WS512K32-XG2LX [ETC]
SRAM MCP ; SRAM的MCP\n
| 型号： | WS512K32-XG2LX |
| 厂家： | 
ETC |
| 描述： | SRAM MCP
|
| 文件： | 总11页 (文件大小：352K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WS512K32-XXX
White Electronic Designs
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
!
Access Times of 15*, 17, 20, 25, 35, 45, 55ns
!
!
!
!
TTL Compatible Inputs and Outputs
!
Packaging
5 Volt Power Supply
Low Power CMOS
•
•
•
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400).
Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
68 lead, 40mm Hermetic Low Profile CQFP,
3.5mm (0.140") (Package 502)1
!
Weight
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880") square (Package 510) 3.56mm
(0.140") height.
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG4TX1 - 20 grams typical
WS512K32-XG2LX - 8 grams typical
•
68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880") square, 5.08mm (0.200") high
(Package 528).
*15ns Access Time available only in Commercial and Industrial
Temperature. This speed is not fully characterized and is subject to
change without notice.
!
!
Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
Note 1: Package Not Recommended For New Design
Commercial, Industrial and Military Temperature
Ranges
FIG. 1 PIN CONFIGURATION FOR WS512K32N-XH1X
TOP VIEW
PIN DESCRIPTION
Data Inputs/Outputs
I/O0-31
A0-18
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
WE1-4
CS1-4
OE
VCC
GND
NC
Not Connected
BLOCK DIAGRAM
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
December 2003, Rev 13
WS512K32-XXX
White Electronic Designs
FIG. 2 PIN CONFIGURATION FOR WS512K32-XG4TX1
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-18
WE
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
CS1-4
OE
VCC
GND
NC
Not Connected
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
FIG. 3 PIN CONFIGURATION FOR WS512K32-XG2UX and WS512K32-XG2LX
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-18
WE1-4
CS1-4
OE
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
VCC
GND
NC
Not Connected
BLOCK DIAGRAM
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
2
WS512K32-XXX
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
TRUTH TABLE
Mode
CS
H
L
OE
X
WE
X
Data I/O
High Z
Power
Standby
Active
Parameter
Symbol
TA
Min
-55
Max
+125
+150
Vcc+0.5
150
Unit
°C
°C
V
Standby
Read
Operating Temperature
Storage Temperature
Signal Voltage Relative to GND
Junction Temperature
Supply Voltage
L
H
Data Out
High Z
TSTG
VG
-65
L
H
H
Out Disable
Write
Active
Active
-0.5
L
X
L
Data In
TJ
°C
V
VCC
-0.5
7.0
CAPACITANCE
RECOMMENDED OPERATING CONDITIONS
(TA = +25°C)
Parameter
Symbol
VCC
VIH
Min
4.5
Max
5.5
Unit
V
Parameter
Symbol
COE
Conditions
Max Unit
Supply Voltage
OE capacitance
V
IN = 0 V, f = 1.0 MHz 50 pF
Input High Voltage
Input Low Voltage
Operating Temp (Mil)
2.2
VCC + 0.3
+0.8
V
WE1-4 capacitance
HIP (PGA)
CQFP G4T
CWE
V
IN = 0 V, f = 1.0 MHz pF
20
50
20
VIL
-0.5
-55
V
TA
+125
°C
CQFP G2U/G2L
CS1-4 capacitance
CCS
CI/O
CAD
V
IN = 0 V, f = 1.0 MHz 20 pF
Data I/O capacitance
V
I/O = 0 V, f = 1.0 MHz 20 pF
IN = 0 V, f = 1.0 MHz 50 pF
Address input capacitance
V
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS
(VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C)
Parameter
Symbol
Conditions
Units
Min
Max
Input Leakage Current
Output Leakage Current
ILI
VCC = 5.5, VIN = GND to VCC
10
µA
µA
mA
mA
V
ILO
CS = VIH, OE = VIH, VOUT = GND to VCC
CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5
CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5
10
660
80
Operating Supply Current x 32 Mode ICC x 32
Standby Current
ISB
Output Low Voltage
VOL
IOL = 8mA for 15 - 35ns,
0.4
IOL = 2.1mA for 45 - 55ns, Vcc = 4.5
Output High Voltage
VOH
IOH = -4.0mA for 15 - 35ns,
2.4
V
IOH = -1.0mA for 45 - 55ns, Vcc = 4.5
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V
