ANRG08SC [ETC]

韩国ADS八键电容式触摸按键IC; 韩国ADS八键电容式触摸按键IC
ANRG08SC
型号: ANRG08SC
厂家: ETC    ETC
描述:

韩国ADS八键电容式触摸按键IC
韩国ADS八键电容式触摸按键IC

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ANRG08  
8-Ch Auto Sensitivity Calibration Capacitive Touch Sensor  
SPECIFICATION V2.1  
Marketing  
Q A  
Approval  
작성  
검토  
팀장  
JUNE, 2011  
ADSemiconductor  
ADSemiconductor®  
ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
Revision History  
Rev.  
Description of change  
Date  
Originator  
1.0  
Initial Release  
10.09.29  
KD PARK  
Initial BF time option  
To change chip ID by using OTPROM  
2.0  
10.12.03  
KD PARK  
24 SOP, 24 QFN(Full lead type) 추가  
Sensing Channels : CS0 CS7 CS1 CS8  
Parallel output ports : D0 D7 D1 D8  
Marking description 추가 : 16 TSSOP, 24 SOP, 24 QFN type  
package  
2.1  
11.06.09  
JY SONG  
Recommended Circuit Diagram : CS Pin Rs 직렬저항 추가  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
1. Specification  
1.1 General Feature  
8-Channel capacitive sensor with auto sensitivity calibration  
Available LED PWM drive up to 8 (ANRG08FB, ANRG08SC, ANRG08QL)  
Multi interface - I2C serial interface / Parallel outputs (ANRG08FB, ANRG08SC, ANRG08QL)  
Selectable output operation mode (Single output / Multi output)  
Adjustable 256 steps sensitivity  
Almost no external component needed  
Low current consumption  
Embedded common and normal noise elimination circuit  
RoHS compliant 16 TSSOP, 24 MLF(Punch type), 24 SOP, 24 QFN(Full lead type) package  
1.2 Application  
Home appliances (TV, Monitor keypads)  
Mobile applications (PMP, MP3, Car navigation)  
Membrane switch replacement  
Sealed control panels, keypads  
Touch screen replacement application  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
1.3 Packages  
ANRG08FB (24MLF)  
ANRG08TA (16TSSOP)  
ANRG08SC (24SOP)  
ANRG08QL (24QFN)  
Drawings not to scale  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
2 Pin Description  
VDD, GND  
Supply voltage and ground pin.  
R.N.D  
Radio frequency Noise Detection pin. Normally, R.N.D pin does not connect to anywhere.  
But, in radio frequency noise environment, this pin must form a pattern line on PCB.  
CS1~CS8  
Capacitive sensor input pins.  
VPP  
VPP is external supply voltage for OTP writing.  
D1~D8  
Parallel output ports of CS1~CS8 respectively / LED PWM drive output ports. The structure of these  
parallel output ports is open drain NMOS for active low output level operation.  
SCL, SDA  
SCL is I2C clock input pin and SDA is I2C data input-output pin. These ports have internal pull-up resistor.  
In case of not use, this pin must be not connected to any circuitry.  
INT  
Touch sensing interrupt output pin.  
LDO  
LDO on-off control output pin.  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
2.1 ANRG08TA (16 TSSOP package)  
Pin No.  
Name  
CS2  
CS3  
CS4  
CS5  
CS6  
CS7  
SCL  
I/O  
Description  
Protection  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
1
2
3
4
5
6
7
Analog Input Capacitive sensor input 2  
Analog Input Capacitive sensor input 3  
Analog Input Capacitive sensor input 4  
Analog Input Capacitive sensor input 5  
Analog Input Capacitive sensor input 6  
Analog Input Capacitive sensor input 7  
Digital Input  
Digital  
I2C clock input  
I2C data input-output  
8
SDA  
VDD/GND  
Input / Output Open drain NMOS structure  
Ground Supply ground  
Analog Input Radio frequency Noise Detection pin  
9
GND  
R.N.D  
N.C.  
VDD  
10  
11  
12  
VDD/GND  
-
-
No Connection  
No Connection  
-
-
N.C.  
Touch sensing interrupt output  
Open drain NMOS structure  
13  
INT  
Digital Output  
VDD/GND  
14  
15  
16  
VPP  
VDD  
CS1  
Power  
Power  
External OTP writing Power (11.5V~12.5V)  
Power (3.0V~5.5V)  
GND  
GND  
Analog Input Capacitive sensor input 1  
VDD/GND  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
2.2 ANRG08FB (24 MLF package)  
Pin No.  
Name  
CS4  
CS5  
CS6  
CS7  
CS8  
SCL  
I/O  
Description  
Protection  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
1
2
3
4
5
6
Analog Input Capacitive sensor input 4  
Analog Input Capacitive sensor input 5  
Analog Input Capacitive sensor input 6  
Analog Input Capacitive sensor input 7  
Analog Input Capacitive sensor input 8  
Digital Input  
Digital  
Input / Output Open drain NMOS structure  
I2C clock input  
I2C data input-output  
7
SDA  
VDD/GND  
8
9
GND  
R.N.D  
LDO  
Ground Supply ground  
VDD  
Analog Input Radio frequency Noise Detection pin  
Digital Output LDO on-off control output  
VDD/GND  
VDD/GND  
10  
Parallel output of CS1  
Digital Output LED PWM drive output1  
Open drain NMOS structure  
11  
12  
13  
14  
15  
16  
17  
18  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
Parallel output of CS2  
Digital Output LED PWM drive output2  
Open drain NMOS structure  
Parallel output of CS3  
Digital Output LED PWM drive output3  
Open drain NMOS structure  
Parallel output of CS4  
Digital Output LED PWM drive output4  
Open drain NMOS structure  
Parallel output of CS5  
Digital Output LED PWM drive output5  
Open drain NMOS structure  
Parallel output of CS6  
Digital Output LED PWM drive output6  
Open drain NMOS structure  
Parallel output of CS7  
Digital Output LED PWM drive output7  
Open drain NMOS structure  
Parallel output of CS8  
Digital Output LED PWM drive output8  
Open drain NMOS structure  
19  
20  
VPP  
INT  
Power  
Digital Output  
Power  
External OTP writing Power (11.5V~12.5V)  
GND  
Touch sensing interrupt output  
Open drain NMOS structure  
VDD/GND  
21  
22  
23  
24  
VDD  
CS1  
CS2  
CS3  
Power (3.0V~5.5V)  
GND  
Analog Input Capacitive sensor input 1  
Analog Input Capacitive sensor input 2  
Analog Input Capacitive sensor input 3  
VDD/GND  
VDD/GND  
VDD/GND  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
2.3 ANRG08SC (24 SOP package)  
Pin No.  
