019  
NSID:  
D/C1:  
SPEC:  
PN2222N  
FSCINT  
Label  
SPEC REV:  
QA REV:  
D9842  
B2  
5 Reels per  
Intermediate Box  
(FSCINT)  
Customized  
Label  
F63TNR Label sample  
LOT: CBVK741B019  
F63TNR  
Label  
QTY: 2000  
SPEC:  
FSID: PN222N  
Customized  
Label  
D/C1: D9842  
D/C2:  
QTY1:  
QTY2:  
SPEC REV:  
CPN:  
N/F: F  
(F63TNR)3  
375mm x 267mm x 375mm  
Intermediate Box  
TO-92 TNR/AMMO PACKING INFROMATION  
AMMO PACK OPTION  
See Fig 3.0 for 2 Ammo  
Pack Options  
Packing  
Style  
A
Quantity  
2,000  
EOL code  
D26Z  
Reel  
E
2,000  
D27Z  
Ammo  
M
2,000  
D74Z  
P
2,000  
D75Z  
FSCINT  
Label  
Unit weight  
Reel weight with components  
Ammo weight with components = 1.02 kg  
= 0.22 gm  
= 1.04 kg  
Max quantity per intermediate box = 10,000 units  
5 Ammo boxes per  
Intermediate Box  
327mm x 158mm x 135mm  
Immediate Box  
Customized  
Label  
F63TNR  
Label  
Customized  
Label  
333mm x 231mm x 183mm  
Intermediate Box  
(TO-92) BULK PACKING INFORMATION  
BULK OPTION  
See Bulk Packing  
Information table  
EOL  
CODE  
LEADCLIP  
DESCRIPTION  
QUANTITY  
2.0 K / BOX  
DIMENSION  
J18Z  
TO-18 OPTION STD  
TO-5 OPTION STD  
NO LEAD CLIP  
Anti-static  
Bubble Sheets  
J05Z  
NO LEAD CLIP  
NO LEADCLIP  
1.5 K / BOX  
2.0 K / BOX  
FSCINT Label  
NO EOL  
CODE  
TO-92 STANDARD  
STRAIGHT FOR: PKG 92,  
94 (NON PROELECTRON  
SERIES), 96  
L34Z  
TO-92 STANDARD  
STRAIGHT FOR: PKG 94  
NO LEADCLIP  
2.0 K / BOX  
(PROELECTRON SERIES  
2000 units per  
EO70 box for  
std option  
114mm x 102mm x 51mm  
Immediate Box  
BCXXX, BFXXX, BSRXXX),  
97, 98  
5 EO70 boxes per  
intermediate Box  
530mm x 130mm x 83mm  
Intermediate box  
Customized  
Label  
FSCINT Label  
10,000 units maximum  
per intermediate box  
for std option  
March 2001, Rev. B1  
©2001 Fairchild Semiconductor Corporation  
TO-92 Tape and Reel Data, continued  
TO-92 Reeling Style  
Configuration: Figure 2.0  
Machine Option “A” (H)  
Machine Option “E” (J)  
Style “A”, D26Z, D70Z (s/h)  
Style “E”, D27Z, D71Z (s/h)  
TO-92 Radial Ammo Packaging  
Configuration: Figure 3.0  
FIRST WIRE OFF IS COLLECTOR  
ADHESIVE TAPE IS ON THE TOP SIDE  
FLAT OF TRANSISTOR IS ON TOP  
FIRST WIRE OFF IS EMITTER  
ADHESIVE TAPE IS ON THE TOP SIDE  
FLAT OF TRANSISTOR IS ON BOTTOM  
ORDER STYLE  
D74Z (M)  
ORDER STYLE  
D75Z (P)  
FIRST WIRE OFF IS COLLECTOR (ON PKG. 92)  
ADHESIVE TAPE IS ON BOTTOM SIDE  
FLAT OF TRANSISTOR IS ON TOP  
FIRST WIRE OFF IS EMITTER (ON PKG. 92)  
ADHESIVE TAPE IS ON BOTTOM SIDE  
FLAT OF TRANSISTOR IS ON BOTTOM  
September 1999, Rev. B  
TO-92 Tape and Reel Data, continued  
TO-92 Tape and Reel Taping  
Dimension Configuration: Figure 4.0  
Hd  
P
Pd  
b
Ha  
W1  
d
S
L
H1  
HO  
L1  
WO  
t
W2  
W
t1  
P1 F1  
P2  
DO  
ITEM DESCRIPTION  
SYMBOL  
DIMENSION  
PO  
b
0.098 (max)  
Base of Package to Lead Bend  
Component Height  
Ha  
HO  
H1  
Pd  
Hd  
P
0.928 (+/- 0.025)  
0.630 (+/- 0.020)  
0.748 (+/- 0.020)  
0.040 (max)  
