DS1305Z [ETC]
Serial Alarm Real-Time Clock(287.74 k) ; 闹钟的串行实时时钟（ 287.74 K）\n
| 型号： | DS1305Z |
| 厂家： | 
ETC |
| 描述： | Serial Alarm Real-Time Clock(287.74 k)
|
| 文件： | 总22页 (文件大小：288K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS1305
Serial Alarm Real-Time Clock
www.maxim-ic.com
FEATURES
C Real-time clock (RTC) counts seconds,
minutes, hours, date of the month, month,
day of the week, and year with leap-year
compensation valid up to 2100
C 96-byte, battery-backed, nonvolatile (NV)
RAM for data storage
PIN ASSIGNMENT
VCC2
VBAT
X1
NC
X2
NC
INT0
NC
INT1
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC1
NC
PF
VCCIF
SD0
SDI
SCLK
NC
C Two time-of-day alarms—programmable on
combination of seconds, minutes, hours, and
day of the week
C Serial interface supports Motorola Serial
Peripheral Interface (SPI) serial data ports or
standard 3-wire interface
CE
SERMODE
C Burst mode for reading/writing successive
addresses in clock/RAM
DS1305 20-Pin TSSOP (173-mil)
C Dual-power supply pins for primary and
backup power supplies
C Optional trickle charge output to backup
supply
VCC2
VBAT
X1
X2
NC
INT0
INT1
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCC1
PF
C 2.0V to 5.5V operation
VCCIF
SDO
SDI
SCLK
CE
C Optional industrial temperature range:
-ꢀꢁLC to +85LC
C Available in space-efficient, 20-pin TSSOP
package
C Underwriters Laboratory (UL) recognized
SERMODE
ORDERING INFORMATION
DS1305 16-Pin DIP (300-mil)
DS1305
16-Pin DIP (300-mil)
DS1305N
DS1305E
DS1305EN
16-Pin DIP (Industrial)
20-Pin TSSOP (173-mil)
20-Pin TSSOP (Industrial)
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092801
DS1305
PIN DESCRIPTION
VCC1
- Primary Power Supply
VCC2
- Backup Power Supply
- +3V Battery Input
VBAT
VCCIF
GND
X1, X2
- Interface Logic Power Supply Input
- Ground
- 32,768kHz Crystal Connection
INT0
- Interrupt 0 Output
INT1
SDI
- Interrupt 1 Output
- Serial Data In
- Serial Data Out
- Chip Enable
SDO
CE
SCLK
- Serial Clock
SERMODE - Serial Interface Mode
PF
- Power-Fail Output
DESCRIPTION
The DS1305 Serial Alarm Real-Time Clock provides a full binary-coded decimal (BCD) clock calendar
that is accessed via a simple serial interface. The clock/calendar provides seconds, minutes, hours, day,
date, month, and year information. The end of the month date is automatically adjusted for months with
fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-
hour format with AM/PM indicator. In addition, 96 bytes of nonvolatile RAM are provided for data
storage.
An interface logic power supply input pin (VCCIF) allows the DS1305 to drive SDO and PF pins to a level
that is compatible with the interface logic. This allows an easy interface to 3V logic in mixed supply
systems.
The DS1305 offers dual-power supplies as well as a battery input pin. The dual power supplies support a
programmable trickle charge circuit that allows a rechargeable energy source (such as a super cap or
rechargeable battery) to be used for a backup supply. The VBAT pin allows the device to be backed up by
a non-rechargeable battery. The DS1305 is fully operational from 2.0V to 5.5V.
Two programmable time-of-day alarms are provided by the DS1305. Each alarm can generate an
interrupt on a programmable combination of seconds, minutes, hours, and day. “Don’t care” states can be
inserted into one or more fields if it is desired for them to be ignored for the alarm condition. The time-of-
day alarms can be programmed to assert two different interrupt outputs or to assert one common interrupt
output. Both interrupt outputs operate when the device is powered by VCC1, VCC2, or VBAT
.
The DS1305 supports a direct interface to Motorola SPI serial data ports or standard 3-wire interface. A
straightforward address and data format is implemented in which data transfers can occur 1 byte at a time
or in multiple-byte burst mode.
