16-213SYGC_13 [EVERLIGHT]
Technical Data Sheet 0402 Package Chip LED (0.45 mm Height); 技术数据表0402封装贴片LED （0.45 mm高度）
| 型号： | 16-213SYGC_13 |
| 厂家： | 
EVERLIGHT ELECTRONICS CO., LTD |
| 描述： | Technical Data Sheet 0402 Package Chip LED (0.45 mm Height) |
| 文件： | 总10页 (文件大小：169K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Technical Data Sheet
0402 Package Chip LED (0.45 mm Height)
16-213SYGC/S530-XX/TR8
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow
solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS
compliant version.
Descriptions
․The 16-213 SMD LED is much smaller than lead
frame type components, thus enable smaller board
size, higher packing density, reduced storage space
and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in
telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
Device Selection Guide
Chip
Resin Color
Material
Emitted Color
AlGaInP
Brilliant Yellow Green
Water Clear
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Page: 1 of 10
Prepared by: Betty Lin
16-213SYGC/S530-XX/TR8
Package Outline Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Page: 2 of 10
Prepared by: Betty Lin
16-213SYGC/S530-XX/TR8
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
VR
Rating
Unit
V
Reverse Voltage
Forward Current
5
IF
25
mA
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
60
mA
Power Dissipation
Electrostatic Discharge(HBM)
Operating Temperature
Storage Temperature
Pd
60
mW
V
ESD
Topr
Tstg
2000
℃
-40 ~ +85
-40 ~ +90
℃
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Soldering Temperature
Tsol
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Page: 3 of 10
Prepared by: Betty Lin
16-213SYGC/S530-XX/TR8
Electro-Optical Characteristics (Ta=25℃)
*Chip
Parameter
Symbol
Min.
Typ.
Max.
Unit
mcd
Condition
Rank
E1
10
20
15
25
-----
-----
-----
-----
-----
-----
E2
Luminous Intensity
Viewing Angle
Iv
E3
30
35
E4
40
45
2θ1/2
λp
-----
-----
-----
-----
120
575
deg
nm
IF=20mA
Peak Wavelength
Dominant Wavelength
λd
-----
-----
-----
573
20
-----
-----
nm
Spectrum Radiation
Bandwidth
△λ
VF
-----
-----
-----
nm
V
Forward Voltage
Reverse Current
1.7
2.0
2.4
10
VR=5V
IR
-----
-----
μA
*16-213SYGC/S530-XX/TR8
Chip Rank
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Prepared by: Betty Lin
Page: 4 of 10
16-213SYGC/S530-XX/TR8
Typical Electro-Optical Characteristics Curves
Forward Current vs.
Forward Voltage
Spectrum Distribution
Ta=25°C
Ta=25°C
Forward Voltage VF (V)
Luminous Intensity vs.
Wavelength λ (nm)
Luminous Intensity vs.
Ambient Temperature
Forward Current
Ta=25°C
Ambient Temperature Ta (°C)
Forward Current Derating Curve
Forward Current
IF(mA)
Radiation Diagram
Ta=25°C
Ambient Temperature Ta (°C)
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Page: 5 of 10
Prepared by: Betty Lin
16-213SYGC/S530-XX/TR8
Label Explanation
CAT: Luminous Intensity Rank
Pb
EVERLIGHT
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
CPN :
P
N : XXXXXXXXXXXXX
RoHS
XXXXXXXXXXXXX
QTY : XXX
CAT : XXX
HUE : XXX
REF : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MSL-2
MADE IN TAIWAN
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Prepared by: Betty Lin
Page: 6 of 10
16-213SYGC/S530-XX/TR8
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Aluminum moisture-proof bag
Label
Desiccant
Label
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Prepared by: Betty Lin
Page: 7 of 10
16-213SYGC/S530-XX/TR8
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level：90%
LTPD：10%
Test
Hours/Cycles
Sample
Size
No.
1
Items
Test Condition
Ac/Re
0/1
Temp. : 260℃±5℃
Min. 5sec.
Reflow Soldering
6 Min.
22 PCS.
H : +100℃ 15min
∫ 5 min
L : -40℃ 15min
H : +100℃ 5min
∫ 10 sec
300 Cycles
2
Temperature Cycle
Thermal Shock
22 PCS.
0/1
300 Cycles
3
4
22 PCS.
22 PCS.
0/1
0/1
L : -10℃ 5min
High Temperature
Storage
Low Temperature
Storage
DC Operating Life
High Temperature /
High Humidity
1000 Hrs.
1000 Hrs.
Temp. : 100℃
Temp. : -40℃
5
6
7
22 PCS.
22 PCS.
22 PCS.
0/1
0/1
0/1
IF = 20 mA
1000 Hrs.
1000 Hrs.
85℃/ 85%RH
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Page: 8 of 10
Prepared by: Betty Lin
16-213SYGC/S530-XX/TR8
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
1~5 °C / Sec.
260°C. Max.
10 Sec. Max.
Pre-heating
180~200°C
1~5 °C / Sec.
60 Sec. Max.
Above 220°C
120 Sec. Max.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Page: 9 of 10
Prepared by: Betty Lin
16-213SYGC/S530-XX/TR8
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of
the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
Everlight Electronics Co., Ltd.
Device No: DSE-163-023
http://www.everlight.com
Prepared date: 08-Jan-2009
Rev 2
Page: 10 of 10
Prepared by: Betty Lin
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