BAT54ACJW [ETC]
SMALL SIGNAL SCHOTTKY DIODE ; 小信号肖特基二极管\n
| 型号： | BAT54ACJW |
| 厂家： | 
ETC |
| 描述： | SMALL SIGNAL SCHOTTKY DIODE
|
| 文件： | 总5页 (文件大小：244K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAT54J / W / AW / CW / SW
®
SMALL SIGNAL SCHOTTKY DIODE
FEATURES AND BENEFITS
K2
NC
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
SURFACE MOUNT DEVICE
K
A
K
A
K2
NC
K1
A
A
K1
BAT54W
BAT54AW
A2
K2
DESCRIPTION
A2
K1
K
A2
K1
K
Schottky barrier diodes encapsulated either in
SOT-323 or SOD-323 small SMD packages.
A2
A1
K2
A1
A1
Single and double diodes with different pining are
available.
A1
BAT54SW
BAT54CW
SOT-323
A
86
K
BAT54J
SOD-323
ABSOLUTE RATINGS
Symbol
(limiting values)
Parameter
Value
Unit
V
VRRM Repetitive peak reverse voltage
30
0.3
1
IF
Continuous forward current
A
IFSM
Ptot
Surge non repetitive forward current
tp=10ms sinusoidal
SOD-323
A
Power dissipation (note 1)
Tamb = 25°C
230
mW
SOT-323
Tstg
Tj
Maximum storage temperature range
- 65 to +150
150
°C
°
C
Maximum operating junction temperature *
TL
Maximum temperature for soldering during 10s
260
°C
Note 1:
for double diodes, Ptot is the total dissipation of both diodes
dPtot
dTj
1
<
* :
thermal runaway condition for a diode on its own heatsink
Rth(j−a)
June 1999 - Ed: 2A
1/5
BAT54J / W / AW / CW / SW
THERMAL RESISTANCE
Symbol
Parameters
Value
Unit
°
Rth (j-a) Junction to ambient (*)
SOD-323
SOT-323
550
C/W
C/W
°
(*) Mounted on epoxy board, with recommended pad layout.
STATIC ELECTRICAL CHARACTERISTICS
(per diode)
Tests conditions
Symbol
Parameters
Min. Typ. Max.
Unit
°
VF *
Forward voltage drop
Tj = 25 C
IF = 0.1 mA
IF = 1 mA
240
320
400
500
900
1
mV
IF = 10 mA
IF = 30 mA
IF = 100 mA
VR = 30 V
°
µ
A
IR **
Reverse leakage current
Tj = 25 C
°
Tj = 100 C
100
Pulse test : * tp = 380 µs, δ < 2%
** tp = 5 ms, δ < 2%
DYNAMIC CHARACTERISTICS
(Tj = 25 °C)
Symbol
Parameters
Junction
Tests conditions
= 1 V F = 1 MHz
Min.
Typ. Max. Unit
°
10
pF
C
Tj = 25 C
VR
capacitance
trr
Reverse recovery
time
IF = 10 mA IR = 10 mA Tj = 25°C
Irr = 1 mA RL = 100 Ω
5
ns
Fig. 1-2:
current (typical values, high level).
Forward voltage drop versus forward
Fig. 1-1:
current (typical values, low level).
Forward voltage drop versus forward
IFM(A)
5E-1
IFM(A)
2.00E-2
1.80E-2
Tj=100°C
Tj=100°C
1.60E-2
1.40E-2
1E-1
Tj=25°C
1.20E-2
Tj=50°C
Tj=50°C
1.00E-2
8.00E-3
6.00E-3
4.00E-3
2.00E-3
0.00E+0
1E-2
Tj=25°C
VFM(V)
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
VFM(V)
1E-3
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
2/5
BAT54J / W / AW / CW / SW
Fig. 3:
temperature.
Reverse leakage current versus junction
Fig. 2:
Reverse leakage current versus reverse
voltage applied (typical values).
IR(µA)
IR(µA)
1E+2
1E+4
VR=30V
Tj=100°C
1E+3
1E+2
1E+1
1E+0
1E-1
1E-2
1E+1
Tj=50°C
1E+0
Tj=25°C
1E-1
Tj(°C)
VR(V)
1E-2
0
25
50
75
100
125
150
0
5
10
15
20
25
30
Fig. 5:
Relative variation of thermal impedance
Fig. 4:
voltage applied (typical values).
Junction capacitance versus reverse
junction to ambient versus pulse duration (epoxy
FR4 with recommended pad layout, e(Cu)=35 m)
µ
C(pF)
Zth(j-a)/Rth(j-a)
10
1.00
F=1MHz
Tj=25°C
δ = 0.5
5
2
δ = 0.2
0.10
0.01
δ = 0.1
T
Single pulse
tp
=tp/T
δ
tp(s)
VR(V)
1
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
1
2
5
10
20
30
Fig. 6:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
µ .)
printed circuit board FR4, copper thickness: 35 m
Rth(j-a) (°C/W)
600
550
500
450
400
350
300
P=0.2W
S(Cu) (mm²)
10 15 20 25 30 35 40 45 50
0
5
3/5
BAT54J / W / AW / CW / SW
PACKAGE MECHANICAL DATA
SOT-323
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
REF.
A
A1
A
A1
b
0.8
0.0
1.1 0.031
0.1 0.0
0.043
0.004
0.016
0.010
D
b
0.25
0.1
0.4 0.010
0.26 0.004
c
D
E
e
1.8
2.0
2.2 0.071 0.079 0.086
1.15 1.25 1.35 0.045 0.049 0.053
L
0.65
2.1
0.026
H
L
1.8
0.1
0
2.4 0.071 0.083 0.094
0.3 0.004 0.008 0.012
H
E
0.2
θ
θ
30°
0
30°
c
e
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BAT54J / W / AW / CW / SW
PACKAGE MECHANICAL DATA
SOD-323
DIMENSIONS
Millimeters Inches
H
A1
REF.
b
Min.
Max.
Min.
Max.
E
A
A1
b
1.17
0.1
0.046
0.004
0.017
0.01
0
0
0.25
0.1
0.44
0.25
1.8
0.01
A
D
c
0.004
0.06
D
1.52
1.11
2.3
0.071
0.057
0.106
0.02
c
Q1
E
1.45
2.7
0.044
0.09
H
L
0.1
0.46
0.41
0.004
0.004
L
Q1
0.1
0.016
Ordering type
BAT54W
Marking
D73
Package
SOT-323
SOT-323
SOT-323
SOT-323
SOD-323
Weight
0.006g
0.006g
0.006g
0.006g
0.005g
Base qty
3000
Delivery mode
Tape & reel
Tape & reel
Tape & reel
Tape & reel
Tape & reel
BAT54AW
BAT54CW
BAT54SW
BAT54J
D74
3000
D77
3000
D78
3000
86
3000
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
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© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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