Name  
CS6  
I/O  
Description  
Protection  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
1
2
3
4
Analog Input Capacitive sensor input 6  
Analog Input Capacitive sensor input 7  
Analog Input Capacitive sensor input 8  
CS7  
CS8  
SCL  
Digital Input  
Digital  
Input / Output Open drain NMOS structure  
I2C clock input  
I2C data input-output  
5
SDA  
VDD/GND  
6
7
GND  
Ground Supply ground  
VDD  
R.N.D  
Analog Input Radio frequency Noise Detection pin  
VDD/GND  
Parallel output of CS1  
Digital Output LED PWM drive output1  
Open drain NMOS structure  
8
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
Parallel output of CS2  
Digital Output LED PWM drive output2  
Open drain NMOS structure  
9
Parallel output of CS3  
Digital Output LED PWM drive output3  
Open drain NMOS structure  
10  
11  
12  
13  
14  
15  
Parallel output of CS4  
Digital Output LED PWM drive output4  
Open drain NMOS structure  
Parallel output of CS5  
Digital Output LED PWM drive output5  
Open drain NMOS structure  
Parallel output of CS6  
Digital Output LED PWM drive output6  
Open drain NMOS structure  
Parallel output of CS7  
Digital Output LED PWM drive output7  
Open drain NMOS structure  
Parallel output of CS8  
Digital Output LED PWM drive output8  
Open drain NMOS structure  
16  
17  
VPP  
INT  
Power  
Digital Output  
Power  
External OTP writing Power (11.5V~12.5V)  
GND  
Touch sensing interrupt output  
Open drain NMOS structure  
VDD/GND  
18  
19  
20  
21  
22  
23  
VDD  
CS1  
CS2  
CS3  
CS4  
N.C.  
Power (3.0V~5.5V)  
GND  
Analog Input Capacitive sensor input 1  
Analog Input Capacitive sensor input 2  
Analog Input Capacitive sensor input 3  
Analog Input Capacitive sensor input 4  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
-
-
No Connection  
24  
CS5  
Analog Input Capacitive sensor input 5  
VDD/GND  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
2.4 ANRG08QL (24 QFN package)  
Pin No.  
Name  
CS4  
CS5  
CS6  
CS7  
CS8  
SCL  
I/O  
Description  
Protection  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
1
2
3
4
5
6
Analog Input Capacitive sensor input 4  
Analog Input Capacitive sensor input 5  
Analog Input Capacitive sensor input 6  
Analog Input Capacitive sensor input 7  
Analog Input Capacitive sensor input 8  
Digital Input  
Digital  
Input / Output Open drain NMOS structure  
I2C clock input  
I2C data input-output  
7
SDA  
VDD/GND  
8
9
GND  
R.N.D  
LDO  
Ground Supply ground  
VDD  
Analog Input Radio frequency Noise Detection pin  
Digital Output LDO on-off control output  
VDD/GND  
VDD/GND  
10  
Parallel output of CS1  
Digital Output LED PWM drive output1  
Open drain NMOS structure  
11  
12  
13  
14  
15  
16  
17  
18  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
VDD/GND  
Parallel output of CS2  
Digital Output LED PWM drive output2  
Open drain NMOS structure  
Parallel output of CS3  
Digital Output LED PWM drive output3  
Open drain NMOS structure  
Parallel output of CS4  
Digital Output LED PWM drive output4  
Open drain NMOS structure  
Parallel output of CS5  
Digital Output LED PWM drive output5  
Open drain NMOS structure  
Parallel output of CS6  
Digital Output LED PWM drive output6  
Open drain NMOS structure  
Parallel output of CS7  
Digital Output LED PWM drive output7  
Open drain NMOS structure  
Parallel output of CS8  
Digital Output LED PWM drive output8  
Open drain NMOS structure  
19  
20  
VPP  
INT  
Power  
Digital Output  
Power  
External OTP writing Power (11.5V~12.5V)  
GND  
Touch sensing interrupt output  
Open drain NMOS structure  
VDD/GND  
21  
22  
23  
24  
VDD  
CS1  
CS2  
CS3  
Power (3.0V~5.5V)  
GND  
Analog Input Capacitive sensor input 1  
Analog Input Capacitive sensor input 2  
Analog Input Capacitive sensor input 3  
VDD/GND  
VDD/GND  
VDD/GND  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
3 Absolute Maximum Rating  
Battery supply voltage  
6V  
Maximum voltage on any pin VDD+0.3  
Maximum current on any PAD 100mA  
Power Dissipation  
800mW  
Storage Temperature  
Operating Temperature  
Junction Temperature  
-50 ~ 150℃  
-20 ~ 75℃  
150℃  
Note : Unless any other command is noted, all above are operated in normal temperature.  
4 ESD & Latch-up Characteristics  
4.1 ESD Characteristics  
Mode  
Polarity  
Max  
Reference  
8000V  
8000V  
8000V  
500V  
VDD  
VSS  
H.B.M  
Pos / Neg  
P to P  
VDD  
M.M  
Pos / Neg  
500V  
VSS  
500V  
P to P  
C.D.M  
-
1000V  
Field Induced Charge  
4.2 Latch-up Characteristics  
Mode  
Polarity  
Positive  
Negative  
Positive  
Max  
100mA  
-100mA  
8.5V  
Reference  
JESD78A  
I Test  
V supply over 5.0V  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
5 Electrical Characteristics  
Note : VDD=3.3V, Typical system frequency (Unless otherwise noted), TA = 25℃  
Characteristics  
Symbol  
Test Condition  
Min  
Typ  
Max  
Units  
Power supply requirement and current consumption  
Operating voltage  
OTP writing voltage  
VDD  
VPP  
3.0  
5.5  
V
V
11.5  
12  
12.5  
VDD =  
3.3V  
Current consumption  
IDD  
Standby state @10MHz  
-
0.75  
-
Reset and input level  
Internal reset voltage  
Input high level  
VDD_RST  
VIH  
VIL  
TA = 25℃  
| IIH | +5μA  
| IIL | +5μA  
-
VDD*0.6  
2.6  
-
VDD+0.3  
V
V
V
Input low level  
0.3  
-
VDD*0.3  
Slow calibration speed  
Normal calibration speed  
Fast calibration speed  
100  
80  
-
-
-
Self calibration time after  
system reset  
TCAL  
-
msec  
-
60  
Internal P/U resister of  
SDA, SCL, INT and LDO  
Touch sensing performance  
Minimum detective  
capacitance difference  
Sense input  
RP/U  
-
30  
-
kΩ  
ΔCMIN  
CS  
0.1  
-
-
-
-
Ω
50  
capacitance range1  
Output impedance  
(open drain)  
ΔC > ΔCMIN  
ΔC < ΔCMIN  
-
-
12  
-
-
Zo  
30M  
System performance  
Max. output current  
(LED drive current)  
LED PWM control2  
Sensitivity control3  
IOUT  
Per unit drive output port  
-
-
8.0  
NPWM  
-
-
16  
256  
-
-
step  
step  
Max. I2C SCL clock speed  
Touch expired time  
LDO control output high  
level  
fSCL_MAX  
TEX  
Maximum internal I2C clock  
Normal calibration speed  
-
-
-
30  
2
-
MHz  
sec  
VOH  
VOL  
VDD*0.9  
-
-
-
-
V
V
LDO control output low  
level  
VDD*0.1  
1
The sensitivity can be decreased with higher parallel capacitance of CS pin including parasitic capacitance made by  
neighbor GND or other pattern. The series resistor(under 1k) of CS can be used in noisy condition to avoid mal-function  
from external surge and ESD.  