OPERATION
The block diagram in Figure 1 shows the main elements of the serial alarm RTC. The following
paragraphs describe the function of each pin.
2 of 22
DS1305
DS1305 BLOCK DIAGRAM Figure 1
SIGNAL DESCRIPTIONS
VCC1 – DC power is provided to the device on this pin. VCC1 is the primary power supply.
VCC2 – This is the secondary power supply pin. In systems using the trickle charger, the rechargeable
energy source is connected to this pin.
VBAT – Battery input for any standard 3V lithium cell or other energy source. UL recognized to ensure
against reverse charging current when used in conjunction with a lithium battery.
See “Conditions of Acceptability” at http://www.maxim-ic.com/TechSupport/QA/ntrl.htm.
VCCIF (Interface Logic Power Supply Input) – The VCCIF pin allows the DS1305 to drive SDO and PF
output pins to a level that is compatible with the interface logic, thus allowing an easy interface to 3V
logic in mixed supply systems. This pin is physically connected to the source connection of the p-channel
transistors in the output buffers of the SDO and PF pins.
SERMODE (Serial Interface Mode Input) – The SERMODE pin offers the flexibility to choose
between two serial interface modes. When connected to GND, standard 3-wire communication is
selected. When connected to VCC, Motorola SPI communication is selected.
SCLK (Serial Clock Input) – SCLK is used to synchronize data movement on the serial interface for
either the SPI or 3-wire interface.
SDI (Serial Data Input) – When SPI communication is selected, the SDI pin is the serial data input for
the SPI bus. When 3-wire communication is selected, this pin must be tied to the SDO pin (the SDI and
SDO pins function as a single I/O pin when tied together).
3 of 22
DS1305
SDO (Serial Data Output) – When SPI communication is selected, the SDO pin is the serial data output
for the SPI bus. When 3-wire communication is selected, this pin must be tied to the SDI pin (the SDI and
SDO pins function as a single I/O pin when tied together).
CE (Chip Enable) – The chip enable signal must be asserted high during a read or a write for both 3-
wire and SPI communication. This pin has an internal 55k pull-down resistor (typical).
INT0 (Interrupt 0 Output) – The INT0 pin is an active low output of the DS1305 that can be used as an
interrupt input to a processor. The INT0 pin can be programmed to be asserted by only Alarm 0 or can be
programmed to be asserted by either Alarm 0 or Alarm 1. The INT0 pin remains low as long as the status
bit causing the interrupt is present and the corresponding interrupt enable bit is set. The INT0 pin operates
when the DS1305 is powered by VCC1, VCC2, or VBAT. The INT0 pin is an open drain output and requires
an external pull-up resistor.
INT1 (Interrupt 1 Output) – The INT1pin is an active low output of the DS1305 that can be used as an
interrupt input to a processor. The INT1 pin can be programmed to be asserted by Alarm 1 only. The
INT1 pin remains low as long as the status bit causing the interrupt is present and the corresponding
interrupt enable bit is set. The INT1 pin operates when the DS1305 is powered by VCC1, VCC2, or VBAT
.
The INT1 pin is an open drain output and requires an external pull-up resistor.
Both INT0 and INT1are open drain outputs. The two interrupts and the internal clock continue to run
regardless of the level of VCC (as long as a power source is present).
PF (Power Fail Output) – The PF pin is used to indicate loss of the primary power supply (VCC1). When
VCC1 is less than VCC2 or is less than VBAT , the PF pin will be driven low.
X1, X2 – Connections for a standard 32.768kHz quartz crystal. The internal oscillator is designed for
operation with a crystal having a specified load capacitance of 6pF. For more information on crystal
selection and crystal layout considerations, please consult Application Note 58, “Crystal Considerations
with Dallas Real-Time Clocks.” The DS1305 can also be driven by an external 32.768kHz oscillator. In
this configuration, the X1 pin is connected to the external oscillator signal and the X2 pin is floated.
