XRP2526ID-1-F [EXAR]

Single/Dual Channel USB 3.0 Power Distribution Switch;
XRP2526ID-1-F
型号: XRP2526ID-1-F
厂家: EXAR CORPORATION    EXAR CORPORATION
描述:

Single/Dual Channel USB 3.0 Power Distribution Switch

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XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
July 2011  
Rev. 1.1.0  
GENERAL DESCRIPTION  
APPLICATIONS  
The XRP2525 and XRP2526 devices are  
respectively single and dual channel integrated  
high-side power distribution switches with  
independent enables and fault flags. A wide  
1.8V to 5.5V input voltage range allows for  
operations from industry standard 1.8V, 3.3V  
and 5V power rails.  
Self Powered USB 2.0 and 3.0 Hubs  
USB Compliant VBUS Power Distribution  
Audio-Video Equipments  
Generic Power Switching  
FEATURES  
Optimized for USB VBUS power distribution, the  
XRP2525 and XRP2526 are compliant with the  
latest USB 3.0 specification and can be used in  
any self or bus powered USB applications. The  
power-switch rise and fall times are controlled  
to minimize current surges during turn on/off.  
Single/Dual Channel Current Switch  
900mA per channel capable  
1.15A Over-current Limit  
1.8V to 5.5V Input Voltage Range  
USB 2.0/3.0 Compliant  
The XRP2525 and XRP2526 are pin and  
function compatible to respectively Exar’s  
SP2525A and SP2526A.  
Active High or Low Individual Enable  
Individual Channel Fault Flag Indicator  
Built-in over current, under voltage lockout  
(UVLO), reverse current and over temperature  
protections insure safe operations under  
abnormal operating conditions.  
Under voltage Lockout, Reverse  
Current and Thermal Shutdown  
Protection  
RoHS Compliant, Green/Halogen Free  
XRP2525 and XRP2526 are offered in a RoHS  
compliant “green”/halogen free 8-pin NSOIC  
package.  
8-Pin NSOIC Package  
TYPICAL APPLICATION DIAGRAM  
Fig. 1: XRP2526 Application Diagram  
Exar Corporation  
www.exar.com  
48720 Kato Road, Fremont CA 94538, USA  
Tel. +1 510 668-7000 – Fax. +1 510 668-7001  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
ABSOLUTE MAXIMUM RATINGS  
OPERATING RATINGS  
These are stress ratings only and functional operation of  
the device at these ratings or any other above those  
indicated in the operation sections of the specifications  
below is not implied. Exposure to absolute maximum  
rating conditions for extended periods of time may affect  
reliability.  
Input Voltage Range VIN.............................1.75V to 5.5V  
Junction Temperature Range....................-40°C to 125°C  
Thermal Resistance θJA ..................................128.4ºC/W  
VIN...........................................................-0.3V to 7.0V  
VEN, VFLG ............................................................... 7.0V  
Storage Temperature.............................. -65°C to 150°C  
Power Dissipation................................ Internally Limited  
Lead Temperature (Soldering, 10 sec) ...................300°C  
ESD Rating (HBM - Human Body Model).................... 2kV  
ESD Rating (MM - Machine Model) ...........................200V  
ELECTRICAL SPECIFICATIONS  
Specifications are for an Operating Junction Temperature of TJ = 25°C only; limits applying over the full Operating Junction  
Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical  
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes  
only. Unless otherwise indicated, 1.8V to 5.5V, CIN = 47µF//1µF, COUT = 10µF, TJ = –40°C to 125°C.  
Parameter  
Min.  
Typ.  
Max.  
