74LCX16373 [FAIRCHILD]
Low Voltage 16-Bit Transparent Latch with 5V Tolerant Inputs and Outputs; 低电压16位透明锁存器,具有5V容限输入和输出型号: | 74LCX16373 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Low Voltage 16-Bit Transparent Latch with 5V Tolerant Inputs and Outputs |
文件: | 总10页 (文件大小:130K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
February 1994
Revised May 2005
74LCX16373
Low Voltage 16-Bit Transparent Latch
with 5V Tolerant Inputs and Outputs
General Description
Features
■ 5V tolerant inputs and outputs
The LCX16373 contains sixteen non-inverting latches with
3-STATE outputs and is intended for bus oriented applica-
tions. The device is byte controlled. The flip-flops appear
transparent to the data when the Latch Enable (LE) is
HIGH. When LE is LOW, the data that meets the setup time
is latched. Data appears on the bus when the Output
Enable (OE) is LOW. When OE is HIGH, the outputs are in
a high impedance state.
■ 2.3V–3.6V VCC specifications provided
■ 5.4 ns tPD max (VCC 3.3V), 20 A ICC max
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■
24 mA output drive (VCC 3.0V)
■ Uses patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
The LCX16373 is designed for low voltage (2.5V or 3.3V)
VCC applications with capability of interfacing to a 5V signal
environment.
Human body model 2000V
The LCX16373 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Machine model 200V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
through a pull-up resistor: the minimum value or the
CC
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number Package Number
Package Description
74LCX16373G
(Note 2)(Note 3)
BGA54A
MS48A
MTD48
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LCX16373MEA
(Note 3)
74LCX16373MTD
(Note 3)
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
© 2005 Fairchild Semiconductor Corporation
DS012002
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Connection Diagrams
Pin Descriptions
Pin Assignment for SSOP and TSSOP
Pin Names
Description
OEn
Output Enable Input (Active LOW)
Latch Enable Input
Inputs
LEn
I0–I15
O0–O15
NC
Outputs
No Connect
FBGA Pin Assignments
1
2
3
4
5
6
A
B
C
D
E
F
O0
O2
NC
O1
OE1
NC
LE1
NC
NC
I1
I0
I2
O4
O3
VCC
GND
GND
GND
VCC
NC
VCC
GND
GND
GND
VCC
NC
I3
I4
O6
O5
I5
I6
O8
O7
I7
I8
O10
O12
O14
O9
I9
I10
I12
I14
G
H
O11
O13
I11
I13
J
O15
NC
OE2
LE2
NC
I15
Truth Tables
Inputs
Outputs
LE1
OE1
I0–I7
O0–O7
X
H
H
L
H
L
L
L
X
L
Z
L
Pin Assignment for FBGA
H
X
H
O0
Inputs
OE2
Outputs
O8–O15
LE2
I8–I15
X
H
H
L
H
L
L
L
X
L
Z
L
H
X
H
O0
H
L
X
Z
O
HIGH Voltage Level
LOW Voltage Level
Immaterial
(Top Thru View)
High Impedance
Previous O before HIGH-to-LOW transition of Latch Enable
0
0
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2
Functional Description
The LCX16373 contains sixteen D-type latches with
3-STATE standard outputs. The device is byte controlled
with each byte functioning identically, but independent of
the other. Control pins can be shorted together to obtain full
16-bit operation. The following description applies to each
byte. When the Latch Enable (LEn) input is HIGH, data on
its I input changes. When LEn is LOW, the latches store
information that was present on the I inputs a setup time
preceding the HIGH-to-LOW transition of LEn. The
3-STATE standard outputs are controlled by the Output
Enable (OEn) input. When OEn is LOW, the standard out-
puts are in the 2-state mode. When OEn is HIGH, the stan-
the In enters the latches. In this condition the latches are
transparent, i.e. a latch output will change state each time
dard outputs are in the high impedance mode but this does
not interfere with entering new data into the latches.
Logic Diagrams
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
3
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Absolute Maximum Ratings(Note 4)
Symbol
VCC
VI
Parameter
Supply Voltage
Value
Conditions
Units
0.5 to 7.0
0.5 to 7.0
0.5 to 7.0
V
V
DC Input Voltage
VO
DC Output Voltage
Output in 3-STATE
V
0.5 to VCC 0.5 Output in HIGH or LOW State (Note 5)
IIK
DC Input Diode Current
DC Output Diode Current
50
50
VI GND
VO GND
VO VCC
mA
mA
IOK
50
IO
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
50
mA
mA
mA
C
ICC
100
IGND
TSTG
100
65 to 150
Recommended Operating Conditions (Note 6)
Symbol
Parameter
Min
2.0
1.5
0
Max
3.6
3.6
5.5
VCC
5.5
24
Units
VCC
Supply Voltage
Operating
V
V
V
Data Retention
VI
Input Voltage
VO
Output Voltage
HIGH or LOW State
3-STATE
0
0
IOH/IOL
Output Current
VCC 3.0V 3.6V
VCC 2.7V 3.0V
VCC 2.3V 2.7V
12
mA
8
TA
Free-Air Operating Temperature
40
0
85
C
t/ V
Input Edge Rate, VIN 0.8V–2.0V, VCC 3.0V
10
ns/V
Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom-
mended Operating Conditions” table will define the conditions for actual device operation.
