9403APCQM [FAIRCHILD]

FIFO, 16X4, Asynchronous, TTL, PDIP24,;
9403APCQM
型号: 9403APCQM
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

FIFO, 16X4, Asynchronous, TTL, PDIP24,

存储 先进先出芯片
文件: 总16页 (文件大小:158K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
April 1989  
Revised June 1999  
9403A  
First-In First-Out (FIFO) Buffer Memory  
The 9403A has 3-STATE outputs which provide added ver-  
satility and is fully compatible with all TTL families.  
General Description  
The 9403A is an expandable fall-through type high-speed  
First-In First-Out (FIFO) Buffer Memory optimized for high  
speed disk or tape controllers and communication buffer  
applications. It is organized as 16-words by 4-bits and may  
be expanded to any number of words or any number of bits  
in multiples of four. Data may be entered or extracted asyn-  
chronously in serial or parallel, allowing economical imple-  
mentation of buffer memories.  
Features  
Serial or parallel input  
Serial or parallel output  
Expandable without external logic  
3-STATE outputs  
Fully compatible with all TTL families  
Slim 24-pin package  
Ordering Code:  
Order Number  
Package Number Package Description  
N24E 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-011, 0.400 Wide  
9403APC  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Logic Symbol  
Connection Diagram  
© 1999 Fairchild Semiconductor Corporation  
DS010193.prf  
www.fairchildsemi.com  
Unit Loading/Fan Out  
Pin Names  
Description  
U.L.  
Input IIH/IIL  
HIGH/LOW  
Output IOH/IOL  
D0–D8  
DS  
Parallel Data Inputs  
Serial Data Input  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
2.0/0.667  
285/26.7  
285/26.7  
20/13.3  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
40 µA/400 µA  
5.7 mA/16 mA  
5.7 mA/16 mA  
400 µA/8 mA  
400 µA/8 mA  
PL  
Parallel Load Input  
Serial Input Clock  
Serial Input Enable  
Transfer to Stack Input  
Serial Output Enable  
Transfer Out Serial  
Transfer Out Parallel  
Master Reset  
CPSI  
IES  
TTS  
OES  
TOS  
TOP  
MR  
OE  
Output Enable  
CPSO  
Q0 - Q3  
QS  
Serial Output Clock  
Parallel Data Outputs  
Serial Data Output  
Input Register Full  
Output Register Empty  
IRF  
ORE  
20/13.3  
Block Diagram  
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2
Functional Description  
As shown in the block diagram the 49403A consists of  
the F3 flip-flop and resetting the other flip-flops. The Q out-  
three sections:  
put of the last flip-flop (FC) is brought out as the “Input  
Register Full” output (IRF). After initialization this output is  
HIGH.  
1. An Input Register with parallel and serial data inputs as  
well as control inputs and outputs for input handshak-  
ing and expansion.  
Parallel Entry—A HIGH on the PL input loads the D0-D3  
2. A 4-bit wide, 14-word deep fall-through stack with self-  
contained control logic.  
inputs into the F0-F3 flip-flops and sets the FC flip-flop. This  
forces the IRF output LOW indicating that the input register  
is full. During parallel entry, the CPSI input must be LOW. If  
parallel expansion is not being implemented, IES must be  
LOW to establish row mastership (see Expansion section).  
3. An Output Register with parallel and serial data outputs  
as well as control inputs and outputs for output hand-  
shaking and expansion.  
Since these three sections operate asynchronously and  
almost independently, they will be described separately  
below.  
Serial Entry—Data on the DS input is serially entered into  
the F3, F2, F1, F0, FC shift register on each HIGH-to-LOW  
transition of the CPSI clock input, provided IES and PL are  
LOW.  
