CS52015-3/D [ETC]
1.5A, 3.3V Fixed Linear Regulator ; 1.5A , 3.3V固定线性稳压器\n型号: | CS52015-3/D |
厂家: | ETC |
描述: | 1.5A, 3.3V Fixed Linear Regulator
|
文件: | 总8页 (文件大小:71K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CS52015-3
1.5 A, 3.3 V Fixed Linear
Regulator
The CS52015–3 linear regulator provides 1.5 A @ 3.3 V reference
at 1.0 A with an output voltage accuracy of ±1.5 %.
The regulator is intended for use as a post regulator and
microprocessor supply. The fast loop response and low dropout
voltage make this regulator ideal for applications where low voltage
operation and good transient response are important.
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The circuit is designed to operate with dropout voltages less than 1.4 V
at 1.5 A output current. The maximum quiescent current is only 10 mA
at full load. Device protection includes over–current and thermal
shutdown.
TO–220
THREE LEAD
T SUFFIX
The CS52015–3 is pin compatible with the LT1086 family of linear
regulators but has lower dropout voltage.
CASE 221A
2
The regulator is available in TO–220, surface mount D , and
1
2
Tab = V
SOT–223 packages.
OUT
3
Pin 1. GND
2
2. V
D PAK
OUT
Features
• Output Current to 1.5 A
• Output Accuracy to ±1.5% Over Temperature
• Dropout Voltage (typical) 1.05 V @ 1.5 A
• Fast Transient Response
• Fault Protection
3. V
3–PIN
DP SUFFIX
CASE 418E
IN
1
2
3
SOT–223
ST SUFFIX
CASE 318E
1
2
3
– Current Limit
– Thermal Shutdown
ORDERING INFORMATION*†
Device
Package
Shipping
V
IN
V
OUT
3.3 V @ 1.5 A
CS52015–3GT3
50 Units/Rail
50 Units/Rail
TO–220‡
CS52015–3
2
CS52015–3GDP3
CS52015–3GDPR3
CS52015–3GST3
CS52015–3GSTR3
D PAK‡
GND
2
750 Tape & Reel
80 Units/Rail
10 µF
5.0 V
22 µF
5.0 V
D PAK‡
SOT–223‡
SOT–223‡
2500 Tape & Reel
*Additional ordering information can be found on page
6 of this data sheet.
Figure 1. Applications Diagram
†Consult your local sales representative for other
fixed output voltage versions.
2
‡TO–220 are all 3–pin, straight leaded. D PAK and
SOT–223 are all 3–pin.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 6 of this data sheet.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
March, 2001 – Rev. 4
CS52015–3/D
CS52015–3
ABSOLUTE MAXIMUM RATINGS*
Parameter
Value
7.0
Unit
V
Supply Voltage, V
IN
Operating Temperature Range
Junction Temperature
–40 to +70
150
°C
°C
°C
Storage Temperature Range
Lead Temperature Soldering:
–60 to +150
Wave Solder (through hole styles only) Note 1.
Reflow (SMD styles only) Note 2.
260 Peak
230 Peak
°C
°C
ESD Damage Threshold
2.0
kV
1. 10 second maximum.
2. 60 second maximum above 183°C
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (C = 10 µF, C
= 22 µF Tantalum, V
+ V
< V < 7.0 V, 0°C ≤ T ≤ 70°C,
IN
OUT
OUT
DROPOUT
IN
A
T ≤ +150°C, unless otherwise specified, I
= 1.5 A)
J
full load
Characteristic
Fixed Output Voltage
Test Conditions
Min
Typ
Max
Unit
Output Voltage (Notes 3. and 4.)
V
IN
– V
= 1.5 V;
3.250
3.300
3.350
V
OUT
0 ≤ I
≤ 1.5 A
(–1.5%)
(+1.5%)
OUT
Line Regulation
2.0 V ≤ V – V
≤ 3.7 V; I = 10 mA
OUT
–
–
0.02
0.04
1.05
3.1
0.20
0.4
1.4
–
%
%
IN
OUT
Load Regulation (Notes 3. and 4.)
Dropout Voltage (Note 5.)
