XRP2526ID-1-F [EXAR]
Single/Dual Channel USB 3.0 Power Distribution Switch;型号: | XRP2526ID-1-F |
厂家: | EXAR CORPORATION |
描述: | Single/Dual Channel USB 3.0 Power Distribution Switch |
文件: | 总11页 (文件大小:3085K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
July 2011
Rev. 1.1.0
GENERAL DESCRIPTION
APPLICATIONS
The XRP2525 and XRP2526 devices are
respectively single and dual channel integrated
high-side power distribution switches with
independent enables and fault flags. A wide
1.8V to 5.5V input voltage range allows for
operations from industry standard 1.8V, 3.3V
and 5V power rails.
Self Powered USB 2.0 and 3.0 Hubs
USB Compliant VBUS Power Distribution
Audio-Video Equipments
Generic Power Switching
FEATURES
Optimized for USB VBUS power distribution, the
XRP2525 and XRP2526 are compliant with the
latest USB 3.0 specification and can be used in
any self or bus powered USB applications. The
power-switch rise and fall times are controlled
to minimize current surges during turn on/off.
Single/Dual Channel Current Switch
900mA per channel capable
1.15A Over-current Limit
1.8V to 5.5V Input Voltage Range
USB 2.0/3.0 Compliant
The XRP2525 and XRP2526 are pin and
function compatible to respectively Exar’s
SP2525A and SP2526A.
Active High or Low Individual Enable
Individual Channel Fault Flag Indicator
Built-in over current, under voltage lockout
(UVLO), reverse current and over temperature
protections insure safe operations under
abnormal operating conditions.
Under voltage Lockout, Reverse
Current and Thermal Shutdown
Protection
RoHS Compliant, Green/Halogen Free
XRP2525 and XRP2526 are offered in a RoHS
compliant “green”/halogen free 8-pin NSOIC
package.
8-Pin NSOIC Package
TYPICAL APPLICATION DIAGRAM
Fig. 1: XRP2526 Application Diagram
Exar Corporation
www.exar.com
48720 Kato Road, Fremont CA 94538, USA
Tel. +1 510 668-7000 – Fax. +1 510 668-7001
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
ABSOLUTE MAXIMUM RATINGS
OPERATING RATINGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
Input Voltage Range VIN.............................1.75V to 5.5V
Junction Temperature Range....................-40°C to 125°C
Thermal Resistance θJA ..................................128.4ºC/W
VIN...........................................................-0.3V to 7.0V
VEN, VFLG ............................................................... 7.0V
Storage Temperature.............................. -65°C to 150°C
Power Dissipation................................ Internally Limited
Lead Temperature (Soldering, 10 sec) ...................300°C
ESD Rating (HBM - Human Body Model).................... 2kV
ESD Rating (MM - Machine Model) ...........................200V
ELECTRICAL SPECIFICATIONS
Specifications are for an Operating Junction Temperature of TJ = 25°C only; limits applying over the full Operating Junction
Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes
only. Unless otherwise indicated, 1.8V to 5.5V, CIN = 47µF//1µF, COUT = 10µF, TJ = –40°C to 125°C.
Parameter
Min.
Typ.
Max.
Units
Conditions
•
•
Input Supply Voltage
5.5
V
1.8
XRP2526 (Both Channels enabled)
VIN=5V, IOUT1 = IOUT2 =0mA
Input Quiescent Current
80
52
150
µA
XRP2525 & XRP2526 (1 Channel enabled)
VIN=5V, IOUT1 =0mA
•
•
•
Input Quiescent Current
Input Shutdown Current
100
3
µA
µA
VIN=5V, Channel(s) disabled
Maximum Output Current per
channel
mA
XRP2525 and XRP2526
900
Output Leakage Current
Reverse Leakage Current
Output MOSFET Resistance
Output turn-on delay
10
10
µA
µA
mΩ
µs
µs
µs
µs
A
VIN=5V, VOUT=0V, Each channel, Switch off
VIN=0V, VOUT=5V, Each channel, Switch off
IOUT=0.3A, Each channel
•
•
80
1000
2000
10
140
VIN=5V, RL=10Ω, COUT=1µF, each output
VIN=5V, RL=10Ω, COUT=1µF, each output
VIN=5V, RL=10Ω, COUT=1µF, each output
VIN=5V, RL=10Ω, COUT=1µF, each output
VIN – VOUT =0.3V, Internally set
Output turn-on rise time
Output turn-off delay
4000
20
Output turn-off fall time
Current limit threshold
Short Circuit Current Limit
22
50
1.15
0.66xILIM
1.40
0.90
A
VOUT =0V
Output Voltage Short Circuit
Detect Threshold
Operates in short circuit current limit mode
when output voltage is below threshold.