INPUT REGISTER (DATA ENTRY)  
After the fourth clock transition, the four data bits are  
located in the four flip-flops, F0-F3. The FC flip-flop is set,  
The Input Register can receive data in either bit-serial or in  
4-bit parallel form. It stores this data until it is sent to the  
fall-through stack and generates the necessary status and  
control signals.  
forcing the IRF output LOW and internally inhibiting CPSI  
clock pulses from affecting the register, Figure 2 illustrates  
the final positions in a 9403A resulting from a 64-bit serial  
bit train. B0 is the first bit, B63 the last bit.  
Figure 1 is a conceptual logic diagram of the input section.  
As described later, this 5-bit register is initialized by setting  
FIGURE 1. Conceptual Input Section  
FIGURE 2. Final Positions in a 9403A Resulting from a 64-Bit Serial Train  
3
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Transfer to the Stack—The outputs of Flip-Flops F0-F3  
stack, data falls through the stack automatically, pausing  
only when it is necessary to wait for an empty next location.  
In the 9403A as in most modern FIFO designs, the MR  
input only initializes the stack control section and does not  
clear the data.  
feed the stack. A LOW level on the TTS input initiates a  
“fall-through” action. If the top location of the stack is  
empty, data is loaded into the stack and the input register is  
re-initialized. Note that this initialization is postponed until  
PL is LOW again. Thus, automatic FIFO action is achieved  
by connecting the IRF output to the TTS input.  
OUTPUT REGISTER (DATA EXTRACTION)  
The Output Register receives 4-bit data words from the  
bottom stack location, stores it and outputs data on a 3-  
STATE 4-bit parallel data bus or on a 3-STATE serial data  
bus. The output section generates and receives the neces-  
sary status and control signals. Figure 3 is a conceptual  
logic diagram of the output section.  
An RS Flip-Flop (the Request Initialization Flip-Flop shown  
in Figure 10) in the control section records the fact that  
data has been transferred to the stack. This prevents multi-  
ple entry of the same word into the stack despite the fact  
the IRF and TTS may still be LOW. The Request Initializa-  
tion Flip-Flop is not cleared until PL goes LOW. Once in the  
FIGURE 3. Conceptual Output Section  
Parallel Data Extraction—When the FIFO is empty after a  
LOW pulse is applied to MR, the Output Register Empty  
(ORE) output is LOW. After data has been entered into the  
FIFO and has fallen through to the bottom stack location, it  
is transferred into the Output Register provided the “Trans-  
fer Out Parallel” (TOP) input is HIGH. As a result of the  
data transfer ORE goes HIGH, indicating valid data on the  
data outputs (provided the 3-STATE buffer is enabled).  
TOP can now be used to clock out the next word. When  
TOP goes LOW, ORE will go LOW indicating that the out-  
put data has been extracted, but the data itself remains on  
the output bus until the next HIGH level at TOP permits the  
transfer of the next word (if available) into the Output Reg-  
ister. During parallel data extraction CPSO should be LOW.  
TOS should be grounded for single slice operation or con-  
nected to the appropriate ORE for expanded operation  
(see Expansion section).  
transferred twice. If TOP goes HIGH and returns to LOW  
before data is available from the stack, ORE remains LOW  
indicating that there is no valid data at the outputs.  
Serial Data Extraction—When the FIFO is empty after a  
LOW pulse is applied to MR, the Output Register Empty  
(ORE) output is LOW. After data has been entered into the  
FIFO and has fallen through to the bottom stack location, it  
is transferred into the Output Register provided TOS is  
LOW and TOP is HIGH. As a result of the data transfer  
ORE goes HIGH indicating valid data in the register. The 3-  
STATE Serial Data Output, QS, is automatically enabled  
and puts the first data bit on the output bus. Data is serially  
shifted out on the HIGH-to-LOW transition of CPSO. To  
prevent false shifting, CPSO should be LOW when the new  
word is being loaded into the Output Register. The fourth  
transition empties the shift register, forces ORE output  
LOW and disables the serial output, QS (refer to Figure 3).  
