CEK01N6 [ETC]

600V N Channel MOS ; 600V N沟道MOS\n
CEK01N6
型号: CEK01N6
厂家: ETC    ETC
描述:

600V N Channel MOS
600V N沟道MOS\n

文件: 总5页 (文件大小:52K)
中文:  中文翻译
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CEK01N6  
PRELIMINARY  
N-Channel Enhancement Mode Field Effect Transistor  
FEATURES  
D
600V , 0.25A , RDS(ON)=7.5  
@VGS=10V.  
Super high dense cell design for low RDS(ON)  
High power and current handling capability.  
TO-92 Package.  
.
TO-92  
G
G
D
S
S
ABSOLUTE MAXIMUM RATINGS (T =25 C unless otherwise noted)  
A
Limit  
600  
Ć30  
0.25  
1
Unit  
V
Parameter  
Symbol  
Drain-Source Voltage  
V
DS  
V
GS  
V
Gate-Source Voltage  
I
D
A
A
Drain Current-Continuous  
-Pulsed  
I
DM  
Drain-Source Diode Forward Current  
Maximum Power Dissipation  
A
I
S
0.25  
1.5  
P
D
W
Operating Junction and Storage  
Temperature Range  
T
J
, TSTG  
-55 to 150  
C
THERMAL CHARACTERISTICS  
Thermal Resistance, Junction-to-Ambient  
C
/W  
RįJA  
85  
1
CEK01N6  
ELECTRICAL CHARACTERISTICS (T =25 C unless otherwise noted)  
C
Typ Max  
Parameter  
Condition  
Min  
Unit  
Symbol  
DRAIN-SOURCE AVALANCHE RATINGa  
Single Pulse Drain-Source  
Avalanche Energy  
V
DD =50V, L=60mH  
mJ  
A
E
AS  
100  
R =9.1  
G
Maximum Drain-Source  
Avalanche Current  
I
AS  
0.25  
OFF CHARACTERISTICS  
V
GS = 0V,I  
D
= 250µA  
Drain-Source Breakdown Voltage  
600  
V
BVDSS  
µA  
25  
I
DSS  
GSS  
V
DS = 600V, VGS = 0V  
Zero Gate Voltage Drain Current  
Gate-Body Leakage  
VGS  
=
30V, VDS = 0V  
Ć
I
nA  
100  
Ć
ON CHARACTERISTICSa  
VGS(th)  
2
4
V
Gate Threshold Voltage  
V
DS = VGS, I  
D
= 250µA  
R
DS(ON)  
5.5  
0.7  
Drain-Source On-State Resistance  
7.5  
V
GS =10V, I  
D
= 0.125A  
gFS  
Forward Transconductance  
S
VDS = 50V, I  
D
= 0.125A  
SWITCHING CHARACTERISTICSb  
Turn-On Delay Time  
ns  
ns  
ns  
ns  
nC  
6
t
D(ON)  
18  
50  
V
DD = 300V,  
= 1A,  
I
V
D
Rise Time  
25  
t
r
GS = 10V  
Turn-Off Delay Time  
Fall Time  
t
D(OFF)  
30  
50  
12  
10  
20  
8
R
GEN=25  
t
f
Q
g
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
V
DS =480V, I  
D
= 1A,  
Q
gs  
gd  
nC  
nC  
1.3  
3
VGS =10V  
Q
2
CEK01N6  
ELECTRICAL CHARACTERISTICS (T  
C
=25 C unless otherwise noted)  
Typ Max  
Unit  
Parameter  
DYNAMIC CHARACTERISTICSb  
Condition  
Min  
Symbol  
200  
30  
Input Capacitance  
P
F
C
ISS  
OSS  
RSS  
V
DS =25V, VGS = 0V  
P
P
F
F
Output Capacitance  
C
f =1.0MH  
Z
Reverse Transfer Capacitance  
C
10  
DRAIN-SOURCE DIODE CHARACTERISTICS a  
Diode Forward Voltage  