Current Limit
V
IN
– V
= 2.0 V; 10 mA ≤ I
≤ 1.5 A
OUT
OUT
I
= 1.5 A
–
V
OUT
V
IN
– V
= 3.0 V
1.6
–
A
OUT
Quiescent Current
I
= 10 mA
5.0
10
mA
%/W
dB
OUT
Thermal Regulation (Note 6.)
Ripple Rejection (Note 6.)
30 ms Pulse, T = 25°C
–
0.002
80
0.020
–
A
f = 120 Hz; I
= 1.5 A; V – V = 3.0 V;
OUT
–
OUT
IN
V
= 1.0 V
PP
RIPPLE
Thermal Shutdown (Note 7.)
–
–
150
–
180
25
210
–
°C
°C
Thermal Shutdown Hysteresis (Note 7.)
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
voltage due to temperature changes must be taken into account seperately.
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differential at full load.
6. Guaranteed by design, not 100% tested in production.
7. Thermal shutdown is 100% functionally tested in production.
PACKAGE PIN DESCRIPTION
Package Pin Number
2
TO–220
D PAK
SOT–223
Pin Symbol
Function
1
2
3
1
2
3
1
2
3
GND
Ground connection.
V
OUT
Regulated output voltage (case).
Input voltage.
V
IN
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2
CS52015–3
V
OUT
V
IN
Output
Current
Limit
Thermal
Shutdown
–
+
Error
Amplifier
Bandgap
GND
Figure 2. Block Diagram
TYPICAL PERFORMANCE CHARACTERISTICS
0.10
0.08
0.06
0.04
1.05
1.00
0.95
0.90
0.85
0.80
0.75
T
= 0°C
CASE
0.02
0.00
T
= 25°C
CASE
–0.02
–0.04
–0.06
–0.08
–0.10
–0.12
T
= 125°C
CASE
0
300
600
900
(mA)
1200
1500
0
10 20 30 40 50 60 70 80 90 100 110 120 130
I
T (°C)
J
OUT
Figure 3. Dropout Voltage vs. Output
Current
Figure 4. Output Voltage vs. Temperature
85
75
65
55
45
35
25
15
3.5
3.3
3.1
2.9
2.7
2.5
2.3
2.1
1.9
T
= 25°C
= 1.5 A
CASE
I
OUT
(V – V
V
) = 3.0 V
OUT
IN
= 1.0 V
PP
RIPPLE
1.7
1.5
1
2
3
4
5
6
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
– V (V)
10
10
10
10
10
10
V
IN
Frequency (Hz)
OUT
Figure 5. Ripple Rejection vs. Frequency
Figure 6. Short Circuit Current vs.
VIN – VOUT
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3
CS52015–3
0.100
300
200
100
0
0.075
0.050
0.025
0.000
C
= C = 22 µF Tantalum
IN
OUT
–100
–200
1500
750
0
T
= 25°C
CASE
T
= 125°C
CASE
T
= 0°C
CASE
0
1
2
3
4
5
6
7
8
9
10
0
1
2
Output Current (A)
Time (µS)
Figure 7. Transient Response
Figure 8. Load Regulation vs. Output
Current
APPLICATIONS INFORMATION
The CS52015–3 linear regulator provides a 3.3 V output
voltage at currents up to 1.5 A. The regulator is protected
against overcurrent conditions and includes thermal
shutdown.
The CS52015–3 has a composite PNP–NPN output
transistor and requires an output capacitor for stability. A
detailed procedure for selecting this capacitor is included in
the Stability Considerations section.
For microprocessor applications it is customary to use an
output capacitor network consisting of several tantalum and
ceramic capacitors in parallel. This reduces the overall ESR
and reduces the instantaneous output voltage drop under
transient load conditions. The output capacitor network
should be as close to the load as possible for the best results.
Protection Diodes
When large external capacitors are used with a linear
regulator it is sometimes necessary to add protection diodes.
If the input voltage of the regulator gets shorted, the output
capacitor will discharge into the output of the regulator. The
discharge current depends on the value of the capacitor, the
Stability Considerations
The output compensation capacitor helps determine three
main characteristics of a linear regulator: start–up delay,
load transient response, and loop stability.