TOP is not edge triggered. Therefore, if TOP goes HIGH  
before data is available from the stack, but data does  
become available before TOP goes LOW again, that data  
will be transferred into the Output Register. However, inter-  
nal control circuitry prevents the same data from being  
For serial operation the ORE output may be tied to the TOS  
input, requesting a new word from the stack as soon as the  
previous one has been shifted out.  
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4
EXPANSION  
Horizontal and Vertical Expansion—The 9403A can be  
expanded in both the horizontal and vertical directions  
without any external parts and without sacrificing any of its  
FIFO’s flexibility for serial/parallel input and output. The  
interconnections necessary to form a 31-word by 16-bit  
FIFO are shown in Figure 6. Using the same technique,  
any FIFO of (15m + 1)-words by (4n)-bits can be con-  
structed, where m is the number of devices in a column  
and n is the number of devices in a row. Figure 7 and Fig-  
ure 8 show the timing diagrams for serial data entry and  
extraction for the 31-word by 16-bit FIFO shown in Figure  
6. The final position of data after serial insertion of 496 bits  
into the FIFO array of Figure 6 is shown in Figure 9.  
Vertical Expansion—The 9403A may be vertically  
expanded to store more words without external parts. The  
interconnection is necessary to form a 46-word by 4-bit  
FIFO are shown in Figure 4. Using the same technique,  
and FIFO of (15n + 1)-words by 4-bits can be constructed,  
where n is the number of devices. Note that expansion  
does not sacrifice any of the 9403A’s flexibility for serial/  
parallel input and output.  
Interlocking Circuitry—Most conventual FIFO designs  
provide status signals analogous to IRF and ORE. How-  
ever, when these devices are operated in arrays, variations  
in unit to unit operating speed require external gating to  
assure all devices have completed an operation. The  
9403A incorporates simple but effective “master/slave”  
interlocking circuitry to eliminate the need for external gat-  
ing.  
In the 9403A array of Figure 6 devices 1 and 5 are defined  
as “row masters” and the other devices are slaves to the  
master in their row. No slave in a given row will initialize its  
Input Register until it has received LOW on its IES input  
from a row master or a slave of higher priority.  
In a similar fashion, the ORE outputs of slaves will not go  
HIGH until their OES inputs have gone HIGH. This inter-  
locking scheme ensures that new input data may be  
accepted by the array when the IRF output of the final  
slave in that row goes HIGH and that output data for the  
array may be extracted when the ORE of the final slave in  
the output row goes HIGH.  
The row master is established by connecting its IES input  
to ground while a slave receives it IES input from the IRF  
output of the next higher priority device. When an array of  
9403A FIFOs is initialized with a LOW on the MR inputs of  
all devices, the IRF outputs of all devices will be HIGH.  
Thus, only the row master receives a LOW on the IES input  
during initialization. Figure 10 is a conceptual logic diagram  
of the internal circuitry which determines master/slave  
operation. Whenever MR and IES are LOW, the Master  
Latch is set. Whenever TTS goes LOW the Request Initial-  
ization Flip-Flop will be set. If the Master Latch is HIGH, the  
input Register will be immediately initialized and the  
Request Initialization Flip-Flop reset. If the Master Latch is  
reset, the Input Register is not initialized until IES goes  
LOW. In array operation, activating the TTS initiates a rip-  
ple input register initialization from the row master to the  
last slave.  
FIGURE 4. A Vertical Expansion Scheme  
Horizontal Expansion—The 9403A can also be horizon-  
tally expanded to store long words (in multiples of four bits)  
without external logic. The interconnections necessary to  
form a 16-word by 12-bit FIFO are shown in Figure 5.  
Using the same technique, any FIFO of 16 words by 4n bits  
can be constructed, where n is the number of devices. The  
IRF output of the right most device (most significant device)  
is connected to the TTS inputs of all devices. Similarly, the  
ORE output of the most significant device is connected to  
the TOS inputs of all devices. As in the vertical expansion  
scheme, horizontal expansion does not sacrifice any of the  
9403A’s flexibility for serial/parallel input and output.  
A similar operation takes place for the output register.  
