74ABT16373 [FAIRCHILD]

16-Bit Transparent D-Type Latch with 3-STATE Outputs; 16位透明D类锁存器具有三态输出
74ABT16373
型号: 74ABT16373
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

16-Bit Transparent D-Type Latch with 3-STATE Outputs
16位透明D类锁存器具有三态输出

锁存器
文件: 总6页 (文件大小:89K)
中文:  中文翻译
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March 1994  
Revised May 2005  
74ABT16373  
16-Bit Transparent D-Type Latch with 3-STATE Outputs  
General Description  
Features  
The ABT16373 contains sixteen non-inverting latches with  
3-STATE outputs and is intended for bus oriented applica-  
tions. The device is byte controlled. The flip-flops appear  
transparent to the data when the Latch Enable (LE) is  
HIGH. When LE is LOW, the data that meets the setup time  
is latched. Data appears on the bus when the Output  
Enable (OE) is LOW. When OE is HIGH, the outputs are in  
high Z state.  
Separate control logic for each byte  
16-bit version of the ABT373  
High impedance glitch free bus loading during entire  
power up and power down cycle  
Non-destructive hot insertion capability  
Guaranteed latch-up protection  
Ordering Code:  
Order Number  
74ABT16373CSSC  
74ABT16373CMTD  
Package Number  
MS48A  
Package Description  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
MTD48  
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Logic Symbol  
Connection Diagram  
Pin Descriptions  
Pin Names  
Description  
OEn  
Output Enable Input (Active LOW)  
Latch Enable Input  
Data Inputs  
LEn  
D0D15  
O0O15  
Outputs  
© 2005 Fairchild Semiconductor Corporation  
DS011666  
www.fairchildsemi.com  
Functional Description  
Truth Tables  
The ABT16373 contains sixteen D-type latches with  
3-STATE standard outputs. The device is byte controlled  
with each byte functioning identically, but independent of  
the other. Control pins can be shorted together to obtain full  
16-bit operation. The following description applies to each  
byte. When the Latch Enable (LEn) input is HIGH, data on  
Inputs  
OE1  
Outputs  
O0–O7  
LE1  
D0–D7  
X
H
H
L
H
L
L
L
X
L
Z
L
H
the Dn enters the latches. In this condition the latches are  
H
X
transparent, i.e., a latch output will change states each time  
its D input changes. When LEn is LOW, the latches store  
(Previous)  
information that was present on the D inputs a setup time  
preceding the HIGH-to-LOW transition of LEn. The 3-  
Inputs  
OE2  
Outputs  
O8–O15  
STATE standard outputs are controlled by the Output  
Enable (OEn) input. When OEn is LOW, the standard out-  
LE2  
D8–D15  
puts are in the 2-state mode. When OEn is HIGH, the stan-  
X
H
H
L
H
L
L
L
X
L
Z
dard outputs are in the high impedance mode but this does  
not interfere with entering new data into the latches.  
L
H
H
X
(Previous)  
H
L
X
Z
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
High Impedance  
Previous previous output prior to HIGH-to-LOW transition of LE  
Logic Diagrams  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 1)  
Recommended Operating  
Conditions  
65 C to 150 C  
Storage Temperature  
Ambient Temperature under Bias  
Junction Temperature under Bias  
VCC Pin Potential to Ground Pin  
Input Voltage (Note 2)  
55 C to 125 C  
55 C to 150 C  
0.5V to 7.0V  
Free Air Ambient Temperature  
Supply Voltage  
40 C to 85 C  
4.5V to 5.5V  
Minimum Input Edge Rate ( V/ t)  
Data Input  
0.5V to 7.0V  
50 mV/ns  
20 mV/ns  
Input Current (Note 2)  
Voltage Applied to Any Output  
in the Disabled or  
30 mA to 5.0 mA  
Enable Input  
Power-Off State  
0.5V to 5.5V  
0.5V to VCC  
in the HIGH State  
Current Applied to Output  
in LOW State (Max)  
twice the rated IOL (mA)  
350 mA  
DC Latchup Source Current: OE Pin  
(Across Comm Operating Range)  
Other Pins  
