SPY0029A [ETC]
3.3稳压器;
| 型号： | SPY0029A |
| 厂家： | 
ETC |
| 描述： | 3.3稳压器 稳压器 |
| 文件： | 总16页 (文件大小：548K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPY0029A
Linear Regulator
Preliminary
APR. 15, 2005
Version 0.6
Sunplus Technology reserves the right to change this documentation without prior notice. Information provided by Sunplus Technology is believed to be
accurate and reliable. However, Sunplus Technology makes no warranty for any errors which may appear in this document. Contact Sunplus Technology. to
obtain the latest version of device specifications before placing your order. No responsibility is assumed by Sunplus Technology for any infringement of patent
or other rights of third parties which may result from its use. In addition, Sunplus products are not authorized for use as critical components in life support
devices/ systems or aviation devices/systems, where a malfunction or failure of the product may reasonably be expected to result in significant injury to the
user, without the express written approval of Sunplus.
Preliminary
SPY0029A
Table of Contents
PAGE
1. GENERAL DESCRIPTION.......................................................................................................................................................................... 3
2. APPLICATION............................................................................................................................................................................................. 3
3. FEATURES.................................................................................................................................................................................................. 3
4. BLOCK DIAGRAM ...................................................................................................................................................................................... 3
5. SIGNAL DESCRIPTIONS............................................................................................................................................................................ 4
5.1. 4 PIN ONLY FOR CHIP ON BOARD (COB) ................................................................................................................................................. 4
5.2. 3 PIN (SOT-89) .................................................................................................................................................................................... 4
5.3. PIN CONFIGURATION ............................................................................................................................................................................. 4
6. ELECTRICAL SPECIFICATIONS ............................................................................................................................................................... 5
6.1. ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................................... 5
6.2. DC CHARACTERISTIC............................................................................................................................................................................. 5
6.3. BONDING OPTION (SEVERAL OUTPUT VOLTAGE)....................................................................................................................................... 6
6.4. TYPICAL OPERATING CHARACTERISTICS ................................................................................................................................................. 7
6. APPLICATION CIRCUIT ........................................................................................................................................................................... 11
6.1. 4 PIN (WITH LOW VOLTAGE DETECTED FUNCTION) ................................................................................................................................11
6.2. 3 PIN (NO LOW VOLTAGE DETECTED FUNCTION)....................................................................................................................................11
7. PACKAGE/PAD LOCATIONS ................................................................................................................................................................... 12
7.1. PAD ASSIGNMENT AND LOCATIONS....................................................................................................................................................... 12
7.2. ORDERING INFORMATION ..................................................................................................................................................................... 12
7.3. PACKAGE INFORMATION ....................................................................................................................................................................... 13
7.4. STORAGE CONDITION AND PERIOD FOR PACKAGE ................................................................................................................................. 14
7.5. RECOMMENDED SMT TEMPERATURE PROFILE...................................................................................................................................... 14
8. DISCLAIMER............................................................................................................................................................................................. 15
9. REVISION HISTORY ................................................................................................................................................................................. 16
© Sunplus Technology Co., Ltd.
Proprietary & Confidential
2
APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
LINEAR REGULATOR
1. GENERAL DESCRIPTION
3. FEATURES
The SPY0029A is a voltage regulator IC with ultra-low quiescent
current and low voltage detection by CMOS process. It operates to
+7.0V input range and delivers up to 100mA.
Low Quiescent Current (Typ. 3A @ VOUT = 3.3V, VIN = 5.0V)
High Current Driving Capability
(Typ. 100mA @ VOUT = 3.3V, VIN = 5.0V)
Small Dropout Voltage (Typ. 40mV @ VOUT = 3.3V, IOUT = 1.0mA)
Low Temperature-Drift Coefficient of Output Voltage
(Typ. ±50ppm/0C)
2. APPLICATION
Excellent Line Regulation (Typ. 0.15%/V)
Bonding Options Output Voltage (2.55V, 2.7V, 3.0V, 3.3V)
High Accuracy Output Voltage (±10%)
Low Voltage Detection.
Battery-powered equipment
Hand-held communication equipment
Audio/Video system
Toys
(A. Overload detection, B. Low battery detection)
3 pin Types of Package or Dice Form
4. BLOCK DIAGRAM
VIN
Vref1
Voltage
Vref
reference
OP1
PMOS
OP2
C1
R1
R3
R4
VOUT
90%Vref
LVDB
C2
COMP1
R2
NMOS
COMP2
GND
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
5. SIGNAL DESCRIPTIONS
5.1. 4 PIN only for chip on board (COB)
Mnemonic
PIN No.
