ILC7071AIC531X [ETC]
VOLT REGULATOR|FIXED|+3.1V|CMOS|TSOP|6PIN|PLASTIC ; VOLT稳压器|固定| + 3.1V | CMOS | TSOP | 6PIN |塑料\n
| 型号： | ILC7071AIC531X |
| 厂家： | 
ETC |
| 描述： | VOLT REGULATOR|FIXED|+3.1V|CMOS|TSOP|6PIN|PLASTIC
|
| 文件： | 总11页 (文件大小：353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
www.fairchildsemi.com
ILC7071
100mA SOT-23-5 Low Noise CMOS RF-LDO™
Regulator
Features
General Description
•
•
•
•
•
•
•
•
1% output voltage accuracy
Low noise
The ILC7071 is an 100mA, Low Noise, Low Dropout
(LDO) linear regulator, designed and processed in CMOS
technology. This process combines the best CMOS features
of low quiescent current, small size and low dropout voltage
with the best bipolar features of high ripple rejection, low
noise and power handling capability. The ILC7071 offers a
quiescent current of less than 100µA, a logic level enable
(regulator EN) pin, the size of the industry standard SOT-23
and a low dropout voltage of 25mV at 10mA. With better
than 70 dB (1kHz) of ripple rejection, low noise of 40µ
VRMS and 1% output voltage accuracy, the ILC7071 is
ideally suited for communications and personal electronics
applications.
Only 90µA ground current at 100mA load
Ripple rejection up to 75 dB at 1kHz
Excellent line and load transient response
Guaranteed to 100mA output current
Industry standard five lead SOT-23 packages
Fixed 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V, 3.3V and
custom output voltage options
Applications
•
•
•
•
Cellular phones
Wireless communicators
PDAs/palmtops/organizers
Battery powered portable electronics
Block Diagram
VIN
Trans-
Error
Amplifier
conductance
Amplifier
Voltage
Reference
+
–
CN
VOUT
EN
Thermal
Shut
Down
GND
REV. 1.0.1 3/28/02
ILC7071
PRODUCT SPECIFICATION
Test circuit
VIN
EN
VOUT
CN
VIN
CIN
COUT
RL
GND
CN
Figure 1.
Pin Configuration
VOUT
CN
5
4
ILC7071
1
2
3
VIN GND EN
SOT-23-5
Pin Definition
Pin Number Pin Name
Pin Function Description
1
2
3
VIN
GND
EN
Supply voltage input
Ground of the IC
Enable input. High level enables VOUT while Low level commands shutdown mode
and discharge COUT to GND
4
5
CN
Optional noise bypass capacitor
VOUT
Voltage output. Regulated output voltage
2
REV. 1.0.1 3/28/02
PRODUCT SPECIFICATION
ILC7071
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life
impaired. Functional operation under these conditions is not implied.
Parameter
Min.
Max.
Units
Supply Voltage:
10
V
V
EN Input Voltage
-0.3
-0.3
VIN + 0.3
Output Voltage
VIN + 0.3
V
Junction Temperature (TJ )
Storage Temperature
Lead Soldering Temperature, 10 seconds
Power Dissipation (PD)
125, Internally limited
°C
°C
°C
mW
-40
150
300
150
Recommended Operating Conditions
Parameter
Conditions
Min.
Typ.
VOUT+VDO VOUT+1 VOUT+4
150
Max.
Units
V
Supply Voltage VDD
Peak Output Current
VIN to GND
IOUT to GND,
tpw=2mS
mA
Ambient Operating Temperature
TA
-40
85
°C
REV. 1.0.1 3/28/02
3
ILC7071
PRODUCT SPECIFICATION
Electrical Specifications
VIN=VOUT+1V, IOUT=1mA, VEN=2V and TA = +25°C using circuit in Figure 1 with CIN=COUT=1µF, CN=0,
unless otherwise specified
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Output Voltage
VOUT
0.99
VOUTnom
VOUT
nom
1.01
VOUTnom
V
Ground pin Current
Line Regulation
IGND
IOUT = 10mA
70
90
90
µA
IOUT = 100mA
110
∆VOUT
VOUT
/
/
VOUT + 2V ≥ VIN ≥
VOUT + 1V
0.017
0.075
%/V
∆VIN
Load
Regulation
∆VOUT
/
IOUT=1 to 100mA
0.15
0.25
%
VOUT
Dropout Voltage.