Units  
Conditions  
Input Supply Voltage  
5.5  
V
1.8  
XRP2526 (Both Channels enabled)  
VIN=5V, IOUT1 = IOUT2 =0mA  
Input Quiescent Current  
80  
52  
150  
µA  
XRP2525 & XRP2526 (1 Channel enabled)  
VIN=5V, IOUT1 =0mA  
Input Quiescent Current  
Input Shutdown Current  
100  
3
µA  
µA  
VIN=5V, Channel(s) disabled  
Maximum Output Current per  
channel  
mA  
XRP2525 and XRP2526  
900  
Output Leakage Current  
Reverse Leakage Current  
Output MOSFET Resistance  
Output turn-on delay  
10  
10  
µA  
µA  
mΩ  
µs  
µs  
µs  
µs  
A
VIN=5V, VOUT=0V, Each channel, Switch off  
VIN=0V, VOUT=5V, Each channel, Switch off  
IOUT=0.3A, Each channel  
80  
1000  
2000  
10  
140  
VIN=5V, RL=10, COUT=1µF, each output  
VIN=5V, RL=10, COUT=1µF, each output  
VIN=5V, RL=10, COUT=1µF, each output  
VIN=5V, RL=10, COUT=1µF, each output  
VIN – VOUT =0.3V, Internally set  
Output turn-on rise time  
Output turn-off delay  
4000  
20  
Output turn-off fall time  
Current limit threshold  
Short Circuit Current Limit  
22  
50  
1.15  
0.66xILIM  
1.40  
0.90  
A
VOUT =0V  
Output Voltage Short Circuit  
Detect Threshold  
Operates in short circuit current limit mode  
when output voltage is below threshold.  
925  
3
mV  
A
Safe Operating Area (SOA)  
Current Limit  
Over temperature shutdown  
threshold  
135  
10  
°C  
°C  
Temperature rising  
Over temperature shutdown  
threshold hysteresis  
Temperature decreasing  
VIN rising or falling  
Under-voltage lockout threshold  
Under-voltage lockout hysteresis  
FLG output logic low voltage  
FLG output high leakage  
FLG blanking time  
1.68  
50  
1.75  
V
mV  
mV  
µA  
ms  
V
1.55  
100  
250  
1
IFLG=10mA, VIN=5.5V  
10  
0
EN input logic high voltage  
EN input logic low voltage  
EN input leakage current  
1.5  
-1  
0.5  
1
V
µA  
VEN=0V or VEN=5.5V  
© 2011 Exar Corporation  
2/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
BLOCK DIAGRAM  
Fig. 2: XRP2525 and XRP2526 Block Diagrams  
© 2011 Exar Corporation  
3/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
PIN ASSIGNMENT  
Fig. 3: XRP2525 - XRP2526 Pin Assignment  
PIN DESCRIPTION – XRP2525  
Name  
Pin Number  
Description  
Channel Enable Input  
Active High for XRP2525-1 and Active Low for XRP2525-2  
1
EN  
Error Flag Signal  
2
FLG  
Active low open drain output. Active on over-current, over-temperature or UVLO conditions.  
3
4,5,6  
7
Ground Signal  
No Connect  
GND  
NC  
Voltage Input Pin  
Voltage Output Pin  
IN  
8
OUT  
PIN DESCRIPTION – XRP2526  
Name  
Pin Number  
Description  
Channel Enable Input  
Active High for XRP2526-1 and Active Low for XRP2526-2  
1,4  
ENX  
Error Flag Signal  
2,3  
FLGX  
Active low open drain output. Active on over-current, over-temperature or UVLO conditions.  