2
Refer to the chapter 8.2.12. LED luminance control register  
3
Refer to the chapter 8.2.9. Sensitivity register  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
6 ANRG08 Implementation  
6.1 Typical current consumption  
ANRG08 uses internal bias circuit, so internal clock frequency and current consumption is fixed  
and no external bias circuit is needed. Internal clock frequency and calibration speed can be  
changed by I2C register setting4. Faster calibration speed needs more current consumption than  
normal or slower calibration speed. Slow calibration speed isn’t recommended if it has not  
problem of current consumption.  
Internal bias circuit can make the circuit design simple and reduce external components.  
6.2 CS implementation  
ANRG08 has 256 step selections of sensitivity and internal surge protection resister. Sensitivity  
of each sensing channel (CS) can be independently controlled on others. External components  
of CS pin such as series resistor or parallel capacitor isnt necessary. The parallel parasitic  
capacitance of CS pins caused by touch line, touch pad and neighbor GND or other pattern  
may affect sensitivity. The sensitivity will be decreased when bigger parallel parasitic  
capacitance of CS pin is added.  
Parallel capacitor (CS1~S8) of CS pin is useful in case of detail sensitivity mediation is required  
such as for complementation sensitivity difference between channels. Same as above parallel  
parasitic capacitance, sensitivity will be decreased when a big value of parallel capacitor  
(CS1~S8) is used. Under 50pF capacitor can be used as sensitivity meditation capacitor and a  
few pF is usually used. The RS, serial connection resistor of CS pins, may be used to avoid  
mal-function from external surge and ESD. (It might be optional.) From 200Ω to 1kΩ is  
recommended for RS. Refer to below CS pins application figure.  
RS8  
CS8<<  
Touch PAD8  
CS8  
RS1  
Touch PAD1  
CS1<<  
CS1  
4
Refer to 8.2.5 Clock control register.  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
The ANRG08 has eight independent touch sensor input from CS1 to CS8. The internal touch  
decision process of each channel is separated from others. Therefore eight channel touch key  
board application can be designed by using only one ANRG08 without coupling problems.  
The size and shape of PAD might have influence on the sensitivity. The sensitivity will be optimal  
when the size of PAD is approximately an half of the first knuckle (its about 10 ㎜x 7 ). The  
connection line of CS to touch PAD is recommended to be routed as short as possible to  
prevent from abnormal touch detect caused by connection line. The unused CS pin should not  
be connected with the ground.  
6.3 LED drive implementation (ANRG08FB, ANRG08SC, ANRG08QL)  
ANRG08 has a function to control the LED using D1~D8 ports. For using D1~D8 as LED driver  
ports, LEDs and resisters must be equipped as below figure, and write the port_moderegister5  
as 1. D1 ~ D8 ports can drive LEDs by PWM_ctrlxregister6 control. ANRG08 can drive up to 8  
LED as below method.  
VDD  
VDD  
LED1  
LED8  
RD8  
RD1  
D1 <<  
D8 <<  
6.4 Parallel output (D1~D8 implementation, ANRG08FB, ANRG08SC,  
ANRG08QL)  
ANRG08 acts as active low parallel output mode. Structures of D1~D8 are same. In case of  
active low parallel output mode, parallel output ports (D1~D8) have an open drain NMOS  
structure. For this reason, the parallel output mode of ANRG08 needs ROUT as below figures.  
The maximum output drive current is 8mA, so over a few kΩ must be used as ROUT. Normally  
10kΩ is used as ROUT  
.
5
Refer to the chapter 8.2.13. Port mode control register  
6
Refer to the chapter 8.2.12. LED luminance control register  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
VDD  
ROUT1  
ROUT2  
OUTPUT1  
D1  
OUTPUT2  
D2  
ROUT8  
OUTPUT8  
D8  
Active low parallel output mode circuit  
6.5 INT (Interrupt output) Implementation  
An INT pin is for the touch sensing interrupt output. The interrupt pulse is generated only during  
short period of every each channel touch start point and touch end point. Interrupt pulse has  
logical low level. INT has NMOS open drain structure and internal pull-up resister of which value  
is 30kΩ typical.  
6.6 LDO implementation (ANRG08FB, ANRG08QL)  
LDO pin acts as LDO on-off control output pin. Because of internal pull-up resister of LDO,  
external pull-up resister can be removed. Writing 1on ‘micom_sleep’ bit of ‘global_ctrl0’  
register7 make LDO output low. This low LDO output can be used as LDO which offers MCU  
power off signal. Any touch output writes 0on ‘micom_sleep’ bit of ‘global_ctrl0’ register, and  
LDO output level becomes high again.  
7
Refer to the chapter 8.2.2. Global option control 0.  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
6.7 Change initial reset register values (OTP writing)  
ANRG08 has eight integrated OTP (One Time Programmable) ROM cells. So, initial reset register  
values can be rewritten up to eight times. One OTP ROM cell size is 64-byte. User can write the  
data eight times to the OTP.  
There are three operation modes about OTP read/write. These are automatically load operation  
mode, writing operation mode and reading operation mode.  
Automatically load operation mode  
After power reset, ANRG08 start to read the LSB of 00H address in each OTP ROM cells from  
8th to 1st. ANRG08 automatically loads the data of the first OTP ROM cell of which LSB of 00H  
address has 0into the control register. And then ANRG08 is starting to work with control  
register values that are loaded from OTP ROM cell. If there are no OTP ROM cell which has ‘0’ in  
LSB of 00H address, ANRG08 is working with initial control register value.  
Writing operation mode  
OTP ROM cell writing provides the flexible reset register values that control all the operation  
options of ANRG08. So, additional communication programs on MCU for operation option  
select or register value setting are not required.  
There are two writing operation modes. When the ‘write_all’ bit of ‘mtp_cmd’ register8 is ‘0’,  
single byte writing mode is activated. User can select OTP ROM cell and address on which new  
register value is wanted to be written. OTP ROM cell selection is enabled by writing ‘mtp_sel_en’  
bit of ‘usr_mtp_sel’ register9 1. When ‘mtp_sel_en’ bit of ‘usr_mtp_sel’ register is 0, OTM ROM  
cell is automatically selected from 1st to 8th. And, ‘org_usr_mtp_sel’ bits of ‘usr_mtp_sel’  
register are for the OTP ROM selection. Read or write command register is ‘mtp_cmd’ registers  
and user can start writing by wr_startbit of ‘mtp_cmd’ register setting as 1. This wr_startbit  
of ‘mtp_cmd’ register is recovered as 0at ending of writing.  
