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3474AN/BADB-AFGA/PR/MS

更新时间：2024-09-18 18:21:29

品牌：EVERLIGHT

描述：Single Color LED, Blue, Diffused Blue, 3.95mm, ROHS COMPLIANT, PLASTIC PACKAGE-2

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3474AN/BADB-AFGA/PR/MS 概述

Single Color LED, Blue, Diffused Blue, 3.95mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 可见光 LED

3474AN/BADB-AFGA/PR/MS 规格参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	包装说明：	ROHS COMPLIANT, PLASTIC PACKAGE-2
Reach Compliance Code：	compliant	HTS代码：	8541.40.20.00
风险等级：	5.84	颜色：	BLUE
配置：	SINGLE	最大正向电流：	0.03 A
透镜类型：	DIFFUSED BLUE	标称发光强度：	645.0 mcd
安装特点：	RADIAL MOUNT	功能数量：	1
端子数量：	2	最高工作温度：	85 °C
最低工作温度：	-40 °C	光电设备类型：	SINGLE COLOR LED
总高度：	6.1 mm	包装方法：	BOX/CARTON
峰值波长：	468 nm	形状：	OVAL
尺寸：	3.95 mm	表面贴装：	NO
端子节距：	2.54 mm	视角：	50 deg
Base Number Matches：	1

3474AN/BADB-AFGA/PR/MS 数据手册

通过下载3474AN/BADB-AFGA/PR/MS数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。

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Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Features

․High luminous intensity output

․Oval Shape

․Well defined spatial radiation

․Wide viewing angle (2θ_1/2) : 110^o/ 50^o

․UV resistant epoxy

․The product itself will remain within RoHS compliant version

Descriptions

․This precision optical performance oval LED is specifically

designed for passenger information signs

․This lamp has matched radiation patterns with red and green

mixing color applications

Applications

․Color graphic signs

․Message boards

․Variable message signs (VMS)

․Commercial outdoor advertising

Device Selection Guide

LED Part No.

Chip Material Emitted Color

Lens Color

Stopper

3474AN/BADB-AFGA/R/MS

3474AN/BADB-AFGA/PR/MS

InGaN

Blue

Blue Diffused

Yes

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 1 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Package Dimensions

Stopper Type

No Stopper Type

Notes:

․All dimensions are in millimeters, tolerance is 0.25mm except being specified.

․Protruded resin under flange is 1.5mm Max LED.

․Bare copper alloy is exposed at tie-bar portion after cutting.

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 2 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Absolute Maximum Rating (T_a=25℃)

Parameter

Symbol

Absolute Maximum Rating

Unit

Forward Current

I_F

Pulse Forward Current

(Duty1/10@ 1KHz)

I_FP

100

℃

Operating Temperature

Storage Temperature

Soldering Temperature

Power Dissipation

T_opr

T_stg

T_sol

P_d

-40 ~ +85

-40 ~ +100

260

100

Reverse Voltage

Electrostatic Discharge

ESD

Notes: Soldering time≦5 seconds.

Electro-Optical Characteristics (T_a=25℃)

Parameter

Luminous Intensity

Viewing Angle

Peak Wavelength

Dominant Wavelength

Spectrum Half width

Forward Voltage

Reverse Current

Symbol

I_V

2θ_1/2

λ_p

Min.

430

465

Typ.

X:110Y:50

Max.

860

475

Unit

mcd

deg

Condition

468

470

I_F=20mA

V_R=5V

λ_d

Δλ

V_F

I_R

2.8

3.6

μA

Rank Combination (I_F=20mA)

Rank

430~520

Luminous Intensity

520~600

600~720

720~860

*Measurement Uncertainty of Luminous Intensity: ±10%

Unit:mcd

Rank

Dominant Wavelength

465~470

470~475

*Measurement Uncertainty of Dominant Wavelength ±1.0nm

Unit:nm

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 3 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Typical Electro-Optical Characteristics Curves

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 4 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Taping Dimensions

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 5 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Taping Sizes

Specifications

Symbol Items

Symbol

Avg.