DATA RETENTION CHARACTERISTICS
(TA = -55°C TO +125°C)
Parameter
Symbol
Conditions
Units
Min
Max
5.5
28
Data Retention Supply Voltage
Data Retention Current
VDR
CS ≥ VCC − 0.2V
VCC = 3V
2.0
V
ICCDR1
ICCDR2
mA
mA
Low Power Data Retention
Current (WS512K32L-XXX)
VCC = 3V
16
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS512K32-XXX
White Electronic Designs
AC CHARACTERISTICS
(VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C)
Parameter
Read Cycle
Symbol
-15*
-17
-20
-25
-35
-45
-55
Units
Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Read Cycle Time
tRC
tAA
15
0
17
0
20
0
25
0
35
0
45
0
55
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address Access Time
15
17
20
25
35
45
55
Output Hold from Address Change tOH
Chip Select Access Time
tACS
tOE
tCLZ1
tOLZ1
15
8
17
9
20
10
25
12
35
25
45
25
55
25
Output Enable to Output Valid
Chip Select to Output in Low Z
Output Enable to Output in Low Z
Chip Disable to Output in High Z tCHZ1
Output Disable to Output in High Z tOHZ1
2
0
2
0
2
0
2
0
4
0
4
0
4
0
12
12
12
12
12
12
12
12
15
15
20
20
20
20
*15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change
without notice.
1. This parameter is guaranteed by design but not tested.
AC CHARACTERISTICS
(VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C)
Parameter
Symbol
-15*
-17
-20
-25
-35
-45
-55
Units
Write Cycle
Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time
tWC
tCW
tAW
tDW
tWP
tAS
15
13
13
10
13
2
17
15
15
11
15
2
20
15
15
12
15
2
25
17
17
13
17
2
35
25
25
20
25
2
45
35
35
25
35
2
55
50
50
25
40
2
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Chip Select to End of Write
Address Valid to End of Write
Data Valid to End of Write
Write Pulse Width
Address Setup Time
Address Hold Time
tAH
0
0
0
0
0
5
5
Output Active from End of Write
Write Enable to Output in High Z
Data Hold Time
tOW1
tWHZ1
tDH
2
2
3
4
4
5
5
8
9
11
13
15
20
20
0
0
0
0
0
0
0
*15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change
without notice.
1. This parameter is guaranteed by design but not tested.
2. The Address Setup Time of minimum 2ns is for the G2U, G1U and H1 packages. tAS minimum for the G4T package is 0ns.
FIG. 4 AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
Typ
Unit
V
Input Pulse Levels
VIL = 0, VIH = 3.0
Input Rise and Fall
5
ns
V
Input and Output Reference Level
Output Timing Reference Level
1.5
1.5
V
Notes:
VZ is programmable from -2V to +7V.
IOL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 ý.
VZ is typically the midpoint of VOH and VOL.
IOL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
4
WS512K32-XXX
White Electronic Designs
FIG. 5 TIMING WAVEFORM - READ CYCLE
FIG. 6 WRITE CYCLE - WE CONTROLLED
FIG. 7 WRITE CYCLE - CS CONTROLLED
WS32K32-XHX
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS512K32-XXX
White Electronic Designs
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE,
HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE
CQFP (G4T)1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
6
WS512K32-XXX
White Electronic Designs
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
25.15 (0.990) – 0.25 (0.010) MAX
5.10 (0.200) MAX
22.36 (0.880) – 0.25 (0.010) MAX
0.25 (0.010) – 0.10 (0.002)
0.23 (0.009) REF
24.0 (0.946)
– 0.25 (0.010)
R 0.127
(0.005)
1.37 (0.054) MIN
0.004
2O / 9O
0.89 (0.035)
– 1.14 (0.045)
1.27 (0.050) TYP
0.38 (0.015) – 0.05 (0.002)
20.31 (0.800) REF
0.940" TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
7
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS512K32-XXX
White Electronic Designs
ORDERING INFORMATION
W S 512K 32 X - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M= Military Screened -55°C to +125°C
I = Industrial
-40°C to 85°C
0°C to +70°C
C = Commercial
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
8
WS512K32-XXX
White Electronic Designs
DEVICE TYPE
SPEED
PACKAGE
SMD NO.