6
7
Ground Signal  
GND  
IN  
Voltage Input Pin  
Voltage Output Pin  
5,8  
OUTX  
ORDERING INFORMATION  
Part Number  
Temperature Range  
-40°CTA+85°C  
-40°CTA+85°C  
-40°CTA+85°C  
-40°CTA+85°C  
Marking  
Package Packing Quantity  
Note 1  
Note 2  
2525ID 1  
YYWW  
X
2525ID 2  
YYWW  
X
2526ID 1  
YYWW  
X
2526ID 2  
YYWW  
X
Bulk  
NSOIC8  
XRP2525ID-1-F  
XRP2525IDTR-1-F  
XRP2525ID-2-F  
XRP2525IDTR-2-F  
XRP2526ID-1-F  
XRP2526IDTR-1-F  
XRP2526ID-2-F  
XRP2526IDTR-2-F  
Single Channel  
Active high  
Lead Free and  
Halogen Free  
2.5K/Tape & Reel  
Bulk  
NSOIC8  
Single Channel  
Active low  
Lead Free and  
Halogen Free  
2.5K/Tape & Reel  
Bulk  
NSOIC8  
Dual Channel  
Active high  
Lead Free and  
Halogen Free  
2.5K/Tape & Reel  
Bulk  
NSOIC8  
Dual Channel  
Active low  
Lead Free and  
Halogen Free  
2.5K/Tape & Reel  
XRP2525 Evaluation Board  
XRP2526 Evaluation Board  
XRP2525EVB  
XRP2526EVB  
“YY” = Year – “WW” = Work Week – “X” = Lot Number; when applicable.  
© 2011 Exar Corporation  
4/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
TYPICAL PERFORMANCE CHARACTERISTICS  
All data taken at VIN = 5V, CIN = 47µF//1µF, COUT = 10µF, TJ = TA = 25°C, unless otherwise specified - Schematic and BOM  
from Application Information section of this datasheet.  
Fig. 5: Output On-Resistance vs. Temperature (XRP2526)  
Fig. 4: Output On-Resistance vs. Temperature (XRP2525)  
Fig. 7: Quiescent Current vs. Temperature  
XRP2525 and XRP2526 (1-channel on)  
Fig. 6: Off Supply Current vs. Temperature  
Fig. 8: Quiescent Current vs. Temperature  
XRP2526 (2-channels on)  
Fig. 9: FLG Logic Low Voltage vs. Temperature  
© 2011 Exar Corporation  
5/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
Fig. 11: Quiescent Current vs. Input Voltage  
XRP2526 (2-channels on)  
Fig. 10: Quiescent Current vs. Input Voltage  
XRP2525 and XRP2526 (1-channel on)  
Fig. 13: Output Turn-on Delay vs. Temperature  
Fig. 12: Output Turn-Off Delay vs. Temperature  
Fig. 15: Output Rise Time vs. Temperature  
Fig. 14: Output Fall Time vs. Temperature  
© 2011 Exar Corporation  
6/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
Fig. 17: Output Turn-On Delay Time vs. Input Voltage  
Fig. 16: Output Turn-Off Delay Time vs. Input Voltage  
Fig. 19: Output Rise Time vs. Input Voltage  
Fig. 18: Output Fall Time vs. Input Voltage  
Fig. 20: Current Limit Threshold vs. Temperature (XRP2525) Fig. 21: Current Limit Threshold vs. Temperature (XRP2526)  
© 2011 Exar Corporation  
7/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
IQ vs VEN @ 25C: XRP2525-1  
60  
58  
56  
54  
52  
50  
48  
46  
1.5  
2.5  
3.5  
VEN [V]  
4.5  
5.5  
Fig. 23: Quiescent Current vs. Enable pin Voltage  
XRP2525-1  
Fig. 22: Under-voltage lockout trip level vs. Temperature  
(VIN Rising)  
Fig. 24: Turn-On, Turn-Off Characteristics  
Fig. 25: Turn-On, Turn-Off Characteristics  
(XRP2526-1) COUT = 1uF, Rload = 10Ω  
(XRP2526-1) COUT = 1uF, Rload = 5.1Ω  
Fig. 27: Current Limit Operation (XRP2526-1):  
Fig. 26: Current Limit Operation (XRP2525-1):  
VIN=1.8V, Rload = 1.5Ω  
VIN=5.5V, Rload = 3.9Ω  
© 2011 Exar Corporation  
8/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
damages resulting from undesirable short  
circuit conditions or excess inrush current,  
which is often encountered during hot plug-in.  
The low limit of the current limit threshold of  
the XRP2525 and XRP2526 allows a minimum  
current of 0.9A through the MOSFET switches.  