When the ‘write_all’ bit of ‘mtp_cmd’ register is ‘1’, all bytes writing operation mode is activated.  
User can write all register frame data on selected OTP ROM cell. At this writing operation mode,  
only OTP ROM cell has to be selected. Writing start is same as single byte writing mode.  
OTP ROM writing needs another 11.5V power supply voltage. VPP pin is for this writing 11.5V  
power.  
Reading operation mode  
When OTP ROM data is required to be read, user can read all the OTP ROM cell date by reading  
operation. When the ‘read_all’ bit of ‘mtp_cmd’ register is ‘0’, user can read one byte data that  
is written on selected address of selected OTP ROM cell. OTP ROM cell and address selection  
are same as single byte writing operation mode. When ‘mtp_sel_en’ bit of ‘usr_mtp_sel’ register  
is 0, OTM ROM cell is automatically selected from 8th to 1st.  
When the ‘read_all’ bit of ‘mtp_cmd’ register is ‘1’, user can read all data on selected OTP ROM  
cell.  
OTP ROM read start command bit is rd_startbit of ‘mtp_cmd’ register. When the rd_startbit  
of ‘mtp_cmd’ register is 1, ANRG08 starts to read. This rd_startbit of ‘mtp_cmd’ register is  
recovered as 0at ending of reading.  
8
Refer to the chapter 8.2.18. OTP ROM control register.  
9
Refer to the chapter 8.2.17. OTP ROM cell select register.  
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6.8 SCL, SDA implementation  
SCL is I2C clock input and SDA is I2C data input-output. These ports have internal pull-up  
resistor. SCL has Schmitt trigger input structure to prevent clock signal from being broken.  
Maximum supported I2C clock frequency is 2MHz. SDA has NMOS open drain structure and  
internal pull-up resister of which value is 30kΩ typical. So, according to communication speed  
a few kΩ resister must be used as pull-up resister for proper data pulse rising time. For more  
details refer to Chapter 7. I2C Interface.  
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7 I2C Interface  
7.1 I2C Enable / Disable  
If the SDA or SCL signal goes to low, I2C control block is enabled automatically. And if the SDA  
and SCL signal maintain high during about 2 us, I2C control block is disabled automatically also.  
7.2 Start & stop condition  
Start Condition (S)  
Stop Condition (P)  
Repeated Start (Sr)  
7.3 Data validity  
The SDA should be stable when the SCL is high and the SDA can be changed when the SCL is  
low.  
7.4 Byte format  
The byte structure is composed with 8Bit data and an acknowledge signal.  
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7.5 Acknowledge  
It is a check bit whether the receiver gets the data from the transmitter without error or not. The  
receiver will write ‘0’ when it received the data successfully and ‘1’ if not.  
7.6 First byte  
7.6.1 Slave address  
It is the first byte from the start condition. It is used to access the slave device. The initial chip  
address of ANRG08 is 48hex number and the chip address is possible to change with I2C  
Address of ANRG08register10.  
7.6.2 R/W  
The direction of data is decided by the bit and it follows the address data.  
MSB  
LSB  
R/W  
Address  
7 bit  
1bit  
10  
Refer to the chapter 8.2.3. I2C address of ANRG08.  
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7.7 Transferring data  
7.7.1 Write operation  
The byte sequence is as follows:  
1. The first byte gives the device address plus the direction bit (R/W = 0).  
2. The second byte contains the internal address of the first register to be accessed.  
3. The next byte is written in the internal register. Following bytes are written in successive  
internal registers.  
4. The transfer lasts until stop conditions are encountered.  
5. The ANRG08 acknowledges every byte transfer.  
7.7.2 Read operation  
The address of the first register to read is programmed in a write operation without data, and  
terminated by the stop condition. Then, another start is followed by the device address and  
R/W= 1. All following bytes are now data to be read at successive positions starting from the  
initial address.  
7.7.3 Read/Write Operation  
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7.8 I2C write and read operations in normal mode  
The following figure represents the I2C normal mode write and read registers.  
Write register 0x00 to 0x01 with data AA and BB  
Device  
Address 0x48  
Register  
Address 0x00  
Start  
ACK  
ACK  
Data AA  
ACK  
Data BB  
ACK  
Stop  
Read register 0x00 and 0x01  
Device  
Address 0x48  
Register  
Address 0x00  
Start  
ACK  
ACK  
ACK  
Stop  
Device  
Start  
ACK  
Data Read AA  
Data Read BB  
Stop  
ACK  
Address 0x49  
From Slave to Master  
From Master to Slave  
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8 ANRG08 Control Register List  
Note: The unused bits (defined as reserved) in I2C registers must be kept to zero.  
Note: The reset value of ANRG08 can be changed by MTP ROM writing.  
8.1 I2C Register Map  
Reset  
Bit name of each bytes  
Addr.  
Name  
Value  
(Bin)  
(Hex)  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
ch_enable  
/soft_rst  
01H 1111 1111  
05H 1--- 0---  
ch8_en  
1
ch7_en  
-
ch6_en  
-
ch5_en  
ch4_en  
ch3_en  
-
ch2_en  
-
ch1_en  
global_ctrl0  
i2c_id  
-
micom_sleep  
-
06H 0100 1000  
2AH 0000 0000  
34H 0000 0110  
36H 0100 1100  
37H 0101 1111  
38H 0001 11-0  
39H 0001 1100  
3AH 0001 1100  
3BH 0001 1100  
3CH 0001 1100  
3DH 0001 1100  
3EH 0001 1100  
3FH 0001 1100  
40H 0001 1100  
41H 0000 0000  
42H 0000 0000  
43H 0000 0000  
44H 0000 0000  
45H 0000 0000  
46H 0000 0000  
4FH 0000 0000  
50H 0000 0000  
i2c_id  
wr_bit  
o_ch1  
output  
o_ch8  
o_ch7  
init_cal_opt  
response_off_ctrl  
1
o_ch6  
0
o_ch5  
o_ch4  
o_ch3  
o_ch2  
bf_mode  
-
clock_ctrl  
sts_clr_en  
clk_sel  
response_ctrl  
rb_sel  
global_ctrl1  
state_count  
global_ctrl2  
sensitivity1  
sensitivity2  
sensitivity3  
sensitivity4  
sensitivity5  
sensitivity6  
sensitivity7  
sensitivity8  
cal_speed  
cal_BS_speed  
PWM_ctrl1  
PWM_ctrl2  
PWM_ctrl3  
PWM_ctrl4  
port_mode  
rd_ch_H1  
software_rst  
0
cal_pre_scaler  
imp_sel  
sin_multi_mode  
cal_hold_time  
clk_off  
sensitivity01  
sensitivity02  
sensitivity03  
sensitivity04  
sensitivity05  
sensitivity06  
sensitivity07  
sensitivity08  
rnd_bf_up  
rnd_bs_up  
rnd_bf_down  
rnd_bs_down  
sen_bf_up  
sen_bs_up  
sen_bf_down  
sen_bs_down  
pwm_d2  
pwm_d4  
pwm_d6  
pwm_d8  
pwm_d1  
pwm_d3  
pwm_d5  
pwm_d7  
pmod_d8  
pmod_d7  
pmod_d6  
pmod_d5  
pmod_d4  
pmod_d3  
pmod_d2  
pmod_d1  
rd_ch_L1  
rd_ch_H1  
rd_ch_L1  
51H  
---- ---0  
-
-
-
-
-
-
-
Percent_H  
Percent_M  
Percent_L  
rd_ch_H2  
52H 0000 0000  
53H 0000 0000  
54H 0000 0000  
56H 0000 0000  
touch_percent[24:17]  
touch_percent[16:9]  
touch_percent[8:1]  
rd_ch_H2  
rd_ch_L2  
57H  
59H  
---- ---0  
---- 00r0  
-
-
-
-
-
-
-
rd_ch_L2  
RAM_ctrl  
clk_mtp_opt  
ram_chk_end  
ram_chk_start  
RAM_data  
usr_mtp_sel  
mtp_cmd  
5AH 0000 0000  
5BH 0000 0000  
5CH 0000 0000  
ram_check_data  
0
0
-
0
0
0
mtp_sel_en  
read_all  
org_usr_mtp_sel  
write_all  
0
0
wr_start  
rd_start  
mtp_status  
otp_add_sel  
otp_wr_data  
otp_rd_data  
5DH  
---- ----  
org_mtp_sel  
wr_done_sts  
otp_add_sel  
rd_done_sts  
no_load_sts  
5EH 0000 0000  
5FH 0000 0000  
0
0
otp_wr_data  
otp_rd_data  
60H  
---- ----  
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8.2 Details  
8.2.1 Channel enable / reset register  
Type: R/W  
Address  
Register Name  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
ch_enable  
/soft_rst  
ch8_en  
ch7_en  
ch6_en  
ch5_en  
ch4_en  
ch3_en  
ch2_en  
ch1_en  
01h  
Description  
Enable, disable and reset of each channel control register.  