Note 5: I Absolute Maximum Rating must be observed.
O
Note 6: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
V
T
40 C to 85 C
Min Max
CC
A
Symbol
Parameter
Conditions
Units
(V)
2.3 2.7
2.7 3.6
2.3 2.7
2.7 3.6
2.3 3.6
2.3
V
V
V
HIGH Level Input Voltage
1.7
2.0
IH
V
V
LOW Level Input Voltage
HIGH Level Output Voltage
0.7
IL
0.8
I
100
A
V
CC
0.2
OH
OH
I
8 mA
1.8
2.2
2.4
2.2
OH
I
12 mA
18 mA
24 mA
2.7
V
V
OH
I
3.0
OH
I
3.0
OH
V
LOW Level Output Voltage
I
100
8 mA
A
2.3 3.6
2.3
0.2
0.6
OL
OL
I
OL
I
12 mA
16 mA
24 mA
2.7
0.4
OL
I
3.0
0.4
OL
I
3.0
0.55
5.0
OL
I
Input Leakage Current
0
0
V
V
V
5.5V
5.5V
2.3 3.6
A
A
A
I
I
I
3-STATE Output Leakage
OZ
O
2.3 3.6
0
5.0
10
V
or V
IL
I
IH
I
Power-Off Leakage Current
V or V
O
5.5V
OFF
I
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4
DC Electrical Characteristics (Continued)
V
T
40 C to 85 C
CC
A
Symbol
Parameter
Conditions
V or GND
CC
Units
(V)
Min
Max
20
I
Quiescent Supply Current
V
2.3 3.6
2.3 3.6
2.3 3.6
CC
I
A
A
3.6V V , V
5.5V (Note 7)
V 0.6V
CC
20
I
O
I
Increase in I per Input
V
500
CC
CC
IH
Note 7: Outputs disabled or 3-STATE only.
AC Electrical Characteristics
T
40 C to 85 C, R
500
A
L
V
3.3V 0.3V
50 pF
Max
V
2.7V
V
2.5V 0.2V
C 30 pF
L
CC
CC
CC
Symbol
Parameter
Units
C
C
50 pF
L
L
Min
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
2.5
1.5
3.0
Min
Max
5.9
5.9
6.4
6.4
6.5
6.5
6.3
6.3
Min
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
3.0
2.0
3.5
Max
6.5
6.5
6.6
6.6
7.9
7.9
7.2
7.2
t
t
t
t
t
t
t
t
t
t
t
t
t
Propagation Delay
to O
5.4
5.4
5.5
5.5
6.1
6.1
6.0
6.0
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
2.5
1.5
3.0
PHL
ns
ns
ns
ns
I
PLH
PHL
PLH
PZL
PZH
PLZ
PHZ
S
n
n
Propagation Delay
LE to O
n
Output Enable Time
Output Disable Time
Setup Time, I to LE
ns
ns
ns
n
Hold Time, I to LE
n
H
LE Pulse Width
W
Output to Output Skew (Note 8)
1.0
1.0
OSHL
OSLH
ns
Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t
) or LOW-to-HIGH (t
). Parameter guaranteed by design.
OSLH
OSHL
Dynamic Switching Characteristics
V
T
25 C
CC
A
Symbol
Parameter
Conditions
Units
(V)
3.3
2.5
3.3
2.5
Typical
0.8
V
Quiet Output Dynamic Peak V
C
C
C
C
50 pF, V
30 pF, V
50 pF, V
30 pF, V
3.3V, V
2.5V, V
3.3V, V
2.5V, V
0V
0V
0V
0V
OLP
OL
L
L
L
L
IH
IH
IH
IH
IL
IL
IL
IL
V
V
0.6
V
Quiet Output Dynamic Valley V
0.8
OLV
OL
0.6
Capacitance
Symbol
Parameter
Conditions
Typical
Units
pF
C
Input Capacitance
Output Capacitance
Power Dissipation Capacitance
V
V
V
Open, V 0V or V
CC
7
8
IN
CC
CC
CC
I
C
C
3.3V, V 0V or V
CC
pF
OUT
PD
I
3.3V, V 0V or V , f 10 MHz
20
pF
I
CC
5
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AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
Test
PLH, tPHL
PZL, tPLZ
Switch
Open
t
t
6V at VCC 3.3 0.3V, and 2.7V
VCC x 2 at VCC 2.5 0.2V
tPZH, tPHZ
GND
3-STATE Output High Enable and
Disable Times for Logic
Waveform for Inverting and Non-Inverting Functions
Setup Time, Hold Time and Recovery Time for Logic
Propagation Delay. Pulse Width and trec Waveforms
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tr = tf = 3ns)
VCC
Symbol
3.3V 0.3V
1.5V
2.7V
1.5V
2.5V 0.2V
VCC/2
Vmi
Vmo
Vx
1.5V
1.5V
VCC/2
VOL 0.3V
VOH 0.3V
VOL 0.3V
VOH 0.3V
VOL 0.15V
VOH 0.15V
Vy
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6
Schematic Diagram Generic for LCX Family
7
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Physical Dimensions inches (millimeters) unless otherwise noted
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Package Number BGA54A
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8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
Package Number MS48A
9
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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10
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