HLMP-4719-A0002 [ETC]

T-13/4 (5mm). Low Current LED Lamp ; T- 13/4 (5毫米) 。低电流LED灯\n
HLMP-4719-A0002
型号: HLMP-4719-A0002
厂家: ETC    ETC
描述:

T-13/4 (5mm). Low Current LED Lamp
T- 13/4 (5毫米) 。低电流LED灯\n

光电
文件: 总6页 (文件大小:176K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Tape and Reel Options for T-13/4  
(5 mm), T-1 (3 mm), LED Lamps  
Technical Data  
Option 01  
Option 02  
Features  
Ordering Information  
• Compatible with Radial Lead  
Automatic Insertion  
Equipment  
• Meets Dimensional Specifi-  
cations of IEC Publication  
286 and ANSI/EIA Standard  
RS-468 for Tape and Reel  
• Reel Packaging Simplifies  
Handling and Testing  
• T-1 and T-1 3/4 LED Lamps  
Available Packaged on Tape  
and Reel  
To order LED lamps packaged on  
tape and reel, include the  
appropriate option code along  
with the device catalog part  
number. Example: to order the  
HLMP-3300 on tape and reel with  
formed leads (5 mm lead spacing)  
order as follows: HLMP-3300  
Option 01. Minimum order  
quantities vary by part number.  
Orders must be placed in reel  
increments. Please contact your  
local Agilent sales office or  
Caution: Agilent does not  
recommend T-1 package, option  
02 LEDs for auto-insertion. The  
force exerted on the LED lead  
frame during the cut and clinch  
operation of auto-insertion may  
result in cracking of the lamp  
epoxy dome which results in  
catastrophic failure. It is  
• 5 mm (0.197 inch) Formed  
Lead and 2.54 mm (0.100  
inch) Straight Lead Spacing  
Available  
franchised Agilent distributor for  
a complete list of lamps available  
on tape and reel.  
LED lamps with 0.46 mm (0.018  
inch) square leads with 5 mm  
(0.197 inch) lead spacing are  
recommended for use with  
Description  
T-1 and T-13/4 LED lamps are  
available on tape and reel as  
specified by the IEC Publication  
286 and ANSI/EIA Standard  
RS-468. The Option 01 lamp  
devices have formed leads with  
5 mm (0.197 inch) spacing for  
automatic insertion into PC  
boards by radial lead insertion  
equipment. The Option 02 lamp  
devices have straight leads with  
2.54 mm (0.100 inch) spacing,  
packaged on tape and reel for  
ease of handling. T-1 lamps are  
packaged 1800/reel. T-13/4 lamps  
are packaged 1300/reel.  
suggested that insertion machine  
compatibility be confirmed.  
automatic insertion equipment.  
Device Selection Guide  
Option  
Description  
01  
02  
Tape and reel, 5 mm (0.197 inch) formed leads.  
Tape and reel, 2.54 mm (0.100 inch) straight leads.  
Package  
T-1  
Quantity/Reel  
1800  
Order Increments  
1800  
1300  
T-13/4  
1300  
2
Notes:  
Absolute Maximum  
1. Minimum leader length at either end of  
tape is 3 blank part spaces.  
2. Silver saver paper is used as the  
interlayer for silver plated lead devices.  
3. The maximum number of consecutive  
missing lamps is 3.  
4. In accordance with EIA and IEC specs,  
the anode lead leaves the reel first.  
5. Drawings apply to devices with  
0.46 mm (0.018 inch) square leads  
only. Contact Agilent Sales Office for  
dimensions of 0.635 mm (0.025 inch)  
square lead devices.  
Ratings and Electrical/  
Optical Characteristics  
The absolute maximum ratings,  
