T6316B-350DG [ETC]

Low-Dropout, Constant-Current White LED Bias Supply; 低压差,恒定电流白光LED偏置电源
T6316B-350DG
型号: T6316B-350DG
厂家: ETC    ETC
描述:

Low-Dropout, Constant-Current White LED Bias Supply
低压差,恒定电流白光LED偏置电源

文件: 总6页 (文件大小:40K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TE  
tmCH  
Preliminary T6316A/B  
Low-Dropout, Constant-Current  
White LED Bias Supply  
FEATURES  
GENERAL DESCRIPTION  
The T6316A/B low-dropout bias supply for  
white LEDs is a high-performance alternative  
to the simple ballast resistors used in  
conventional white LED designs. The T6316A  
uses a single resistor to set the bias current for  
four LEDs, which are matched to 3%. The  
T6316B build in internal resistor to set the bias  
current for four LED. The T6316A/B  
advantages over ballast resistors include  
significantly better LED to LED bias matching,  
much lower bias variation with supply voltage  
variation, significantly lower dropout voltage,  
and in some applications, significantly  
improved efficiency. The T6316A/B is  
available in SOP-8 package and lead-free.  
• Up to 400mA LED Bias Current  
• 3% LED Current Matching  
• Simple LED Brightness Control  
• Low 0.05uA Shutdown Current  
• 2.7V to 5V Supply Voltage Range  
• SOP-8 Package and Lead-free  
• VSET Resistor Option :  
T6316A : External Resistor  
T6316B : 20, 85, 100, 125, 150, 175, 200,  
250, 300 and 350mA Output  
Current Option by Internal  
Resistor  
• Build in Thermat Protect 160 °C  
Applications  
PART NUMBER EXAMPLES  
• Portable Communication Devices  
• Handheld Electronics  
• LED/Display Back Light Driver  
• Lightings  
Vset  
resistor  
External  
Output  
Current  
PART NO.  
T6316A-D  
PACKAGE  
SOP-8  
-
SOP-8  
lead-free  
T6316A-DG  
T6316B-20D  
T6316B-20DG  
T6316B-75D  
T6316B-75DG  
-
External  
SOP-8  
20mA Internal  
20mA Internal  
75mA Internal  
75mA Internal  
SOP-8  
lead-free  
SOP-8  
SOP-8  
lead-free  
T6316B-350D  
SOP-8 350mA Internal  
SOP-8  
T6316B-350DG  
350mA Internal  
lead-free  
TM Technology Inc. reserves the right  
to change products or specifications without notice.  
P. 1  
Publication Date: JUN. 2006  
Revision: B  
TE  
tmCH  
Preliminary T6316A/B  
PIN ARRANGEMENT(Top view)  
1
2
3
4
L E D 1  
L E D 2  
L E D 3  
L E D 4  
8
7
6
5
V S E T  
E N  
V D D  
V S S  
SOP-8  
T6316A-D  
1
2
3
4
L E D 1  
L E D 2  
L E D 3  
L E D 4  
8
7
6
5
E N  
V D D  
V S S  
V S S  
SOP-8  
T6316B-D  
PIN DESCRIPTION  
T6316A  
T6316B  
DESCRIPTION  
SYMBOL  
LED 1 Cathode Connection. Current flowing into LED1 is 270/250 times the current  
flowing into SET. LED1 is high impedance when EN is low.  
LED 2 Cathode Connection. Current flowing into LED1 is 270/250 times the current  
flowing into SET. LED2 is high impedance when EN is low.  
LED 3 Cathode Connection. Current flowing into LED1 is 270/250 times the current  
flowing into SET. LED3 is high impedance when EN is low.  
LED 4 Cathode Connection. Current flowing into LED1 is 270/250 times the current  
flowing into SET. LED4 is high impedance when EN is low.  
Ground  
LED1  
LED2  
LED3  
LED4  
1
2
3
4
1
2
3
4
VSS  
VDD  
EN  
5
6
7
5,6  
7
8
Power supply  
Enables PN6316A/B signal , H: Ative , L : Power Down .  
VSET terminal is used to connect an external resistor to set output current.  
The current flowing into VSET sets the bias current into  
each LED by ILED_= 250 x ISET.  
VSET  
8
-
VSET is internally biased to 0.306V. VSET is high impedance when EN is low.  
TM Technology Inc. reserves the right  
to change products or specifications without notice.  
P. 2  
Publication Date: JUN. 2006  
Revision: B  
TE  
tmCH  
Preliminary T6316A/B  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
-0.3 to 6  
-40 to +85  
300  
Unit  
V
Voltage on any pin relative to GND  
Operating Temperature Rang  
VIN  
T
A
°C  
°C  
°C  
W
Maximum Soldering Temperature (at leads, 10 sec)  
Storage Temperature Rang  
TLEAD  
T
S
-65 to +150  
1
Continuous Power Dissipation ( T = +70°C )  
A
Electrical Characteristics  
(TA = -40 to 85°C unless otherwise noted. Typical values are at TA =25°C,  
VEN =3.3V, VLED1 = VLED2= VLED3= VLED4= 1V)  
Symbol  
Description  
Conditions  
Min. Typ. Max Unit  
2.7  
VEN Operating voltage range  
ISET SET input current range  