RECOMMENDED LAYOUT FOR CRYSTAL
4 of 22
DS1305
CLOCK ACCURACY
The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match
between the capacitive load of the oscillator circuit and the capacitive load for which the crystal was
trimmed. Additional error will be added by crystal frequency drift caused by temperature shifts. External
circuit noise coupled into the oscillator circuit may result in the clock running fast. See Application Note
58, “Crystal Considerations with Dallas Real-Time Clocks” for detailed information.
CLOCK, CALENDAR, AND ALARM
The time and calendar information is obtained by reading the appropriate register bytes. The RTC
registers and user RAM are illustrated in Figure 2. The time, calendar, and alarm are set or initialized by
writing the appropriate register bytes. Note that some bits are set to zero. These bits will always read 0
regardless of how they are written. Also note that registers 12h to 1Fh (read) and registers 92h to 9Fh are
reserved. These registers will always read 0 regardless of how they are written. The contents of the time,
calendar, and alarm registers are in the BCD format.
Except where otherwise noted, the initial power on state of all registers is not defined. Therefore, it is
important to enable the oscillator (EOSC = 0) and disable write protect (WP = 0) during initial
configuration.
RTC REGISTERS AND ADDRESS MAP Figure 2
HEX ADDRESS
Bit7 Bit6
Bit5
Bit4
Bit3 Bit2 Bit1 Bit0
RANGE
READ WRITE
00H
01H
02H
80H
81H
82H
0
0
10 SEC
SEC
MIN
00-99
00-59
10 MIN
0
12
P
A
10 HR
0
HOURS
01-12 + P/A
00-23
24
0
10
0
03H
04H
05H
06H
83H
84H
85H
86H
0
0
0
DAY
DATE
1-7
0
10 DATE
1-31
0
10 MONTH
MONTH
YEAR
01-12
00-99
10 YEAR
Alarm 0
07H
08H
09H
87H
88H
89H
M
M
M
10 SEC ALARM
SEC ALARM
MIN ALARM
00-59
00-59
10 MIN ALARM
12
P
A
10 HR
HOUR ALARM
01-12 + P/A
24
0
10
0
00-23
01-07
0AH
8AH
M
0
DAY ALARM
Alarm 1
0BH
0CH
0DH
8BH
8CH
8DH
M
M
M
10 SEC ALARM
SEC ALARM
MIN ALARM
00-59
00-59
10 MIN ALARM
12
P
A
10 HR
HOUR ALARM
01-12 + P/A
24
0
10
0
00-23
01-07
0EH
0FH
10H
11H
8EH
8FH
90H
91H
M
0
DAY ALARM
CONTROL REGISTER
STATUS REGISTER
TRICKLE CHARGER REGISTER
RESERVED
12-1FH 92-9FH
20-7FH A0-FFH
96 BYTES USER RAM
00-FF
NOTE:
1. Range for alarm registers does not include mask’m’ bits.
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DS1305
The DS1305 can be run in either 12-hour or 24-hour mode. Bit 6 of the hours register is defined as the
12- or 24-hour mode select bit. When high, the 12-hour mode is selected. In the 12-hour mode, bit 5 is the
AM/PM bit with logic high being PM. In the 24-hour mode, bit 5 is the second 10-hour bit (20–23 hours).
The DS1305 contains two time-of-day alarms. Time-of-day alarm 0 can be set by writing to registers 87h
to 8Ah. Time-of-day alarm 1 can be set by writing to registers 8Bh to 8Eh. The alarms can be
programmed (by the INTCN bit of the control register) to operate in two different modes; each alarm can
drive its own separate interrupt output or both alarms can drive a common interrupt output. Bit 7 of each
of the time-of-day alarm registers are mask bits (Table 1). When all of the mask bits are logic 0, a time-
of-day alarm will only occur once per week when the values stored in timekeeping registers 00h to 03h
match the values stored in the time-of-day alarm registers. An alarm will be generated every day when bit
7 of the day alarm register is set to a logic 1. An alarm will be generated every hour when bit 7 of the day
and hour alarm registers is set to a logic 1. Similarly, an alarm will be generated every minute when bit 7
of the day, hour, and minute alarm registers is set to a logic 1. When bit 7 of the day, hour, minute, and
seconds alarm registers is set to a logic 1, alarm will occur every second.
