LNJ461C3XRA [ETC]

Surface Mounting Chip LED; 表面安装LED芯片
LNJ461C3XRA
型号: LNJ461C3XRA
厂家: ETC    ETC
描述:

Surface Mounting Chip LED
表面安装LED芯片

文件: 总2页 (文件大小:79K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Surface Mounting Chip LED  
Unit: mm  
GW Type  
1.8Max  
2.2 ± 0.2  
1.5 ± 0.2  
(
1.7  
)
1
0.65 ± 0.2  
Conventional Part No.  
Global Prat No.  
Lighting Color  
0.4 ± 0.1  
0.15  
C0.5  
LN1261C (TR) ······· LNJ261C3RRA ········ Red  
LN1361C (TR) ······· LNJ361C3GRA ········ Green  
LN1461C (TR) ······· LNJ461C3XRA ········ Amber  
LN1861C (TR) ······· LNJ861C3DRA ········ Orange  
1
0
0.15  
Adsolute Maximum Ratings (Ta = 25°C)  
2
Lighting Color PD(mW) IF(mA) IFP(mA) VR(V) Topr(°C) Tstg(°C)  
0.5 ± 0.1  
Red  
60  
60  
60  
60  
20  
20  
20  
20  
60  
60  
60  
60  
4
4
4
3
25 +80 30 +85  
25 +80 30 +85  
25 +80 30 +85  
25 +80 30 +85  
0.8Max  
2
Green  
Amber  
Orange  
1: Anode  
2: Cathode  
Pulse width 1 msec. The condition of IFP is duty 10%, Pulse width 1 msec  
ElectroOptical Characteristics (Ta = 25°C)  
Conventional Lighting  
Lens Color  
IO  
VF  
λP  
∆λ  
IR  
Part No.  
Color  
Typ Min  
IF  
Typ Max Typ Typ  
IF  
Max VR  
LN1261C (TR) Red  
LN1361C (TR) Green  
LN1461C (TR) Amber  
LN1861C (TR) Orange  
Unit  
Clear  
Clear  
Clear  
Clear  
1.4  
7.5  
4.5  
5.0  
0.5  
2.8  
1.6  
1.9  
15  
20  
20  
20  
2.2  
2.2  
2.2  
2.1  
V
2.8  
2.8  
2.8  
2.8  
V
700 100  
20  
20  
20  
20  
mA  
5
10  
10  
10  
µA  
4
4
4
3
V
565  
590  
630  
nm  
30  
30  
40  
mcd mcd mA  
nm  
65  
Caution for Safety  
Gallium arsenide material (GaAs) is used  
in this product.  
Therefore, do not burn, destroy, cut, crush, or chemi-  
cally decompose the product, since gallium arsenide  
material in powder or vapor form is harmful to human  
health.  
Observe the relevant laws and regulations when dispos-  
ing of the products. Do not mix them with ordinary in-  
dustrial waste or household refuse when disposing of  
GaAs-containing products.  
DANGER  
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the  
products or technologies described in this material and controlled under the "Foreign Exchange and Foreign  
Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteristics and  
applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting  
of relative rights, or the granting of any license.  
(3) The products described in this material are intended to be used for standard applications or general electronic  
equipment (such as office equipment, communications equipment, measuring instruments and household ap-  
pliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion  
equipment, life support systems and safety devices) in which exceptional quality and reliability are required,  
or if the failure or malfunction of the products may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this material are subject to change without notice for  
reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the prod-  
ucts, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifi-  
cations satisfy your requirements.  
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the  
range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for  
any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, redundant design is recommended, so that  
such equipment may not violate relevant laws or regulations because of the function of our products.  
(6) When using products for which dry packing is required, observe the conditions (including shelf life and after-  
unpacking standby time) agreed upon when specification sheets are individually exchanged.  
(7) No part of this material may be reprinted or reproduced by any means without written permission from our  
company.  
Please read the following notes before using the datasheets  
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconduc-  
tor products best suited to their applications.  
Due to modification or other reasons, any information contained in this material, such as available product  
types, technical data, and so on, is subject to change without notice.  
Customers are advised to contact our semiconductor sales office and obtain the latest information before  
starting precise technical research and/or purchasing activities.  
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always  
the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any  
liability for any damages arising from any errors etc. that may appear in this material.  
C. These materials are solely intended for a customer's individual use.  
Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or  
distributing this material to a third party, via the Internet or in any other way, is prohibited.  
2001 MAR  

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