CAT28LV64P-20 [ETC]
EEPROM ; EEPROM\n型号: | CAT28LV64P-20 |
厂家: | ETC |
描述: | EEPROM
|
文件: | 总11页 (文件大小:79K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CAT28LV64
64K-Bit CMOS PARALLEL EEPROM
FEATURES
■ CMOS and TTL compatible I/O
■ 3.0V to 3.6 V Supply
■ Automatic page write operation:
– 1 to 32 bytes in 5ms
■ Read access times:
– 200/250/300/350ns
– Page load timer
■ Low power CMOS dissipation:
– Active: 8 mA max.
■ End of write detection:
– Toggle bit
– Standby: 100 µA max.
– DATA polling
■ Simple write operation:
■ Hardware and software write protection
■ 100,000 program/erase cycles
■ 100 year data retention
– On-chip address and data latches
– Self-timed write cycle with auto-clear
■ Fast write cycle time:
– 5ms max.
■ Commercial, industrial and automotive
temperature ranges
DESCRIPTION
The CAT28LV64 is a low voltage, low power, CMOS
parallel EEPROM organized as 8K x 8-bits. It requires a
simple interface for in-system programming. On-chip
addressanddatalatches,self-timedwritecyclewithauto-
clear and VCC power up/down write protection eliminate
additional timing and protection hardware. DATA Polling
and Toggle status bit signal the start and end of the self-
timed write cycle. Additionally, the CAT28LV64 features
hardware and software write protection.
The CAT28LV64 is manufactured using Catalyst’s
advanced CMOS floating gate technology. It is designed
to endure 100,000 program/erase cycles and has a data
retention of 100 years. The device is available in JEDEC
approved 28-pin DIP, 28-pin TSOP, 28-pin SOIC or 32-
pin PLCC packages.
BLOCK DIAGRAM
8,192 x 8
E2PROM
ARRAY
ROW
DECODER
ADDR. BUFFER
A –A
5
12
& LATCHES
INADVERTENT
WRITE
PROTECTION
HIGH VOLTAGE
GENERATOR
32 BYTE PAGE
REGISTER
V
CC
CE
OE
WE
CONTROL
LOGIC
I/O BUFFERS
DATA POLLING
AND
TIMER
TOGGLE BIT
I/O –I/O
0
7
ADDR. BUFFER
& LATCHES
A –A
COLUMN
DECODER
0
4
5094 FHD F02
Doc. No. 1010, Rev. A
© 2001 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
1
CAT28LV64
PIN CONFIGURATION
DIP Package (P)
SOIC Package (J, K)
NC
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
WE
NC
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
A
12
2
A
2
WE
12
A
3
NC
A
3
NC
7
6
5
4
3
2
1
0
0
1
2
7
6
5
4
3
2
1
0
0
1
2
A
4
A
A
A
8
A
4
A
A
A
8
A
5
9
A
5
9
A
6
11
A
6
11
A
7
OE
A
A
7
OE
A
A
8
10
A
8
10
A
9
CE
A
9
CE
A
10
11
12
13
14
I/O
7
A
10
11
12
13
14
I/O
7
I/O
I/O
I/O
V
I/O
I/O
I/O
I/O
6
5
4
3
I/O
I/O
I/O
V
I/O
I/O
I/O
I/O
6
5
4
3
SS
SS
PLCC Package (N)
TSOP Top View (8mm x 13.4mm) (T13)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
OE
1
2
3
4
5
6
7
8
A
10
A
A
A
NC
CE
I/O
I/O
I/O
I/O
I/O
11
9
8
7
6
5
4
3
4
3 2 1 32 31 30
5
6
7
8
9
29
28
27
26
25
24
23
22
21
A
A
A
A
A
A
A
A
A
A
6
5
4
3
2
1
0
8
WE
9
V
CC
NC
12
GND
11
A
9
I/O
I/O
1
I/O
NC
OE
A
2
A
10
11
12
13
14
7
TOP VIEW
A
A
A
A
6
5
4
3
0
10
11
12
13
A
0
10
A
1
CE
A
2
NC
I/O
I/O
7
6
I/O
0
14 15 16 17 18 19 20
28LV64 F03
5094 FHD F01
PIN FUNCTIONS
Pin Name
Function
Pin Name
WE
Function
Write Enable
3.0 to 3.6 V Supply
Ground
A0–A12
I/O0–I/O7
CE
Address Inputs
Data Inputs/Outputs
Chip Enable
VCC
VSS
OE
Output Enable
NC
No Connect
Doc. No. 25035(Rev.)
