3474AN/R3DB-AGHC/R/MS [EVERLIGHT]

Single Color LED, Brilliant Red, Diffused Red, 3.95mm, ROHS COMPLIANT PACKAGE-2;
3474AN/R3DB-AGHC/R/MS
型号: 3474AN/R3DB-AGHC/R/MS
厂家: EVERLIGHT ELECTRONICS CO., LTD    EVERLIGHT ELECTRONICS CO., LTD
描述:

Single Color LED, Brilliant Red, Diffused Red, 3.95mm, ROHS COMPLIANT PACKAGE-2

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文件: 总10页 (文件大小:102K)
中文:  中文翻译
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Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
Features  
High luminous intensity output  
Oval Shape  
Well defined spatial radiation  
Wide viewing angle (2θ1/2) : 110o / 50 o  
UV resistant epoxy  
The product itself will remain within RoHS compliant version  
Descriptions  
This precision optical performance oval LED is specifically  
designed for passenger information signs  
This lamp has matched radiation patterns with yellow, blue  
or green mixing color applications  
Applications  
Color Graphic Signs  
Message boards  
Variable message signs (VMS)  
Commercial outdoor advertising  
Device Selection Guide  
LED Part No.  
Chip Material Emitted Color Lens Color  
Stopper  
No  
3474AN/R3DB-AGHC/R/MS  
3474AN/R3DB-AGHC/PR/MS  
AlGaInP  
Brilliant Red Red Diffused  
Yes  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 1 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
Package Dimensions  
Stopper Type  
No Stopper Type  
Notes:  
Other dimensions are in millimeters, tolerance is 0.25mm except being specified.  
Protruded resin under flange is 1.5mm Max LED.  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 2 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
Absolute Maximum Rating (Ta=25)  
Parameter  
Symbol Absolute Maximum Rating Unit  
Forward Current  
IF  
50  
mA  
mA  
Pulse Forward Current (Duty1/10@ 1KHz)  
IFP  
160  
mW  
V
Operating Temperature  
Storage Temperature  
Soldering Temperature  
Power Dissipation  
Topr  
Tstg  
Tsol  
Pd  
-40 ~ +85  
-40 ~ +100  
260  
120  
5
Reverse Voltage  
VR  
Electrostatic Discharge  
Notes: Soldering time5 seconds.  
ESD  
2K  
V
Electro-Optical Characteristics (Ta=25)  
Parameter  
Luminous Intensity  
Viewing Angle  
Peak Wavelength  
Dominant Wavelength  
Spectrum Half width  
Forward Voltage  
Reverse Current  
Symbol  
IV  
2θ1/2  
λp  
Min.  
720  
--  
--  
620  
--  
Typ.  
--  
Max.  
1440  
--  
--  
632  
--  
Unit  
mcd  
deg  
Condition  
X:110Y:50  
632  
--  
IF=20mA  
VR=5V  
λd  
nm  
Δλ  
VF  
20  
--  
2.0  
--  
2.6  
10  
V
μA  
IR  
--  
Rank Combination (IF=20mA)  
Rank  
G1  
G2  
H1  
H2  
Luminous Intensity  
720~860  
860~1020  
1020~1220  
1220~1440  
Unit:mcd  
*Measurement Uncertainty of Luminous Intensity: ±10%  
Rank  
1
2
Dominant Wavelength  
620~626  
626~632  
*Measurement Uncertainty of Dominant Wavelength ±1.0nm  
Unit:nm  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 3 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
Typical Electro-Optical Characteristics Curves  
Relative Intensity vs. Wavelength  
Forward Current vs. Forward Voltage  
50  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
40  
30  
20  
10  
0
500  
550  
600  
650  
700  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
Wavelength(nm)  
Forward Voltage(V)  
Relative Intensity vs. Ambient Temp.  
Relative Intensity vs. Forward Current  
2.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.5  
1.0  
0.5  
0.0  
25  
30  
35  
40  
45  
50  
55  
60  
65  
70  
0
10  
20  
30  
40  
50  
Ambient Temperature Ta(OC)  
Forward Current(mA)  
Forward Current vs. Ambient Temp.  
Radiation Characteristics  
60  
50  
40  
30  
20  
10  
0
0
20  
40  
60  
80  
100  
Ambient Temperature Ta(OC)  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 4 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
Taping Dimensions  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 5 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
Taping Sizes  
3474AN/R3DB-AGHC/XR/MS  
Specifications  
Symbol Items  
Symbol  
Avg.  
Inch  
Tolerance  
(mm)  
±0.2  
mm  
4.00  
Tape Feed Hole Diameter  
Component Lead Pitch  
D
F
0.157  
0.100  
0.078  
2.54  
2.0  
±0.3  
Front-to-Read Deflection  
Feed Hole to Button of Component  
Feed Hole to Overall Component Height  
Lead Length after Component Removal  
Feed Hole Pitch  
H  
H1  
H2  
L
Max  
±1.0  
18.5  
24.6  
0.729  
0.969  
±1.0  
11.00 0.433  
12.70 0.500  
Max  
±0.3  
P
Lead Location  
P1  
P2  
T
5.10  
6.35  
1.42  
9.00  
0.200  
0.250  
0.056  
0.354  
±0.7  
Center of Component Location  
Overall Taped Package Thickness  
Feed Hole Location  
±1.2  
Max  
±0.5  
W0  
W1  
W2  
W3  
Adhesive Tape Width  
13.00 0.512  
4.00 0.157  
±0.5  
Adhesive Tape Position  
Tape Width  
Max  
±0.75  
18.00 0.709  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 6 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
Packing Specification  
■ꢀ Inner Carton  
EVERLIGHT  
CPN:  
P/N:XXXXXXXXXX  
RoHS  
XXX/XXXX-XXXX  
QTYXXXX  
CAT:XX  
HUE:XX  
REF:XX  
LOT NO:  
MADE IN TAIWAN  
Label Form Specification  
CPN: Customer’s Production Number  
P/N : Production Number  
Outside Carton  