Bit name  
Reset value  
Function  
Channel enable / disable and Channel reset (chx_en is control bit for CSx channel)  
0 : Channel disable and sensing channel reset  
1 : Channel enable  
chx_en  
1
8.2.2 Global option control register 0  
Type: R/W  
Address  
Register Name  
global_ctrl0  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
micom_  
sleep  
1
0
-
-
-
-
-
05h  
Description  
Operation mode selection and LDO ON/OFF signal control register.  
Bit name  
Reset value  
Function  
LDO output control register. This signal can go out through LDO port.  
micom_  
sleep  
0
0 : LDO ON  
1 : LDO OFF  
8.2.3 I2C address of ANRG08  
Type: R/W  
Address  
06h  
Register Name  
i2c_id  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
i2c_id  
wr_bit  
Description  
Chip address of ANRG08 control register. User can change this address value with OTP ROM write. During  
reset period OTP ROM data is loaded to registers.  
Bit name  
wr_bit  
Reset value  
0
Function  
Write/Read address selection - 0 : Write address, 1 : Read address  
Chip address of ANRG08.  
i2c_id  
0100100  
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8.2.4 Output data  
Type: R  
Address  
2Ah  
Register Name  
output  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
o_ch8  
o_ch7  
o_ch6  
o_ch5  
o_ch4  
o_ch3  
o_ch2  
o_ch1  
Description  
The output data register from channel 1 to channel 8.  
Bit name  
Reset value  
Function  
o_chx is output bit for CSx channel  
0 : No touch detected  
o_chx  
0
1 : Touch detected  
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8.2.5 Clock control register  
Type: R/W  
Address  
Register Name  
clock_ctrl  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
sts_clr_e  
n
init_cal_opt  
clk_sel  
rb_sel  
34h  
Description  
This register controls the global options of ANRG08  
Bit name  
Reset value  
Function  
ANRG08 provides three internal calibration speeds with this register.  
00, 01 : Fast  
10 : Normal  
11 : Slow  
rb_sel  
10  
ANRG08 provides four internal calibration speeds with this register.  
00 : Fast  
clk_sel  
01  
01 : Normal  
10 : Slow  
11 : Slowest  
Clear the mtp_statusregister (Address: 5DH) control bit.  
sts_clr_en  
0
0 : Not clear  
1 : Clear  
To control the initial BF time.  
init_cal_opt  
000  
init_cal_opt[2:0] * 5 + 5 (seconds)  
8.2.6 Global option control register 1  
Type: R/W  
Address  
Register Name  
global_ctrl1  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
software  
_rst  
response_off_ctrl  
response_ctrl  
bf_mode  
36h  
Description  
This register controls the global options of ANRG08  
Bit name  
Reset value  
Function  
Software reset control bit.  
0 : Not reset  
software_rst  
0
1 : Reset  
Operation mode selection  
0 : Normal mode  
1 : BF mode  
bf_mode  
0
Numbers of continuous touch detections for touch decision.  
response_ctrl[2:0] + 1 (Maximum time : 7)  
response_ctrl  
011  
010  
Numbers of continuous touch off detections for touch off decision.  
response_off_ ctrl[2:0] + 1 (Maximum time : 7)  
response_off_ctrl  
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8.2.7 State count control register  
Type: R/W  
Address  
Register Name  
state_count  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
0
1
0
cal_pre_scaler  
37h  
Description  
Register to set the number of the continuous inputted noise through RND channel and to set the pre-scaler for  
the calibration speed.  
Bit name  
Reset value  
Function  
The pre-scaler for the calibration speed.  
cal_pre_scaler  
1 1111  
cal_pre_scaler[4:0] x 16ms (1-period)  
8.2.8 Global option control register 2  
Type: R/W  
Address  
38h  
Register Name  
global_ctrl2  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
sin_mult  
i_mode  
imp_sel  
cal_hold_time  
-
clk_off  
Description  
This register controls the global options of ANRG08.  
Bit name  
Reset value  
Function  
System clock off control bit.  
0 : Not clock off  
clk_off  
0
1 : Clock off  
cal_hold_tim  
e
Output expiration Time control.  
0111  
0
cal_hold_time[3:0] x 4 ( seconds)  
Single/Multi output operation mode selection bit.  
0 : Single output mode  
sin_multi_mo  
de  
1 : Multi output mode  
Impedance of the sensing wire of all channels control bit.  
0 : High impedance  
imp_sel  
0
1 : Low impedance except sensing period.  
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8.2.9 Sensitivity register  
Type: R/W  
Address  
39H  
Register Name  
sensitivity1  
sensitivity2  
sensitivity3  
sensitivity4  
sensitivity5  
sensitivity6  
sensitivity7  
sensitivity8  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
sensitivity01  
sensitivity02  
sensitivity03  
sensitivity04  
sensitivity05  
sensitivity06  
sensitivity07  
sensitivity08  
3AH  
3BH  
3CH  
3DH  
3EH  
3FH  
40H  
Description  
This register controls the global options of ANRG08.  