2
CAT28LV64
ABSOLUTE MAXIMUM RATINGS*
*COMMENT
Temperature Under Bias ................. –55°C to +125°C
Storage Temperature....................... –65°C to +150°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation
of the device at these or any other conditions outside of
those listed in the operational sections of this specifica-
tion is not implied. Exposure to any absolute maximum
rating for extended periods may affect device perfor-
mance and reliability.
Voltage on Any Pin with
Respect to Ground(2) ........... –2.0V to +VCC + 2.0V
V
CC with Respect to Ground ............... –2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C)................................... 1.0W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current(3) ........................ 100 mA
RELIABILITY CHARACTERISTICS
Symbol
Parameter
Endurance
Min.
105
Max.
Units
Cycles/Byte
Years
Test Method
(1)
NEND
MIL-STD-883, Test Method 1033
MIL-STD-883, Test Method 1008
MIL-STD-883, Test Method 3015
JEDEC Standard 17
(1)
TDR
Data Retention
ESD Susceptibility
Latch-Up
100
(1)
VZAP
2000
100
Volts
(1)(4)
ILTH
mA
MODE SELECTION
Mode
CE
WE
OE
L
I/O
DOUT
DIN
Power
ACTIVE
ACTIVE
ACTIVE
STANDBY
ACTIVE
Read
L
L
H
Byte Write (WE Controlled)
Byte Write (CE Controlled)
Standby, and Write Inhibit
Read and Write Inhibit
H
L
X
H
H
DIN
H
X
X
High-Z
High-Z
H
CAPACITANCE T = 25°C, f = 1.0 MHz
A
Symbol
Test
Max.
10
Units
pF
Conditions
(1)
CI/O
Input/Output Capacitance
Input Capacitance
VI/O = 0V
VIN = 0V
(1)
CIN
6
pF
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
(2) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is V +0.5V, which may overshoot to V +2.0V for periods of less than 20 ns.
CC
CC
(3) Output shorted for no more than one second. No more than one output shorted at a time.
(4) Latch-up protection is provided for stresses up to 100mA on address and data pins from –1V to V +1V.
CC
Doc. No. 25035(Rev.)
3
CAT28LV64
D.C. OPERATING CHARACTERISTICS
V
= 3.0V to 3.6V, unless otherwise specified.
cc
Limits
Symbol
Parameter
Min. Typ.
Max.
Units
Test Conditions
CE = OE = VIL,
f = 1/tRC min, All I/O’s Open
CE = VIHC
ICC
VCC Current (Operating, TTL)
8
mA
(3)
ISBC
VCC Current (Standby, CMOS)
100
µA
,
All I/O’s Open
ILI
Input Leakage Current
Output Leakage Current
–1
–5
1
5
µA
µA
VIN = GND to VCC
ILO
VOUT = GND to VCC,
CE = VIH
(3)
VIH
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
Low Level Output Voltage
Write Inhibit Voltage
2
–0.3
2
VCC +0.3
0.6
V
V
V
V
V
VIL
VOH
VOL
VWI
IOH = –100µA
0.3
IOL = 1.0mA
2
A.C. CHARACTERISTICS, Read Cycle
= 3.0V to 3.6V, unless otherwise specified.