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DS1305
TIME-OF-DAY ALARM MASK BITS Table 1
ALARM REGISTER MASK BITS (BIT 7)
SECONDS MINUTES
HOURS
DAYS
1
0
0
0
0
1
1
0
0
0
1
1
1
0
0
1
1
1
1
0
Alarm once per second
Alarm when seconds match
Alarm when minutes and seconds match
Alarm hours, minutes and seconds match
Alarm day, hours, minutes and seconds match
SPECIAL PURPOSE REGISTERS
The DS1305 has three additional registers (control register, status register, and trickle charger register)
that control the real-time clock, interrupts, and trickle charger.
CONTROL REGISTER (READ 0FH, WRITE 8FH)
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
EOSC
WP
0
0
0
INTCN
AIE1
AIEO
EOSC (Enable Oscillator) – This bit when set to logic 0 will start the oscillator. When this bit is set to a
logic 1, the oscillator is stopped and the DS1305 is placed into a low-power standby mode with a current
drain of less than 100 nanoamps when power is supplied by VBAT or VCC2. The initial power on state is
not defined.
WP (Write Protect) – Before any write operation to the clock or RAM, this bit must be logic 0. When
high, the write protect bit prevents a write operation to any register, including bits 0, 1, 2, and 7 of the
control register. Upon initial power-up, the state of the WP bit is undefined. Therefore, the WP bit
should be cleared before attempting to write to the device.
INTCN (Interrupt Control) – This bit controls the relationship between the two time-of-day alarms and
the interrupt output pins. When the INTCN bit is set to a logic 1, a match between the timekeeping
registers and the alarm 0 registers will activate the INT0 pin (provided that the alarm is enabled) and a
match between the timekeeping registers and the alarm 1 registers will activate the INT1 pin (provided
that the alarm is enabled). When the INTCN bit is set to a logic 0, a match between the timekeeping
registers and either alarm 0 or alarm 1 will activate the INT0 pin (provided that the alarms are enabled).
INT1 has no function when INTCN is set to a logic 0.
AIE0 (Alarm Interrupt Enable 0) – When set to a logic 1, this bit permits the interrupt 0 request flag
(IRQF0) bit in the status register to assert INT0 . When the AIE0 bit is set to logic 0, the IRQF0 bit does
not initiate the INT0 signal.
AIE1 (Alarm Interrupt Enable 1) – When set to a logic 1, this bit permits the interrupt 1 request flag
(IRQF1) bit in the status register to assert INT1 (when INTCN = 1) or to assert INT0 (when INTCN = 0).
When the AIE1 bit is set to logic 0, the IRQF1 bit does not initiate an interrupt signal.
STATUS REGISTER (READ 10H)
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
0
0
0
0
0
0
IRQF1
IRQF0
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DS1305
IRQF0 (Interrupt 0 Request Flag) – A logic 1 in the interrupt request flag bit indicates that the current
time has matched the alarm 0 registers. If the AIE0 bit is also a logic 1, the INT0 pin will go low. IRQF0
is cleared when the address pointer goes to any of the alarm 0 registers during a read or write.
IRQF1 (Interrupt 1 Request Flag) – A logic 1 in the interrupt request flag bit indicates that the current
time has matched the alarm 1 registers. This flag can be used to generate an interrupt on either INT0 or
INT1 depending on the status of the INTCN bit in the control Register. If the INTCN bit is set to a logic 1
and IRQF1 is at a logic 1 (and AIE1 bit is also a logic 1), the INT1 pin will go low. If the INTCN bit is
set to a logic 0 and IRQF1 is at a logic 1 (and AIE1 bit is also a logic 1), the INT0 pin will go low. IRQF1
is cleared when the address pointer goes to any of the alarm 1 registers during a read or write.
