333/R5C1-ATWB/P/MS [EVERLIGHT]

Single Color LED, Brilliant Red, Water Clear, T-1 3/4, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;
333/R5C1-ATWB/P/MS
型号: 333/R5C1-ATWB/P/MS
厂家: EVERLIGHT ELECTRONICS CO., LTD    EVERLIGHT ELECTRONICS CO., LTD
描述:

Single Color LED, Brilliant Red, Water Clear, T-1 3/4, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2

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文件: 总9页 (文件大小:109K)
中文:  中文翻译
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EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
Features  
˙Popular T-1 3/4 diameter package.  
˙Choice of various viewing angles.  
˙Available on tape and reel.  
˙Reliable and robust.  
˙The product itself will remain within RoHS compliant version.  
˙UV resistant epoxy  
Descriptions  
˙The series is specially designed for  
applications requiring higher  
brightness.  
˙The LED lamps are available with  
different colors,intensities,epoxy  
colors, etc.  
Applications  
˙Color Graphic Signs  
˙Message boards  
˙Variable message signs (VMS)  
˙Commercial outdoor advertising  
Device Selection Guide  
Chip  
LED Part No.  
Lens Color  
Stopper  
Material  
Emitted Color  
333/R5C1-ATWB/MS  
333/R5C1-ATWB/P/MS  
No  
AlGaInP  
Brilliant Red  
Water clear  
Yes  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 1 of 9  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
Package Dimensions  
No Stopper type  
Stopper type  
Notes:  
˙All dimensions are in millimeters, tolerance is 0.25mm except being specified.  
˙Protruded resin under flange is 1.5mm Max LED.  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 2 of 9  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Symbol  
IF  
Rating  
50  
Units  
mA  
mA  
Forward Current  
Pulse Forward Current*1  
Operating Temperature  
Storage Temperature  
Electrostatic Discharge  
Soldering Temperature*2  
Power Dissipation  
IFP  
160  
Topr  
Tstg  
ESD  
Tsol  
Pd  
-40 ~ +85  
-40 ~ +100  
2K  
V
260  
115  
mW  
V
Reverse Voltage  
VR  
5
Notes: *1:IFP Conditions--Pulse Width10msec and Duty1/10.  
*2:Soldering time5 seconds.  
Electro-Optical Characteristics (Ta=25)  
Parameter  
Forward Voltage  
Luminous Intensity  
Viewing Angle  
Symbol Condition  
Min.  
1.8  
7150  
--  
Typ.  
Max.  
2.6  
Units  
V
VF  
IV  
IF=20mA  
IF=20mA  
IF=20mA  
IF=20mA  
IF=20mA  
IF=20mA  
VR=5V  
2.0  
11250 18000  
mcd  
deg  
nm  
2θ1/2  
λp  
15  
632  
624  
20  
--  
--  
Peak Wavelength  
Dominant Wavelength  
--  
λd  
620  
--  
628  
--  
nm  
Spectrum Radiation  
Bandwidth  
Δλ  
IR  
nm  
μA  
Reverse Current  
--  
--  
10  
Everlight Electronics Co., Ltd.  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 3 of 9  
Device Number : DLE-033-B77  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
Rank Combination (IF=20mA)  
Rank  
T
U
V
W
Luminous Intensity  
7150~9000  
9000~11250 11250~14250 14250~18000  
*Measurement Uncertainty of Luminous Intensity: ±15%  
Unit: :mcd  
Rank  
1
2
3
4
Forward Voltage  
1.8~2.0  
2.0~2.2  
2.2~2.4  
2.4~2.6  
Unit: V  
*Measurement Uncertainty of Forward Voltage: ±0.1V  
Rank  
1
2
Dominant Wavelength  
620~624  
624~628  
*Measurement Uncertainty of Dominant Wavelength ±1.0nm  
Unit: nm  
*The quantity ratio of the ranks is decided by EVERLIGHT.  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 4 of 9  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
Typical Electro-Optical Characteristics Curves  
Relative Intensity vs. Wavelength  
Forward Current vs. Forward Voltage  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
50  
40  
30  
20  
10  
0
500  
550  
600  
650  
700  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
Wavelength(nm)  
Forward Voltage(V)  
Relative Intensity vs. Ambient Temp.  
Relative Intensity vs. Forward Current  
2.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.5  
1.0  
0.5  
0.0  
25  
30  
35  
40  
45  
50  
55  
60  
65  
70  
0
10  
20  
30  
40  
50  
Ambient Temperature Ta(OC)  
Forward Current(mA)  
Forward Current vs. Ambient Temp.  
Radiation Characteristics  
90O  
60O  
30O  
0O  
10O  
60  
20O  
1.0  
0.5  
0
30O  
O
40  
50  
40  
30  
20  
10  
0
50O  
60O  
70O  
80O  
90O  
1.0  
0
0.5  
0
20  
40  
60  
80  
100  
Radiation Angle  
Ambient Temperature Ta(OC)  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 5 of 9  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
Packing Specification  
Anti-electrostatic bag  
EVERLIGHT  
Label  
CPN:  
P/N:XXXXXXXXXX  
RoHS  
XXX/XXXX-XXXX  
Pb  
QTYXXXX  
ELꢀECTROSTATICꢀELECTRONAGNETICꢀ  
MAGNETICꢀORꢀRADIOACTIVEꢀRELDS  
CAT:XX  
anti-staticꢀforꢀ750  
HUE:XX  
REF:XX  
XXXXXXXX  
LOT NO:  
Inner Carton  
MADE IN TAIWAN  
Label Form Specification  
CPN: Customer’s Production Number  
P/N : Production Number  
QTY: Packing Quantity  
CAT: Ranks of Luminous Intensity and Forward  
Voltage  
HUE: Rank of Dominant Wavelength  
REF: Reference  
Outside Carton  
LOT No: Lot Number  
MADE IN TAIWAN: Production Place  
Packing Quantity  
1. 500 PCS/1 Bag5 Bags/1 Inner Carton  