V
cc
28LV64-20 28LV64-25
28LV64-30
28LV64-35
Symbol
tRC
Parameter
Min. Max. Min. Max. Min. Max. Min. Max. Units
Read Cycle Time
200
250
300
350
ns
ns
ns
ns
ns
ns
ns
ns
tCE
CE Access Time
200
200
80
250
250
100
300
300
150
350
350
150
tAA
Address Access Time
OEAccess Time
tOE
(1)
tLZ
CE Low to Active Output
OE Low to Active Output
CE High to High-Z Output
OE High to High-Z Output
0
0
0
0
0
0
0
0
(1)
tOLZ
(1)(2)
tHZ
50
50
55
55
60
60
60
60
(1)(2)
tOHZ
Output Hold from
Address Change
(1)
tOH
0
0
0
0
ns
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
(2) Output floating (High-Z) is defined as the state when the external data line is no longer driven by the output buffer.
(3) V = V –0.3V to V +0.3V.
IHC
CC
CC
Doc. No. 25035(Rev.)
4
CAT28LV64
(4)
Figure 1. A.C. Testing Input/Output Waveform
V
- 0.3 V
CC
2.0 V
0.6 V
INPUT PULSE LEVELS
REFERENCE POINTS
0.0 V
28LV64 F04
Figure 2. A.C. Testing Load Circuit (example)
Vcc
1.8 K
DEVICE
UNDER
TEST
OUTPUT
1. 3K
C
= 100 pF
L
C INCLUDES JIG CAPACITANCE
L
28LV64 F05
A.C. CHARACTERISTICS, Write Cycle
= 3.0V to 3.6V, unless otherwise specified.
V
cc
28LV64-20 28LV64-25
28LV64-30
28LV64-35
Symbol
Parameter
Write Cycle Time
Address Setup Time
Address Hold Time
CE Setup Time
CE Hold Time
Min. Max. Min. Max. Min. Max. Min. Max. Units
tWC
tAS
tAH
tCS
tCH
tCW
5
5
5
5
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
0
100
0
0
100
0
0
100
0
0
100
0
0
0
0
0
(2)
CE Pulse Time
150
10
10
150
100
0
150
10
10
150
100
0
150
10
10
150
100
0
150
10
10
150
100
0
tOES
tOEH
OE Setup Time
OE Hold Time
(2)
tWP
tDS
tDH
WE Pulse Width
Data Setup Time
Data Hold Time
(1)
tINIT
Write Inhibit Period
After Power-up
5
10
5
10
5
10
5
10
ms
(1)(3)
tBLC
Byte Load Cycle Time
0.1
100
0.1
100
0.1
100
0.1
100
µs
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
(2) A write pulse of less than 20ns duration will not initiate a write cycle.
(3) A timer of duration t
max. begins with every LOW to HIGH transition of WE. If allowed to time out, a page or byte write will begin;
BLC
however a transition from HIGH to LOW within t
max. stops the timer.
BLC
(4) Input rise and fall times (10% and 90%) < 10 ns.
Doc. No. 25035(Rev.)
5
CAT28LV64
Byte Write
DEVICE OPERATION
A write cycle is executed when both CE and WE are low,
and OE is high. Write cycles can be initiated using either
WE or CE, with the address input being latched on the
falling edge of WE or CE, whichever occurs last. Data,
conversely, is latched on the rising edge of WE or CE,
whichever occurs first. Once initiated, a byte write cycle
automatically erases the addressed byte and the new
data is written within 5 ms.
Read
Data stored in the CAT28LV64 is transferred to the data
bus when WE is held high, and both OE and CE are held
low. The data bus is set to a high impedance state when
eitherCEorOEgoeshigh.This2-linecontrolarchitecture
can be used to eliminate bus contention in a system
environment.
Figure 3. Read Cycle
t
RC
ADDRESS
CE
t
CE
t
OE
OE
V
IH
t
WE
LZ
t
OHZ
t
t
HZ
DATA VALID
t
OH
OLZ
HIGH-Z
DATA OUT
DATA VALID
t
AA
28LV64 F06
Figure 4. Byte Write Cycle [WE Controlled]
t
WC
ADDRESS
t
t
AH
AS
t
t
CH
CS
CE
OE
WE
t
t
t
OEH
OES
WP
t
BLC
HIGH-Z
DATA OUT
DATA IN
DATA VALID
DS
t
t
DH
5096 FHD F06
Doc. No. 25035(Rev.)
