BAV19T50R [FAIRCHILD]

Rectifier Diode, 1 Element, 0.2A, 120V V(RRM), Silicon, DO-35, D2, 2 PIN;
BAV19T50R
型号: BAV19T50R
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Rectifier Diode, 1 Element, 0.2A, 120V V(RRM), Silicon, DO-35, D2, 2 PIN

文件: 总4页 (文件大小:60K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BAV19 / 20 / 21  
DO-35  
Color Band Denotes Cathode  
Small Signal Diode  
Absolute Maximum Ratings*  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Value  
Units  
VRRM  
Maximum Repetitive Reverse Voltage  
120  
200  
250  
200  
V
V
V
BAV19  
BAV20  
BAV21  
IF(AV)  
IFSM  
Average Rectified Forward Current  
mA  
Non-repetitive Peak Forward Surge Current  
Pulse Width = 1.0 second  
1.0  
4.0  
A
A
Pulse Width = 1.0 microsecond  
Storage Temperature Range  
-65 to +200  
°C  
Tstg  
TJ  
Operating Junction Temperature  
175  
°C  
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  
NOTES:  
1) These ratings are based on a maximum junction temperature of 200 degrees C.  
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.  
Thermal Characteristics  
Symbol  
Parameter  
Value  
Units  
PD  
Power Dissipation  
Thermal Resistance, Junction to Ambient  
500  
300  
mW  
RθJA  
C/W  
°
Electrical Characteristics TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Max Units  
VR  
Breakdown Voltage  
120  
200  
250  
V
V
V
BAV19  
BAV20  
BAV21  
IR = 100 µA  
I = 100  
IR = 100 µA  
IF = 100 mA  
IF = 200 mA  
VR = 100 V  
A
µ
R
VF  
IR  
Forward Voltage  
Reverse Current  
1.0  
1.25  
100  
100  
100  
100  
100  
100  
V
V
nA  
A
µ
nA  
A
µ
nA  
A
µ
BAV19  
BAV20  
BAV21  
V = 100 V, T = 150 C  
°
R
A
VR = 150 V  
V = 150 V, T = 150 C  
°
R
A
VR = 200 V  
V = 200 V, T = 150 C  
°
R
A
CT  
trr  
Total Capacitance  
VR = 0, f = 1.0 MHz  
5.0  
50  
pF  
Reverse Recovery Time  
IF = IR = 30 mA, IRR = 3.0 mA,  
ns  
RL = 100Ω  
2001 Fairchild Semiconductor Corporation  
BAV19/20/21, Rev. C  
Small Signal Diode  
(continued)  
Typical Characteristics  
50  
40  
30  
20  
10  
0
325  
Ta=25  
C
°
Ta= 25 °C  
°
300  
275  
55  
Reverse V1o0lt0age, VR [V]  
3
5
10  
20  
30  
50  
100  
Reverse Current, IR [uA]  
GENERAL RULE: The Reverse Current of a diode will approximately  
double for every ten (10) Degree C increase in Temperature  
Figure 1. Reverse Voltage vs Reverse Current  
BV - 1.0 to 100uA  
Figure 2. Reverse Current vs Reverse Voltage  
IR - 55 to 205 V  
100  
Ta= 25  
C
°
°
C
Ta= 25  
450  
400  
350  
300  
250  
90  
80  
70  
60  
50  
40  
30  
20  
180  
200  
240  
255  
Reverse Vo2lt2a0ge, VR [V]  
1
2
3
5
10  
20  
30  
50  
100  
Forward Current, IF [uA]  
GENERAL RULE: The Reverse Current of a diode will approximately  
double for every ten (10) Degree C increase in Temperature  
Figure 3. Reverse Current vs Reverse Roltage  
IR - 180 to 225 V  
Figure 4. Forward Voltage vs Forward Current  
VF - 1.0 to 100uA  
1.4  
°
C
°
Ta= 25  
Ta= 25  
C
700  
650  
600  
550  
500  
450  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
10  
20  
30  
50  
100  
200 300  
500  
800  
0.1  
0.2 0.3  
0.5  
1
2
3
5
10  
Forward Current, IF [mA]  
Forward Current, IF [mA]  
Figure 6. Forward Voltage vs Forward Current  
VF - 10 to 800mA  
Figure 5. Forward Voltage vs Forward Current  
VF - 0.1 to 10mA  
BAV19/20/21, Rev.  
C
Small Signal Diode  
(continued)  
Typical Characteristics (continued)  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
900  
800  
°
Ta= 25  
C
°
Ta= -40  
C
700  
600  
500  
400  
300  
200  
100  
°
Ta= 25  
C
°
Ta= +80  
C
0.001 0.003  
0.01  
0.03  
0.1  
0.3  
1
3
10  
0
2
4
6
8
10  
12  
14  
Forward Current, IF [mA]  
Reverse Voltage [V]  
Figure 7. Forward Voltage  
vs Ambient Temperature  
Figure 8. Total Capacitance  
VF - 1.0 uA - 10 mA (-40 to +80 Deg C)  
50  
40  
30  
20  
400  
300  
200  
100  
0
IF = IR = 30 mA  
Rloop = 100 Ohms  
1.0  
1.5  
2.0  
2.5  
3.0  
0
50  
100  
150  
Reverse Recovery Current, Irr [mA]  
Ambient Temperature, TA  
[ C]  
Figure 10. Average Rectified Current (IF(AV)  
)
Figure 9. Reverse Recovery Time vs  
Reverse Recovery Current  
versus Ambient Temperature (TA)  
500  
400  
300  
DO-35 Pkg  
SOT-23 Pkg  
200  
100  
0
0
50  
100  
150  
200  
Average Temperature, IO [ C]  
Figure 11. Power Derating Curve  
BAV19/20/21, Rev.  
C
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
â
SMART START™  
STAR*POWER™  
Stealth™  
VCX™  
FAST  
ACEx™  
Bottomless™  
CoolFET™  
OPTOLOGIC™  
OPTOPLANAR™  
PACMAN™  
FASTr™  
FRFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
GlobalOptoisolator™  
GTO™  
HiSeC™  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MicroPak™  
MICROWIRE™  
CROSSVOLT™  
DenseTrench™  
DOME™  
POP™  
Power247™  
PowerTrenchâ  
QFET™  
EcoSPARK™  
E2CMOSTM  
TinyLogic™  
QS™  
EnSignaTM  
TruTranslation™  
UHC™  
QT Optoelectronics™  
Quiet Series™  
SILENTSWITCHERâ  
FACT™  
FACT Quiet Series™  
UltraFETâ  
STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD  
DOES NOT ASSUME ANY LIABILITYARISING OUT OF THE APPLICATION OR USE OFANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICESORSYSTEMSWITHOUTTHEEXPRESSWRITTENAPPROVALOFFAIRCHILDSEMICONDUCTORCORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. H4  

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