Notes 1and 2
VDO
IOUT = 10mA, VOUT > 2.8V
IOUT = 20mA, VOUT > 2.8V
IOUT = 100mA, VOUT > 2.8V
VEN = 0
25
50
30
60
mV
275
10
320
40
Shutdown
(OFF) current
IOFF
VEN
IEN
nA
V
EN Input Voltage
High = ON state
Low = OFF state
2
0.6
EN Input Current
VEN = 0.6V
VEN = 2V
0.3
1
µA
Output Noise Voltage
Ripple Rejection
eN
BW = 300Hz to 50kHz
CIN = COUT = 2.2uF
IOUT = 10mA, CN = 10nF
40
µV
RMS
PSRR
COUT = 4.7uF, f = 120Hz
IOUT = 80mA
65
10
dB
Dynamic Line Regulation ∆VOUT(line) ∆VIN = 1V,IOUT = 10mA,
mV
tr/tf = 2uS
Dynamic Load Regulation ∆VOUT(load) ∆IOUT = 100mA, tr < 5µS
20
mV
Resistance Discharge in
OFF state
RDISC
VEN = 0
1.5
kΩ
Notes:
1. For 2.5V < V
< 2.8V refere to diagram “Dropout Voltage vs.Output Voltage”.
OUT
2. Dropout Voltage is defined as the input to output differential voltage at which the output voltage drops 2% below the nominal
value measured with 1V differential .
4
REV. 1.0.1 3/28/02
PRODUCT SPECIFICATION
ILC7071
Typical Applications Diagrams
Short Circuit Thermal Protection
Load Transient Response
= V +1V, CN=0
V
= V
+1V
IN
OUTnom
V
Output to GND
IN
OUT
I
(0 to 100mA)
OUT
I
(0.5A/div)
OUT
V
OUT(AC)
Line Transient Response
∆V = V +1V to V +2V
ON/OFF Transient Response
Load=80mA,
IN
OUT
OUT
=2.2µF
Load=10mA, C
C
=1µF, CN=0
OUT
OUT
V
IN
V
EN
V
OUT(AC)
V
OUT
REV. 1.0.1 3/28/02
5
ILC7071
PRODUCT SPECIFICATION
ON/OFF Transient Response
Load=10mA, C
=1µF
ON/OFF Transient Response
OUT
CN=10nF
Load=10mA, C
=1µF, C =0
OUT N
V
V
EN
EN
V
V
OUT
OUT
Dropout Voltage vs. Output Voltage
Ground Current
500
450
400
350
120
110
100
90
80
70
60
50
40
30
20
10
0
80mA Load
100mA
300
250
200
150
100
50
No Load
10mA
0
2.5
2.75
3
3.25 3.5 3.75
VOUT (V)
4
4.25 4.5 4.75
5
0
1
2
3
4
5
6
7
8
Input Voltage (V)
Output Voltage
Dropout Voltage
2.830
2.825
300
250
1mA Load
25°C
200
2.820
2.815
2.810
85°C
80mA Load
150
100
-40°C
50
0
2.805
-40
-20
0
20
40
60
80
0
20
40
60
80
100
Temperature (C)
Load Current (mA)
6
REV. 1.0.1 3/28/02
PRODUCT SPECIFICATION
ILC7071
Ripple Rejection
Load=10mA, C =4.7µF
Ripple Rejection
Load=80mA, C =4.7µF
OUT
OUT
Spectral Noise Density and Output Voltage Noise
=C =2.2µF, CN=10nF,
C
IN
OUT
V
IN
=V
+1V, I =10mA
OUT
OUT
REV. 1.0.1 3/28/02
7
ILC7071
PRODUCT SPECIFICATION
Thermal Characteristics
Application Information
The ILC7071 is designed to supply up to 100mA at the
specified output voltage with an operating die (junction)
temperature of up to 125 °C. While the power dissipation is
calculated from known electrical parameters, the thermal
resistance is a result of the thermal characteristics of the
compact SOT-23-5 surface-mount package and the surround-
ing PC Board copper to which it is mounted.
Capacitor Selection
In general, ceramic capacitors are preferred due to their
superior ESR performance. Those with X5R dielectric offer
the best temperature coefficient.
An input capacitor of 1µF or greater, connected between
Input and Ground, located in close proximity to the device
will improve the transient response and the noise rejection.
The relationship describing the thermal behavior of the pack-
age is:
An output capacitor of at least 1µF is required to maintain
regulator loop stability. Stable operation will be achieved
with a wide variety of capacitors with ESR ranging from
10mΩ to 10Ω.
T
J(max) – TA
PD(max) = --------------------------------
ΘJA
where TJ(max) is the maximum allowable junction tempera-
ture of the die, which is 125 °C, and TA is the ambient
operating temperature. ΘJA is dependent on the surrounding
PC board layout and can be empirically obtained. While the
JC (junction-to-case) of the SOT-23-5 package is specified
at 130 °C/W, the ΘJA of the minimum PWB footprint will be
at least 235 °C/W.