Type
Description
LVDB
GND
VOUT
VIN
1
2
3
4
O
G
O
I
Low voltage detection, Low activity
Chip Ground
Output Regulated Voltage.
Input Voltage.
5.2. 3 PIN (SOT-89)
Mnemonic
PIN No.
Type
Description
GND
VIN
1
2
3
G
I
Chip Ground
Input Voltage.
VOUT
O
Output Regulated Voltage.
5.3. PIN Configuration
Customize COB-4pin
SOT-89
4
3
SPY0029A
COB
SPY0029A
2
1
3
1
2
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
6. ELECTRICAL SPECIFICATIONS
6.1. Absolute Maximum Ratings
Characteristic
Input Voltage
Symbol
VIN
Rating
+7.0V
Unit
V
V
Output Voltage
VOUT
TOPT
-0.3 ~ (VIN + 0.3)
0 - 70
℃
℃
Operating Temperature
Storage Temperature
Power Consumption (#)
TSTG
-40 - 125
500
PWATT
mW
Note1: Stresses beyond those given in the “Absolute Maximum Ratings” table may cause operational errors or damage to the device. For normal operational
conditions see Electrical Characteristic
Note2: (#) applied to SOT-89 package
Note3: For bonding-wire current density & package power dissipation issues, we do not suggest that the power consumption exceed “Absolute Maximum
Ratings”; it may cause device damage or affect device reliability
6.2. DC Characteristic
(VOUT (target) = 3.3V / 3.0V / 2.7V / 2.55V, Typical values are at TOPT = 25ºC)
Item
Output Voltage Accuracy
Output Current
Test Conditions
Symbol
Min.
-10.0
50
Typ.
Max.
10.0
-
Unit
Vout - Vout(target)
Vout(target)
V
IN = 5.0V,
-
%
10A≦ IOUT ≦10mA , VOUT = 3.3V
VIN = 5.0V , VOUT = 3.3V
IOUT
100
40
mA
mV
V
IN = 5.0V,
△VOUT
Load Regulation
-
60
1mA ≦ IOUT ≦ 50mA , VOUT=3.3V
IOUT = 1mA, Vin = VOUT (normal),
Dropout Voltage
VDIF
-
-
40
60
mV
V
DIF = VIN - VOUT , VOUT = 3.3V
Quiescent Current
VIN = 5.0V , VOUT = 3.3V
ISS
3.0
6.0
A
ΔVout
IOUT = 1mA,
Line Regulation
-
-
-
0.15
-
-
7.0
-
%/V
V
VOUT + 0.5V ≦ VIN ≦ 7.0V , VOUT = 3.3V
ΔVin Vout
Input Voltage
VOUT = 3.3V
VIN
ΔVout
IOUT = 10mA,
0OC ≦ TOPT ≦ 70OC , VOUT = 3.3V
±50
ppm/℃
Temperature Coefficient
ΔT
Vout
(A) 1
, VOUT = 3.3V
Low Voltage Detection
Threshold
5.0
10
±60
-
15
%
VDET
Vout(Normal)
(B) △V = VOUT (Normal) - VIN , VOUT = 3.3V
△V
-
-
-
mV
V
LVDB Output Voltage Low
(Open Nmos Drain)
ISINK = 1mA , VOUT = 3.3V
VOL
0.4
Note1: VOUT (normal) @ VIN = 5.0V, IOUT = 1mA , Vout = 3.3V , TOPT = 25 OC
Note2: Pwatt = (VIN - VOUT)* IOUT ; SOT-89 package maximum power dissipation is 500mW for SPY0029
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
6.3. Bonding Option (several output voltage)
Option
Output voltage
Power source bonding PAD no.