TRICKLE CHARGE REGISTER (READ 11H, WRITE 91H)
This register controls the trickle charge characteristics of the DS1305. The simplified schematic of Figure
3 shows the basic components of the trickle charger. The trickle charge select (TCS) bits (bits 4-7)
control the selection of the trickle charger. In order to prevent accidental enabling, only a pattern of 1010
will enable the trickle charger. All other patterns will disable the trickle charger. On the initial application
of power, the DS1305 powers up with the trickle charger disabled. The diode select (DS) bits (bits 2-3)
select whether one diode or two diodes are connected between VCC1 and VCC2. The resistor select (RS)
bits select the resistor that is connected between VCC1 and VCC2. The resistor and diodes are selected by
the RS and DS bits as shown in Table 2.
PROGRAMMABLE TRICKLE CHARGER Figure 3
8 of 22
DS1305
TRICKLE CHARGER RESISTOR & DIODE SELECT Table 2
TCS
Bit 7
TCS
Bit 6
TCS
Bit 5
TCS
Bit 4
DS
DS
RS
RS
FUNCTION
Bit 3 Bit 2 Bit 1 Bit 0
X
X
X
X
X
X
X
X
X
0
X
0
0
0
Disabled
Disabled
X
X
X
1
1
1
1
1
1
X
0
0
0
0
0
0
X
1
1
1
1
1
1
X
0
0
0
0
0
0
1
0
0
0
1
1
1
1
1
1
1
0
0
0
X
0
1
1
0
1
1
X
1
0
1
1
0
1
Disabled
1 Diode, 2kΩ
1 Diode, 4kΩ
1 Diode, 8kΩ
2 Diodes, 2kΩ
2 Diodes, 4kΩ
2 Diodes, 8kΩ
Diode and resistor selection is determined by the user according to the maximum current desired for
battery or super cap charging. The maximum charging current can be calculated as illustrated in the
following example. Assume that a system power supply of 5V is applied to VCC1 and a super cap is
connected to VCC2 . Also assume that the trickle charger has been enabled with 1 diode and resister R1
between VCC1 and VCC2. The maximum current IMAX would,therefore,be calculated as follows:
IMAX = (5.0V - diode drop) / R1 W (5.0V - 0.7V) / 2kꢂꢃꢃW 2.2mA
As the super cap charges, the voltage drop between VCC1 and VCC2 will decrease and, therefore, the
charge current will decrease.
POWER CONTROL
Power is provided through the VCC1, VCC2, and VBAT pins. Three different power supply configurations
are illustrated in Figure 4. Configuration 1 shows the DS1305 being backed up by a non-rechargeable
energy source such as a lithium battery. In this configuration, the system power supply is connected to
VCC1 and VCC2 is grounded. The DS1305 will be write protected if VCC1 is less than VBAT. The DS1305
will be fully accessible when VCC1 is greater than VBAT + 0.2V.
Configuration 2 illustrates the DS1305 being backed up by a rechargeable energy source. In this case, the
VBAT pin is grounded, VCC1 is connected to the primary power supply, and VCC2 is connected to the
secondary supply (the rechargeable energy source). The DS1305 will operate from the larger of VCC1 or
V
CC2. When VCC1 is greater than VCC2 + 0.2V (typical), VCC1 will power the DS1305. When VCC1 is less
than VCC2, VCC2 will power the DS1305. The DS1305 does not write protect itself in this configuration.
Configuration 3 shows the DS1305 in battery operate mode where the device is powered only by a single
battery. In this case, the VCC1 and VBAT pins are grounded and the battery is connected to the VCC2 pin.
Only these three configurations are allowed. Unused supply pins must be grounded.
A typical operating circuit is shown on page 11.
9 of 22
DS1305
POWER SUPPLY CONFIGURATIONS FOR THE DS1305 Figure 4
Configuration 1: Backup Supply is a Nonrechargeable Lithium Battery
VCCTP
Configuration 2: Backup Supply is a Rechargeable Battery or Super Capacitor
Configuration 3: Battery Operate Mode
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DS1305
TYPICAL OPERATING CIRCUIT
SERIAL INTERFACE
The DS1305 offers the flexibility to choose between two serial interface modes. The DS1305 can
communicate with the SPI interface or with a standard 3-wire interface. The interface method used is
determined by the SERMODE pin. When this pin is connected to VCC, SPI communication is selected.