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
5962-94611 05HTX
5962-94611 06HTX
5962-94611 07HTX
5962-94611 08HTX
5962-94611 09HTX
5962-94611 10HTX
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
5962-94611 05HYX
5962-94611 06HYX
5962-94611 07HYX
5962-94611 08HYX
5962-94611 09HYX
5962-94611 10HYX
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
5962-94611 05HMX
5962-94611 06HMX
5962-94611 07HMX
5962-94611 08HMX
5962-94611 09HMX
5962-94611 10HMX
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
5962-94611 05HAX
5962-94611 06HAX
5962-94611 07HAX
5962-94611 08HAX
5962-94611 09HAX
5962-94611 10HAX
Note 1: Package Not Recommended For New Design
9
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS512K32-XXX
White Electronic Designs
Document Title
512K x 32 SRAM Multi-Chip Package
Revision History
Rev # History
Release Date Status
Initial
October 1996
Preliminary
Preliminary
Change (Pg. 1, 3)
January 1997
1.1 Change Operation Supply Current from 520mA To 540mA
1.2 Change Data Retention Current from 12mA to 28mA.
Change (Pg. 1, 2, 8, 10, 11)
1.1 Delete G2 Package
November 1997
February 1998
April 1998
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Change (Pg. 1, 9)
1.1 Add SMD Case Outline M for G2T
Change (Pg. 1, 3, 8)
1.1 Remove Low Capacitance package option
Change (Pg. 1, 6, 8)
1.1 Add H1 package
December 1998
March 1999
Change (Pg. 1, 4, 6, 9, 10)
1.1 Remove H2 package
1.2 Change logo to WEDC logo
Rev 2
Change (Pg. 1, 3, 4, 8)
May 1999
Final
1.1 Change status from Preliminary to Final
1.2 Make package descriptions consistent
1.3 Add 15ns as available in Commercial and Industrial Temperatures only.
Rev 4
Rev 5
Rev 6
Change (Pg. 1, 3)
1.1 Change Standby Current (Isb) from 60mA to 80mA Maximum
June 1999
Final
Final
Final
Change (Pg. 1, 2, 3, 4, 7, 8)
1.1 Add G1U package
November 1999
Change (Pg. 1, 8)
February 2000
1.1 Change G1U lead foot length from 0.64mm to 0.84mm Ref
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
10
WS512K32-XXX
White Electronic Designs
Rev 7
Change (Pg. 1, 3, 9)
October 2000
Final
1.1 Change Operating Supply Current from 540mA to 660mA Maximum
1.2 Add Low Power Data Retention Current of 16mA to Data Retention Characteristics table
1.3 Add Low Power Data Retention (L) option to Ordering Information
Rev 8
Rev 9
Change (Pg. 1, 2, 6, 7, 9, 10)
1.1 Change G2T and G4T package status to Not Recommended For New Design
October 2001
Final
Final
Change (Pg. 1, 2, 3, 8, 9, 10)
1.1 Add G1T package
1.2 Remove ‘Hi-Reliability Product’ Title
November 2001
August 2002
Rev 10 Change (Pg. 1, 2, 3, 4, 7, 8, 9, 10, 11)
1.1 Remove G2T package
Final
1.2 Add G2U package
1.3 Remove ‘Package to be Developed’ note for G4T
Rev 11 Change (Pg. 1,2,4,8,10,11,13)
February 2002
Final
Final
Final
1.1 Change G1U package status to Not Recommended For New Designs
Rev 12 Change (Pg. 1,2,3,7,8,10,11,13)
1.1 Add G2L package
May 2003
Rev 13 Change (Pg. 1,2,3,7,8,10,11,13)
1.1 Remove all reference to G1U package
1.2 Remove all reference to G1T package
December 2003
11
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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