6
Page Write
CAT28LV64
(which can be loaded in any order) during the first and
subsequent write cycles. Each successive byte load
cycle must begin within tBLC MAX of the rising edge of the
preceding WE pulse. There is no page write window
The page write mode of the CAT28LV64 (essentially an
extended BYTE WRITE mode) allows from 1 to 32 bytes
ofdatatobeprogrammedwithinasingleEEPROMwrite
cycle. This effectively reduces the byte-write time by a
factor of 32.
limitation as long as WE is pulsed low within tBLC MAX
.
Upon completion of the page write sequence, WE must
stayhighaminimumoftBLCMAX fortheinternalautomatic
program cycle to commence. This programming cycle
consists of an erase cycle, which erases any data that
existed in each addressed cell, and a write cycle, which
writes new data back into the cell. A page write will only
write data to the locations that were addressed and will
not rewrite the entire page.
FollowinganinitialWRITEoperation(WE pulsedlow,for
tWP, and then high) the page write mode can begin by
issuing sequential WE pulses, which load the address
anddatabytesintoa32bytetemporarybuffer. Thepage
address where data is to be written, specified by bits A5
to A12, is latched on the last falling edge of WE. Each
byte within the page is defined by address bits A0 to A4
Figure 5. Byte Write Cycle [CE Controlled]
t
WC
ADDRESS
t
t
t
BLC
AS
AH
t
CW
CE
OE
WE
t
OEH
t
OES
t
t
CH
CS
HIGH-Z
DATA OUT
DATA IN
DATA VALID
DS
t
t
DH
5094 FHD F07
Figure 6. Page Mode Write Cycle
OE
CE
WE
t
t
BLC
WP
ADDRESS
I/O
t
WC
LAST BYTE
BYTE n+2
BYTE 0 BYTE 1
BYTE 2
7
BYTE n
BYTE n+1
5096 FHD F10
Doc. No. 25035(Rev.)
CAT28LV64
DATA Polling
Toggle Bit
DATA polling is provided to indicate the completion of
write cycle. Once a byte write or page write cycle is
initiated, attempting to read the last byte written will
output the complement of that data on I/O7 (I/O0–I/O6
are indeterminate) until the programming cycle is
complete. Upon completion of the self-timed write cycle,
all I/O’s will output true data during a read cycle.
In addition to the DATA Polling feature, the device offers
an additional method for determining the completion of
a write cycle. While a write cycle is in progress, reading
data from the device will result in I/O6 toggling between
one and zero. However, once the write is complete, I/O6
stops toggling and valid data can be read from the
device.
Figure 7. DATA Polling
ADDRESS
CE
WE
t
OEH
t
OES
t
OE
OE
t
WC
= X
I/O
D
IN
= X
D
D
= X
OUT
7
OUT
28LV64 F10
Figure 8. Toggle Bit
WE
CE
OE
t
OEH
t
OES
t
OE
(1)
(1)
I/O
6
t
WC
28LV64 F11
Note:
(1) Beginning and ending state of I/O is indeterminate.
6
Doc. No. 25035(Rev.)
8
CAT28LV64
HARDWARE DATA PROTECTION
(4) Noise pulses of less than 20 ns on the WE or CE
inputs will not result in a write cycle.
Thefollowingisalistofhardwaredataprotectionfeatures
that are incorporated into the CAT28LV64.
SOFTWARE DATA PROTECTION
(1) VCC sense provides for write protection when VCC
falls below 2.0V min.
The CAT28LV64 features a software controlled data
protectionschemewhich, onceenabled, requiresadata
algorithmtobeissuedtothedevicebeforeawritecanbe
performed. The device is shipped from Catalyst with the
software protection NOT ENABLED (the CAT28LV64 is
in the standard operating mode).
(2) A power on delay mechanism, tINIT (see AC
characteristics), provides a 5 to 10 ms delay before
a write sequence, after VCC has reached 2.40V min.