When this pin is connected to ground, standard 3-wire communication is selected.
SERIAL PERIPHERAL INTERFACE (SPI)
The serial peripheral interface (SPI) is a synchronous bus for address and data transfer, and is used when
interfacing with the SPI bus on specific Motorola microcontrollers such as the 68HC05C4 and the
68HC11A8. The SPI mode of serial communication is selected by tying the SERMODE pin to VCC. Four
pins are used for the SPI. The four pins are the SDO (Serial Data Out), SDI (Serial Data In), CE (Chip
Enable), and SCLK (Serial Clock). The DS1305 is the slave device in an SPI application, with the
microcontroller being the master.
The SDI and SDO pins are the serial data input and output pins for the DS1305, respectively. The CE
input is used to initiate and terminate a data transfer. The SCLK pin is used to synchronize data
movement between the master (microcontroller) and the slave (DS1305) devices.
The shift clock (SCLK), which is generated by the microcontroller, is active only during address and data
transfer to any device on the SPI bus. The inactive clock polarity is programmable in some
microcontrollers. The DS1305 determines the clock polarity by sampling SCLK when CE becomes
active. Therefore, either SCLK polarity can be accommodated. Input data (SDI) is latched on the internal
strobe edge and output data (SDO) is shifted out on the shift edge (See Figure 5). There is one clock for
each bit transferred. Address and data bits are transferred in groups of eight.
11 of 22
DS1305
SERIAL CLOCK AS A FUNCTION OF MICROCONTROLLER CLOCK
POLARITY (CPOL) Figure 5
CE
CPOL = 1
SCLK
Shift data out (read)
Data latch (write)
Data latch (write)
CPOL = 0
SCLK
Shift data out (read)
CPHA bit polarity (if applicable) may need to be set accordingly.
CPOL is a bit that is set in the microcontroller’s Control Register.
SDO remains at High Z until 8 bits of data are ready to be shifted out during a read.
ADDRESS AND DATA BYTES
Address and data bytes are shifted MSB first into the serial data input (SDI) and out of the serial data
output (SDO). Any transfer requires the address of the byte to specify a write or read to either a RTC or
RAM location, followed by one or more bytes of data. Data is transferred out of the SDO for a read
operation and into the SDI for a write operation (see Figure 6 and 7).
SPI SINGLE-BYTE WRITE Figure 6
SPI SINGLE-BYTE READ Figure 7
*SCLK can be either polarity.
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DS1305
The address byte is always the first byte entered after CE is driven high. The most significant bit (A7) of
this byte determines if a read or write will take place. If A7 is 0, one or more read cycles will occur. If A7
is 1, one or more write cycles will occur.
Data transfers can occur 1 byte at a time or in multiple-byte burst mode. After CE is driven high an
address is written to the DS1305. After the address, one or more data bytes can be written or read. For a
single-byte transfer 1 byte is read or written and then CE is driven low. For a multiple-byte transfer,
however, multiple bytes can be read or written to the DS1305 after the address has been written. Each
read or write cycle causes the RTC register or RAM address to automatically increment. Incrementing
continues until the device is disabled. When the RTC is selected, the address wraps to 00h after
incrementing to 1Fh (during a read) and wraps to 80h after incrementing to 9Fh (during a write). When
the RAM is selected, the address wraps to 20h after incrementing to 7Fh (during a read) and wraps to
A0h after incrementing to FFh (during a write).
SPI MULTIPLE-BYTE BURST TRANSFER Figure 8
3-WIRE INTERFACE
The 3-wire interface mode operates similarly to the SPI mode. However, in 3-wire mode there is one I/O
instead of separate data in and data out signals. The 3-wire interface consists of the I/O (SDI and SDO
pins tied together), CE, and SCLK pins. In 3-wire mode, each byte is shifted in LSB first unlike SPI mode
where each byte is shifted in MSB first.
As is the case with the SPI mode, an address byte is written to the device followed by a single data byte
or multiple data bytes. Figure 9 illustrates a read and write cycle. In 3-wire mode, data is input on the
rising edge of SCLK and output on the falling edge of SCLK.