2. 10 Inner Cartons/1 Outside Carton  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 6 of 9  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
Notes  
1. Lead Forming  
„
During lead formation, the leads should be bent at a point at least 3mm from the base of  
the epoxy bulb.  
„
„
Lead forming should be done before soldering.  
Avoid stressing the LED package during leads forming. The stress to the base may  
damage the LED’s characteristics or it may break the LEDs.  
„
„
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures  
may cause failure of the LEDs.  
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the  
lead position of the LED. If the LEDs are mounted with stress at the leads, it causes  
deterioration of the epoxy resin and this will degrade the LEDs.  
2. Storage  
„
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from  
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or  
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and  
moisture absorbent material.  
„
Please avoid rapid transitions in ambient temperature, especially, in high humidity  
environments where condensation can occur.  
3. Soldering  
„
Careful attention should be paid during soldering. When soldering, leave more then 3mm  
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is  
recommended.  
„
Recommended soldering conditions:  
Hand Soldering  
DIP Soldering  
100 Max. (60 sec  
Max.)  
Bath temp. & time 260 Max., 5 sec Max  
300Max. (30W  
Max.)  
Temp. at tip of iron  
Preheat temp.  
Soldering time  
Distance  
3 sec Max.  
3mm Min.(From solder Distance  
joint to epoxy bulb)  
3mm Min. (From solder  
joint to epoxy bulb)  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 7 of 9  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
„
Recommended soldering profile  
laminar wave  
Fluxing  
Prehead  
„
Avoiding applying any stress to the lead frame while the LEDs are at high temperature  
particularly when soldering.  
„
„
Dip and hand soldering should not be done more than one time  
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or  
vibration until the LEDs return to room temperature.  
„
„
„
A rapid-rate process is not recommended for cooling the LEDs down from the peak  
temperature.  
Although the recommended soldering conditions are specified in the above table, dip or  
handsoldering at the lowest possible temperature is desirable for the LEDs.  
Wave soldering parameter must be set and maintain according to recommended  
temperature and dwell time in the solder wave.  
4. Cleaning  
„
When necessary, cleaning should occur only with isopropyl alcohol at room  
temperature for a duration of no more than one minute. Dry at room temperature before  
use.  
„
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence  
of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the  
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not  
cause damage to the LED  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 8 of 9  
Prepared :Flourix Chen  
EVERLIGHT ELECTRONICS CO.,LTD.  
Technical Data Sheet  
333/R5C1-ATWB/X/MS  
5. Heat Management  
„
Heat management of LEDs must be taken into consideration during the design stage of  
LED application. The current should be de-rated appropriately by referring to the  
de-rating curve found in each product specification.  
„
The temperature surrounding the LED in the application should be controlled. Please  
refer to the data sheet de-rating curve.  
6. ESD (Electrostatic Discharge)  
„
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.  
„
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever  
handling LEDs.  
„
„
All devices, equipment and machinery must be properly grounded.  
Use ion blower to neutralize the static charge which might have built up on surface of  
the LEDs plastic lens as a result of friction between LEDs during storage and handing.  
7. Other  
„
Above specification may be changed without notice. EVERLIGHT will reserve  
authority on material change for above specification.  
„
When using this product, please observe the absolute maximum ratings and the  
instructions for using outlined in these specification sheets. EVERLIGHT assumes no  
responsibility for any damage resulting from use of the product which does not comply  
with the absolute maximum ratings and the instructions included in these specification  
sheets.  
„
These specification sheets include materials protected under copyright of EVERLIGHT  
corporation. Please don’t reproduce or cause anyone to reproduce them without  
EVERLIGHT’s consent.  
EVERLIGHT ELECTRONICS CO., LTD.  
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,  
Tucheng, Taipei 236, Taiwan, R.O.C  
Tel: 886-2-2267-2000, 2267-9936  
Fax: 886-2267-6244, 2267-6189, 2267-6306  
http:\\www.everlight.com  
Everlight Electronics Co., Ltd.  
Device Number : DLE-033-B77  
http\\:www.everlight.com  
Prepared date:02-25-2008  
Rev 3  
Page: 9 of 9  
Prepared :Flourix Chen  

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