The capacitor value and type is based on cost, availability,
size and temperature constraints. A tantalum or aluminum
electrolytic capacitor is best, since a film or ceramic
capacitor with almost zero ESR can cause instability. The
aluminum electrolytic capacitor is the least expensive
solution. However, when the circuit operates at low
temperatures, both the value and ESR of the capacitor will
vary considerably. The capacitor manufacturer’s data sheet
provides this information.
A 22 µF tantalum capacitor will work for most
applications, but with high current regulators such as the
CS52015–3 the transient response and stability improve
with higher values of capacitance. The majority of
applications for this regulator involve large changes in load
current so the output capacitor must supply the
instantaneous load current. The ESR of the output capacitor
causes an immediate drop in output voltage given by:
output voltage and the rate at which V drops. In the
IN
CS52015–3 linear regulator, the discharge path is through a
large junction and protection diodes are not usually needed.
If the regulator is used with large values of output
capacitance and the input voltage is instantaneously shorted
to ground, damage can occur. In this case, a diode connected
as shown in Figure 9 is recommended.
IN4002 (Optional)
V
IN
V
OUT
V
IN
V
OUT
CS52015–3
C
C
2
1
GND
DV + DI ESR
Figure 9. Protection Diode Scheme for Large
Output Capacitors
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4
CS52015–3
Output Voltage Sensing
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
Since the CS52015–3 is a three terminal regulator, it is not
possible to provide true remote load sensing. Load
regulation is limited by the resistance of the conductors
connecting the regulator to the load. For best results the
regulator should be connected as shown in Figure 10.
{
}
I
P
+ V
* V
) V
I
D(max)
IN(max)
OUT(min) OUT(max)
IN(max) Q
(2)
where:
Conductor Parasitic
Resistance
V
V
is the maximum input voltage,
is the minimum output voltage,
is the maximum output current, for the
IN(max)
OUT(min)
OUT(max)
R
C
V
IN
V
IN
V
OUT
I
CS52015–3
application
I is the maximum quiescent current at I
R
LOAD
.
OUT(max)
Q
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
Figure 10. Conductor Parasitic Resistance Effects
Can Be Minimized With the Above Grounding
Scheme For Fixed Output Regulators
determine R , the total thermal resistance between the
ΘJA
junction and the surrounding air.
1. Thermal Resistance of the junction to case, R
Calculating Power Dissipation and Heat Sink
Requirements
ΘJC
(°C/W)
The CS52015–3 linear regulator includes thermal
shutdown and current limit circuitry to protect the device.
High power regulators such as these usually operate at high
junction temperatures so it is important to calculate the
power dissipation and junction temperatures accurately to
ensure that an adequate heat sink is used.
2. Thermal Resistance of the case to Heat Sink, R
ΘCS
(°C/W)
3. Thermal Resistance of the Heat Sink to the ambient
air, R (°C/W)
ΘSA
These are connected by the equation:
The case is connected to V
on the CS52015–3,
R
+ R
) R
) R
QSA
(3)
OUT
QJA
QJC
QCS
electrical isolation may be required for some applications.
Thermal compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
The value for R
is calculated using equation (3) and
ΘJA
the result can be substituted in equation (1).
The value for R is 3.5°C/W for a given package type
ΘJC
based on an average die size. For a high current regulator
such as the CS52015–3 the majority of the heat is generated
in the power transistor section. The value for R
1. Maximum Ambient Temperature T (°C)
A
depends
ΘSA
2. Power dissipation P (Watts)
D
on the heat sink type, while R
depends on factors such
ΘCS
3. Maximum junction temperature T (°C)
J
as package type, heat sink interface (is an insulator and
thermal grease used?), and the contact area between the heat
sink and the package. Once these calculations are complete,
4. Thermal resistance junction to ambient R
(°C/W)
ΘJA
These four are related by the equation
the maximum permissible value of R
can be calculated
ΘJA
and the proper heat sink selected. For further discussion on
heat sink selection, see application note “Thermal
Management for Linear Regulators,” document number
SR006AN/D, available through the Literature Distribution
Center or via our website at http://onsemi.com.