13 of 22
DS1305
3-WIRE SINGLE-BYTE TRANSFER Figure 9
SINGLE BYTE READ
RST
SCLK
I/O*
SINGLE BYTE WRITE
RST
SCLK
I/O*
In burst mode, RST is kept high and additional SCLK cycles are sent until the end of the burst.
*I/O is SDI and SDO tied together.
14 of 22
DS1305
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground
Storage Temperature
-0.5V to +7.0V
-55°C to +125°C
260°C for 10 seconds
Soldering Temperature
* This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect reliability.
Range
Commercial
Industrial
Temperature
0°C to +70°C
-40°C to +85°C
VCC
2.0V to 5.5V VCC1 or VCC2
2.0V to 5.5V VCC1 or VCC2
RECOMMENDED DC OPERATING CONDITIONS
Over the operating range*
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
VCC1
,
Supply Voltage
VCC1, VCC2
Logic 1 Input
Logic 0 Input
2.0
5.5
V
7
VCC2
VIH
2.0
-0.3
-0.3
2.0
VCC + 0.3
+0.3
V
V
VIL
VCC = 2.0V
VCC = 5V
+0.8
5.5
5.5
VBAT Battery Voltage
VCCIF Supply Voltage
VBAT
VCCIF
V
V
2.0
11
*Unless otherwise specified.
15 of 22
DS1305
DC ELECTRICAL CHARACTERISTICS
Over the operating range*
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS NOTES
Input Leakage
Output Leakage
Logic 0 Output IOL= 1.5mA
ILI
ILO
VOL
-100
-1
+500
1
0.4
0.4
µA
µA
V
VCC = 2.0V
IOL = 4.0mA
VCC = 5V
VCCIF = 2.0V
VCCIF = 5V
VCC1 = 2.0V
VCC1 = 5V
VCC1 = 2.0V
VCC1 = 5V
VCC1 = 2.0V
VCC1 = 5V
VCC2 = 2.0V
VCC2 = 5V
VCC2 = 2.0V
VCC2 = 5V
VCC2 = 2.0V
VCC2 = 5V
VBAT = 3V
VBAT = 3V
Logic 1 Output IOH = -0.4mA
VOH
ICC1A
ICC1T
ICC1S
ICC2A
ICC2T
ICC2S
1.6
2.4
V
IOH = -1.0mA
VCC1 Active Supply Current
0.425
1.28
25.3
81
25
80
0.4
1.2
0.3
1
mA
µA
µA
mA
µA
µA
2,8
1,8
6,8
2,9
1,9
6,9
VCC1 Timekeeping Current
(Osc on)
VCC1 Standby Current
(Osc off)
VCC2 Active Supply Current
VCC2 Timekeeping Current
(Osc on)
VCC2 Standby Current
(Osc off)
200
200
400
200
Battery Timekeeping Current
Battery Standby Current
VCC Trip Point
IBAT
IBATS
VCCTP
nA
nA
mV
10
10
VBAT - 50
VBAT
+
200
Trickle Charge Resistors
R1
R2
R3
2
4
8
kꢀ
kꢀ
kꢀ
Trickle Charge Diode
Voltage Drop
*Unless otherwise specified.
VTD
0.7
V
CAPACITANCE
(TA = 25LC)
PARAMETER
SYMBOL CONDITION TYP
MAX
UNITS
NOTES
Input Capacitance
Output Capacitance
Crystal Capacitance
CI
CO
CX
10
15
6
pF
pF
pF
16 of 22
DS1305
3-WIRE AC ELECTRICAL CHARACTERISTICS
Over the operating range*
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS NOTES
Data to CLK Setup
tDC
tCDH
tCDD
tCL
VCC = 2.0V
200
50
280
70
ns
ns
3,4
3,4
3,4,5
4
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
CLK to Data Hold
CLK to Data Delay
CLK Low Time
800
200
ns
1000
250
1000
250
ns
CLK High Time
tCH
ns
4
CLK Frequency
tCLK
tR, tF
tCC
0.6
2.0
2000
500
MHz
ns
4
DC
CLK Rise and Fall
CE to CLK Setup
4
1
240
60
4
µs
4
4
CLK to CE Hold
tCCH
tCWH
tCDZ
tCCZ
ns
CE Inactive Time
µs
4
1
CE to Output High Z
SCLK to Output High Z
*Unless otherwise specified.