Bit name  
Reset value  
Function  
Sensitivities of each channel.  
sensitivity0x  
0001 1100  
Sensitivity of CSx channel: {(sensitivity0x[7:0] x 0.025)} (%).  
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8.2.10 Calibration speed control register  
Type: R/W  
Address  
41H  
Register Name  
cal_speed  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
rnd_bf_up  
rnd_bf_down  
sen_bf_up  
sen_bf_down  
Description  
Calibration speed can be controlled by this cal_speedregister at BF mode.  
Bit name  
Reset value  
Function  
Sense channel down calibration speed at BF mode control bits.  
00 : Fastest  
01 : Fast  
sen_bf_down  
00  
10 : Normal  
11 : Slow  
Sense channel up calibration speed at BF mode control bits.  
00 : Fastest  
01 : Fast  
10 : Normal  
11 : Slow  
sen_bf_up  
rnd_bf_down  
rnd_bf_up  
00  
00  
00  
RND channel down calibration speed at BF mode control bits.  
00 : Fastest  
01 : Fast  
10 : Normal  
11 : Slow  
RND channel up calibration speed at BF mode control bits.  
00 : Fastest  
01 : Fast  
10 : Normal  
11 : Slow  
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8.2.11 Calibration speed control register at BS mode  
Type: R/W  
Address  
42H  
Register Name  
cal_BS_speed  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
rnd_bs_up  
rnd_bs_down  
sen_bs_up  
sen_bs_down  
Description  
Calibration speed can be controlled by this cal_BS_speedregister at BS mode.  
Bit name  
Reset value  
Function  
Sense channel down calibration speed at BS mode control bits.  
00 : Fastest  
01 : Fast  
sen_bs_down  
00  
10 : Normal  
11 : Slow  
Sense channel up calibration speed at BS mode control bits.  
00 : Fastest  
01 : Fast  
10 : Normal  
11 : Slow  
sen_bs_up  
rnd_bs_down  
rnd_bs_up  
00  
00  
00  
RND channel down calibration speed at BS mode control bits.  
00 : Fastest  
01 : Fast  
10 : Normal  
11 : Slow  
RND channel up calibration speed at BS mode control bits.  
00 : Fastest  
01 : Fast  
10 : Normal  
11 : Slow  
8.2.12 LED luminance control register  
Type: R/W  
Address  
43h  
Register Name  
PWM_ctrl1  
PWM_ctrl2  
PWM_ctrl3  
PWM_ctrl4  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
pwm_d2  
pwm_d1  
pwm_d4  
pwm_d6  
pwm_d8  
pwm_d3  
pwm_d5  
pwm_d7  
44h  
45h  
46h  
Description  
LED luminance can be controlled by PWM_ctrlxregister.  
Bit name  
Reset value  
Function  
The LED PWM control bits of Dx port.  
0000 : The minimum low duty  
pwm_dx  
0000  
1111 : The maximum low duty  
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8.2.13 Port mode control register  
Type: R/W  
Address  
Register Name  
port_mode  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
pmod_d  
8
pmod_d  
7
pmod_d  
6
pmod_d  
5
pmod_d  
4
pmod_d  
3
pmod_d  
2
pmod_d  
1
4Fh  
Description  
This register controls the mode of output port.  
Bit name  
Reset value  
Function  
Select the output port operation mode of each channels.  
0 : Parallel output mode  
pmod_dx  
0
1 : LED drive mode  
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8.2.14 Sense, reference count read register  
Type: R  
Address  
50h  
Register Name  
rd_ch_H1  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
rd_ch_H1  
rd_ch_L1  
-
-
-
-
-
-
-
rd_ch_L1  
51h  
touch_percent[24:17]  
touch_percent[16:9]  
touch_percent[8:1]  
rd_ch_H2  
Percent_H  
Percent_M  
Percent_L  
rd_ch_H2  
52h  
53h  
54h  
56h  
rd_ch_L2  
-
-
-
-
-
-
-
rd_ch_L2  
57h  
Description  
ANRG08 provides the special function to read sense count of each channels or reference count.  
Bit name  
Reset value  
Function  
Read channel indication register.  
00000001 : R.N.D channel  
00000010 : CS1 channel  
00000100 : CS2 channel  
00001000 : CS3 channel  
00010000 : CS4 channel  
00100000 : CS5 channel  
01000000 : CS6 channel  
10000000 : CS7 channel  
rd_ch_H1  
Read only  
Read channel indication register.  
1 : CS8 channel  
rd_ch_L1  
Read only  
Read only  
Read only  
Read only  
The percent data of RND channel and sense channels.  
[24:17] bits of the touch percent data.  
touch_percent[24:17]  
touch_percent[16:9]  
touch_percent[8:1]  
The percent data of RND channel and sense channels.  
[16:9] bits of the touch percent data.  
The percent data of RND channel and sense channels.  
[8:1] bits of the touch percent data.  
Read channel confirm register.  
00000001 : R.N.D channel  
00000010 : CS1 channel  
00000100 : CS2 channel  
00001000 : CS3 channel  
00010000 : CS4 channel  
00100000 : CS5 channel  
01000000 : CS6 channel  
10000000 : CS7 channel  
rd_ch_H2  
rd_ch_L2  
Read only  
Read only  
Read channel confirm register.  
1 : CS8 channel  
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8.2.15 Ram control register  
Type: R/W  
Address  
Register Name  
RAM_ctrl  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
ram_chk_en ram_chk_sta  
clk_mtp_opt  
59h  
d
rt  
Description  
These registers are the command register and status register for RAM access.  
Bit name  
Reset value  
Function  
ram_chk_star  
t
0
RAM cells check start command bit  
RAM cells check finish status bit  
ram_chk_end  
Read only  
Clock division register for MTP reading and writing.  
00 : Fast  
clk_mtp_opt  
00  
01 : Normal  
10 : Slow  
11 : Slowest  
8.2.16 Ram check data register  
Type: R/W  
Address  
5Ah  
Register Name  
RAM_data  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
ram_check_data  
Description  
This register is the data register for RAM check.  
Bit name  
Reset value  
Function  
ram_check_d  
ata  
0000 0000  
The data register to test the RAM interface and RAM cells.  
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8.2.17 OTP ROM cell select register  
Type: R/W  
Address  
5Bh  
Register Name  
usr_mtp_sel  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
0
0
0
mtp_sel_en  
org_usr_mtp_sel  
Description  
The OTP ROM cells of ANRG08 are made up of eight memory cells of 64 bytes. ANRG08 provides the way to  
access OTP ROM cells with this register. User can select the OTP ROM cell with „org_usr_mtp_sel‟ bits and if  
user doesn‟t want to select the OTP ROM cell directly, „mtp_sel_en‟ bit leaves „0‟, then OTP ROM cell is  
selected the automatically.  
Bit name  
Reset value  
Function  
OTP ROM cell selection bits.  