Inch

Tolerance

(mm)

±0.2

4.00

Tape Feed Hole Diameter

Component Lead Pitch

0.157

0.100

0.078

2.54

2.0

±0.3

Front-to-Read Deflection

Feed Hole to Button of Component

Feed Hole to Overall Component Height

Lead Length after Component Removal

Feed Hole Pitch

△H

Max

±1.0

18.5

24.6

0.729

0.969

±1.0

11.00 0.433

12.70 0.500

Max

±0.3

Lead Location

5.10

6.35

1.42

9.00

0.200

0.250

0.056

0.354

±0.7

Center of Component Location

Overall Taped Package Thickness

Feed Hole Location

±1.2

Max

±0.5

Adhesive Tape Width

13.00 0.512

4.00 0.157

±0.5

Adhesive Tape Position

Tape Width

Max

±0.75

18.00 0.709

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 6 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Packing Specification

■ꢀ Inner Carton

EVERLIGHT

CPN:

P/N:XXXXXXXXXX

RoHS

XXX/XXXX-XXXX

QTY：XXXX

CAT:XX

HUE:XX

REF:XX

LOT NO：

MADE IN TAIWAN

■ꢀLabel Form Specification

CPN: Customer’s Production Number

P/N : Production Number

ꢀ

QTY: Packing Quantity

ꢀ

CAT: Rank of Luminous Intensity

HUE: Rank of Dominant Wavelength

REF: Reference

■ Outside Carton

LOT No: Lot Number

MADE IN TAIWAN: Production Place

■ Packing Quantity

1. 2500 PCS/1 Inner Carton

2. 10Inner Cartons/1 Outside Carton

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 7 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Notes

1. Lead Forming

During lead formation, the leads should be bent at a point at least 3mm from the base of the

epoxy bulb.

Lead forming should be done before soldering.

Avoid stressing the LED package during leads forming. The stress to the base may damage

the LED’s characteristics or it may break the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures

may cause failure of the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead

position of the LED. If the LEDs are mounted with stress at the leads, it causes

deterioration of the epoxy resin and this will degrade the LEDs.

2. Storage

The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from

Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or

more, they can be stored for a year in a sealed container with a nitrogen atmosphere and

moisture absorbent material.

Please avoid rapid transitions in ambient temperature, especially, in high humidity

environments where condensation can occur.

3. Soldering

Careful attention should be paid during soldering. When soldering, leave more then 3mm

from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is

recommended.

Recommended soldering conditions:

Hand Soldering

300℃Max. (30W

DIP Soldering

100℃ Max. (60 sec

Temp. at tip of iron

Preheat temp.

Max.)

Soldering time

Distance

3 sec Max.

3mm Min.(From

solder joint to

epoxy bulb)

Bath temp. & time

Distance

260 Max., 5 sec Max

3mm Min. (From

solder joint to epoxy

bulb)

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 8 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

Recommended soldering profile

laminar wave

Fluxing

Prehead

Avoiding applying any stress to the lead frame while the LEDs are at high temperature

particularly when soldering.

Dip and hand soldering should not be done more than one time

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or

vibration until the LEDs return to room temperature.

A rapid-rate process is not recommended for cooling the LEDs down from the peak

temperature.

Although the recommended soldering conditions are specified in the above table, dip or

handsoldering at the lowest possible temperature is desirable for the LEDs.

Wave soldering parameter must be set and maintain according to recommended

temperature and dwell time in the solder wave.

4. Cleaning

When necessary, cleaning should occur only with isopropyl alcohol at room temperature

for a duration of no more than one minute. Dry at room temperature before use.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of

ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the

assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not

cause damage to the LED.

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 9 of 10

Prepared by: Grace Shen

Technical Data Sheet

3474AN/BADB-AFGA/XR/MS

5. Heat Management

Heat management of LEDs must be taken into consideration during the design stage of

LED application. The current should be de-rated appropriately by referring to the

de-rating curve found in each product specification.

The temperature surrounding the LED in the application should be controlled. Please

refer to the data sheet de-rating curve.

6. ESD (Electrostatic Discharge)

Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling

LEDs.

All devices, equipment and machinery must be properly grounded.

Use ion blower to neutralize the static charge which might have built up on surface of the

LEDs plastic lens as a result of friction between LEDs during storage and handing.

7. Other

Above specification may be changed without notice. EVERLIGHT will reserve authority

on material change for above specification.

When using this product, please observe the absolute maximum ratings and the

instructions for using outlined in these specification sheets. EVERLIGHT assumes no

responsibility for any damage resulting from use of the product which does not comply

with the absolute maximum ratings and the instructions included in these specification

sheets.

These specification sheets include materials protected under copyright of EVERLIGHT

corporation. Please don’t reproduce or cause anyone to reproduce them without

EVERLIGHT’s consent.

EVERLIGHT ELECTRONICS CO., LTD.

Office: No 25, Lane 76, Sec 3, Chung Yang Rd,

Tucheng, Taipei 236, Taiwan, R.O.C

Tel: 886-2-2267-2000, 2267-9936

Fax: 886-2267-6244, 2267-6189, 2267-6306

http:\\www.everlight.com

Everlight Electronics Co., Ltd.

Device Number :DT1-347-023

http\\:www.everlight.com

Prepared date: 03-24-2008

Rev 1

Page: 10 of 10

Prepared by: Grace Shen

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