74LCX541WM_08

更新时间:2024-09-18 12:53:17
品牌:FAIRCHILD
描述:Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs

74LCX541WM_08 概述

Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs 低电压与5V容限输入和输出的八路缓冲器/线路驱动器

74LCX541WM_08 数据手册

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February 2008  
74LCX541  
Low Voltage Octal Buffer/Line Driver  
with 5V Tolerant Inputs and Outputs  
Features  
General Description  
5V tolerant input and outputs  
The LCX541 is an octal buffer/line driver designed to be  
employed as memory and address drivers, clock drivers  
and bus oriented transmitter/receivers. The LCX541 is a  
non inverting option of the LCX540.  
2.3V–3.6V V specifications provided  
CC  
6.5ns t max (V = 3.3V), 10µA I max  
PD  
CC  
CC  
Power-down high impedance inputs and outputs  
(1)  
This device is similar in function to the LCX244 while  
providing flow-through architecture (inputs on opposite  
side from outputs). This pinout arrangement makes this  
device especially useful as an output port for micropro-  
cessors, allowing ease of layout and greater PC board  
density.  
Supports live insertion/withdrawal  
24 mA output drive (V = 3.0V)  
CC  
Implements proprietary noise/ EMI reduction circuitry  
Latch-up performance exceeds JEDEC 78 conditions  
ESD performance  
– Human body model > 2000V  
The LCX541 is designed for low voltage applications  
with capability of interfacing to a 5V signal environment.  
The LCX541 is fabricated with an advanced CMOS  
technology to achieve high speed operation while  
maintaining CMOS low power dissipation.  
– Machine model > 200V  
Leadless DQFN package  
Note:  
1. To ensure the high impedance state during power up  
or down, OE should be tied to V through a pull-up  
CC  
resistor: the minimum value of the resistor is  
determined by the current-sourcing capability of the  
driver.  
Ordering Information  
Package  
Order Number  
74LCX541WM  
74LCX541SJ  
Number  
Package Description  
M20B  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
M20D  
(2)  
74LCX541BQX  
MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),  
JEDEC MO-241, 2.5 x 4.5mm  
74LCX541MSA  
74LCX541MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,  
4.4mm Wide  
Note:  
2. DQFN package available in Tape and Reel only.  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.  
All packages are lead free per JEDEC: J-STD-020B standard.  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
Connection Diagrams  
Logic Symbol  
Pin Assignments for  
SOIC, SOP, SSOP, TSSOP  
IEEE/IEC  
&
OE1  
OE2  
EN  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
1
2
OE1  
VCC  
OE2  
O0  
I0  
I1  
3
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
O0  
O1  
O2  
O3  
O4  
O5  
O6  
O7  
4
I2  
I3  
I4  
I5  
O1  
O2  
O3  
O4  
5
6
7
8
I6  
I7  
GND  
O5  
O6  
9
10  
O7  
Truth Table  
Pad Assignment for DQFN  
VCC  
20  
OE1  
1
Inputs  
Outputs  
OE  
L
OE  
L
I
O
n
1
2
19  
18  
17  
16  
15  
14  
13  
12  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
2
3
4
5
6
7
8
9
OE2  
O0  
O1  
O2  
O3  
O4  
O5  
O6  
H
X
X
L
H
H
X
Z
Z
L
X
H
L
L
H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Immaterial  
Z = High Impedance  
10  
11  
GND O7  
(Top View)  
Pin Descriptions  
Pin Names  
Description  
3-STATE Output Enable Inputs  
Inputs  
OE , OE  
1
2
I –I  
0
7
O –O  
Outputs  
0
7
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Conditions  
Value  
Units  
V
Supply Voltage  
–0.5 to +7.0  
–0.5 to +7.0  
–0.5 to +7.0  
V
V
V
CC  
V
DC Input Voltage  
I
V
DC Output Voltage  
Output in 3-STATE  
Output in HIGH or LOW State  
V < GND  
O
(3)  
–0.5 to V + 0.5  
CC  
I
DC Input Diode Current  
DC Output Diode Current  
–50  
–50  
mA  
mA  
IK  
I
I
I
V < GND  
O
OK  
V
> V  
+50  
O
CC  
I
DC Output Source/Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
±50  
mA  
mA  
mA  
°C  
O
±100  
CC  
I
±100  
GND  
T
–65 to +150  
STG  
(4)  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to absolute maximum ratings.  
Symbol  
Parameter  
Conditions  
Min.  
2.0  
1.5  
0
Max.  
3.6  
Units  
V
Supply Voltage  
Operating  
V