QTY: Packing Quantity  
CAT: Rank of Luminous Intensity  
HUE: Rank of Dominant Wavelength  
REF: Reference  
LOT No: Lot Number  
MADE IN TAIWAN: Production Place  
Packing Quantity  
1. 2500 PCS/1 Inner Carton  
2. 10Inner Cartons/1 Outside Carton  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 7 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
Notes  
1. Lead Forming  
„
During lead formation, the leads should be bent at a point at least 3mm from the base of the  
epoxy bulb.  
„
„
Lead forming should be done before soldering.  
Avoid stressing the LED package during leads forming. The stress to the base may damage  
the LED’s characteristics or it may break the LEDs.  
„
„
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures  
may cause failure of the LEDs.  
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead  
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration  
of the epoxy resin and this will degrade the LEDs.  
2. Storage  
„
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from  
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or  
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and  
moisture absorbent material.  
„
Please avoid rapid transitions in ambient temperature, especially, in high humidity  
environments where condensation can occur.  
3. Soldering  
„
Careful attention should be paid during soldering. When soldering, leave more then 3mm  
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is  
recommended.  
„
Recommended soldering conditions:  
Hand Soldering  
300Max. (30W  
DIP Soldering  
100Max. (60 sec  
Temp. at tip of iron  
Preheat temp.  
Max.)  
Max.)  
Soldering time  
Distance  
3 sec Max.  
3mm Min.(From  
solder joint to  
epoxy bulb)  
Bath temp. & time  
Distance  
260 Max., 5 sec Max  
3mm Min. (From  
solder joint to epoxy  
bulb)  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 8 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
„
Recommended soldering profile  
laminar wave  
Fluxing  
Prehead  
„
Avoiding applying any stress to the lead frame while the LEDs are at high temperature  
particularly when soldering.  
„
„
Dip and hand soldering should not be done more than one time  
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or  
vibration until the LEDs return to room temperature.  
„
„
„
A rapid-rate process is not recommended for cooling the LEDs down from the peak  
temperature.  
Although the recommended soldering conditions are specified in the above table, dip or  
handsoldering at the lowest possible temperature is desirable for the LEDs.  
Wave soldering parameter must be set and maintain according to recommended  
temperature and dwell time in the solder wave.  
4. Cleaning  
„
When necessary, cleaning should occur only with isopropyl alcohol at room temperature  
for a duration of no more than one minute. Dry at room temperature before use.  
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of  
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the  
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not  
cause damage to the LED  
„
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 9 of 10  
Prepared by: Grace Shen  
Technical Data Sheet  
3474AN/R3DB-AGHC/XR/MS  
5. Heat Management  
„
Heat management of LEDs must be taken into consideration during the design stage of  
LED application. The current should be de-rated appropriately by referring to the de-rating  
curve found in each product specification.  
„
The temperature surrounding the LED in the application should be controlled. Please refer  
to the data sheet de-rating curve.  
6. ESD (Electrostatic Discharge)  
„
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.  
„
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling  
LEDs.  
„
„
All devices, equipment and machinery must be properly grounded.  
Use ion blower to neutralize the static charge which might have built up on surface of the  
LEDs plastic lens as a result of friction between LEDs during storage and handing.  
7. Other  
„
Above specification may be changed without notice. EVERLIGHT will reserve authority  
on material change for above specification.  
„
„
When using this product, please observe the absolute maximum ratings and the  
instructions for using outlined in these specification sheets. EVERLIGHT assumes no  
responsibility for any damage resulting from use of the product which does not comply  
with the absolute maximum ratings and the instructions included in these specification  
sheets.  
These specification sheets include materials protected under copyright of EVERLIGHT  
corporation. Please don’t reproduce or cause anyone to reproduce them without  
EVERLIGHT’s consent.  
EVERLIGHT ELECTRONICS CO., LTD.  
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,  
Tucheng, Taipei 236, Taiwan, R.O.C  
Tel: 886-2-2267-2000, 2267-9936  
Fax: 886-2267-6244, 2267-6189, 2267-6306  
http:\\www.everlight.com  
Everlight Electronics Co., Ltd.  
Device Number : DT1-347-015  
http\\:www.everlight.com  
Prepared date: 03-08-20088  
Rev 1  
Page: 10 of 10  
Prepared by: Grace Shen  

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