23-21C-T1D-CP2Q2TY-2A [EVERLIGHT]

Reverse Package Chip LED; 反向套餐LED芯片
23-21C-T1D-CP2Q2TY-2A
型号: 23-21C-T1D-CP2Q2TY-2A
厂家: EVERLIGHT ELECTRONICS CO., LTD    EVERLIGHT ELECTRONICS CO., LTD
描述:

Reverse Package Chip LED
反向套餐LED芯片

文件: 总12页 (文件大小:193K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Technical Data Sheet  
Reverse Package Chip LED  
23-21C/T1D-CP2Q2TY/2A  
Features  
Package in 8mm tape on 7diameter reel.  
Compatible with automatic placement equipment.  
Compatible with infrared and vapor phase reflow  
solder process.  
Mono-color type.  
Pb-free.  
The product itself will remain within RoHS compliant version.  
Descriptions  
The 23-21C SMD LED is much smaller than lead  
frame type components, thus enable smaller  
board size, higher packing density, reduced  
storage space and finally smaller equipment to be  
obtained.  
Besides, lightweight makes them ideal for  
miniature applications. etc.  
Applications  
Backlighting in dashboard and switch.  
Telecommunication: indicator and backlighting in  
telephone and fax.  
Flat backlight for LCD, switch and symbol.  
General use.  
Device Selection Guide  
Chip  
Part No.  
Emitted Color  
Pure White  
Resin Color  
Material  
23-21C/T1D-CP2Q2TY/2A  
Yellow Diffused  
InGaN  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 1 of 12  
Prepared by: Sam Feng  
23-21C/T1D-CP2Q2TY/2A  
Package Outline Dimensions  
Note: The tolerances unless mentioned is ±0.1mm,Unit = mm  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 2 of 12  
Prepared by: Sam Feng  
                                    
                                     
23-21C/T1D-CP2Q2TY/2A  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Symbol  
Rating  
Unit  
V
Reverse Voltage  
Forward Current  
VR  
5
IF  
25  
mA  
Peak Forward Current  
(Duty 1/10 @1KHz)  
IFP  
100  
mA  
Power Dissipation  
Electrostatic Discharge(HBM)  
Operating Temperature  
Storage Temperature  
Pd  
95  
mW  
V
ESD  
Topr  
Tstg  
150  
-40 ~ +85  
-40 ~ +90  
Reflow Soldering : 260 for 10 sec.  
Hand Soldering : 350 for 3 sec.  
Soldering Temperature  
Tsol  
Electro-Optical Characteristics (Ta=25)  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
mcd  
Condition  
Iv  
57.0  
-----  
-----  
140  
112  
Luminous Intensity  
Viewing Angle  
2θ1/2  
IF=5mA  
VR=5V  
-----  
deg  
V
VF  
IR  
Forward Voltage  
Reverse Current  
2.60  
-----  
-----  
-----  
3.00  
50  
μA  
Notes:  
1.Tolerance of Luminous Intensity ±11%  
2.Tolerance of Forward Voltage ±0.05V  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 3 of 12  
Prepared by: Sam Feng  
                                    
                                     
23-21C/T1D-CP2Q2TY/2A  
Bin Range Of Luminous Intensity  
Bin  
P2  
Min.  
Max.  
Unit  
mcd  
Condition  
IF=5mA  
57.0  
72.0  
90.0  
72.0  
90.0  
112  
Q1  
Q2  
Bin Range Of Forward Voltage  
Symbol  
Bin  
Min.  
Max.  
Unit  
V
Condition  
IF=5mA  
28  
29  
30  
31  
2.60  
2.70  
2.80  
2.90  
2.70  
2.80  
2.90  
3.00  
T
Notes:  
1.Tolerance of Luminous Intensity ±11%  
2.Tolerance of Forward Voltage ±0.05V  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 4 of 12  
Prepared by: Sam Feng  
                                                
