AN22022 [ETC]

; - 12号的铝制车身绘( RAL 7032 )
AN22022
型号: AN22022
厂家: ETC    ETC
描述:


- 12号的铝制车身绘( RAL 7032 )

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CXA2022S  
I2C Bus Sound Processor for TV  
Description  
30 pin SDIP (Plastic)  
The CXA2022S is a bipolar IC designed as an I2C  
bus control sound processor for TV. This IC has  
simulate stereo, surround, tone control, balance,  
volume, muting, AGC and other functions.  
Features  
Allows control by I2C bus  
Employs a special surround system to prevent  
"vocal missing" in the surround mode  
Adopts an AGC circuit to absorb the difference in  
sound level between input sources and improves  
S/N ratio of hearing characteristics  
Structure  
Bipolar silicon monolithic IC  
Applications  
TVs  
Absolute Maximum Ratings  
Supply voltage  
VCC  
14  
V
Operating temperature  
Storage temperature  
Topr –20 to +75 °C  
Tstg –65 to +150 °C  
Allowable power dissipation PD  
1.25  
W
Recommended Operating Condition  
Supply voltage  
8 to 13  
V
Pin Configuration  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E95Y17A7X  
CXA2022S  
L C S  
A D S  
L O V  
L A B  
E R T  
S S A B  
L L C  
L H C  
R L C  
R H C  
L C C  
R C C  
B 3 S P  
A 3 S P  
B 2 S P  
A 2 S P  
B 1 S P  
A 1 S P  
C C V  
D N G  
I F V M  
O F V M  
S R V  
2 T E D  
1 T E D  
– 2 –  
CXA2022S  
Pin Description  
(Ta = 25°C, VCC = 12V)  
Description  
Pin  
Symbol  
Pin voltage  
Equivalent circuit  
No.  
VCC  
10µ  
130 10k  
1
R IN  
6V  
Input pins.  
1
30 L IN  
30k  
30  
VCC/2  
2
3
GND  
CL R  
0V  
6V  
GND  
VCC  
250µ  
250µ  
5.4k  
External pins for LPF  
capacitance (BASS).  
11k  
11k  
28 CL L  
3
130  
28  
VCC/2  
VCC  
250µ  
250µ  
6k  
4
CH R  
External pins for HPF  
capacitance (TREBLE).  
5.7k  
5.7k  
130  
6V  
27 CH L  
4
27  
VCC  
40k  
20k  
DAC output pins.  
Connect LPF  
capacitance of DAC.  
Internal impedance is  
approximetely 20k.  
5
6
7
8
BAL  
7.5V  
5
6
7
8
2k  
TRE  
BASS  
VOL  
4.5V  
2k  
75µ  
– 3 –  
CXA2022S  
Pin  
No.  
Symbol  
Pin voltage  
Equivalent circuit  
Description  
VCC  
1k  
1k  
500  
20k  
DC-cut pins for L and R.  
Internal impedance is  
approximately 20k.  
9
CC R  
20k  
1k  
6V  
22 CC L  
9
22  
500  
VCC  
5P  
500  
500  
130  
10 ROUT  
21 LOUT  
10  
21  
6V  
Output pins.  
84k  
VCC  
10µ  
11 PS1A  
17 PS2A  
18 PS2B  
19 PS1B  
20 PS3A  
23 PS3B  
11  
External capacitance  
pins for surround phase-  
shifter. Internal  
impedance is  
approximately 18k.  
18k  
18k  
17  
18  
19  
20  
23  
130  
6V  
VCC  
200  
10k  
200  
AGC detector output and  
control pin.  
12  
12 DET2  
130  
100k  
100k  
– 4 –  
CXA2022S  
Pin  
No.  
Symbol  
Pin voltage  
Equivalent circuit  
Description  
10µ  
500  
130  
10k  
HPF external capacitance  
pin of AGC.  
13 HPF  
14 SCL  
15 SDA  
6V  
13  
500  