Either a TOS or TOP input initiates a load-from-stack oper-  
ation and sets the ORE Request Flip-Flop. If the Master  
Latch is set, the last Output Register Flip-Flop is set and  
ORE goes HIGH. If the Master latch is reset, the ORE out-  
put will be LOW until an OES input is received.  
5
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FIGURE 5. A Horizontal Expansion Scheme  
FIGURE 6. A 31x16 FIFO Array  
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6
FIGURE 7. Serial Data Entry for Array of Figure 6  
FIGURE 8. Serial Data Extraction for Array of Figure 6  
7
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FIGURE 9. Final Position of a 496-Bit Serial Input  
FIGURE 10. Conceptual Diagram, Interlocking Circuitry  
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8
Absolute Maximum Ratings(Note 1)  
Recommended Operating  
Conditions  
Storage Temperature  
65°C to +150°C  
Ambient Temperature under Bias  
Junction Temperature under Bias  
VCC Pin Potential to Ground Pin  
Input Voltage (Note 2)  
55°C to +125°C  
55°C to +175°C  
0.5V to +7.0V  
Free Air Ambient Temperature  
Supply Voltage  
0°C to +70°C  
+4.5V to +5.5V  
0.5V to +7.0V  
Input Current (Note 2)  
30 mA to +5.0 mA  
Voltage Applied to Output  
in HIGH State (with VCC = 0V)  
Standard Output  
Note 1: Absolute maximum ratings are values beyond which the device  
may be damaged or have its useful life impaired. Functional operation  
under these conditions is not implied.  
0.5V to VCC  
3-STATE Output  
0.5V to +5.5V  
Note 2: Either voltage limit or current limit is sufficient to protect inputs.  
Current Applied to Output  
in LOW State (Max)  
twice the rated IOL (mA)  
DC Electrical Characteristics  
Min  
V
CC  
Symbol  
Parameter  
Input HIGH Voltage  
Units  
Conditions  
Typ  
Max  
V
V
V
V
2.0  
V
V
V
V
Recognized as a HIGH Signal  
Recognized as a LOW Signal  
IH  
Input LOW Voltage  
0.8  
IL  
Input Clamp Diode Voltage  
1.5  
Min  
Min  
I
I
I
I
I
= −18 mA  
CD  
OH  
IN  
Output HIGH  
Voltage  
10% V  
2.4  
2.4  
= −400 µA (IRF, ORE)  
CC  
CC  
CC  
CC  
OH  
OH  
OL  
OL  
10% V  
10% V  
10% V  
= −5.7 mA (Q , Q )  
n s  
V
Output LOW  
Voltage  
0.5  
V
Min  
= 8 mA (IRF, ORE)  
= 16 Ma (Q , Q )  
OL  
0.5  
n
s
I
I
I
I
I
I
I
I
Input HIGH Current  
40  
µA  
µA  
mA  
µA  
µA  
mA  
µA  
mA  
Max  
Max  
Max  
Max  
Max  
Max  
Max  
Max  
V
V
V
V
V
V
V
= 2.7V  
= 7.0V  
= 0.4V  
IH  
IN  
IN  
IN  
Input HIGH Current Breakdown Test  
Input LOW Current  
100  
BVI  
IL  
0.45  
100  
Output Leakage Current  
Output Leakage Current  
Output Short-Circuit Current  
Output HIGH Leakage Current  
Power Supply Current  
= 2.4V  
= 0.5V  
= 0V  
OZH  
OZL  
OS  
OUT  
OUT  
OUT  
OUT  
100  
130  
250  
30  
= V  
CEX  
CC  
CC  
170  
V = LOW  
O
9
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AC Electrical Characteristics  
T
= +25°C  
= +5.0V  
T = 0°C to 70°C  
A
A
V
V
= +5.0V  
C = 50 pF  
L
Figure  
CC  
CC  
Symbol  
Parameter  