23-21C/T1D-CP2Q2TY/2A  
Chromaticity Coordinates Specifications for Bin Grading  
Condition  
Groups  
Bin Code  
1
CIE_x  
CIE_y  
0.274  
0.274  
0.294  
0.294  
0.274  
0.274  
0.294  
0.294  
0.294  
0.294  
0.314  
0.314  
0.294  
0.294  
0.314  
0.314  
0.226  
0.258  
0.286  
0.254  
0.258  
0.291  
0.319  
0.286  
0.254  
0.286  
0.315  
0.282  
0.286  
0.319  
0.347  
0.315  
2
3
4
IF=5mA  
C
Notes:  
1.The C.I.E. 1931 chromaticity diagram ( Tolerance ±0.01).  
2.The products are sensitive to static electricity and care must be fully taken when  
handling products.  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 5 of 12  
Prepared by: Sam Feng  
23-21C/T1D-CP2Q2TY/2A  
CIE Chromaticity Diagram  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 6 of 12  
Prepared by: Sam Feng  
23-21C/T1D-CP2Q2TY/2A  
Typical Electro-Optical Characteristics Curves  
Spectrum Distribution  
Forward Current vs.  
Forward Voltage  
Ta=25°C  
Ta=25°C  
100  
50  
40  
75  
50  
25  
30  
25  
20  
10  
0
0
2.6  
400  
500  
600  
700  
800  
2.8 3.4 3.8  
4.2 4.5  
Wavelength λ (nm)  
Forward Voltage (V )-volts  
F
Luminous Intensity vs  
Forward Current  
Luminous Intensity vs.  
Ambient Temperature  
Ta=25°C  
1000  
100  
1000  
100  
10  
f=1KHz  
Duty=  
1/10  
10  
1
1
10  
0
1
2
-60 -40 -20  
0
20 40  
80 100  
60  
10  
10  
I (mA)  
Ambient Temperature Ta (°C)  
Forward Current  
F
Radiation Diagram  
Forward Current Derating Curve  
Ta=25°C  
50  
40  
0° 10° 20°  
30°  
40°  
50°  
30  
25  
1.0  
0.9  
0.8  
20  
60°  
70°  
10  
0.7  
80°  
90°  
0
0
20  
Ambient Temperature Ta (°C)  
40  
60  
85 100  
0.5 0.3 0.1 0.2 0.4 0.6  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Rev. 1  
Page: 7 of 12  
Prepared date:3-Jul-2011  
Prepared by: Sam Feng  
23-21C/T1D-CP2Q2TY/2A  
Label explanation  
CAT: Luminous Intensity Rank  
Pb  
EVERLIGHT  
CPN :  
P
HUE: Dom. Wavelength Rank  
REF: Forward Voltage Rank  
N : XXXXXXXXXXXXX  
RoHS  
XXXXXXXXXXXXX  
QTY : XXX  
CAT : XXX  
HUE : XXX  
REF : XXX  
LOT NO : XXXXXXXXXX  
Reference : XXXXXXXX  
MADE IN TAIWAN  
Reel Dimensions  
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 8 of 12  
Prepared by: Sam Feng  
23-21C/T1D-CP2Q2TY/2A  
Carrier Tape Dimensions : Loaded quantity 2000 pcs per reel  
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm  
Moisture Resistant Packaging  
Aluminum moisture-proof bag  
Label  
Desiccant  
Label  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Rev. 1  
Page: 9 of 12  
Prepared by: Sam Feng  
Prepared date:3-Jul-2011  
23-21C/T1D-CP2Q2TY/2A  
Reliability Test Items And Conditions  
The reliability of products shall be satisfied with items listed below.  
Confidence level90%  
LTPD10%  
Test  
Sample  
Size  
No.  
1
Items  
Test Condition  
Ac/Re  
0/1  
Hours/Cycles  
Temp. : 260℃±5℃  
Reflow Soldering  
22 PCS.  
6 Min.  
Min. 5sec.  
H : +10015min  
300 Cycles  
2
Temperature Cycle  
Thermal Shock  
22 PCS.  
0/1  
5 min  
L : -4015min  
H : +1005min  
300 Cycles  
3
4
22 PCS.  
22 PCS.  
0/1  
0/1  
10 sec  
L : -105min  
High Temperature  
Storage  
1000 Hrs.  
1000 Hrs.  
Temp. : 100℃  
Temp. : -40℃  
Low Temperature  
Storage  
5
6
7
22 PCS.  
22 PCS.  
22 PCS.  
0/1  
0/1  
0/1  
DC Operating Life  
IF = 20 mA  
1000 Hrs.  
1000 Hrs.  
High Temperature /  
High Humidity  
85/ 85%RH  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Rev. 1  
Page: 10 of 12  
Prepared by: Sam Feng  
Prepared date:3-Jul-2011  
23-21C/T1D-CP2Q2TY/2A  
Precautions For Use  
1. Over-current-proof  
Customer must apply resistors for protection , otherwise slight voltage shift will cause big  
current change ( Burn out will happen ).  
2. Storage  
2.1 Do not open moisture proof bag before the products are ready to use.  
2.2 Before opening the package, the LEDs should be kept at 30or less and 90%RH or less.  
2.3 After opening the package: The LED's floor life is 1 year under 30or less and 60% RH or less.  
If unused LEDs remain, it should be stored in moisture proof packages.  
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the  
storage time, baking treatment should be performed using the following conditions.  
Baking treatment : 60±5for 24 hours.  
3. Soldering Condition  
3.1 Pb-free solder temperature profile  
3.2 Reflow soldering should not be done more than two times.  
3.3 When soldering, do not put stress on the LEDs during heating.  
3.4 After soldering, do not warp the circuit board.  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 11 of 12  
Prepared by: Sam Feng  
23-21C/T1D-CP2Q2TY/2A  
4. Soldering Iron  
Each terminal is to go to the tip of soldering iron temperature less than 350for 3 seconds  
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do  
soldering of each terminal. Be careful because the damage of the product is often started at the time of the  
hand solder.  
5.Repairing  
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a  
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether  
the characteristics of the LEDs will or will not be damaged by repairing.  
EVERLIGHT ELECTRONICS CO., LTD.  
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,  
Tucheng, Taipei 236, Taiwan, R.O.C  
Tel: 886-2-2267-2000, 2267-9936  
Fax: 886-2267-6244, 2267-6189, 2267-6306  
http://www.everlight.com  
Everlight Electronics Co., Ltd.  
Device No.:  
http://www.everlight.com  
Prepared date:3-Jul-2011  
Rev. 1  
Page: 12 of 12  
Prepared by: Sam Feng  

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