280
70
280
70
ns
3,4
3,4
ns
TIMING DIAGRAM: 3-WIRE READ DATA TRANSFER Figure 10
17 of 22
DS1305
TIMING DIAGRAM: 3-WIRE WRITE DATA TRANSFER Figure 11
SPI AC ELECTRICAL CHARACTERISTICS
Over the operating range*
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS NOTES
Data to CLK Setup
tDC
tCDH
tCDD
tCL
VCC = 2.0V
200
50
280
70
ns
ns
5,6
5,6
5,6,7
6
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
VCC = 2.0V
VCC = 5V
CLK to Data Hold
CLK to Data Delay
CLK Low Time
800
200
ns
1000
250
1000
250
ns
CLK High Time
tCH
ns
6
CLK Frequency
tCLK
tR, tF
tCC
0.6
2.0
2000
500
MHz
ns
6
DC
CLK Rise and Fall
CE to CLK Setup
CLK to CE Hold
4
1
240
60
4
µs
6
6
tCCH
tCWH
tCDZ
ns
CE Inactive Time
CE to Output High Z
*Unless otherwise specified.
µs
6
1
280
70
ns
5,6
18 of 22
DS1305
TIMING DIAGRAM: SPI READ DATA TRANSFER Figure 12
TIMING DIAGRAM: SPI WRITE DATA TRANSFER Figure 13
19 of 22
DS1305
NOTES:
1. ICC1T and ICC2T are specified with CE set to a logic 0 and EOSC bit = 0 (oscillator enabled).
2. ICC1A and ICC2A are specified with CE=VCC, SCLK=2MHz at VCC = 5V; SCLK = 500kHz
at VCC = 2.0V, VIL = 0V, VIH = VCC, and EOSC bit = 0 (oscillator enabled).
3. Measured at VIH = 2.0V or VIL = 0.8V and 10ms maximum rise and fall time.
4. Measured with 50pF load.
5. Measured at VOH = 2.4V or VOL = 0.4V.
6. ICC1S and ICC2S are specified with CE set to a logic 0. The EOSC bit must be set to logic 1 (oscillator
disabled).
7. VCC = VCC1 , when VCC1 > VCC2 + 0.2V (typical); VCC = VCC2, when VCC2 > VCC1
.
8. VCC2 = 0V.
9. VCC1 = 0V.
10. VCC1 < VBAT.
11. VCCIF must be less than or equal to the largest of VCC1, VCC2, and VBAT
.
20 of 22
DS1305
DS1305 16-PIN DIP (300-MIL)
PKG
DIM
A IN
MM
B IN
MM
C IN
MM
D IN
MM
E IN
MM
F IN
MM
G IN
MM
H IN
MM
J IN
MM
K IN
MM
16-PIN
MIN
0.740
18.80
0.240
6.10
MAX
0.780
19.81
0.260
6.60
0.120
3.05
0.140
3.56
0.300
7.62
0.325
8.26
0.015
0.38
0.040
1.02
0.120
3.05
0.140
3.56
0.090
2.29
0.110
2.79
0.320
8.13
0.370
9.40
0.008
0.20
0.012
0.30
0.015
0.38
0.021
0.53
21 of 22
DS1305
DS1305 20-PIN TSSOP
DIM
A MM
A1 MM
A2 MM
C MM
L MM
e1 MM
B MM
D MM
E MM
G MM
H MM
phi
MIN
-
MAX
1.10
-
0.05
0.75
0.09
0.50
1.05
0.18
0.70
0.65 BSC
0.18
6.40
0.30
6.90
4.40 NOM
0.25 REF
6.25
0°
6.55
8°
22 of 22
相关型号：
DS1306E+T&R
Real Time Clock, Volatile, 0 Timer(s), CMOS, PDSO20, 0.173 INCH, ROHS COMPLIANT, TSSOP-20
MAXIM
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