Units  
C
= 50 pF  
Number  
L
Min  
Max  
Min  
Max  
t
Propagation Delay,  
Negative-Going  
CPSI to IRF Output  
Propagation Delay,  
Negative-Going  
TTS to IRF  
1.5  
20.0  
1.5  
21.0  
PHL  
Figure 11  
Figure 12  
ns  
t
1.5  
36.0  
1.5  
38.0  
PLH  
t
Propagation Delay,  
Negative-Going  
1.5  
1.5  
28.0  
28.0  
1.5  
1.5  
29.0  
29.0  
Figure 13  
Figure 14  
PLH  
t
ns  
ns  
ns  
PHL  
CPSO to Q Output  
S
t
Propagation Delay,  
Positive-Going  
1.5  
1.5  
46.0  
46.0  
1.5  
1.5  
48.0  
48.0  
PLH  
t
Figure 15  
PHL  
TOP to Outputs Q -Q  
0
3
t
Propagation Delay,  
Negative-Going  
CPSO to ORE  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
35.0  
37.0  
47.0  
42.5  
28.0  
24.0  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
37.0  
39.0  
49.0  
45.0  
29.0  
25.0  
Figure 13  
Figure 14  
PHL  
t
Propagation Delay,  
Negative-Going  
TOP to ORE  
Figure 15  
PHL  
ns  
t
Propagation Delay,  
Positive-Going  
PLH  
TOP to ORE  
t
Propagation Delay,  
Negative-Going  
ns  
ns  
Figure 13  
Figure 14  
PLH  
TOS to Positive Going ORE  
Propagation Delay,  
t
PLH  
Positive-Going  
PL to Negative-Going IRF  
Propagation Delay,  
Figure 17  
Figure 18  
t
PLH  
Negative-Going  
PL to Positive-Going IRF  
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10  
AC Electrical Characteristics  
T
= +25°C  
= +5.0V  
T = 0°C to +70°C  
A
A
V
V
= +5.0V  
C = 50 pF  
L
Figure  
CC  
CC  
Symbol  
Parameter  
Units  
C
= 50 pF  
Number  
L
Min  
Max  
Min  
Max  
t
t
Propagation Delay,  
Positive-Going  
OES to ORE  
1.5  
39.5  
1.5  
41.0  
PLH  
ns  
ns  
Propagation Delay,  
Positive-Going  
1.5  
20.0  
1.5  
21.0  
PLH  
Figure 18  
IES to Positive-Going IRF  
Propagation Delay,  
MR to IRF  
t
t
1.5  
1.5  
20.0  
33.0  
1.5  
1.5  
20.0  
35.0  
PLH  
PHL  
ns  
ns  
Propagation Delay,  
MR to ORE  
t
t
t
t
t
t
Propagation Delay,  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
14.0  
14.0  
14.0  
14.0  
16.5  
17.0  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
14.0  
14.0  
14.0  
14.0  
17.0  
17.0  
PZH  
PZL  
PHZ  
PLZ  
PZH  
PZL  
OE to Q , Q , Q , Q  
0
1
2
3
3
ns  
ns  
Propagation Delay,  
OE to Q , Q , Q , Q  
0
1
2
Propagation Delay,  
Negative-Going  
OES to Q  
S
t
t
Propagation Delay,  
Negative-Going  
1.5  
1.5  
14.0  
14.0  
1.5  
1.5  
14.0  
14.0  
PHZ  
PLZ  
OES to Q  
S
t
t
t
t
Turn On Time  
TOS to Q  
1.5  
1.5  
60.0  
60.0  
500  
6.5  
1.5  
1.5  
60.0  
60.0  
500  
7.0  
PZH  
PZL  
DFT  
AP  
ns  
ns  
S
Fall Through Time  
Parallel Appearance Time,  
ORE to Q -Q  
Figure 16  
19.0  
9.5  
20.0  
10.0  
0
3
ns  
ns  
t
t
Serial Appearance Time,  
ORE to Q  
14.5  
470  
15.0  
500  
AS  
S
Bubble-Up Time  
DBU  
11  
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AC Operating Requirements  
T
= +25°C  
T = 0°C to +70°C  
A
A
Figure  
Number  
Symbol  
Parameter  
V
= +5.0V  
V
= +5.0V  
Units  
CC  
CC  
Min  
Max  
Min  
Max  
t
(H)  
(L)  
(H)  
(L)  
(L)  