THEORY OF OPERATION  
The XRP2525 and XRP2526 devices are  
respectively single and dual channel integrated  
high-side power distribution switches that can  
be used in any self or bus powered USB  
applications. They are compliant with the  
latest USB 3.0 specifications. The reverse  
current protection feature prevents current to  
flow from OUT to IN when the device is  
disabled.  
When an overcurrent condition is detected, the  
output current is limited to a constant current  
limit threshold value and output voltage is  
reduced accordingly. Triggering the current  
limit function is signaled by the Error Flag  
after 10ms of blanking time period.  
I
NPUT & OUTPUT  
Placing bulk capacitances of at least 47μF and  
10μF at the input and output pins respectively  
reduces power supply transients under heavy  
current load conditions.  
U
NDER-VOLTAGE LOCKOUT  
Under-voltage lockout function (UVLO) keeps  
the internal power switch from being turned  
on until the power supply has reached at least  
1.68V, even if the switch is enabled. Upon  
It is important to place a 1μF ceramic bypass  
capacitor from IN to GND as close as possible  
to the device in order to control supply  
transients.  
detection  
of  
an  
input  
voltage  
below  
approximately 1.68V, the power switch is  
turned off while a fault condition is reported by  
the error flag signal.  
Furthermore, bypassing the output pin with a  
0.1μF to 1μF ceramic capacitor improves the  
device response to short-circuit transients.  
T
HERMAL PROTECTION  
Internal thermal sensing circuitry monitors the  
operating temperature of the device for each  
channel independently. Upon detection of a  
temperature in excess of 135°C, the power  
switch for the given channel is disabled  
preventing any damages to the device while a  
fault condition is reported by the error flag  
signal. A built-in 10°C hysteresis allows the  
device to cool down to 125°C before resuming  
normal operations on the faulty channel at  
which point the error flag signal is cleared.  
E
RROR FLAG  
The error flag signal (FLGX output pin) is an  
open-drain output and is pulled low (active  
low) upon detection of the following  
conditions:  
Over-current condition  
Over-temperature condition  
Under voltage lockout condition  
Over-temperature and under voltage lockout  
conditions are flagged immediately while the  
over – current condition is reported only if this  
condition persists continuously for longer than  
the blanking time of 10ms. The blanking time  
prevents erroneous reporting of current faults  
due to brief output current spikes.  
T
EST CIRCUIT  
Once activated, the error flag signal remains  
low until all fault conditions have been  
removed and is independent for each  
individual channel.  
CURRENT LIMIT  
The current limit threshold is preset internally.  
It protects the output MOSFET switches from  
© 2011 Exar Corporation  
9/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
PACKAGE SPECIFICATION  
8-PIN NSOIC  
© 2011 Exar Corporation  
10/11  
Rev. 1.1.0  
XRP2525 - XRP2526  
Single/Dual Channel USB 3.0 Power Distribution Switch  
REVISION HISTORY  
Revision  
Date  
Description  
05/13/2011  
07/14/2011  
Initial release of datasheet  
1.0.0  
1.1.0  
Corrections of typographical errors  
FOR FURTHER ASSISTANCE  
Email:  
customersupport@exar.com  
Exar Technical Documentation:  
http://www.exar.com/TechDoc/default.aspx?  
E
XAR  
CORPORATION  
H
EADQUARTERS AND  
SALES OFFICES  
48720 Kato Road  
Fremont, CA 94538 – USA  
Tel.: +1 (510) 668-7000  
Fax: +1 (510) 668-7030  
www.exar.com  
NOTICE  
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve  
design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein,  
conveys no license under any patent or other right, and makes no representation that the circuits are free of patent  
infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a  
user’s specific application. While the information in this publication has been carefully checked; no responsibility, however,  
is assumed for inaccuracies.  
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or  
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its  
safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in  
writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all  
such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.  
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.  
© 2011 Exar Corporation  
11/11  
Rev. 1.1.0  

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