User Direction of Feed  
Lead Clinch Height  
Component Base Height  
Component Alignment ( side/side )  
Component Alignment ( front/back )  
Component Pitch  
0.031 (max)  
0.500 (+/- 0.020)  
0.500 (+/- 0.008)  
0.150 (+0.009, -0.010)  
0.247 (+/- 0.007)  
0.104 (+/- 0 .010)  
0.018 (+0.002, -0.003)  
0.429 (max)  
PO  
P1  
P2  
F1/F2  
d
Feed Hole Pitch  
Hole Center to First Lead  
Hole Center to Component Center  
Lead Spread  
Lead Thickness  
L
Cut Lead Length  
L1  
t
0.209 (+0.051, -0.052)  
0.032 (+/- 0.006)  
0.021 (+/- 0.006)  
0.708 (+0.020, -0.019)  
0.236 (+/- 0.012)  
0.035 (max)  
Taped Lead Length  
Taped Lead Thickness  
Carrier Tape Thickness  
Carrier Tape Width  
t1  
W
TO-92 Reel  
Configuration: Figure 5.0  
Hold - down Tape Width  
Hold - down Tape position  
Feed Hole Position  
WO  
W1  
W2  
DO  
S
0.360 (+/- 0.025)  
0.157 (+0.008, -0.007)  
0.004 (max)  
Sprocket Hole Diameter  
Lead Spring Out  
Note : All dimensions are in inches.  
ELECTROSTATIC  
SENSITIVE DEVICES  
D4  
D1  
ITEM DESCRIPTION  
SYSMBOL MINIMUM  
MAXIMUM  
D2  
Reel Diameter  
D1  
D2  
D2  
D3  
D4  
W1  
W2  
W3  
13.975  
1.160  
0.650  
3.100  
2.700  
0.370  
1.630  
14.025  
1.200  
0.700  
3.300  
3.100  
0.570  
1.690  
2.090  
F63TNR Label  
Arbor Hole Diameter (Standard)  
(Small Hole)  
Customized Label  
Core Diameter  
Hub Recess Inner Diameter  
Hub Recess Depth  
Flange to Flange Inner Width  
Hub to Hub Center Width  
W1  
W3  
W2  
Note: All dimensions are inches  
D3  
July 1999, Rev. A  
TO-92 Package Dimensions  
TO-92; TO-18 Reverse Lead Form (J35Z Option)  
(FS PKG Code 92, 94, 96)  
1:1  
Scale 1:1 on letter size paper  
Dimensions shown below are in:  
inches [millimeters]  
Part Weight per unit (gram): 0.22  
*
;
*
Note: All package 97 or 98 transistors are leadformed  
to this configuration prior to bulk shipment. Order  
L34Z option if in-line leads are preferred on package  
97 or 98.  
* Standard Option on 97 & 98 package code  
January 2000, Rev. B  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
PowerTrench  
QFET™  
QS™  
SyncFET™  
TinyLogic™  
UHC™  
ACEx™  
FASTr™  
GlobalOptoisolator™  
GTO™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DOME™  
QT Optoelectronics™  
VCX™  
HiSeC™  
Quiet Series™  
SILENT SWITCHER  
SMART START™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
ISOPLANAR™  
MICROWIRE™  
OPTOLOGIC™  
OPTOPLANAR™  
PACMAN™  
POP™  
E2CMOSTM  
EnSignaTM  
FACT™  
FACT Quiet Series™  
FAST  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TOANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD  
DOES NOTASSUMEANY LIABILITYARISING OUT OF THEAPPLICATION OR USE OFANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
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2. A critical component is any component of a life  
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effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. G  

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