HD74HCT241T [ETC]
Buffer/Driver ; 缓冲器/驱动器\n
| 型号： | HD74HCT241T |
| 厂家： | 
ETC |
| 描述： | Buffer/Driver
|
| 文件： | 总7页 (文件大小：57K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HD74HCT241
Octal Buffers/Line Drivers/Line Receivers
(with noninverted 3-state outputs)
ADE-205-551 (Z)
1st. Edition
Sep. 2000
Description
The HD74HCT241 is a noninverting buffer and has one active low enable and one active high enable.
Each enable independently controls 4 buffers.
This device does not have schmitt trigger inputs.
Features
•
•
•
•
•
•
LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility
High Speed Operation: tpd (A to Y) = 10 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 4.5 to 5.5 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Inputs
Output
1G
H
L
2G
L
A
X
H
L
Y
Z
H
L
H
L
H
H :
High level
Low level
Irrelevant
L
X
Z
:
:
:
Off (high impedance) state of a 3-state output
HD74HCT241
Pin Arrangement
1G
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
1
2
3
4
5
6
7
8
9
20 VCC
19 2G
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 2A1
GND 10
(Top view)
2
HD74HCT241
Block Diagram
To three other
1A Buffers
To three other
2A Buffers
VCC
Two of 8
Buffers
Input
1A
YA
VCC
Input
2A
YB
1G
2G
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
V
Supply voltage range
Input voltage
VCC
VIN
–0.5 to +7.0
–0.5 to VCC + 0.5
–0.5 to VCC + 0.5
±35
V
Output voltage
VOUT
IOUT
ICC, IGND
IIK
V
DC current drain per pin
DC current drain per VCC, GND
DC input diode current
DC output diode current
Power dissipation per package
Storage temperature
mA
mA
mA
mA
mW
°C
±75
±20
IOK
±20
PT
500
Tstg
–65 to +150
3
HD74HCT241
DC Characteristics
Ta = –40 to
Ta = 25°C
+85°C
Test Conditions
Item
Symbol Min Typ Max Min Max Unit VCC (V)
Input voltage
VIH
2.0
—
—
—
—
2.0
—
V
V
V
4.5 to
5.5
VIL
—
0.8
—
0.8
4.5 to
5.5
Output voltage
VOH
4.4
—
4.4
4.13
—
—
4.5
4.5
4.5
4.5
5.5
Vin = VIH or VIL IOH = –20 µA
IOH = –6 mA
4.18 —
—
—
VOL
—
—
—
—
—
—
0.1
0.1
0.33
V
Vin = VIH or VIL IOL = 20 µA
IOL = 6 mA
0.26 —
Off-state output
current
IOZ
Iin
±0.5 —
±5.0 µA
Vin = VIH or VIL,
Vout = VCC or GND
Input current
—
—
—
—
±0.1 —
±1.0 µA
5.5
5.5
Vin = VCC or GND
Quiescent current ICC
4.0
—
40
µA
Vin = VCC or GND, Iout = 0 µA
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
+85°C
Test Conditions
Item
Propagation delay tPHL
Symbol Min Typ Max Min Max Unit VCC (V)
—
—
—
—
—
—
—
11 20
9 20
—
—
—
—
—
—
—
25
25
38
38
38
38
15
ns
ns
ns
4.5
4.5
4.5
4.5
4.5
4.5
4.5
time
tPLH
tZL
tZH
tLZ
Output enable
time
14 30
12 30
13 30
17 30
Output disable
time
tHZ
Output rise/fall
time
tTLH
tTHL
4
12
ns
Input capacitance Cin
—
5
10
—
10
pF
—
4
HD74HCT241
Package Dimensions
Unit: mm
24.50
25.40 Max
20
11
10
1
1.30
0.89
7.62
1.27 Max
+ 0.11
– 0.05
0.25
2.54 ± 0.25
0.48 ± 0.10
0° – 15°
Hitachi Code
DP-20N
JEDEC
EIAJ
Mass (reference value)
—
Conforms
1.26 g
Unit: mm
12.6
13 Max
11
20
1
10
+ 0.20
7.80
– 0.30
0.80 Max
1.15
0° – 8°
1.27
0.70 ± 0.20
*0.42 ± 0.08
0.40 ± 0.06
0.15
M
0.12
Hitachi Code
JEDEC
FP-20DA
—
EIAJ
Conforms
0.31 g
*Dimension including the plating thickness
Base material dimension
Mass (reference value)
5
HD74HCT241
Unit: mm
12.8
13.2 Max
11
10
20
1
+ 0.25
– 0.40
10.40
0.935 Max
1.45
0° – 8°
+ 0.57
– 0.30
1.27
0.70
*0.42 ± 0.08
0.40 ± 0.06
0.15
M
0.12
Hitachi Code
JEDEC
EIAJ
FP-20DB
Conforms
—
*Dimension including the plating thickness
Base material dimension
Mass (reference value)
0.52 g
Unit: mm
6.50
6.80 Max
20
11
1
10
0.65
1.0
+0.08
*0.22
0.20 ± 0.06
–0.07
0.13
M
6.40 ± 0.20
0.65 Max
0° – 8°
0.50 ± 0.10
0.10
Hitachi Code
JEDEC
TTP-20DA
—
EIAJ
—
0.07 g
*Dimension including the plating thickness
Base material dimension
Mass (reference value)
6
HD74HCT241
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
Asia
: http://semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
: http://sicapac.hitachi-asia.com
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive, Dornacher Straβe 3
Hitachi Europe GmbH
Electronic Components Group
Hitachi Asia Ltd.
Hitachi Tower
16 Collyer Quay #20-00,
Singapore 049318
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower,
San Jose,CA 95134
D-85622 Feldkirchen, Munich
World Finance Centre,
Tel: <1> (408) 433-1990 Germany
Fax: <1>(408) 433-0223 Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Tel : <65>-538-6533/538-8577
Fax : <65>-538-6933/538-3877
URL : http://www.hitachi.com.sg
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon,
Hong Kong
Tel : <852>-(2)-735-9218
Fax : <852>-(2)-730-0281
URL : http://www.hitachi.com.hk
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road,
Hung-Kuo Building,
Taipei (105), Taiwan
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 585160
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Colophon 2.0
7
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