CC  
Data Retention  
3.6  
V
Input Voltage  
5.5  
V
V
I
V
Output Voltage  
HIGH or LOW State  
3-STATE  
0
V
CC  
O
0
5.5  
±24  
±12  
±8  
I
/I  
Output Current  
V
V
V
= 3.0V–3.6V  
= 2.7V–3.0V  
= 2.3V–2.7V  
mA  
OH OL  
CC  
CC  
CC  
T
Free-Air Operating Temperature  
Input Edge Rate  
–40  
0
85  
°C  
A
t/V  
V
= 0.8V–2.0V, V = 3.0V  
10  
ns/V  
IN  
CC  
Notes:  
3. I Absolute Maximum Rating must be observed.  
O
4. Unused inputs must be held HIGH or LOW. They may not float.  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
3
DC Electrical Characteristics  
T = –40°C to +85°C  
A
Symbol  
Parameter  
V
(V)  
Conditions  
Min.  
1.7  
Max.  
Units  
CC  
V
HIGH Level Input Voltage  
2.3–2.7  
2.7–3.6  
2.3–2.7  
2.7–3.6  
2.3–3.6  
2.3  
V
IH  
2.0  
V
V
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.7  
0.8  
V
V
IL  
I
I
I
I
I
I
I
I
I
I
= –100µA  
= –8mA  
= –12mA  
= –18mA  
= –24mA  
= 100µA  
= 8mA  
V
– 0.2  
OH  
OH  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
CC  
1.8  
2.2  
2.4  
2.2  
2.7  
3.0  
V
LOW Level Output Voltage  
2.3–3.6  
2.3  
0.2  
0.6  
V
OL  
2.7  
= 12mA  
= 16mA  
= 24mA  
0.4  
3.0  
0.4  
0.55  
±5.0  
10  
I
I
I
Input Leakage Current  
2.3–3.6  
0
0 V 5.5V  
µA  
µA  
µA  
I
I
Power-Off Leakage Current  
Quiescent Supply Current  
V or V = 5.5V  
I O  
OFF  
CC  
2.3–3.6  
V = V or GND  
10  
I
CC  
(5)  
3.6V V , V 5.5V  
±10  
500  
I
O
I  
Increase in I per Input  
2.3–3.6  
V
= V = 0.6V  
µA  
CC  
CC  
IH  
CC  
AC Electrical Characteristics  
T = –40°C to +85°C, R = 500Ω  
A
L
V
= 3.3V ± 0.3V,  
V
= 2.7V,  
V
= 2.5V ± 0.2V,  
CC  
CC  
CC  
C = 50pF  
C = 50pF  
C = 30pF  
L
L
L
Symbol  
Parameter  
Propagation Delay  
Output Enable Time  
Output Disable Time  
Output to Output Skew  
Min.  
1.5  
Max.  
6.5  
Min.  
Max.  
7.5  
Min.  
1.5  
Max. Units  
t
t
t
t
, t  
1.5  
1.5  
1.5  
7.8  
10.5  
9.0  
ns  
ns  
ns  
ns  
PHL PLH  
, t  
1.5  
8.5  
9.5  
1.5  
PZL PZH  
, t  
1.5  
7.5  
8.5  
1.5  
PLZ PHZ  
(6)  
, t  
1.0  
OSHL OSLH  
Notes  
5. Outputs disabled or 3-STATE only.  
6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two  
separate outputs of the same device. The specification applies to any outputs switching in the same direction,  
either HIGH-to-LOW (t  
) or LOW-to-HIGH (t  
).  
OSHL  
OSLH  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
4
Dynamic Switching Characteristics  
T = 25°C  
A
Symbol  
Parameter  
V
(V)  
Conditions  
Typical  
0.8  
Units  
CC  
V
Quiet Output Dynamic Peak V  
3.3  
C = 50 pF, V = 3.3V, V = 0V  
V
OLP  
OL  
L
IH  
IL  
2.5  
3.3  
2.5  
C = 30 pF, V = 2.5V, V = 0V  
0.6  
L
IH  
IL  
V
Quiet Output Dynamic Valley V  
C = 50 pF, V = 3.3V, V = 0V  
–0.8  
–0.6  
V
OLV  
OL  
L
IH  
IL  
C = 30 pF, V = 2.5V, V = 0V  
L
IH  
IL  
Capacitance  
Symbol  
Parameter  
Conditions  
Typical Units  
C
C
C
Input Capacitance  
Output Capacitance  
Power Dissipation Capacitance  
V
V
V
= Open, V = 0V or V  
CC  
7
8
pF  
pF  
pF  
IN  
CC  
CC  
CC  
I
= 3.3V, V = 0V or V  
CC  
OUT  
PD  
I
= 3.3V, V = 0V or V , f = 10 MHz  
25  
I
CC  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
5
AC Loading and Waveforms (Generic for LCX Family)  
V
CC  
OPEN  
GND  
t
t
t
, t  
PLH PHI  
500Ω  
TEST  
, t  
PZH PHZ  
DUT  
SIGNAL  
V
, t  
PZL PLZ  
I
C
L
500Ω  
Figure 1. AC Test Circuit (C includes probe and jig capacitance)  
L
Test  
Switch  
t
, t  
Open  
PLH PHL  
t
, t  
6V at V = 3.3 ± 0.3V  
CC  
PZL PLZ  
V
x 2 at V = 2.5 ± 0.2V  
CC  
CC  
t
, t  
GND  
PZH PHZ  
V
CC  
V
CC  
DATA  
IN  
OUTPUT  
V
mi  
V
V
mi  
CONTROL  
GND  
GND  
t
t
pxx  
pxx  
t
t
PLZ  
PZL  
DATA  
OUT  
DATA  
OUT  
mo  
V
mo  
V
X
V
OL  
3-STATE Output High Enable and  
Disable Times for Logic  
Waveform for Inverting and  
Non-Inverting Functions  
t
V
W
CC  
DATA  
V
V
mi  
CC  
CONTROL  
IN  
IN  
V
GND  
mi  
GND  
t
S
t
H
t
rec  
V
CC  
CONTROL  
INPUT  
V
mi  
GND  
V
CLOCK  
mi  
t
S
t
PHL  
t
rec  
t
PLH  
V
MR  
OR  
CLEAR  
V
mi  
V
mo  
OUTPUT  
mo  
Setup Time, Hold Time and  
Recovery Time for Logic  
Propagation Delay, Pulse Width and  
t
Waveforms  
rec  
t
t
f
r
V