An optional capacitor connected between the CN pin and
ground can significantly reduce noise on the output.Values
ranging up to 10nF can be used, depending upon the sensi-
tivity to output noise in the application. Care should be taken
to prevent noise from external sources to enter into the CN
pin, which is a very sensitive, high impedance pin. Leakage
currents into this pin will directly affect the regulator accu-
racy and should be kept as low as possible.
Θ
This can be improved upon by providing a heat sink of
surrounding copper ground on the PCB.
Control Functions
Enable Pin
Applying a voltage of 0.6V or less at the Enable pin will
disable the output, reducing the quiescent output current to
less than 1µA, while a voltage of 2V or greater will enable
the device. If this shutdown function is not needed, the pin
can simply be connected to the VIN pin. Allowing this pin to
float will cause erratic operation.
Depending on the size of the copper area, the resulting ΘJA
can range from approximately 180 °C/W for one square
inch, to nearly 130 °C/W for 4 square inches.
The addition of backside copper with through-holes, stiffen-
ers, and other enhancements can also aid in reducing this
value. The heat contributed by the dissipation of other
devices located nearby must be included in design consider-
ations.
Thermal Protection
Once the limiting parameters in the thermal relationship
have been determined, the electrical design should be
verified to ensure that the device remains within specified
operating conditions.
The ILC7071 is designed to supply high peak output currents
for brief periods, however this output load will cause the
device temperature to increase and exceed maximum ratings
due to power dissipation. During output overload conditions,
when the die temperature exceeds the shutdown limit tem-
perature of 125 °C, onboard thermal protection will disable
the output until the temperature drops below this limit,at
which point the output is then re-enabled.
If overload conditions are not considered, it is possible for
the device to enter a thermal cycling loop, in which the
circuit enters a shutdown condition, cools, reenables, and
then again overheats and shuts down repeatedly due to an
unmanaged fault condition.
During a thermal shutdown situation the user may assert the
power-down function at the Enable pin, reducing power
consumption to the minimum level.
8
REV. 1.0.1 3/28/02
PRODUCT SPECIFICATION
ILC7071
The proximity of the output capacitor is especially important
to achieve optimal noise compensation from the onboard
error amplifier, especially during high load conditions.
General PCB Layout Considerations
To achieve the full performance of the device, careful circuit
layout and grounding technique must be observed. Establish-
ing a small local ground, to which the GND pin, the output
and bypass capacitors are connected, is recommended, while
the input capacitor should be grounded to the main ground
plane.
A large copper area in the local ground will provide the heat
sinking discussed above when high power dissipation signif-
icantly increases the temperature of the device.
Component-side copper provides significantly better thermal
performance for this surface-mount device, compared to that
obtained when using only copper planes on the underside.
The quiet local ground is then routed back to the main
ground plane using feedthrough vias.
In general, the high frequency compensation components
(input, bypass, and output capacitors) should be located as
close to the device as possible.
REV. 1.0.1 3/28/02
9
ILC7071
PRODUCT SPECIFICATION
Mechanical Dimensions
5 Lead SOT-23-5
0.122 (3.10)
0.106 (2.70)
0.071 (1.80)
0.055 (1.40)
0.118 (3.00)
0.102 (2.60)
PIN 1
0.037 (0.95) BSC
0.055 (1.40)
0.0393 (1.0)
0.057 (1.45)
0.035 (0.90)
10°
0°
0.0217 (0.55)
0.0138 (0.35)
0.0078 (0.2)
0.0031 (0.08)
SEATING
PLANE
0.0059 (0.15)
0.0019 (0.05)
0.019 (0.50)
0.0138 (0.35)
10
REV. 1.0.1 3/28/02
ILC7071
PRODUCT SPECIFICATION
Ordering Information
Output Voltage
Part Number
ILC7071AIC525X
ILC7071AIC526X
ILC7071AIC527X
ILC7071AIC528X
ILC7071AIC5285X
ILC7071AIC529X
ILC7071AIC530X
ILC7071AIC531X
ILC7071AIC533X
Temperature Range
-40 to 85 ˚C
-40 to 85 ˚C
-40 to 85 ˚C
-40 to 85 ˚C
-40 to 85 ˚C
-40 to 85 ˚C
-40 to 85 ˚C
-40 to 85 ˚C
-40 to 85 ˚C
Package
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
2.5
2.6
2.7
2.8
2.85
2.9
3.0
3.1
3.3
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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3/28/02 0.0m 002
Stock#DS30007010
2002 Fairchild Semiconductor Corporation
相关型号：
ILC7071AIC533X
Fixed Positive LDO Regulator, 3.3V, 0.32V Dropout, CMOS, PDSO5, SOT-23-5, 5 PIN
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