EN is power supply input  
5
V
1400 1600 uA  
T6316A  
T6316B  
270  
A/A  
250  
ISETR SET to LED current ratio  
ILED / ISET, SET  
I
=400uA  
VSET SET bias voltage  
ISET=400uA, no loading  
0.306  
3
V
ICM LED to LED current matching ISET=400uA, 100mA loading  
%
ILED Maximum LED sink current  
Each LED  
350 400 mA  
LED leakage current in  
shutdown  
VLED1=VLED2=VLED3=VLED4= 3.3V,  
EN=GND, TA=+25°C, each LED  
ILSD  
0.01  
1
uA  
VIH Input high voltage  
VIL Input low voltage  
VEN >VIH for enable, VDD=5V  
VEN <VIL for disable, VDD=5V  
2.0  
V
V
0.8  
TTP  
160  
Thermat Protect  
°C  
TM Technology Inc. reserves the right  
to change products or specifications without notice.  
P. 3  
Publication Date: JUN. 2006  
Revision: B  
TE  
tmCH  
Preliminary T6316A/B  
Functional Description  
Applications Information  
The T6316A/B provides constant current  
bias supply for white LED designs. The  
T6316A uses a single resistor to set the bias  
current for up to four LEDs. LED bias  
currents are matched to 3%. The T6316B  
build in internal resistor to set the bias current  
for four LED. The T6316A/B offers several  
advantages over using ballast resistors, such  
as improved LED to LED brightness  
matching, lower bias variation with supply  
voltage changes, significantly lower dropout  
voltage, and in some applications,  
significantly improved efficiency.  
Very Low-Cost, High-Efficiency Solution .  
A battery (single Li+ or three NiMH cells)  
powers the LEDs directly. This is the least  
expensive and most efficient architecture. Due  
to the high forward voltage of white LEDs,  
the LED brightness may dim slightly at the  
end of battery life. The T6316A/B current  
regulating architecture and low dropout  
greatly minimize this effect compared to  
using simple ballast resistors. The enable  
function of the T6316A/B turns on and off the  
LEDs.  
Enable Input  
EN powers the input of the T6316A/B.  
Drive EN high (> 2.0V) to enable the device;  
drive EN low (< 0.8V) to disable the device.  
Driving EN low forces LED1, LED2, LED3,  
LED4 and SET into a high-impedance state.  
Setting the Output Current  
SET controls the LED bias current. Current  
flowing into LED1, LED2, LED3 and LED4  
is 270/250 times greater than the current  
flowing  
into SET. Set the output current as follows:  
T6316A  
ILED = 270 (0.306V / RSET )  
T6316B  
ILED = 250 (0.306V / RSET )  
TM Technology Inc. reserves the right  
to change products or specifications without notice.  
P. 4  
Publication Date: JUN. 2006  
Revision: B  
TE  
tmCH  
Preliminary T6316A/B  
TYPICAL APPLICATION CIRCUITS  
V +  
V D D  
V D D L E D 1 L E D 2 L E D 3 L E D 4  
E N  
O N  
O F F  
T 6 3 1 6 A  
G N D  
S E T  
R
V +  
V D D  
O F F  
V D D L E D 1 L E D 2 L E D 3 L E D 4  
O N  
E N  
T 6 3 1 6 B  
G N D  
Very low-cost, high-efficiency solution  
TM Technology Inc. reserves the right  
to change products or specifications without notice.  
P. 5  
Publication Date: JUN. 2006  
Revision: B  
TE  
tmCH  
Preliminary T6316A/B  
PACKAGE DIMENSIONS  
8-LEAD SOP  
B
B 1  
K
T h e rm a l P a d *  
J
A 1  
A
C 1  
C
C 2  
F
D
E
H
Dimension in mm  
Dimension in inch  
Symbol  
Min.  
5.70  
3.75  
-
-
-
1.35  
0.10  
0.31  
0.30  
0.10  
Typ.  
6.00  
3.95  
-
1.27  
-
Max.  
6.30  
4.10  
5.13  
-
1.80  
1.75  
0.25  
0.51  
0.70  
0.25  
Min.  
Typ.  
0.236  
0.156  
-
0.050  
-
Max.  
0.248  
0.164  
0.202  
-
0.071  
0.069  
0.004  
0.020  
0.028  
0.010  
A
A1  
B
B1  
C
C1  
C2  
D
E
F
J
K
0.224  
0.148  
-
-
-
0.052  
0.001  
0.012  
0.012  
0.004  
1.55  
-
0.061  
-
0.41  
0.50  
0.15  
2.23 REF  
2.97 REF  
0~8°  
0.016  
0.020  
0.006  
0.088 REF  
0.117 REF  
0~8°  
H
*Note :  
The thermal pad on the IC’s bottom has to be mounted on the copper foil.  
To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB.  
In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on  
PCB is soldered with thermal pad. The thermal pad enhances the power dissipation. As a result, a  
large amount of current can be sunk safely in one package.  
TM Technology Inc. reserves the right  
to change products or specifications without notice.  
P. 6  
Publication Date: JUN. 2006  
Revision: B  

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