PIC12C508/PIC12C508A. [ETC]
PIC12C508/509 Rev. A Silicon Errata ; PIC12C508 / 509版本A芯片勘误表\n
| 型号： | PIC12C508/PIC12C508A. |
| 厂家： | 
ETC |
| 描述： | PIC12C508/509 Rev. A Silicon Errata
|
| 文件： | 总12页 (文件大小：251K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PIC12C508/509
PIC12C508/509 Data Sheet Errata
The PIC12C5XX parts conform functionally to the
PIC12C5XX Data Sheet (DS40139E), except for the
anomalies described below:
Clarifications/Corrections to the Data
Sheet:
In the Device Data Sheet (DS40139E), the following
clarifications and corrections should be noted.
None
Section 11: Corrections for the DC Characteristics,
Section 11.2 are shown.
Corrections for the GPIO pull-up resistor ranges are
shown in Table 11-1.
For the section titled “RESET”, additional information is
provided on OSC1/CLKIN and OSC2/CLKOUT pin
states during a MCLR.
2003 Microchip Technology Inc.
DS80023C-page 1
PIC12C508/509
11.2 DC CHARACTERISTICS: PIC12C508/509 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified)
Operating temperature
0°C ≤ TA ≤ +70°C (commercial)
-40°C ≤ TA ≤ +85°C (industrial)
-40°C ≤ TA ≤ +125°C (extended)
DC CHARACTERISTICS
Operating voltage VDD range as described in DC spec Section 11.1 and
Section 11.2.
Param
No.
Characteristic
Sym
Min
Typ† Max Units
Conditions
Input High Voltage
I/O ports
VIH
—
D040
with TTL buffer
2.0V
0.25VDD
+ 0.8V
50
—
—
VDD
V
V
4.5 ≤ VDD ≤ 5.5V
otherwise
D040A
VDD
(7)
D070
IPUR
250
400
µA VDD = 5V, VPIN = VSS
For VDD ≤ 5.5V
GPIO weak pull-up current
(2), (3)
Input Leakage Current
IIL
(5)
D061
8
130
—
250
+5
µA Vss ≤ VPIN ≤ VDD
µA Vss ≤ VPIN ≤ VDD
GP3/MCLR
(6)
D061A
—
GP3/MCLR
†
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended
that the PIC12C5XX be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as coming out of the pin.
4: Extended operating range is Advanced Information for this device.
5: This specification applies to GP3/MCLR configured as external MCLR and GP3/MCLR configured as input
with internal pull-up enabled.
6: This specification applies when GP3/MCLR is configured as an input with pull-up disabled. The leakage
current of the MCLR circuit is higher than the standard I/O logic.
7: Does not include GP3. For GP3 see parameters D0061 and D0061A.
DS80023C-page 2
2003 Microchip Technology Inc.
PIC12C508/509
TABLE 11-1: PULL-UP RESISTOR RANGES - PIC12C508/C509
VDD (Volts)
Temperature (°C)
Min
Typ
Max
Units
GP0/GP1
2.5
-40
25
38K
42K
42K
50K
15K
18K
19K
22K
42K
48K
49K
55K
17K
20K
22K
24K
63K
63K
63K
63K
20K
23K
25K
28K
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
85
125
-40
25
5.5
85
125
(1)
GP3
2.5
5.5
-40
25
65K
80K
85K
100K
50K
60K
65K
75K
80K
100K
110K
120K
60K
850K
1150K
1300K
1500K
600K
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
85
125
-40
25
65K
750K
85
80K
900K
125
90K
990K
*
These parameters are characterized but not tested.
Note 1: The weak pull-up resistor and associated current for the GP3/MCLR pin is non-linear when the respective
pin voltage is less than VDD - 1.0V. See parameter D061 for GP3/MCLR pin current specifications.
1. Module: RESET
When MCLR is asserted, the state of the OSC1/CLKIN
and CLKOUT/OSC2 pins are as follows:
CLKIN/CLKOUT PIN STATES WHEN MCLR
ASSERTED
Oscillator Mode
OSC1/CLKIN Pin OSC2/CLKOUT Pin
EXTRC, CLKOUT OSC1 pin is
OSC2 pin is driven
on OSC2
tristated and driven low
by external circuit
EXTRC, OSC2 is
I/O
OSC1 pin is
OSC2 pin is tristate
tristated and driven input
by external circuit
INTRC, CLKOUT
on OSC2
OSC1 pin is tristate OSC2 pin is driven
input
OSC1 pin is tristate OSC2 pin is tristate
input input
low
INTRC, OSC2 is
I/O
2003 Microchip Technology Inc.
DS80023C-page 3
PIC12C508/509
2. Module: Packaging
The package information contained in the data sheet is
incorrect. Please refer to the following tables for correct
package data.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS80023C-page 4
2003 Microchip Technology Inc.
PIC12C508/509
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
E
E1
p
D
2
n
1
B
α
c
A2
A
φ
A1
L
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
8
8
.050
.075
.074
.005
.313
.208
.205
.025
4
1.27
1.97
1.88
0.13
7.95
5.28
5.21
0.64
4
Overall Height
A
.070
.080
1.78
2.03
Molded Package Thickness
Standoff
A2
A1
E
.069
.002
.300
.078
.010
.325
.212
.210
.030
8
1.75
0.05
7.62
5.11
5.13
0.51
0
1.98
0.25
8.26
5.38
5.33
0.76
8
§
Overall Width
Molded Package Width
Overall Length
E1
D
.201
.202
.020
0
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.014
0
.009
.017
12
.010
.020
15
0.20
0.36
0
0.23
0.43
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-056
2003 Microchip Technology Inc.
DS80023C-page 5
PIC12C508/509
8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
E1
W
T
D
2
1
n
U
A
A2
L
A1
c
B1
p
eB
B
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.165
.123
.035
.290
.520
.140
.010
.055
.018
.310
.166
.450
.270
2.54
Top to Seating Plane
A
.145
.103
.025
.280
.510
.130
.008
.050
.016
.296
.161
.440
.260
.185
3.68
2.62
4.19
3.12
0.89
7.37
13.21
3.56
0.25
1.40
0.46
7.87
4.22
11.43
6.86
4.70
Top of Body to Seating Plane
Standoff
A2
A1
E1
D
.143
.045
.300
.530
.150
.012
.060
.020
.324
.171
.460
.280
3.63
1.14
7.62
13.46
3.81
0.30
1.52
0.51
8.23
4.34
11.68
7.11
0.64
7.11
Package Width
Overall Length
12.95
3.30
0.20
1.27
0.41
7.52
4.09
11.18
6.60
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
Lid Length
L
c
B1
B
§
eB
W
T
Lid Width
U
* Controlling Parameter
§ Significant Characteristic
JEDC Equivalent: MS-015
Drawing No. C04-083
DS80023C-page 6
2003 Microchip Technology Inc.
PIC12C508/509
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
8
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
Overall Height
A
.053
.069
1.35
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.32
0.10
5.79
3.71
4.80
0.25
0.48
0
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2003 Microchip Technology Inc.
DS80023C-page 7
PIC12C508/509
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
E
p
B
E1
n
L
R
D1
D
D2
PIN 1
EXPOSED
METAL
PADS
ID
1
2
E2
TOP VIEW
BOTTOM VIEW
α
A2
A3
A
A1
Units
Dimension Limits
INCHES
MILLIMETERS*
MIN
NOM
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050 BSC
1.27 BSC
0.85
Overall Height
A
A2
A1
A3
E
.033
.039
1.00
Molded Package Thickness
Standoff
.026
.0004
.031
.002
0.65
0.80
0.05
.000
.152
0.00
0.01
0.20 REF.
Base Thickness
Overall Length
.008 REF.
.194 BSC
.184 BSC
.158
4.92 BSC
4.67 BSC
Molded Package Length
Exposed Pad Length
Overall Width
E1
E2
D
.163
3.85
4.00
4.15
.236 BSC
.226 BSC
.091
5.99 BSC
5.74 BSC
Molded Package Width
Exposed Pad Width
Lead Width
D1
D2
B
.085
.014
.020
.097
.019
.030
2.16
0.35
0.50
2.31
2.46
0.47
0.75
.016
0.40
0.60
.356
Lead Length
L
.024
Tie Bar Width
R
.014
α
Mold Draft Angle Top
12
12
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
DS80023C-page 8
2003 Microchip Technology Inc.
PIC12C508/509
APPENDIX A: REVISION HISTORY
Rev. C Document (3/2003)
Under Clarifications/Corrections to the Data Sheet,
Item 2, Packaging: correct package data was added.
Added Appendix A: Revision History.
2003 Microchip Technology Inc.
DS80023C-page 9
PIC12C508/509
NOTES:
DS80023C-page 10
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications. No
representation or warranty is given and no liability is assumed by
Microchip Technology Incorporated with respect to the accuracy
or use of such information, or infringement of patents or other
intellectual property rights arising from such use or otherwise.
Use of Microchip’s products as critical components in life
support systems is not authorized except with express written
approval by Microchip. No licenses are conveyed, implicitly or
otherwise, under any intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Accuron, dsPIC, dsPICDEM, dsPICDEM.net,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit
Serial Programming, ICSP, ICEPIC, microPort, Migratable
Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit,
PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerTool,
rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark of
Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
®
PICmicro 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS80023C - page 11
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Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Tel: 39-0331-742611 Fax: 39-0331-466781
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
02/12/03
DS80023C-page 12
2003 Microchip Technology Inc.
相关型号：
PIC12C50804I/JW
8-BIT, UVPROM, 4 MHz, RISC MICROCONTROLLER, CDIP8, WINDOWED, SIDE BRAZED, CERAMIC, DIP-8
MICROCHIP
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