925
3
mV
A
Safe Operating Area (SOA)
Current Limit
Over temperature shutdown
threshold
135
10
°C
°C
Temperature rising
Over temperature shutdown
threshold hysteresis
Temperature decreasing
VIN rising or falling
Under-voltage lockout threshold
Under-voltage lockout hysteresis
FLG output logic low voltage
FLG output high leakage
FLG blanking time
1.68
50
1.75
V
mV
mV
µA
ms
V
1.55
100
250
1
IFLG=10mA, VIN=5.5V
10
0
•
•
EN input logic high voltage
EN input logic low voltage
EN input leakage current
1.5
-1
0.5
1
V
µA
VEN=0V or VEN=5.5V
© 2011 Exar Corporation
2/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
BLOCK DIAGRAM
Fig. 2: XRP2525 and XRP2526 Block Diagrams
© 2011 Exar Corporation
3/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
PIN ASSIGNMENT
Fig. 3: XRP2525 - XRP2526 Pin Assignment
PIN DESCRIPTION – XRP2525
Name
Pin Number
Description
Channel Enable Input
Active High for XRP2525-1 and Active Low for XRP2525-2
1
EN
Error Flag Signal
2
FLG
Active low open drain output. Active on over-current, over-temperature or UVLO conditions.
3
4,5,6
7
Ground Signal
No Connect
GND
NC
Voltage Input Pin
Voltage Output Pin
IN
8
OUT
PIN DESCRIPTION – XRP2526
Name
Pin Number
Description
Channel Enable Input
Active High for XRP2526-1 and Active Low for XRP2526-2
1,4
ENX
Error Flag Signal
2,3
FLGX
Active low open drain output. Active on over-current, over-temperature or UVLO conditions.
6
7
Ground Signal
GND
IN
Voltage Input Pin
Voltage Output Pin
5,8
OUTX
ORDERING INFORMATION
Part Number
Temperature Range
-40°C≤TA≤+85°C
-40°C≤TA≤+85°C
-40°C≤TA≤+85°C
-40°C≤TA≤+85°C
Marking
Package Packing Quantity
Note 1
Note 2
2525ID 1
YYWW
X
2525ID 2
YYWW
X
2526ID 1
YYWW
X
2526ID 2
YYWW
X
Bulk
NSOIC8
XRP2525ID-1-F
XRP2525IDTR-1-F
XRP2525ID-2-F
XRP2525IDTR-2-F
XRP2526ID-1-F
XRP2526IDTR-1-F
XRP2526ID-2-F
XRP2526IDTR-2-F
Single Channel
Active high
Lead Free and
Halogen Free
2.5K/Tape & Reel
Bulk
NSOIC8
Single Channel
Active low
Lead Free and
Halogen Free
2.5K/Tape & Reel
Bulk
NSOIC8
Dual Channel
Active high
Lead Free and
Halogen Free
2.5K/Tape & Reel
Bulk
NSOIC8
Dual Channel
Active low
Lead Free and
Halogen Free
2.5K/Tape & Reel
XRP2525 Evaluation Board
XRP2526 Evaluation Board
XRP2525EVB
XRP2526EVB
“YY” = Year – “WW” = Work Week – “X” = Lot Number; when applicable.
© 2011 Exar Corporation
4/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
TYPICAL PERFORMANCE CHARACTERISTICS
All data taken at VIN = 5V, CIN = 47µF//1µF, COUT = 10µF, TJ = TA = 25°C, unless otherwise specified - Schematic and BOM
from Application Information section of this datasheet.
Fig. 5: Output On-Resistance vs. Temperature (XRP2526)
Fig. 4: Output On-Resistance vs. Temperature (XRP2525)
Fig. 7: Quiescent Current vs. Temperature
XRP2525 and XRP2526 (1-channel on)
Fig. 6: Off Supply Current vs. Temperature
Fig. 8: Quiescent Current vs. Temperature
XRP2526 (2-channels on)
Fig. 9: FLG Logic Low Voltage vs. Temperature
© 2011 Exar Corporation
5/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
Fig. 11: Quiescent Current vs. Input Voltage
XRP2526 (2-channels on)
Fig. 10: Quiescent Current vs. Input Voltage
XRP2525 and XRP2526 (1-channel on)
Fig. 13: Output Turn-on Delay vs. Temperature
Fig. 12: Output Turn-Off Delay vs. Temperature
Fig. 15: Output Rise Time vs. Temperature
Fig. 14: Output Fall Time vs. Temperature
© 2011 Exar Corporation
6/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
Fig. 17: Output Turn-On Delay Time vs. Input Voltage
Fig. 16: Output Turn-Off Delay Time vs. Input Voltage
Fig. 19: Output Rise Time vs. Input Voltage
Fig. 18: Output Fall Time vs. Input Voltage
Fig. 20: Current Limit Threshold vs. Temperature (XRP2525) Fig. 21: Current Limit Threshold vs. Temperature (XRP2526)
© 2011 Exar Corporation
7/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
IQ vs VEN @ 25C: XRP2525-1
60
58
56
54
52
50
48
46
1.5
2.5
3.5
VEN [V]
4.5
5.5
Fig. 23: Quiescent Current vs. Enable pin Voltage
XRP2525-1
Fig. 22: Under-voltage lockout trip level vs. Temperature
(VIN Rising)
Fig. 24: Turn-On, Turn-Off Characteristics
Fig. 25: Turn-On, Turn-Off Characteristics
(XRP2526-1) COUT = 1uF, Rload = 10Ω
(XRP2526-1) COUT = 1uF, Rload = 5.1Ω
Fig. 27: Current Limit Operation (XRP2526-1):
Fig. 26: Current Limit Operation (XRP2525-1):
VIN=1.8V, Rload = 1.5Ω
VIN=5.5V, Rload = 3.9Ω
© 2011 Exar Corporation
8/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
damages resulting from undesirable short
circuit conditions or excess inrush current,
which is often encountered during hot plug-in.