0000, 0001 : 1st OTP ROM cell  
0010 : 2nd OTP ROM cell  
0011 : 3rd OTP ROM cell  
0100 : 4th OTP ROM cell  
0101 : 5th OTP ROM cell  
0110 : 6th OTP ROM cell  
0111 : 7th OTP ROM cell  
1000 : 8th OTP ROM cell  
org_usr_mtp_  
sel  
0000  
OTP ROM cell selection enable bit.  
mtp_sel_en  
0
0 : Select OTP ROM cell automatically  
1 : Select OTP ROM cell by user  
8.2.18 OTP ROM control register (OTP ROM command)  
Type: R/W  
Address  
5Ch  
Register Name  
mtp_cmd  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
0
0
write_all  
read_all  
0
0
wr_start  
rd_start  
Description  
OTP ROM commands to access.  
Bit name  
Reset value  
Function  
Reading selected OTP ROM cell start command bit.  
rd_start  
0
0 : Dont start  
1 : Start to read  
Writing on selected OTP ROM cell start command bit.  
0 : Dont write  
wr_start  
read_all  
write_all  
0
0
0
1 : Start to write  
Unit of reading the selected OTP ROM cell control bit.  
0 : 1-Byte reading  
1 : All bytes of selected OTP ROM cell reading  
Unit of writing on selected OTP ROM cell control bit.  
0 : 1-Byte writing  
1 : All bytes of selected OTP ROM cell writing  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
8.2.19 OTP ROM status register  
Type: R  
Address  
Register Name  
mtp_status  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
wr_done  
_sts  
rd_done  
_sts  
no_load_  
sts  
-
org_mtp_sel  
5Dh  
Description  
This register indicates the status of operation of selected one OTP ROM cell.  
Bit name  
Reset  
Function  
This bit indicates whether some data are loaded from OTP ROM cells.  
0 : There is some data loaded from OTP ROM cells  
1 : No data loaded from OTP ROM cells  
no_load_sts  
-
This bit indicates the end of reading.  
rd_done_sts  
wr_done_sts  
-
-
0 :  
1 : End of reading  
This bit indicates the end of writing.  
0 :  
1 : End of writing  
These bits indicate that OTP ROM cell is loaded at initial time.  
0000 : No loaded  
0001 : 1st OTP ROM cell  
0010 : 2nd OTP ROM cell  
0011 : 3rd OTP ROM cell  
org_mtp_sel  
-
0100 : 4th OTP ROM cell  
0101 : 5th OTP ROM cell  
0110 : 6th OTP ROM cell  
0111 : 7th OTP ROM cell  
1000 : 8th OTP ROM cell  
8.2.20 OTP ROM data address select register  
Type: R/W  
Address  
5Eh  
Register Name  
otp_add_sel  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
0
0
otp_add_sel  
Description  
Register for the specific address of selected OTP ROM cell. User can access OTP ROM data of specific address  
by leaving „read_all‟ and „write_all‟ bits in the „mtp_cmd‟ register „0‟, selecting the OTP ROM cell with  
„usr_mtp_sel‟ register and selecting the specific address with this register.  
Bit name  
Reset  
Function  
Select specific address of selected OTP ROM cell.  
otp_add_sel[5:0] : Address  
otp_add_sel  
000000  
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8.2.21 OTP ROM data register to write  
Type: R/W  
Address  
5Fh  
Register Name  
otp_wr_data  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
otp_wr_data  
Description  
The data register to write on specific address of selected OTP ROM cell.  
Bit name  
Reset  
Function  
Data register to write.  
otp_wr_data[7:0] : Data  
otp_wr_data  
00000000  
8.2.22 OTP data register to read  
Type: R  
Address  
60h  
Register Name  
otp_rd_data  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
otp_rd_data  
Description  
The data register for reading data from specific address of selected OTP ROM cell.  
Bit name  
Reset  
Function  
Data register for reading OTP ROM data.  
otp_rd_data [7:0] : Data  
otp_rd_data  
---- ----  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
9 Recommended Circuit Diagram  
9.1 ANRG08TA (16 TSSOP)  
ANRG08TA (16TSSOP) Application Example Circuit for parallel output  
ANRG08TA is reset by internal reset circuit. VDD voltage rising time should be shorter than 100msec  
for proper operation.  
The VDD periodic voltage ripple over 50mV and the ripple frequency is lower than 10 kHz can cause  
wrong sensitivity calibration. To prevent above problem, power (VDD, GND) line of touch circuit  
should be separated from other circuit. Especially LED driver power line or digital switching circuit  
power line certainly should be treated to be separated from touch circuit.  
The CS patterns also should be routed as short as possible and the width of line might be about 0.25mm.  
Parallel capacitor of CS pin could be useful in case detail sensitivity mediation is required such as for  
complementation sensitivity difference between channels.  
Serial connection resistor of CS pins may be used to avoid mal-function from external surge and ESD.  
The capacitor that is between VDD and GND is an obligation. It should be located as close as possible  
from ANRG08TA.  
The CS pattern routing should be formed by bottom metal (opposite metal of touch PAD).  
The empty space of PCB must be filled with GND pattern to strengthen GND pattern and to prevent  
external noise from interfere with sensing frequency.  
VPPpin for 12V voltage input is needed at MTP ROM writing only.  
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9.2 ANRG08FB (24 MLF)  
ANRG08FB (24 MLF) Application Example Circuit  
ANRG08FB is reset by internal reset circuit. VDD voltage rising time should be shorter than 100msec  
for proper operation.  
Normally, R.N.D pin dose not connection to anywhere. But, in radio frequency noise environment,  
R.N.D pin must form a pattern line on PCB.  
The VDD periodic voltage ripple over 50mV and the ripple frequency is lower than 10 kHz can cause  
wrong sensitivity calibration. To prevent above problem, power (VDD, GND) line of touch circuit  
should be separated from other circuit. Especially LED driver power line or digital switching circuit  
power line certainly should be treated to be separated from touch circuit.  
The CS patterns also should be routed as short as possible and the width of line might be about 0.25mm.  
Parallel capacitor of CS pin could be useful in case detail sensitivity mediation is required such as for  
complementation sensitivity difference between channels.  
Serial connection resistor of CS pins may be used to avoid mal-function from external surge and ESD.  
The capacitor that is between VDD and GND is an obligation. It should be located as close as possible  
from ANRG08FB.  
The CS pattern routing should be formed by bottom metal (opposite metal of touch PAD).  
The empty space of PCB must be filled with GND pattern to strengthen GND pattern and to prevent  
external noise from interfere with sensing frequency.  
VPPpin for 12V voltage input is needed at MTP ROM writing only.  
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9.3 ANRG08SC (24 SOP)  
ANRG08SC (24 SOP) Application Example Circuit  
ANRG08SC is reset by internal reset circuit. VDD voltage rising time should be shorter than 100msec  
for proper operation.  
Normally, R.N.D pin dose not connection to anywhere. But, in radio frequency noise environment,  
R.N.D pin must form a pattern line on PCB.  