mechanical dimension tolerances  
and electrical/optical  
characteristics for lamps  
packaged on tape and reel are  
identical to the basic catalog  
device. Refer to the basic data  
sheet for the specified values.  
Tape and Reel LED Configurations  
Figure 1. T-1 High Profile Lamps, Option 01.  
Figure 2. T-1 High Profile Lamps, Option 02.  
Figure 3. T-1 Low Profile Lamps, Option 01.  
Figure 4. T-1 Low Profile Lamps, Option 02.  
3
Tape and Reel LED Configurations (cont.)  
Figure 6. T-13/4 High Profile Lamps, Option 02.  
Figure 5. T-13/4 High Profile Lamps, Option 01.  
Figure 7. T-13/4 Low Profile Lamps, Option 01.  
Figure 8. T-13/4 Low Profile Lamps, Option 02.  
4
Dimensional Specifications for Tape and Reel  
Item  
Option 01 02  
Symbol  
Specification  
Notes  
T1 High Profile  
Body Height  
A1  
4.70 (0.185)  
4.19 (0.165)  
Body Diameter  
D1  
3.18 (0.125)  
2.67 (0.105)  
Component Height  
H1  
25.7 (1.012) Max.  
Tl Low Profile  
Body Height  
A2  
3.73 (0.147)  
3.23 (0.127)  
Body Diameter  
D2  
3.05 (0.120)  
2.79 (0.110)  
Component Height  
H2  
24.7 (0.974) Max.  
T13/4 High Profile  
Body Height  
A3  
9.19 (0.362)  
8.43 (0.332)  
Body Diameter  
D3  
5.08 (0.200)  
4.32 (0.170)  
Component Height  
H3  
30.2 (1.189) Max.  
T13/4 Low Profile  
Body Height  
A4  
6.35 (0.250)  
5.33 (0.210)  
Body Diameter  
D4  
5.08 (0.200)  
4.32 (0.170)  
Component Height  
Lead Wire Thickness  
Pitch of Component  
H4  
d
27.4 (1.079) Max.  
0.45 (0.018)  
Square Leads  
P
13.7 (0.539)  
11.7 (0.461)  
Feed Hole Pitch  
P0  
12.9 (0.508)  
12.5 (0.492)  
Cumulative error:  
1.0 mm/20 pitches  
Feed Hole Center to Lead Center  
P1  
4.55 (0.179)  
3.15 (0.124)  
Measure at crimp  
bottom 5.78/3.68  
(0.227/0.1448) for  
straight leads  
Hole Center to Component Center  
Lead to Lead Distance  
P2  
F
7.35 (0.289)  
5.35 (0.211)  
5.40 (0.213)  
4.90 (0.193)  
2.54 (0.100) nominal  
for straight leads  
Component Alignment, Front-rear  
Tape Width  
h  
0 ± 1.0 (0.039)  
Figure 9  
W
18.5 (0.728)  
17.5 (0.689)  
Hold Down Tape Width  
Hole Position  
W0  
W1  
15.3 (0.602)  
12.0 (0.472)  
9.75 (0.384)  
8.50 (0.335)  
5
Dimensional Specifications for Tape and Reel (cont.)  
Item  
Option 01 02  
Symbol  
W2  
Specification  
Notes  
Hold Down Tape Position  
2.54 (0.100) Max.  
Height of Component from Hole Center  
H
21.0 (0.827)  
20.0 (0.787)  
Lead Clinch Height  
Feed Hole Diameter  
Total Tape Thickness  
HO  
DO  
t
16.5 (0.650)  
15.5 (0.610)  
4.20 (0.165)  
3.80 (0.150)  
0.90 (0.035)  
0.50 (0.020)  
Paper thickness:  
0.55 (0.022)  
0.45 (0.018) Figure 9  
Length of Snipped Lead  
L
11.0 (0.433) Max.  
14.5 (0.571) Min.  
Lead Length Under Hold Down Tape  
I1  
Note:  
1. Dimensions in millimetres (inches) maximum/minimum.  
Figure 9. Front to Rear Alignment and  
Tape Thickness, Typical All Device  
Types.  
Figure 10. Device Retention Tests and Specifications.  
Figure 11. Reel Configuration and Labeling.  
www.semiconductor.agilent.com  
Data subject to change.  
Copyright © 1999 Agilent Technologies, Inc.  
Obsoletes 5964-9375E (4/96)  
5968-4164E (11/99)  

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