AN-5019 [FAIRCHILD]

Calculating Driver/Receiver Power; 计算驱动器/接收器电源
AN-5019
型号: AN-5019
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Calculating Driver/Receiver Power
计算驱动器/接收器电源

驱动器
文件: 总2页 (文件大小:105K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Fairchild Semiconductor  
Application Note  
July 2002  
AN-5019  
Revised July 2002  
LVDS: Calculating Driver/Receiver Power  
(2) PDOUTPUT(S) = [IO(VCCVOD)]  
Where,  
PDOUTPUT(S)  
Introduction  
To insure system functionality and reliability many board  
and system level designs must employ power budgets. The  
cumulative power dissipated by each device in the applica-  
tion contributes to the total power dissipated by the system.  
Calculated total device power dissipation can help deter-  
mine a power source best suited for the specific applica-  
tion. It can also provide an understanding of the system’s  
(or board’s) operating conditions that might have an impact  
on system reliability or cause damage to on board ICs.  
= Power dissipated by the output(s)  
= Differential current per output  
= Supply Voltage  
IO  
VCC  
VOD  
= Differential Output  
When dealing with LVDS products with multiple channels,  
the formula to calculate the power dissipated by the output  
is:  
This application note outlines an example of a power dissi-  
pation calculation for typical LVDS differential line drivers. It  
provides designers a method for calculating power dissipa-  
tion of individual LVDS components to assist in meeting  
system power budgets.  
(3) PDOUTPUT(S) = (# of channels) [IO(VCCVOD)]  
The approximate total power dissipated by the differential  
driver is the sum of the supply power and the power dissi-  
pated by the differential outputs:  
(4) PDTOTAL = PDDC + PDOUTPUT(S)  
Components of  
Total Power Dissipation  
Total power dissipation can typically be divided into two  
parts: a static and a dynamic component. The static com-  
ponent, or supply power, is derived from current flowing  
into the power pins. The dynamic component is the output  
power derived from current into or out of the output pins.  
For an LVDS receiver, the supply power is calculated simi-  
larly to the approach used for the driver. The output power  
of the receiver would be derived using the following equa-  
tion and inserting the values from the datasheet electricals:  
(5) PDOUTPUT = VOL * IOL + [(VCC VOH) * IOH  
]
The device switching frequency component of the total  
power varies from application to application. The following  
example demonstrates how to calculate total power dissi-  
pation, with assigned values for illustrative purposes only. If  
the exact application configuration is known, appropriate  
adjustments can be made to the calculations.  
The static power consumption of a device is the total DC  
current that flows from VCC to GND with the inputs con-  
nected to VCC or GND with the outputs left open. To calcu-  
late the supply power, multiply the device supply current  
(ICC) by the supply voltage (VCC). The maximum specifica-  
Power Dissipation Calculation  
Example  
To illustrate the calculation for total power dissipation, this  
example uses typical values for a Quad High-Speed Differ-  
ential Line Driver (FI1031) with the following conditions:  
tions are found in the DC electrical characteristics of the  
datasheets.  
(1) PDDC(max) = ICC(max)  
Where,  
PDDC  
*
VCC(max)  
= Static DC Power  
= Supply Current  
= Supply Voltage  
VCC  
TA  
= 3.6V (max)  
= 25°C  
ICC  
VCC  
VOD  
IOD  
ICC  
= 350 mV (typical)  
= 3.5 mA (typical)  
= 4 mA (max)  
The current sinking and sourcing capability of the driver’s  
output structure, along with the load being driven, dictates  
the amount of power being consumed.  
To calculate the dynamic power dissipated by the device  
outputs, use the differential output voltage (VOD) and the  
(6) Static DC Power  
output current (IO) being sourced and sunk. The formula to  
calculate the output power dissipated by a single differen-  
tial channel is:  
PDDC(max)  
= ICC(max) * VCC(max)  
= (4 mA) (3.6V)  
= 14.4 mW  
© 2002 Fairchild Semiconductor Corporation  
AN500495  
www.fairchildsemi.com  
Power Dissipation Calculation Example (Continued)  
(7) Dynamic Output Power  
(9) Total Power  
PDOUTPUTS  
= (No. of channels) [IO(VCC VOD)]  
PDTOTAL  
= PDDC + PDOUTPUT(S) + COUT (VCC)2(f)  
= (4) [3.5 mA (3.6V 350 mV)]  
= 45.5 mW  
COUT  
f
= device output capacitive load  
= switching frequency  
(8) Total Power  
For most differential line drivers the magnitude of the CV2f  
term on total device power dissipation is negligibly small.  
The significant advantage of LVDS technology is the low  
power requirement because of the constant current source  
driver rather than a voltage mode driver. With minimal  
switching spikes in the driver, ICC does not increase expo-  
PDTOTAL  
= PDDC + PDOUTPUT(S)  
= 14.4 mW + 45.5 mW  
= 59.9 mW  
A more comprehensive total power dissipation calculation  
would include power dissipation from the devices switch-  
ing frequency. Therefore, the equation would be as follows:  
nentially, resulting in very low (almost flat) power consump-  
tion across frequency. Refer to Figure 1 for a relative  
comparison.  
FIGURE 1. ICC vs. Frequency  
Summary  
An advantage of LVDS is its low power at high data rates.  
With a current draw of 3.5 mA per output, an LVDS output  
at 3.3V dissipates about 11 mW, a constant with the fre-  
quency of operation. A method for calculating the total  
power dissipated by an LVDS TIA/EIA-644 compliant driver  
and receiver was presented. This approach can be applied  
to similar LVDS devices designed to meet the TIA/EIA-644  
requirements and specifications.  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
2

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