V
V
SD  
V
GS = 0V, Is =0.25A  
1.5  
Notes  
ś
ś
a.Pulse Test:Pulse Width 300ijs, Duty Cycle 2%.  
b.Guaranteed by design, not subject to production testing.  
1.2  
VGS=10,9,8,7V  
1.0  
0.8  
150 C  
0.1  
0.6  
VGS=6V  
0.4  
VGS=5V  
-55 C  
1.VDS=40V  
2.Pulse Test  
0.2  
25 C  
0.01  
0
2
4
10  
8
6
0
1
2
3
4
5
6
VDS, Drain-to-Source Voltage (V)  
VGS, Gate-to-Source Voltage (V)  
Figure 1. Output Characteristics  
Figure 2. Transfer Characteristics  
3
CEK01N6  
3.0  
2.5  
300  
ID=0.125A  
VGS=10V  
250  
Ciss  
2.0  
1.5  
200  
150  
Coss  
100  
1.0  
50  
0.5  
0.0  
Crss  
0
25  
0
5
10  
15  
20  
-100  
-50  
0
50  
100  
200  
150  
TJ, Junction Temperature( C)  
VDS, Drain-to Source Voltage (V)  
Figure 4. On-Resistance Variation with  
Temperature  
Figure 3. Capacitance  
1.15  
1.30  
1.20  
ID=250͋A  
V
DS=VGS  
=250͋A  
1.10  
I
D
1.10  
1.0  
1.05  
1.00  
0.90  
0.95  
0.90  
0.85  
0.80  
0.70  
0.60  
-50 -25  
0
25 50 75 100 125 150  
-50 -25  
0
25 50 75 100 125 150  
Tj, Junction Temperature ( C)  
Tj, Junction Temperature ( C)  
Figure 5. Gate Threshold Variation  
with Temperature  
Figure 6. Breakdown Voltage Variation  
with Temperature  
2
1
V
GS=0V  
V
DS=50V  
1
0.75  
0.5  
0.25  
0
0.1  
0
0.05  
0.2  
0.1  
0.15  
0.4  
0.6  
1.2  
1.0  
0.8  
IDS, Drain-Source Current (A)  
VSD, Body Diode Forward Voltage (V)  
Figure 7. Transconductance Variation  
with Drain Current  
Figure 8. Body Diode Forward Voltage  
Variation with Source Current  
4
CEK01N6  
1
0
15  
12  
10  
10  
V
=480V  
I
D
DS=1A  
it  
im  
L
1ms  
S(ON)  
10ms  
D
R
9
6
100ms  
-1  
-2  
10  
10  
1s  
DC  
3
0
T
A
=25 C  
Tj=150 C  
Single Pulse  
-3  
10  
3
1
2
0
12  
10  
10  
0
3
6
9
10  
10  
Qg, Total Gate Charge (nC)  
VDS, Drain-Source Voltage (V)  
Figure 9. Gate Charge  
Figure 10. Maximum Safe  
Operating Area  
VDD  
on  
t
toff  
d(off)  
r
t
t
d(on)  
RL  
t
f
t
VIN  
90%  
90%  
D
OUT  
V
OUT  
V
VGS  
10%  
10%  
INVERTED  
RGEN  
G
90%  
50%  
50%  
S
IN  
V
10%  
PULSE WIDTH  
Figure 12. Switching Waveforms  
Figure 11. Switching Test Circuit  
10 0  
D=0.5  
0.2  
10-1  
0.1  
0.05  
0.02  
DM  
P
1
t
0.01  
10-2  
2
t
1. RįJA (t)=r (t) * RįJA  
2. RįJA=See Datasheet  
3. TJM-TA = P* RįJA (t)  
4. Duty Cycle, D=t1/t2  
Single Pulse  
10-3  
10 2  
10-4  
10-3  
10-2  
10-1  
10 0  
Square Wave Pulse Duration (sec)  
Figure 13. Normalized Thermal Transient Impedance Curve  
5

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