The low limit of the current limit threshold of
the XRP2525 and XRP2526 allows a minimum
current of 0.9A through the MOSFET switches.
THEORY OF OPERATION
The XRP2525 and XRP2526 devices are
respectively single and dual channel integrated
high-side power distribution switches that can
be used in any self or bus powered USB
applications. They are compliant with the
latest USB 3.0 specifications. The reverse
current protection feature prevents current to
flow from OUT to IN when the device is
disabled.
When an overcurrent condition is detected, the
output current is limited to a constant current
limit threshold value and output voltage is
reduced accordingly. Triggering the current
limit function is signaled by the Error Flag
after 10ms of blanking time period.
I
NPUT & OUTPUT
Placing bulk capacitances of at least 47μF and
10μF at the input and output pins respectively
reduces power supply transients under heavy
current load conditions.
U
NDER-VOLTAGE LOCKOUT
Under-voltage lockout function (UVLO) keeps
the internal power switch from being turned
on until the power supply has reached at least
1.68V, even if the switch is enabled. Upon
It is important to place a 1μF ceramic bypass
capacitor from IN to GND as close as possible
to the device in order to control supply
transients.
detection
of
an
input
voltage
below
approximately 1.68V, the power switch is
turned off while a fault condition is reported by
the error flag signal.
Furthermore, bypassing the output pin with a
0.1μF to 1μF ceramic capacitor improves the
device response to short-circuit transients.
T
HERMAL PROTECTION
Internal thermal sensing circuitry monitors the
operating temperature of the device for each
channel independently. Upon detection of a
temperature in excess of 135°C, the power
switch for the given channel is disabled
preventing any damages to the device while a
fault condition is reported by the error flag
signal. A built-in 10°C hysteresis allows the
device to cool down to 125°C before resuming
normal operations on the faulty channel at
which point the error flag signal is cleared.
E
RROR FLAG
The error flag signal (FLGX output pin) is an
open-drain output and is pulled low (active
low) upon detection of the following
conditions:
Over-current condition
Over-temperature condition
Under voltage lockout condition
Over-temperature and under voltage lockout
conditions are flagged immediately while the
over – current condition is reported only if this
condition persists continuously for longer than
the blanking time of 10ms. The blanking time
prevents erroneous reporting of current faults
due to brief output current spikes.
T
EST CIRCUIT
Once activated, the error flag signal remains
low until all fault conditions have been
removed and is independent for each
individual channel.
CURRENT LIMIT
The current limit threshold is preset internally.
It protects the output MOSFET switches from
© 2011 Exar Corporation
9/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
PACKAGE SPECIFICATION
8-PIN NSOIC
© 2011 Exar Corporation
10/11
Rev. 1.1.0
XRP2525 - XRP2526
Single/Dual Channel USB 3.0 Power Distribution Switch
REVISION HISTORY
Revision
Date
Description
05/13/2011
07/14/2011
Initial release of datasheet
1.0.0
1.1.0
Corrections of typographical errors
FOR FURTHER ASSISTANCE
Email:
customersupport@exar.com
Exar Technical Documentation:
http://www.exar.com/TechDoc/default.aspx?
E
XAR
CORPORATION
H
EADQUARTERS AND
SALES OFFICES
48720 Kato Road
Fremont, CA 94538 – USA
Tel.: +1 (510) 668-7000
Fax: +1 (510) 668-7030
www.exar.com
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein,
conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a
user’s specific application. While the information in this publication has been carefully checked; no responsibility, however,
is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its
safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in
writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all
such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
© 2011 Exar Corporation
11/11
Rev. 1.1.0
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