(3) Write inhibit is activated by holding any one of OE
low, CE high or WE high.
Figure 9. Write Sequence for Activating Software
Data Protection
Figure 10. Write Sequence for Deactivating
Software Data Protection
AA
WRITE DATA:
ADDRESS:
AA
WRITE DATA:
ADDRESS:
1555
1555
WRITE DATA:
ADDRESS:
55
WRITE DATA:
ADDRESS:
55
0AAA
0AAA
WRITE DATA:
ADDRESS:
A0
WRITE DATA:
ADDRESS:
80
1555
1555
WRITE DATA:
ADDRESS:
AA
SOFTWARE DATA
PROTECTION ACTIVATED
(1)
1555
WRITE DATA:
XX
WRITE DATA:
ADDRESS:
55
TO ANY ADDRESS
0AAA
WRITE LAST BYTE
TO
LAST ADDRESS
WRITE DATA:
ADDRESS:
20
1555
28LV64 F12
5094 FHD F09
Note:
(1) Write protection is activated at this point whether or not any more writes are completed. Writing to addresses must occur within t
Max., after SDP activation.
BLC
Doc. No. 25035(Rev.)
9
CAT28LV64
Toactivatethesoftwaredataprotection,thedevicemust
besentthreewritecommandstospecificaddresseswith
specific data (Figure 9). This sequence of commands
(along with subsequent writes) must adhere to the page
writetimingspecifications(Figure11).Oncethisisdone,
all subsequent byte or page writes to the device must be
preceded by this same set of write commands. The data
protection mechanism is activated until a deactivate
sequenceisissuedregardlessofpoweron/offtransitions.
This gives the user added inadvertent write protection
on power-up in addition to the hardware protection
provided.
To allow the user the ability to program the device with
anEEPROMprogrammer(orfortestingpurposes)there
is a software command sequence for deactivating the
data protection. The six step algorithm (Figure 10) will
reset the internal protection circuitry, and the device will
return to standard operating mode (Figure 12 provides
reset timing). After the sixth byte of this reset sequence
has been issued, standard byte or page writing can
commence.
Figure 11. Software Data Protection Timing
t
WC
DATA
ADDRESS
AA
1555
55
0AAA
A0
1555
BYTE OR
PAGE
CE
WRITES
ENABLED
t
t
BLC
WP
WE
5094 FHD F13
Figure 12. Resetting Software Data Protection Timing
t
DATA
ADDRESS
AA
1555
55
0AAA
80
1555
AA
1555
55
0AAA
20
1555
WC
SDP
RESET
CE
DEVICE
UNPROTECTED
WE
5094 FHD F14
ORDERING INFORMATION
Prefix
Device #
Suffix
T
CAT
28LV64
N
I
-25
Optional
Company
ID
Temperature Range
Tape & Reel
T: 500/Reel
Blank = Commercial (0˚C to +70˚C)
I = Industrial (-40˚C to +85˚C)
A = Automotive (-40˚ to +105˚C)*
Package
Speed
Product
Number
P: PDIP
20: 200ns
J: SOIC (JEDEC)
K: SOIC (EIAJ)
N: PLCC
25: 250ns
30: 300ns
35: 350ns
T13: TSOP (8mmx13.4mm)
* -40˚C to +125˚C is available upon request
Notes:
28LV64 F17
(1) The device used in the above example is a CAT28LV64NI-25T (PLCC, Industrial temperature, 250 ns Access Time, Tape & Reel).
Doc. No. 25035(Rev.)
10
Copyrights, Trademarks and Patents
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:
DPP ™
AE2 ™
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents
issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000.
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PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a
situation where personal injury or death may occur.
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate
typical semiconductor applications and may not be complete.
Catalyst Semiconductor, Inc.
Corporate Headquarters
1250 Borregas Avenue
Sunnyvale, CA 94089
Phone: 408.542.1000
Fax: 408.542.1200
Publication #: 1010
Revison:
Issue date:
Type:
A
07/23/01
Final
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