AN5569 [ETC]
?Standard waveforms ; ？标准波形\n
ETC 
AN5569
Standard Waveforms
Application Note
AN5569-1.0 November 2002
SINGLE PHASE
Circuit and output voltage waveform across a – b
(+) a
(+) a
(-) b
(+) a
(-) b
(-) b
EPK
EPK
EPK
ERMS
ERMS
EDC
EDC
ERMS
EDC
a
b
a
b
a
b
Fig. 1: Half wave
Fig. 2: Full wave centre tap
Fig. 3: Full wave bridge
Current Ratios
Voltage Ratios
Fundamental
Ripple
A
B
C
D
E
F
I
AV / IDC
IRMS / IDC
IPK / IDC
IPK / IDC
ERMS / EDC
ERMS / EDC EPK / EDC
Frequency
R
L
R
L
R
L
Half Wave
1f
2f
3f
1.0
0.5
0.5
1.57
-
3.14
-
1.57
-
2.22
1.11
1.11
1.57
2.22
1.11
3.14
1.57
1.57
Half Wave
Centre Tap
0.785 0.707 1.57 1.0 0.785 0.707
Full Wave
Bridge
0.785 0.707 1.57 1.0
1.11
1.0
NOTES
R = Resistive load.
L = Inductive load.
A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current.
B = Ratio of peak device current to DC output current.
C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current.
D = Ratio of no load RMS line to line voltage to no load DC voltage.
E = Ratio of RMS phase voltage to DC voltage.
F = Ratio of peak phase voltage to DC voltage.
1/4
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AN5569 Application Note
THREE PHASE
Circuit and output voltage waveform across a – b
(-) b
(+) a
(-) b
(-) b
(+) a
(+) a
EPK
EPK
EDC
E
PK
ERMS
EDC
EDC
ERMS
ERMS
a
b
a
b
a
b
Fig. 4: Half wave
Fig. 5: Bridge
Fig. 6: Double star
Voltage Ratios
Current Ratios
Fundamental
Ripple
A
B
C
D
E
F
I
AV / IDC
IRMS / IDC
IPK / IDC
IPK / IDC
ERMS / EDC
ERMS / EDC EPK / EDC
Frequency
R
L
R
L
R
L
Half Wave
Bridge
3f
6f
6f
0.33
0.33
0.588 0.577 1.21 1.0 0.588 0.577
0.588 0.577 1.05 1.0 0.816 0.816
0.293 0.289 1.05 0.5 0.293 0.289
1.48
0.74
1.48
0.855
0.427
0.855
2.1
1.05
2.42
Double Star
0.167
NOTES
R = Resistive load.
L = Inductive load.
A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current.
B = Ratio of peak device current to DC output current.
C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current.
D = Ratio of no load RMS line to line voltage to no load DC voltage.
E = Ratio of RMS phase voltage to DC voltage.
F = Ratio of peak phase voltage to DC voltage.
2/4
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AN5569 Application Note
SIX PHASE
Circuit and output voltage waveform across a – b
(-) b
(+) a
(+) a
(+) a
(-) b
(-) b
EPK
EPK
EPK
EDC
EDC
EDC
ERMS
ERMS
ERMS
a
b
a
b
a
b
Fig. 7: 5 star limb core
Fig. 8: Series bridges
Fig. 9: Star delta with IPT
Current Ratios
Voltage Ratios
Fundamental
Ripple
A
B
C
D
E
F
IAV / IDC
IRMS / IDC
IPK / IDC
IPK / IDC
ERMS / EDC
ERMS / EDC EPK / EDC
Frequency
R
L
R
L
R L
5 Star Limb
6f
0.167
0.33
0.408 0.408 1.05 0.5 0.408 0.408
0.588 0.577 1.05 1.0 0.816 0.816
0.293 0.289 0.525 0.5 0.408 0.408
1.48
0.74
1.48
-
-
-
2.1
Core
Series
Bridges
12f
12f
1.05
2.42
Star Delta
with IPT
0.167
NOTES
R = Resistive load.
L = Inductive load.
A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current.
B = Ratio of peak device current to DC output current.
C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current.
D = Ratio of no load RMS line to line voltage to no load DC voltage.
E = Ratio of RMS phase voltage to DC voltage.
F = Ratio of peak phase voltage to DC voltage.
3/4
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
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These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
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