Setup Time, HIGH or LOW  
to Negative CPSI  
15.5  
15.5  
2.0  
16.0  
16.0  
2.0  
S
t
D
Figure 11  
Figure 12  
S
S
ns  
t
Hold Time, HIGH or LOW  
to CPSI  
H
t
D
2.0  
2.0  
H
S
t
Set-Time, LOW  
18.0  
18.0  
S
ns  
ns  
Figure 12  
Figure 12  
Negative-Going IES to CPSI  
Set-Up Time, LOW  
t
(L)  
65.0  
70.0  
S
Negative-Going TTS to CPSI  
Set-Up time, HIGH or LOW  
Parallel Inputs to PL  
Hold Time, HIGH or LOW  
Parallel Inputs to PL  
CPSI Pulse Width  
t
(H)  
(L)  
(H)  
(L)  
(H)  
(L)  
(H)  
0
0
0
0
S
t
S
ns  
t
0
0
H
t
0
0
H
t
30  
20  
16.5  
32  
20  
17.0  
Figure 11  
Figure 12  
Figure 17  
Figure 18  
Figure 11  
Figure 12  
Figure 13  
Figure 14  
Figure 16  
W
ns  
ns  
t
HIGH or LOW  
W
t
PL Pulse Width, HIGH  
W
t
(L)  
TTS Pulse Width, LOW  
Serial or Parallel Mode  
16.0  
17.0  
W
ns  
t
(L)  
(H)  
(L)  
(H)  
(L)  
MR Pulse Width, LOW  
TOP Pulse Width  
HIGH or LOW  
15.0  
15.0  
15.0  
17.0  
17.0  
16.5  
15.0  
17.0  
15.0  
17.0  
18.0  
19.0  
ns  
ns  
W
t
W
Figure 15  
t
W
t
CPSO Pulse Width  
HIGH or LOW  
Figure 13  
Figure 14  
W
ns  
ns  
t
W
t
Recovery Time  
REC  
Figure 16  
MR to Any Input  
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12  
Timing Waveforms  
Conditions: stack not full, IES, PL LOW  
FIGURE 11. Serial Input, Unexpanded or Master Operation  
Conditions: stack not full, IES HIGH when initiated, PL LOW  
FIGURE 12. Serial Input, Expanded Slave Operation  
Conditions: data in stack, TOP HIGH, IES LOW when initiated, OES LOW  
FIGURE 13. Serial Output, Unexpanded or Master Operation  
13  
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Timing Waveforms (Continued)  
Conditions: data in stack, TOP HIGH, IES HIGH when initiated  
FIGURE 14. Serial Output, Slave Operation  
Conditions: IES LOW when initiated, OE, CPSO LOW; data available in stack  
FIGURE 15. Parallel Output, 4-Bit Word or Master in Parallel Expansion  
Conditions: TTS connected to IRF, TOS connected to ORE, IES, OES, OE, CPSO LOW, TOP HIGH  
FIGURE 16. Fall Through Time  
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14  
Timing Waveforms (Continued)  
Conditions: stack not full, IES LOW when initialized  
FIGURE 17. Parallel Load Mode, 4-Bit Word (Unexpanded) or Master in Parallel Expansion  
Conditions: stack not full, device initialized (Note 3) with IES HIGH  
FIGURE 18. Parallel Load, Slave Mode  
Note 3: Initialization requires a master reset to occur after power has been applied.  
Note 4: TTS normally connected to IRF.  
Note 5: If stack if full, IRF will stay LOW.  
15  
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Physical Dimensions inches (millimeters) unless otherwise noted  
24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-011, 0.400 Wide  
Package Number N24E  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
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Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.  

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