TOPD371-RXDS [ETC]
Optoelectronic ; 光电\n
ETC 
March 2002
Op tica l Com m unica tion Devices
1 0 Gb / s Op tica l Receiver
TOPD3 7 1 -RXDS Series
APPLICATION
SONET / SDH (OC-192 / STM-64) applications
•
FEATURES
InGaAs PIN-PD and TIA
•
Differential output
•
Sensitivity: −19 dBm (typ. @ BER = 1 x 10−12, PRBS 231−1)
•
Overload : +1 dBm (typ. @ BER = 1 x 10−12, PRBS 231−1)
•
Transimpedance: 1200 Ω (typ.)
Cuttoff frequency: 8.0 GHz (typ.)
•
•
TOPD3 7 1 -RXDS Series
BLOCK DIAGRAM
DC Offset Monitor: V+off (+)
DC Offset Monito : V-off (–)
DC Feedback (DCFB)
DC Feedback Input (FBIN) Voltage: Vfbin
PD Bias Voltage: VPD (+)
Optical Input
InGaAs
Output (+)
PIN-PD
SMF
Output (–)
Supply Voltage: VSS (–5.2 V)
ABSOLUTE MAXIMUM RATINGS (Tc = 25 ˚C)
Item
Symbol
Rating
Unit
Storage temperature
Tstg
Tc
−40 to +85
0 to +70
2
˚C
˚C
Operating case temperature
PD reverse current
Ir
mA
V
PD reverse voltage
VPD
0 to +20
−6 to 0
−3 to + 0.3
+4
Supply voltage
Vss
Vfbin
V
DC feedback input (FBIN) voltage
Optical input power (Peak)
Soldering temperature / time
V
Pin
dBm
˚C / s
Tsol / tsol
260 / 5
ELECTRICAL AND OPTICAL CHARACTERISTICS
(Vss = –5.2 V, VPD = +10 V, Output load resistance = 50 Ω, λ = 1.55 µm, Tc = 25 ˚C)
Item
Symbol
Min
Condition
Typ.
Max
Unit
Responsivity
R
—
0.75
800
0.85
—
—
A/W
1.55
Zt
Transimpedance (AC)
f = 200 MHz
1200
Ω
Pin = –14 dBm
3 dB down
from 130 MHz
Cutoff frequency
fc
7.5
8.0
—
GHz
Sensitivity
Ps
Po
(Note 1)
(Note 1)
—
—
0
−19
+1
−18
—
dBm
dBm
dB
Overload
Optical return loss
Power supply current
Power supply voltage
ORL
Iss
27
—
—
—
—
115
−5.2
150
−4.94
mA
V
Vss
—
−5.46
Note 1: 10 Gb/s, NRZ, PRBS 231−1, BER = 1 x 10−12
DIMENSIONAL OUTLINE AND PIN ASSIGNMENT
(Unit: mm)
3.4
(4)
ø5.8 (2.25) (1)
pin1
pin16
pin11
pin6
pin7
pin10
0.635
3.175
20.83
25.83
29.83
+0.3
-0
4-ø2.2
3.8
Recommended External Feedback Circuit
External Feedback Circuit
47 ohm
15 nF
1µF
Pin Assignment
GND GND
16 15
FBIN
14
V+off V-off DCFB
13 12 11
Pin
Function
Pin
Function
1
PD bias (+)
9
Output (+)
GND
10 GND
2
GND
10
11
12
13
14
15
16
9
8
OUTPUT(+)
3
Vss (−5.2 V)
GND
DCFB
_
OUTPUT(
GND
)
4
DC offset monitor (V-off)
DC offset monitor (V+off)
DC feedback input (FBIN)
GND
7
5
NC
6
GND
2
3
4
5
6
1
7
GND
PD Bias(+)
GND Vss(-5.2V)
GND
NC
GND
8
Output (−)
GND
PRECAUTIONS
(a) Power supply: Transient electric spike may cause a damage to the photodiode or IC chips.
A surge-free power supply and a slow starter circuit should be used.
To avoid causing an electrical surge, pins should not be connected or disconnected on the test fixture
before turning power off .
(b) The product should be grounded for obtaininng the performance.