CC  
OUTPUT  
CONTROL  
V
mi  
GND  
V
V
OH  
OL  
t
t
90%  
90%  
10%  
PZH  
PHZ  
ANY  
OUTPUT  
V
V
OH  
Y
DATA  
OUT  
10%  
V
mo  
t
and t  
fall  
rise  
3-STATE Output Low Enable and  
Disable Times for Logic  
Figure 2. Waveforms (Input Characteristics; f = 1MHz, t = t = 3ns)  
r
f
V
CC  
Symbol  
3.3V ± 0.3V  
1.5V  
2.7V  
1.5V  
1.5V  
2.5V ± 0.2V  
V
V
V
/ 2  
/ 2  
mi  
CC  
V
1.5V  
mo  
CC  
V
V
+ 0.3V  
– 0.3V  
V
+ 0.3V  
V
+ 0.15V  
– 0.15V  
x
y
OL  
OL  
OL  
V
V
V
– 0.3V  
V
OH  
OH  
OH  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
6
Schematic Diagram (Generic for LCX Family)  
Input Stage  
P2  
P1  
V
CC  
Data  
ESD  
P5  
X1  
D2 N+/P–  
V
DD  
N1  
N2  
P4  
GTO™  
Output  
Input Stage  
D6  
N+/P–  
P3  
N5  
Enable  
N4  
ESD  
D4 N+/P–  
N3  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
7
Tape and Reel Specification  
Tape Format for DQFN  
Package  
Designator  
Tape  
Section  
Number  
Cavities  
Cavity  
Status  
Cover Tape  
Status  
BQX  
Leader (Start End)  
Carrier  
125 (typ)  
3000  
Empty  
Filled  
Sealed  
Sealed  
Sealed  
Trailer (Hub End)  
75 (typ)  
Empty  
Tape Dimensions inches (millimeters)  
Reel Dimensions inches (millimeters)  
Tape Size  
A
B
C
D
N
W1  
W2  
12mm  
13.0 (330.0) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) 0.488 (12.4) 0.724 (18.4)  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
8
Physical Dimensions  
13.00  
12.60  
A
11.43  
20  
11  
B
9.50  
10.65 7.60  
10.00 7.40  
2.25  
1
PIN ONE  
INDICATOR  
10  
0.65  
0.51  
0.35  
1.27  
1.27  
M
0.25  
C B A  
LAND PATTERN RECOMMENDATION  
SEE DETAIL A  
2.65 MAX  
0.33  
0.20  
C
0.10  
C
0.30  
0.10  
SEATING PLANE  
0.75  
0.25  
X 45°  
NOTES: UNLESS OTHERWISE SPECIFIED  
(R0.10)  
(R0.10)  
A) THIS PACKAGE CONFORMS TO JEDEC  
MS-013, VARIATION AC, ISSUE E  
GAGE PLANE  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS.  
0.25  
8°  
0°  
D) CONFORMS TO ASME Y14.5M-1994  
1.27  
0.40  
SEATING PLANE  
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L  
F) DRAWING FILENAME: MKT-M20BREV3  
(1.40)  
DETAIL A  
SCALE: 2:1  
Figure 3. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
9
Physical Dimensions (Continued)  
Figure 4. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
10  
Physical Dimensions (Continued)  
Figure 5. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
11  
Physical Dimensions (Continued)  
Figure 6. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
12  
Physical Dimensions (Continued)  
Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
13  
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subsidiaries, and is not intended to be an exhaustive list of all such trademarks.  
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* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE  
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS  
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S  
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,  
which, (a) are intended for surgical implant into the body or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in a significant injury of the user.  
device, or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
This datasheet contains the design specifications for product  
development. Specifications may change in any manner without notice.  
Advance Information  
Formative or In Design  
This datasheet contains preliminary data; supplementary data will be  
published at a later date. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve design.  
Preliminary  
First Production  
Full Production  
Not In Production  
This datasheet contains final specifications. Fairchild Semiconductor  
reserves the right to make changes at any time without notice to improve  
the design.  
No Identification Needed  
Obsolete  
This datasheet contains specifications on a product that has been  
discontinued by Fairchild Semiconductor. The datasheet is printed for  
reference information only.  
Rev. I33  
©2006 Fairchild Semiconductor Corporation  
74LCX541 Rev. 1.6.0  
www.fairchildsemi.com  
14  

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