STPS30L30CG-1 [ETC]

LOW DROP POWER SCHOTTKY RECTIFIER ; 电力低压降肖特基整流器


型号：	STPS30L30CG-1
厂家：	ETC
描述：	LOW DROP POWER SCHOTTKY RECTIFIER 电力低压降肖特基整流器二极管
文件：	总5页 (文件大小：100K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

STPS30L30CT/CG/CG-1

LOW DROP POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

I_F(AV)

V_RRM

2 x 15 A

30 V

Tj (max)

V_F(max)

150 °C

0.37 V

FEATURES AND BENEFITS

VERY SMALL CONDUCTION LOSSES

NEGLIGIBLE SWITCHING LOSSES

EXTREMELY FAST SWITCHING

LOW FORWARD VOLTAGE DROP

LOW THERMAL RESISTANCE

D²PAK

TO-220AB

STPS30L30CT

STPS30L30CG

DESCRIPTION

Dual center tap Schottky rectifiers suited for

Switch Mode Power Supply and high frequency

DC to DC converters.

Packaged in TO-220AB and D²PAK these devices

are intended for use in low voltage, high frequency

inverters, free-wheeling and polarity protection

applications.

I²PAK

STPS30L30CG-1

ABSOLUTE RATINGS (limiting values, per diode)

Symbol

Parameter

Repetitive peak reverse voltage

Value

Unit

V_RRM

I_F(RMS)

I_F(AV)

RMS forward current

Average forward current

Tc = 140°C

δ = 0.5

Per diode

Per device

I_FSM

I_RRM

I_RSM

T_stg

220

Surge non repetitive forward current

Peak repetitive reverse current

Non repetitive peak reverse current

Storage temperature range

tp = 10 ms Sinusoidal

tp = 2 µs F = 1kHz square

tp = 100µs square

- 65 to + 150

150

°C

V/µs

Maximum operating junction temperature *

Critical rate of rise reverse voltage

dV/dt

10000

dPtot

* :

thermal runaway condition for a diode on its own heatsink

dTj

Rth(j − a)

March 2000 - Ed: 4B

1/5

STPS30L30CT/CG/CG-1

THERMAL RESISTANCE

Symbol

Parameter

Value

Unit

R_{th (j-c)}

Per diode

Total

1.5

0.8

°C/W

Junction to case

R_{th (c)}

Coupling

0.1

°C/W

When the diodes 1 and 2 are used simultaneously :

∆ Tj(diode 1) = P(diode1) x R_th(j-c)(Per diode) + P(diode 2) x R_th(c)

STATIC ELECTRICAL CHARACTERISTICS (per diode)

Symbol

Parameter

Tests Conditions

Min. Typ. Max.

Unit

I_R*

1.5

Reverse leakage cur- Tj = 25°C

V_R= V_RRM

rent

170

0.33

0.43

350

0.46

0.37

0.57

0.5

Tj = 125°C

V_F*

Forward voltage drop Tj = 25°C

Tj = 125°C

I_F= 15 A

I_F= 30 A

Tj = 25°C

Tj = 125°C

Pulse test : * tp = 380 µs, δ < 2%

To evaluate the conduction losses use the following equation :

P = 0.24x I_F(AV)+ 0.009 I_{F (RMS)}

Fig. 2: Average current versus ambient

temperature (δ=0.5) (per diode).

Fig. 1: Average forward power dissipation versus

average forward current (per diode).

IF(av)(A)

PF(av)(W)

Rth(j-a)=Rth(j-c)

δ = 0.2

δ = 0.1

δ = 0.5

δ = 0.05

Rth(j-a)=15°C/W

δ = 1

Rth(j-a)=50°C/W

IF(av) (A)

Tamb(°C)

=tp/T

10 12 14 16 18 20

100

125

150

2/5

STPS30L30CT/CG/CG-1

Fig. 3: Non repetitive surge peak forward current

versus overload duration (maximum values) (per

diode).

Fig. 4: Relative variation of thermal transient

impedance junction to case versus pulse duration.