Note 1: Absolute maximum ratings are values beyond which the device  
may be damaged or have its useful life impaired. Functional operation  
under these conditions is not implied.  
500 mA  
10V  
Over Voltage Latchup (I/O)  
Note 2: Either voltage limit or current limit is sufficient to protect inputs.  
DC Electrical Characteristics  
V
Symbol  
Parameter  
Input HIGH Voltage  
Min  
Typ  
Max  
Units  
Conditions  
Recognized HIGH Signal  
Recognized LOW Signal  
CC  
V
2.0  
V
V
V
IH  
V
V
V
Input LOW Voltage  
0.8  
1.2  
IL  
Input Clamp Diode Voltage  
Output HIGH Voltage  
Min  
Min  
Min  
Max  
Max  
Max  
0.0  
I
I
I
I
18 mA  
3 mA  
CD  
OH  
IN  
2.5  
2.0  
OH  
OH  
OL  
32 mA  
V
Output LOW Voltage  
Input HIGH Current  
0.55  
V
A
A
A
V
64 mA  
OL  
I
1
1
7
1
1
V
V
V
V
V
2.7V (Note 3)  
IH  
IN  
IN  
IN  
IN  
IN  
V
CC  
I
I
Input HIGH Current Breakdown Test  
Input LOW Current  
7.0V  
BVI  
IL  
0.5V (Note 3)  
0.0V  
V
Input Leakage Test  
4.75  
100  
I
1.9  
A
ID  
ID  
All Other Pins Grounded  
I
Output Leakage Current  
10  
A
0
0
5.5V  
5.5V  
Max  
V
2.7V; OE 2.0V  
OZH  
OUT  
I
I
I
I
I
I
Output Leakage Current  
Output Short-Circuit Current  
Output HIGH Leakage Current  
Bus Drainage Test  
10  
275  
50  
A
mA  
A
V
V
V
V
0.5V; OE 2.0V  
0.0V  
OZL  
OS  
OUT  
OUT  
OUT  
OUT  
Max  
0.0  
V
CC  
CEX  
ZZ  
100  
2.0  
62  
A
5.5V; All Others GND  
Power Supply Current  
Power Supply Current  
mA  
mA  
Max  
Max  
All Outputs HIGH  
All Outputs LOW  
CCH  
CCL  
I
Power Supply Current  
2.0  
mA  
Max  
OE  
V
CC  
CCZ  
All Others at V or GND  
CC  
I
Additional I /Input  
Outputs Enabled  
Outputs 3-STATE  
Outputs 3-STATE  
2.5  
2.5  
2.5  
mA  
mA  
mA  
V
V
2.1V  
CCT  
CC  
I
CC  
Max  
Enable Input V  
V
2.1V  
2.1V  
All Others at V or GND  
I
CC  
CC  
CC  
Data Input V  
V
I
I
Dynamic I  
(Note 3)  
No Load  
mA/  
Outputs Open, LE  
V
CC  
CCD  
CC  
Max  
0.15  
MHz  
OE GND, (Note 4)  
One Bit Toggling, 50% Duty Cycle  
Note 3: Guaranteed, but not tested.  
Note 4: For 8 bits toggling, I 0.8 mA/MHz.  
CCD  
3
www.fairchildsemi.com  
AC Electrical Characteristics  
(SOIC and SSOP Packages)  
T
25 C  
5.0V  
T
40 C to 85 C  
4.5V to 5.5V  
A
A
V
V
CC  
CC  
Symbol  
Parameter  
Units  
C
50 pF  
C
50 pF  
Max  
L
L
Min  
1.4  
1.4  
1.7  
1.7  
1.1  
1.5  
2.4  
1.6  
Typ  
Max  
5.6  
5.6  
6.0  
5.5  
6.1  
5.6  
7.1  
6.5  
Min  
1.4  
1.4  
1.7  
1.7  
1.1  
1.5  
2.4  
1.6  
t
t
t
t
t
t
t
t
Propagation Delay  
to O  
5.6  
5.6  
6.0  
5.5  
6.1  
5.6  
7.1  
6.5  
PLH  
ns  
ns  
ns  
ns  
D
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
n
n
Propagation Delay  
LE to O  
n
Output Enable Time  
Output Disable Time  
AC Operating Requirements  
(SOIC and SSOP Packages)  
T
25 C  
5.0V  
T
40 C to 85 C  
4.5V to 5.5V  
A
A
V
V
CC  
CC  
Symbol  
Parameter  
Units  
C
50 pF  
C
50 pF  
Max  
L
L
Min  
Typ  
100  
Max  
Min  
f
Maximum Toggle Frequency  
Setup Time, HIGH  
MHz  
ns  
TOGGLE  
t (H)  
1.5  
1.5  
1.0  
1.0  
1.5  
1.5  
1.0  
1.0  
S
t (L)  
or LOW D to LE  
n
S
t (H)  
Hold Time, HIGH  
H
ns  
ns  
t (L)  
or LOW D to LE  
n
H
t
(H)  
Pulse Width,  
LE HIGH  
W
3.0  
3.0  
Capacitance  
Conditions  
(T 25 C)  
Symbol  
Parameter  
Typ  
Units  
A
C
C
Input Capacitance  
Output Capacitance  
5
pF  
pF  
V
V
0V  
5.0V  
IN  
CC  
CC  
(Note 5)  
11  
OUT  
Note 5: C  
is measured at frequency f 1 MHz, per MIL-STD-883, Method 3012.  
OUT  
www.fairchildsemi.com  
4
Physical Dimensions inches (millimeters) unless otherwise noted  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
Package Number MS48A  
5
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD48  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
6

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