EIA1616-8P-2 [EXCELICS]

16.2-16.4GHz 8-Watt Internally Matched Power FET; 16.2-16.4GHz 8瓦内部匹配功率场效应管
EIA1616-8P-2
型号: EIA1616-8P-2
厂家: EXCELICS SEMICONDUCTOR, INC.    EXCELICS SEMICONDUCTOR, INC.
描述:

16.2-16.4GHz 8-Watt Internally Matched Power FET
16.2-16.4GHz 8瓦内部匹配功率场效应管

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EIA1616-8P-2  
UPDATED 11/09/06  
16.2-16.4GHz 8-Watt Internally Matched Power FET  
FEATURES  
16.2– 16.4GHz Bandwidth  
Input/Output Impedance Matched to 50 Ohms  
+39.0 dBm Output Power at 1dB Compression  
6.0 dB Min. Power Gain at 1dB Compression  
30% Power Added Efficiency  
EIA1616-8P-2  
Non-Hermetic Metal Flange Package  
100% Tested for DC, RF, and RTH  
Caution! ESD sensitive device.  
ELECTRICAL CHARACTERISTICS (Ta = 25°C)  
SYMBOL  
P1dB  
PARAMETERS/TEST CONDITIONS1  
MIN  
TYP  
MAX  
UNITS  
Output Power at 1dB Compression  
VDS = 8 V, IDSQ 2200mA  
Gain at 1dB Compression  
DS = 8 V, IDSQ 2200mA  
f = 16.2-16.4GHz  
f = 16.2-16.4GHz  
f = 16.2-16.4GHz  
38.0  
39.0  
dBm  
6.0  
7.0  
dB  
dB  
%
G1dB  
G  
V
Gain Flatness  
±0.6  
VDS = 8 V, IDSQ 2200mA  
Power Added Efficiency at 1dB Compression  
30  
PAE  
V
DS = 8 V, IDSQ 2200mA  
f = 16.2-16.4GHz  
Drain Current at 1dB Compression  
f = 16.2-16.4GHz  
2600  
4000  
-1.0  
3.5  
3200  
6000  
-2.5  
4.0  
mA  
mA  
V
Id1dB  
IDSS  
VP  
Saturated Drain Current  
Pinch-off Voltage  
VDS = 3 V, VGS = 0 V  
VDS = 3 V, IDS = 40 mA  
Thermal Resistance2  
oC/W  
RTH  
Note:  
1. Tested with 100 Ohm gate resistor.  
2. Overall Rth depends on case mounting.  
ABSOLUTE MAXIMUM RATING1,2  
SYMBOLS  
Vds  
Vgs  
Igf  
PARAMETERS  
Drain-Source Voltage  
ABSOLUTE1  
CONTINUOUS2  
8V  
-3V  
10V  
-5V  
Gate-Source Voltage  
Forward Gate Current  
Reverse Gate Current  
Input Power  
86.4mA  
-14.4mA  
38 dBm  
175 oC  
28.8mA  
-4.8mA  
Igr  
@ 3dB Compression  
175 oC  
Pin  
Channel Temperature  
Storage Temperature  
Total Power Dissipation  
Tch  
Tstg  
Pt  
-65 to +175 oC  
-65 to +175 oC  
38W  
38W  
Notes:  
1. Operating the device beyond any of the above ratings may result in permanent damage or reduction of MTTF.  
2.  
Bias conditions must also satisfy the following equation PT < (TCH –TPKG)/RTH; where TPKG = temperature of package,  
and PT = (VDS * IDS) – (POUT – PIN).  
Specifications are subject to change without notice.  
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085  
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com  
page 1 of 2  
Revised November 2006  
EIA1616-8P-2  
UPDATED 11/09/06  
DISCLAIMER  
16.2-16.4GHz 8-Watt Internally Matched Power FET  
EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN.  
LIFE SUPPORT POLICY  
EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE  
SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR,  
INC. AS HERE IN:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for  
use provided in the labeling, can be reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness  
Specifications are subject to change without notice.  
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085  
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com  
page 2 of 2  
Revised November 2006  

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