The VDD periodic voltage ripple over 50mV and the ripple frequency is lower than 10 kHz can cause  
wrong sensitivity calibration. To prevent above problem, power (VDD, GND) line of touch circuit  
should be separated from other circuit. Especially LED driver power line or digital switching circuit  
power line certainly should be treated to be separated from touch circuit.  
The CS patterns also should be routed as short as possible and the width of line might be about 0.25mm.  
Parallel capacitor of CS pin could be useful in case detail sensitivity mediation is required such as for  
complementation sensitivity difference between channels.  
Serial connection resistor of CS pins may be used to avoid mal-function from external surge and ESD.  
The capacitor that is between VDD and GND is an obligation. It should be located as close as possible  
from ANRG08SC.  
The CS pattern routing should be formed by bottom metal (opposite metal of touch PAD).  
The empty space of PCB must be filled with GND pattern to strengthen GND pattern and to prevent  
external noise from interfere with sensing frequency.  
VPPpin for 12V voltage input is needed at MTP ROM writing only.  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
9.4 ANRG08QL (24 QFN)  
ANRG08QL (24 QFN) Application Example Circuit  
ANRG08QL is reset by internal reset circuit. VDD voltage rising time should be shorter than 100msec  
for proper operation.  
Normally, R.N.D pin dose not connection to anywhere. But, in radio frequency noise environment,  
R.N.D pin must form a pattern line on PCB.  
The VDD periodic voltage ripple over 50mV and the ripple frequency is lower than 10 kHz can cause  
wrong sensitivity calibration. To prevent above problem, power (VDD, GND) line of touch circuit  
should be separated from other circuit. Especially LED driver power line or digital switching circuit  
power line certainly should be treated to be separated from touch circuit.  
The CS patterns also should be routed as short as possible and the width of line might be about 0.25mm.  
Parallel capacitor of CS pin could be useful in case detail sensitivity mediation is required such as for  
complementation sensitivity difference between channels.  
Serial connection resistor of CS pins may be used to avoid mal-function from external surge and ESD.  
The capacitor that is between VDD and GND is an obligation. It should be located as close as possible  
from ANRG08QL.  
The CS pattern routing should be formed by bottom metal (opposite metal of touch PAD).  
The empty space of PCB must be filled with GND pattern to strengthen GND pattern and to prevent  
external noise from interfere with sensing frequency.  
VPPpin for 12V voltage input is needed at MTP ROM writing only.  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
9.5 Example Power Line Split Strategy PCB Layout  
A. Not split power Line (Bad power line design)  
The noise that is generated by AC load or relay can be loaded at 5V power line.  
A big inductance might be appeared in case of the connection line between main board and  
display board is too long, moreover the voltage ripple could be generated by LED (LCD)  
display driver at VDD (5V).  
B. Split power Line (One 5V regulator used) Recommended  
C. Split power Line (Separated 5V regulator used) Strongly recommended  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
10 MECHANICAL DRAWING  
10.1 Mechanical Drawing of ANRG08TA (16 TSSOP)  
DIM  
A
A1  
A2  
A3  
b
b1  
c
c1  
D
E1  
E
e
L
L1  
θ
MIN  
-
NOM  
-
MAX  
1.20  
0.15  
1.05  
0.49  
0.30  
0.25  
0.19  
0.14  
5.06  
4.50  
6.60  
NOTES  
1. ALL DIMENSIONS ARE IN MILLIMETERS.  
ANGLES ARE IN DEGREES.  
0.05  
0.90  
0.39  
0.20  
0.19  
0.13  
0.12  
4.86  
4.30  
6.20  
-
1.00  
0.44  
-
0.22  
-
2. DIMENSION b APPLIES TO METALLIZED  
TERMINAL AND IS MEASURED  
BETWEEN 0.25mm AND 0.30mm FROM  
TERMINAL TIP.  
DIMENSION L1 REPRESENTS TERMINAL  
FULL BACK FROM PACKAGE EDGE UP  
TO 0.1mm IS ACCEPTABLE.  
0.13  
4.96  
4.40  
6.40  
0.65BSC  
-
3. COPLANARITY APPLIES TO THE  
EXPOSED HEAT SLUG AS WELL AS THE  
TERMINAL.  
4. RADIUS ON TERMINAL IS OPTIONAL.  
0.45  
0
0.75  
1.00BSC  
-
8˚  
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10.2 Mechanical Drawing of ANRG08FB (24 MLF Punched type)  
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10.3 Mechanical Drawing of ANRG08SC (24 SOP)  
DIM  
A
MIN  
-
NOM  
-
MAX  
2.64  
NOTES  
1. JEDEC OUTLINE : N/A.  
2. DIMENSIONS DDOES NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS.MOLD FLASH, PROTRUSIONS AND  
GATE BURRS SHALL NOT EXCEED .25mm  
(.010in) PER SIDE.  
A1  
D
0.10  
15.24  
7.42  
10.29  
0.53  
0
-
-
-
15.70  
7.59  
10.64  
1.04  
8
E
7.52  
10.46  
0.79  
4
3. DIMENSIONS EDOES NOT INCLUDE  
INTER-LEAD FLASH, OR PROTRUSIONS.  
INTER-LEAD FLASH AND PROTRUSIONS  
SHALL NOT EXCEED .25mm (.010in) PER  
SIDE.  
H
L
θ˚  
UNIT : MM  
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10.4 Mechanical Drawing of ANRG08QL (24 QFN Full lead type)  
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ANRG08 (8-CH Auto Sensitivity Calibration Capacitive Touch Sensor)  
11 MARKING DESCRIPTION  
11.1 Marking Description of ANRG08TA (16 TSSOP)  
Device Code : ANRG 08  
Channel Number  
Touch Switch Group  
Year / Week Code : YY WW  
Manufacturing Week  
Manufacturing Year  
11.2 Marking Description of ANRG08FB (24 MLF), ANRG08QL (24 QFN)  
Company Code : ADS  
AD Semiconductor  
Device Code : ANRG 8  
Channel Number  
Touch Switch Group  
Customer / Assembly Lot Code : CC TTT  
Assembly Lot Code  
Customer Code  
Year / Week Code : YY WW  
Manufacturing Week  
Manufacturing Year  
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11.3 Marking Description of ANRG08SC (24 SOP)  
Company Code : ADS  
AD Semiconductor  
Device Code : ANRG 08  
Channel Number  
Touch Switch Group  
Year / Week Code : YY WW  
Manufacturing Week  
Manufacturing Year  
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NOTES:  
LIFE SUPPORT POLICY  
AD SEMICONDUCTORS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN  
LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE  
PRESIDENT AND GENERAL COUNSEL OF AD SEMICONDUCTOR CORPORATION  
The ADS logo is a registered trademark of ADSemiconductor  
2006 ADSemiconductor All Rights Reserved  
www.adsemicon.com  
www.adsemicon.co.kr  
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