1
2
3
4
3.3V
3.0V
2
(note1)
(note 2)
(note 3)
(note 4)
2 & 6
2.7V
2 & 5 & 6
2 & 5
2.55V
Note 1
Note 2
Note 3
Note 4
5
5
2
2
6
6
5
2
5
6
2
6
Bonding Point
Bonding Point
Bonding Point
Bonding Point
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
6.4. Typical Operating Characteristics
6.4.1. Output voltage vs. output current (Vout = 3.3V)
6.4.3. Output voltage vs. output current (Vout = 2.7V)
Vin=7V
Vin=5V
Vin=3.1V
Vin=7V
Vin=5V
Vin=3.7V
2.8
2.78
2.76
2.74
2.72
2.7
3.4
3.38
3.36
3.34
3.32
3.3
2.68
2.66
2.64
2.62
2.6
3.28
3.26
3.24
3.22
3.2
0
10 20 30 40 50 60 70 80 90 100
0
10 20 30 40 50 60 70 80 90 100
Output Current Iout (mA)
Output Current Iout (mA)
6.4.2. Output voltage vs. output current (Vout = 3.0V)
Vin=7V Vin=5V Vin=3.4V
6.4.4. Output voltage vs. output current (Vout = 2.55V)
Vin=7V Vin=5V Vin=2.95V
2.6
2.58
2.56
2.54
2.52
2.5
3.1
3.08
3.06
3.04
3.02
3
2.98
2.96
2.94
2.92
2.9
2.48
2.46
2.44
2.42
2.4
0
10 20 30 40 50 60 70 80 90 100
0
10 20 30 40 50 60 70 80 90 100
Output Current Iout (mA)
Output Current Iout (mA)
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
6.4.5. Output voltage vs. input voltage (Vout = 3.3V)
6.4.7. Output voltage vs. input voltage (Vout = 2.7V)
Iout=1mA
Iout=10mA
Iout=50mA
Iout=1mA
Iout=10mA
Iout=50mA
3.4
3.37
3.34
3.31
3.28
3.25
3.22
3.19
3.16
3.13
3.1
2.8
2.77
2.74
2.71
2.68
2.65
2.62
2.59
2.56
2.53
2.5
3.2 3.6
4
4.4 4.8 5.2 5.6
6
6.4 6.8 7.2
2.6
3
3.4 3.8 4.2 4.6
5
5.4 5.8 6.2 6.6
7
Input Voltage Vin(V)
Input Voltage Vin(V)
6.4.6. Output voltage vs. input voltage (Vout = 3.0V)
6.4.8. Output voltage vs. input voltage (Vout = 2.55V)
Iout=1mA
Iout=10mA
Iout=50mA
Iout=1mA
Iout=10mA
Iout=50mA
2.6
2.57
2.54
2.51
2.48
2.45
2.42
2.39
2.36
2.33
2.3
3.1
3.07
3.04
3.01
2.98
2.95
2.92
2.89
2.86
2.83
2.8
2.4 2.8 3.2 3.6
4
4.4 4.8 5.2 5.6
6
6.4 6.8 7.2
2.8 3.2 3.6
4
4.4 4.8 5.2 5.6
6
6.4 6.8 7.2
Input Voltage Vin(V)
Input Voltage Vin(V)
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
6.4.9. Output voltage vs. temperature (Vout = 3.3V)
6.4.11. Output voltage vs. temperature (Vout = 2.7V)
3.35
3.34
3.33
3.32
3.31
3.3
2.75
2.74
2.73
2.72
2.71
2.7
2.69
2.68
2.67
2.66
2.65
3.29
3.28
3.27
3.26
3.25
-20 -10
0
10 20 30 40 50 60 70 80 90
Temperature Topt (C)
-20 -10
0
10 20 30 40 50 60 70 80 90
Temperature Topt (C)
6.4.10. Output voltage vs. temperature (Vout = 3.0V)
6.4.12. Output voltage vs. Temperature (Vout = 2.55V)
3.05
3.04
3.03
3.02
3.01
3
2.6
2.59
2.58
2.57
2.56
2.55
2.54
2.53
2.52
2.51
2.5
2.99
2.98
2.97
2.96
2.95
-20 -10
0
10 20 30 40 50 60 70 80 90
Temperature Topt (C)
-20 -10
0
10 20 30 40 50 60 70 80 90
Temperature Topt (C)
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
6.4.13. Load –transient response test module
(VIN = 5V, IOUT = 0 to 50mA, CLOAD = 10F)
6.4.16. Load –transient response; Vout = 2.7V
Vin
Vout
SPY0029A
50mA
GND
10F
A733
Vsw
5.1K
6.4.14. Load –transient response; Vout = 3.3V
6.4.17. Load –transient response; Vout = 2.55V
6.4.15. Load –transient response; Vout = 3.0V
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Preliminary Version: 0.6
Preliminary
SPY0029A
6. APPLICATION CIRCUIT
6.1. 4 PIN (with Low Voltage Detected Function)
VIN
VOUT
VIN
VOUT
LVDB
10F
SPY0029A
10F
100K
GND
LVDB
GND
6.2. 3 PIN (no Low Voltage Detected Function)
VIN
VOUT
VIN
VOUT
SPY0029A
10F
10F
GND
GND
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Proprietary & Confidential
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
7. PACKAGE/PAD LOCATIONS
7.1. PAD Assignment and Locations
Please contact Sunplus sales representatives for more information.