011025 (X)
OVERSEAS SUBSIDIARIES AND AFFILIATES
Toshiba America
Toshiba Electronics Europe GmbH
Toshiba Electronics Asia, Ltd.
Electronic Components, Inc.
Düsseldorf Head Office
Hansaallee 181, D-40549 Düsseldorf,
Germany
Hong Kong Head Office
Level 11, Tower 2, Grand Century
Place, No.193, Prince Edward Road West,
Mong Kok, Kowloon, Hong Kong
Tel: 2375-6111 Fax: 2375-0969
Headquarters-Irvine, CA
9775 Toledo Way, Irvine, CA 92618, U.S.A.
Tel: (0211)5296-0 Fax: (0211)5296-400
Tel: (949)455-2000 Fax: (949)859-3963
Toshiba Electronics Italiana S.R.L.
Centro Direzionale Colleoni,
Deerfield, IL(Chicago)
One Pkwy., North, Suite 500, Deerfield,
Beijing Office
Rm 714, Beijing Fortune Building,
Palazzo Perseo 3,
IL 60015, U.S.A.
1-20041 Agrate Brianza, (Milan), Italy
Tel: (039)68701 Fax:(039)6870205
No.5 Dong San Huan Bei-Lu, Chao Yang District,
Beijing, 100004, China
Tel: (847)945-1500 Fax: (847)945-1044
Edison, NJ
2035 Lincoln Hwy. #3000, Edison.
Tel: (010)6590-8796 Fax: (010)6590-8791
Toshiba Electronics(UK) Ltd.
Riverside Way, Camberley Surrey,
GU15 3YA, U.K.
Toshiba Electronics Korea
Corporation
NJ 08817, U.S.A.
Tel: (732)248-8070 Fax: (732)248-8030
Tel: (01276)69-4600 Fax: (01276)69-4800
Seoul Head Office
14/F, KEC B/D, 275-7 Yangjae-dong,
Raleigh, NC
Toshiba Electronics Scandinavia A.B.
Gustavslundsvägen 12, 2nd Floor,
S-161 15 Bromma, Sweden
5511 Capitol Center Dr., #114,
Raleigh, NC 27606, U.S.A.
Tel: (919)859-2800 Fax: (919)859-2898
Seocho-ku, Seoul, Korea
Tel: (02)589-4300 Fax: (02)589-4302
Tel: (08)704-0900 Fax: (08)80-8459
Richardson,TX(Dallas)
777 East Campbell Rd., #650, Richardson,
Toshiba Technology Development
(Shanghai) Co., Ltd.
Toshiba Electronics Asia
(Singapore) Pte. Ltd.
TX 75081, U.S.A.
23F, HSBC Tower, 101
Singapore Head Office
Tel: (972)480-0470 Fax: (972)235-4114
Yin Cheng East Road, Pudong New Area, Shanghai,
200120, China
438B Alexandra Road, #06-08/12 Alexandra
Technopark, Singapore 119968
Tel: (278)5252 Fax: (271)5155
Wakefield, MA(Boston)
401 Edgewater Place, #360, Wakefield,
MA 01880, U.S.A.
Tel: (021)6841-0666 Fax: (021)6841-5002
Toshiba Electronics Taiwan
Corporation
Tel: (781)224-0074 Fax: (781)224-1095
Taipei Head Office
17F, Union Enterprise Plaza Bldg. 109
Min Sheng East Rd., Section 3, 10446 Taipei,Taiwan
Tel: (02)2514-9988 Fax: (02)2514-7892
(As of August, 2001)
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid
situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to
property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in
the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling
Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc..
The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment,
office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).
These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or
reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage
include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed in
this document shall be made at the customerís own risk.
Electronic Devices Sales & Marketing Division
1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-8001, Japan
Tel: +81-3-3457-3405 Fax: +81-3-5444-9431
The products described in this document are subject to the foreign exchange and foreign trade laws.
Gallium arsenide (GaAs) is a substance used in some of the products described in this documents. GaAs dust and fumes are toxic. Do not break, cut or pulverize the products, or use chemicals to dissolve them.
When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage.
Website: http://www.semicon.toshiba.co.jp/eng/index.html
©2002 TOSHIBA CORPORATION
Printed in Japan
3691C-0203 D5
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