Zth(j-c)/Rth(j-c)

IM(A)

250

1.0

225

200

175

0.8

150

δ = 0.5

0.6

Tc=25°C

125

Tc=75°C

100

0.4

Tc=110°C

δ = 0.2

δ = 0.1

0.2

t(s)

tp(s)

=tp/T

δ=0.5

Single pulse

0.0

1E-4

1E-3

1E-2

1E-1

1E+0

1E-3

1E-2

1E-1

1E+0

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values) (per diode).

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values) (per diode).

IR(mA)

C(nF)

1E+3

5.0

Tj=150°C

F=1MHz

Tj=25°C

1E+2

Tj=125°C

1E+1

1.0

1E+0

Tj=25°C

1E-1

VR(V)

0.1

VR(V)

1E-2

Fig. 7: Forward voltage drop versus forward

current (maximum values - per diode).

Fig. 8: Thermal resistance junction to ambient

versus copper surface under tab (epoxy printed

circuit board FR4, e(Cu) = 35 µm)

(STPS30L30CG).

Rth(j-a) (°C/W)

IFM(A)

200

100

Tj=150°C

(typical values)

Tj=125°C

Tj=25°C

S(Cu) (cm²)

12 16 20 24 28 32 36 40

VFM(V)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

3/5

STPS30L30CT/CG/CG-1

PACKAGE MECHANICAL DATA

TO-220AB

DIMENSIONS

Millimeters Inches

Min. Max.

4.40 4.60

REF.

Min.

Max.

Dia

0.173

0.048

0.094

0.019

0.024

0.044

0.194

0.094

0.393

0.181

0.051

0.107

0.027

0.034

0.066

0.202

0.106

0.409

1.23

2.40

0.49

0.61

1.14

4.95

2.40

1.32

2.72

0.70

0.88

1.70

5.15

2.70

10.40

16.4 typ.

0.645 typ.

0.511

0.104

0.600

0.244

0.137

0.551

0.116

0.620

0.259

0.154

2.65

15.25

6.20

3.50

2.95

15.75

6.60

3.93

2.6 typ.

0.102 typ.

Diam.

3.75

3.85

0.147

0.151

Cooling method: C

Recommended torque value: 0.55 m.N

Maximum torque value: 0.70 m.N

PACKAGE MECHANICAL DATA

I²PAK

DIMENSIONS

Millimeters Inches

Max.

REF.

Min.

4.40

2.49

0.70

1.14

0.45

1.23

8.95

2.40

10.0

13.1

3.48

1.27

Min.

Max.

0.181

0.106

0.037

0.046

0.024

0.054

0.368

0.106

0.409

0.535

0.149

0.055

4.60

2.69

0.93

1.17

0.60

1.36

9.35

2.70

10.4

13.6

3.78

1.40

0.173

0.098

0.028

0.044

0.018

0.048

0.352

0.094

0.394

0.516

0.137

0.050

4/5

STPS30L30CT/CG/CG-1

DIMENSIONS

PACKAGE MECHANICAL DATA

D²PAK

REF.

Millimeters

Inches

Min.

Max.

Min.

Max.

4.40

2.49

0.03

0.70

1.14

0.45

1.23

8.95

10.00

4.88

15.00

1.27

1.40

2.40

4.60

2.69

0.23

0.93

1.70

0.60

1.36

9.35

10.40

5.28

15.85

1.40

1.75

3.20

0.173

0.098

0.001

0.027

0.045

0.017

0.048

0.352

0.393

0.192

0.590

0.050

0.055

0.094

0.181

0.106

0.009

0.037

0.067

0.024

0.054

0.368

0.409

0.208

0.624

0.055

0.069

0.126

0.40 typ.

0.016 typ.

0°

8°

0°

8°

* FLAT ZONE NO LESS THAN 2mm

FOOT PRINT (in millimeters)

16.90

10.30

5.08

1.30

3.70

8.90

Ordering type

Marking

Package

Weight

Base qty

Delivery mode

STPS30L30CT

STPS30L30CG

STPS30L30CT

STPS30L30CG

TO-220AB

D²PAK

I²PAK

Tube

1.8g

1.49g

STPS30L30CG-TR

STPS30L30CG-1

1000

Tape & reel

Tube

STPS30L30CG-1

Epoxy meets UL94,V0

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change without notice. This publication supersedes and replaces all information previously supplied.

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5/5

STPS30L30CG-1 [ETC]

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