7.2. Ordering Information
Product Number
Package Type
Chip form
SPY0029A-C
SPY0029A-RE011
SPY0029A-RE012
SPY0029A-RE013
SPY0029A-RE014
Package form - SOT89 (Vout = 3.3V)
Package form - SOT89 (Vout = 3.0V)
Package form - SOT89 (Vout = 2.7V)
Package form - SOT89 (Vout = 2.55V)
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
7.3. Package Information
7.3.1. 3 PIN SOT89 package size
D
D1
POLISHED(2X)
B1
C
B
100(2X)
e
e1
Symbol
Min.
1.40
0.44
0.36
0.35
4.40
1.35
2.29
3.94
Max.
1.60
0.56
0.48
0.44
4.60
1.83
2.60
4.25
Unit
A
B
Millimeter
Millimeter
Millimeter
Millimeter
Millimeter
Millimeter
Millimeter
Millimeter
Millimeter
Millimeter
Millimeter
B1
C
D
D1
E
H
e
1.50 BSC
3.00 BSC
e1
L
0.89
1.2
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APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
7.4. Storage Condition and Period for Package
Package
Moisture sensitivity level
Max. Reflow temperature
Floor life storage condition
N/A
Dry pack
SOT
LEVEL 3
220 +5/-0℃
No
Note1: Please refer to IPC/JEDEC standard J-STD-020A and EIA JEDEC stand JFSD22-A112
Note2: or refer to the “CAUTION Note” on dry pack bag.
7.5. Recommended SMT Temperature Profile
This “Recommended” temperature profile is a rough guideline for
SMT process reference. Most of SUNPLUS leadframe base
product choice Matte Tin and Sn/Bi for plating recipe. For
PPF(Pre-Plated Frame) product with 63/37 solder paste, we
recommend 240℃~245℃ for peak temperature.
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Preliminary Version: 0.6
Preliminary
SPY0029A
8. DISCLAIMER
The information appearing in this publication is believed to be accurate.
Integrated circuits sold by Sunplus Technology are covered by the warranty and patent indemnification provisions stipulated in the terms of
sale only. SUNPLUS makes no warranty, express, statutory implied or by description regarding the information in this publication or
regarding the freedom of the described chip(s) from patent infringement. FURTHERMORE, SUNPLUS MAKES NO WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. SUNPLUS reserves the right to halt production or alter the specifications and
prices at any time without notice. Accordingly, the reader is cautioned to verify that the data sheets and other information in this
publication are current before placing orders. Products described herein are intended for use in normal commercial applications.
Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical life support equipment, are
specifically not recommended without additional processing by SUNPLUS for such applications. Please note that application circuits
illustrated in this document are for reference purposes only.
© Sunplus Technology Co., Ltd.
Proprietary & Confidential
15
APR. 15, 2005
Preliminary Version: 0.6
Preliminary
SPY0029A
9. REVISION HISTORY
Date
Revision #
Description
Page
APR. 15, 2005
0.6
1. Update absolute maximum ratings
5
2. Add section 7.4 Storage Condition and Period for Package
3. Add section 7.5 Recommended SMT Temperature Profile
14
14
DEC. 20, 2004
FEB. 25, 2004
0.5
0.4
1.Update Ordering Information
4
1.Remote 4pin package type TO-92 , add into 4pin COB type
2.Update Ordering Information
4
5
3.Update output voltage accuracy=+/-10%
4.Update output current=100mA (Typ)
6
6
5. Remove “8.1 PAD Assignment and Locations”
12
JAN.28, 2003
OCT.15, 2002
0.3
0.2
Update Ordering Information SPY0029A-RE011, SPY0029A-RE013 and SPY0029A-RE014
11
1. Update quiescent current = 3.0A in Features
3
5
5
5
6
2. Update quiescent current = 3.0A in DC characteristic
3. Add VOUT = 3.3V into test conditions of DC characteristic
4. Add Note1 figure into bonding option
5. Add typical operating characteristic figures from page 6 to page 9 (6.4.1 ~ 6.4.17)
JUL. 10, 2002
0.1
Original
12
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16
APR. 15, 2005
Preliminary Version: 0.6
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