T + T ) P R
QJA
(1)
J
A
D
The maximum ambient temperature and the power
dissipation are determined by the design while the
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5
CS52015–3
ADDITIONAL ORDERING INFORMATION
Orderable Part
Number
Type
Description
CS52015–3GT3
1.5 A, 3.3 V Output
1.5 A, 3.3 V Output
1.5 A, 3.3 V Output
1.5 A, 3.3 V Output
1.5 A, 3.3 V Output
TO–220 THREE LEAD, STRAIGHT
2
CS52015–3GDP3
CS52015–3GDPR3
CS52015–3GST3
CS52015–3GSTR3
D PAK 3–PIN
2
D PAK 3–PIN (Tape & Reel)
SOT–223
SOT–223 (Tape & Reel)
MARKING DIAGRAMS
2
TO–220
THREE LEAD
T SUFFIX
D PAK
3–PIN
DP SUFFIX
CASE 418E
SOT–223
ST SUFFIX
CASE 318E
CASE 221A
AYW
52015
CS
52015–3
AWLYWW
CS52015–3
AWLYWW
1
1
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
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6
CS52015–3
PACKAGE DIMENSIONS
TO–220
THREE LEAD
T SUFFIX
CASE 221A–09
ISSUE AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
PLANE
–T–
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
C
S
B
F
T
4
1
INCHES
DIM MIN MAX
MILLIMETERS
MIN
14.48
9.66
4.07
0.64
3.61
2.42
2.80
0.46
12.70
1.15
4.83
2.54
2.04
1.15
5.97
0.00
1.15
---
MAX
15.75
10.28
4.82
0.88
3.73
2.66
3.93
0.64
14.27
1.52
5.33
3.04
2.79
1.39
6.47
1.27
---
A
K
Q
Z
A
B
C
D
F
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.018
0.500
0.045
0.190
0.100
0.080
0.045
0.235
0.000
0.045
---
0.620
0.405
0.190
0.035
0.147
0.105
0.155
0.025
0.562
0.060
0.210
0.120
0.110
0.055
0.255
0.050
---
2
3
U
H
G
H
J
K
L
L
R
J
N
Q
R
S
T
V
G
D
U
V
Z
N
0.080
2.04
D2PAK
3–PIN
DP SUFFIX
CASE 418E–01
ISSUE O
SEATING
PLANE
–T–
NOTES:
B
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
M
E
4
INCHES
DIM MIN MAX
MILLIMETERS
MIN
8.28
10.05
4.31
0.66
1.14
2.29
MAX
8.53
10.31
4.57
0.91
1.40
2.79
A
B
C
D
E
F
0.326
0.396
0.170
0.026
0.045
0.090
0.336
0.406
0.180
0.036
0.055
0.110
A
K
1
2
3
G
H
J
0.100 BSC
2.54 BSC
0.098
0.108
0.025
0.214
0.055
0.066
0.004
2.49
0.46
5.18
1.14
1.40
0.00
2.74
0.64
5.44
1.40
1.68
0.10
0.018
0.204
0.045
0.055
0.000
F
K
L
M
N
H
G
D
3 PL
J
L
M
M
0.13 (0.005)
T
B
N
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7
CS52015–3
SOT–223
ST SUFFIX
CASE 318E–04
ISSUE K
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
2
INCHES
DIM MIN MAX
MILLIMETERS
S
B
MIN
6.30
3.30
1.50
0.60
2.90
2.20
0.020
0.24
1.50
0.85
0
MAX
6.70
3.70
1.75
0.89
3.20
2.40
0.100
0.35
2.00
1.05
10
1
3
A
B
C
D
F
0.249
0.130
0.060
0.024
0.115
0.087
0.263
0.145
0.068
0.035
0.126
0.094
D
G
H
J
L
0.0008 0.0040
G
0.009
0.060
0.033
0
0.014
0.078
0.041
10
J
K
L
C
M
S
_
_
_
_
0.08 (0003)
0.264
0.287
6.70
7.30
M
H
K
PACKAGE THERMAL DATA
2
TO–220
D PAK
THREE LEAD
3–PIN
Parameter
SOT–223
15
Unit
R
R
Typical
Typical
3.5
50
3.5
°C/W
°C/W
Θ
Θ
JC
JA
10–50*
156
* Depending on thermal properties of substrate. R
= R
+ R
Θ
JC CA
Θ
Θ
JA
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CS52015–3/D
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