SP/1608FF-500MA [ETC]
Fuse ; 保险丝\n
ETC 
®
Bu s s m a n n
S MT Ch ip Fu s e
S u b m in ia t u re S u rfa c e Mo u n t Fu s e s
1 6 0 8 FF
R
Dimensional Data
Dimensions - mm (inches)
1.60 ± 0.15
(0.063 ± 0.006)
0.80 ± 0.15
(0.032 ± 0.006)
Catalog Symbol: 1608FF
Voltage Rating: 24 VDC
Interrupting Rating: 35 Amperes
Physical Size:
0.36 ± 0.15
(0.014 ± 0.006)
0.80 ± 0.15
(0.032 ± 0.006)
EIA SOCM-1608-AC (Equivalent to 0603)
1.6 ≈ 0.8 ≈ 0.8mm
0.063 ≈ 0.032 ≈ 0.032 in.
Construction
1. Ceramic Substrate
1
2
3
4
5
8
7
6
2. Silver Termination Pad
3. Metal Film Fusible Element
4. Fused Glass Cover (Color Coded)
5. White Stripe (Only On Certain
Ratings)
6. Silver End Termination
7. Nickel Barrier (5.1-10.2 µm)
8. 90/10 Tin-Lead Plating
(7.6-12.7 µm)
Time-Current Characteristics:
Carry 100% rated current, 4 hours minimum. Open within
5 seconds at 250% rated current.
SUBSTRATE
Agency Approvals:
Not to Scale.
UL Recognized, Std. 248-14, File E19180, Guide JDYX2
CSA Component Acceptance File 53787, Class 1422-30
General Information:
Packaging and Ordering Information:
Tape and Reel: Standard 8mm tape, in compliance with
EIA-RS481 (equivalent to IEC 286, Part 3).
•
Bussmann SMT Chip Fuses utilize thick and thin metal
film technologies for superior fusing action and enhanced
reliability.
•
The fuse element is bonded to a ceramic substrate and
encapsulated with glass, providing excellent short-circuit
performance and environmental integrity. Predicted reliability
of the 1608FF chip fuse is 30 times greater than that of the
typical chip capacitor (consult Bussmann for details).
Substrate and coating thermal expansion coefficients are
closely matched to that of FR-4 epoxy-glass circuit board for
superior solder joint reliability.
1608FF
(See Table)
Product
Symbol
Rated Current
Package Code
TR = 3,000 pieces on tape on a 178mm reel.
TR1 = 15,000 pieces on tape on a 330mm reel.
SP = 50 pieces on tape in a plastic box.
•
•
Contact Bussmann if other package quantities are required.
CE logo denotes compliance with European Union Low Voltage Directive
(50-1000 VAC, 75-1500 VDC). Refer to BIF document #8002 or contact
Bussmann Application Engineering at 314-527-1270 for more information.
The end terminations are over-plated with nickel and tin-lead.
Electrical Characteristics
Current
Rating
(Amperes)
Color
Code
(Cover/Stripe)
Typ. Resistance
@ ² 10% Rated
Current (Ohms)
Typ. Voltage
Drop @ Rated
Current (Volts)
Typ. Melting
Integral @ 35A
(A2 sec.)
Typ. Total
Part Number
(XX=Package Code)
Clearing Integral
@ 35A (A2 sec.)
xx/1608FF-250mA
xx/1608FF-375mA
xx/1608FF-500mA
xx/1608FF-750mA
xx/1608FF-1A
0.25
0.375
0.5
0.75
1
Green
Green/White
Blue
3.0
0.90
0.80
0.54
0.45
0.18
0.12
0.11
0.09
0.087
0.08
0.08
.000067
.00015
.00055
.00132
.0022
.014
.000082
.00017
.00058
.00137
.0026
.015
2.0
0.9
Blue/White
Brown
0.51
0.15
0.068
0.042
0.029
0.022
0.018
0.014
xx/1608FF-1.5A
xx/1608FF-2A
1.5
2
Brown/White
Black
.037
.038
xx/1608FF-2.5A
xx/1608FF-3A
2.5
3
Black/White
Violet
.070
.078
.095
.107
xx/1608FF-3.5A
xx/1608FF-4A
3.5
4
Violet/White
Yellow
.185
.190
.270
.272
General Notes:
1. AC interrupting rating, melting integral and total clearing integral measured at 32V, unity power factor.
2. DC interrupting rating, melting integral and total clearing integral measured at 63V (250mA-3A) and 32V (4-5A), with a battery source.
3. It is recommended that fuses be mounted with ceramic (white) side facing up.
4. Contact Bussmann if higher ampere ratings are needed.
5. Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended,
with further derating required at elevated ambient temperatures.
Form No. 1608FF
12-16-98
Page 1 of 2
BIF Doc #3002
SB98107 Rev. A
®
Bu s s m a n n
S MT Ch ip Fu s e
S u b m in ia t u re S u rfa c e Mo u n t Fu s e s
1 6 0 8 FF
R
Environm e nta l Spe c ific a tions
Ope ra ting Te m pe ra ture Ra nge :
-65 to +125°C, with proper derating.
The rm a l Shoc k:
MIL-STD-202, Method 107, Test Condition B (-65 to
125°C), 1000 cycles, fuses soldered to FR-4 glass -epoxy
circuit board.
Vibra tion:
MIL-STD-202, Method 204, Test Condition C
(55 to 2000 HZ, 10G).
Carrier Dimensions - mm
E
D0
W
8.0 + 0.3 / -0.1
3.5 ± 0.05
1.75 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
F
E
A0
P2
P0
P1
A0
B0
D0
F
W
B0
4.0 ± 0.1
1.71 ± 0.1
1.88 ± 0.1
1.5 + 0.1 / -0.0
P1
P2
P0
Solde ra bility:
Withstands 60 seconds above 200°C, 260°C maximum.
Mois ture Re s is ta nc e :
AMPERE
RATING
MIL-STD-202, Method 106, 10 day cycle.
Solde r Le a c h Re s is ta nc e & Te rm ina l Adhe s ion:
EIA-576 (30 seconds submersion in 260°C tin-lead
solder).
10
1
Re c om m e nde d La nd Pa tte rn - m m (inc he s )
1.25
(0.05)
.1
0.90
(0.035)
.01
0.50
(0.02)
.001
CURRENT IN AMPERES
The only controlled copy of this BIF document is the electronic read-on version located on the Bussmann Network Drive. All other copies of this BIF document are by definition uncontrolled. This bulletin
is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Form No. 1608FF
12-16-98
Page 2 of 2
SB98107 Rev. A
BIF Doc #3002
相关型号：
SP/3216FF-250MA
Electric Fuse, Fast Blow, 0.25A, 32VAC, 63VDC, 50A (IR), Surface Mount, 1206,
COOPER
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