16k  
16k  
VCC  
50µ  
100µ  
14  
I2C bus clock line pin.  
4k  
3k  
11k  
56k  
VCC  
100µ  
50µ  
I2C bus data line pin.  
15  
4k  
3k  
4.5k  
56k  
VCC  
40k  
16  
AGC detector output pin.  
Connect capacitance for  
setting time constant.  
16 DET1  
7.8V  
2k  
– 5 –  
CXA2022S  
Pin  
No.  
Symbol  
Pin voltage  
Equivalent circuit  
Description  
VCC  
5µ  
5µ  
22k  
10k  
22k  
10k  
External pin for surround  
filter.  
24 MVFI  
25 MVFO  
26 VRS  
6V  
24  
130  
18k  
39k  
VCC  
500  
130  
External pin for surround  
filter.  
6V  
25  
500  
VCC  
16k  
16k  
30k  
VCC/2 reference voltage  
pin.  
6V  
1k  
26  
30k  
30µ  
29  
VCC  
12V  
Power supply.  
– 6 –  
CXA2022S  
A D S  
L C S  
1 T E D  
A 2 S P  
B 2 S P  
B 1 S P  
A 3 S P  
T U O L  
L C C  
B 3 S P  
I F V M  
O F V M  
S R V  
F P H  
2 T E D  
A 1 S P  
T U O R  
R C C  
L O V  
S S A B  
E R T  
L A B  
R H C  
R L C  
D N G  
N I R  
L H C  
L L C  
C C V  
N I L  
– 7 –  
CXA2022S  
Control Register Table  
(SLAVE ADDRESS = 82H)  
(Power ON setting value)  
DATA  
bit 4 bit 3  
bit 7  
bit 6  
bit 5  
bit 2  
bit 1  
MUTE AGC  
(0) (0)  
MODE (00)  
bit 0  
AGC : 0 = OFF/1 = ON  
MUTE : 0 = OFF/1 = ON  
VOLUME (00)  
BASS (00)  
TREBLE (00)  
BALANCE (00)  
SURR-EFFECT (00)  
VOCAL-MIX (00)  
MONO-EFFECT (00)  
MODE : 00 = Surround OFF  
: 01 = Simulate Stereo  
: 10 = Stereo Surround 1  
: 11 = Stereo Surround 2  
Undefined  
Description of Register  
VOLUME: Common to both L and R channels  
0 = Minimum  
3F = Maximum  
MUTE: MUTE switch  
0 = Mute OFF  
1 = Mute ON (muting state)  
AGC: AGC switch  
0 = AGC OFF  
1 = AGC ON  
BASS: Low frequency control  
0 = Minimum  
10 = Typical  
1F = Maximum  
MODE: Surround mode setting  
00 = Surround OFF  
01 = Simulate Stereo (Monaural Surround)  
10 = Stereo Surround 1  
11 = Stereo Surround 2  
TREBLE: High frequency control  
00 = Minimum  
10 = Typical  
1F = Maximum  
– 8 –  
CXA2022S  
BALANCE: Balance control for L and R channels  
00 = L channel (Minimum), R channel (Maximum)  
20 = Typical  
3F = L channel (Maximum), R channel (Minimum)  
SURR-EFFECT: Effect setting for Stereo Surround 1 and 2  
0 = Minimum  
8 = Typical  
F = Maximum  
MONO-EFFECT: Effect setting for Simulate Stereo (Monaural Surround)  
0 = Minimum  
F = Maximum  
VOCAL-MIX: Addition amount setting of middle frequency for Stereo Surround 1 and 2  
0 = Minimum  
8 = Typical  
F = Maximum  
Application Circuit  
L IN  
L OUT  
VCC  
C10  
0.1µ  
C2  
4.7µ  
C4  
0.1µ  
C6  
4700P  
C8  
47µ  
C13  
8200P  
C15  
4.7µ  
C17  
10µ  
C19  
8200P  
C21  
4700P  
C24  
0.1µ  
C25  
4.7µ  
R1  
820k  
C23  
0.022µ  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
CXA2022S  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
C20  
10µ  
R3  
220  
R4  
220  
C1  
4.7µ  
C3  
0.1µ  
C5  
4700P  
C7  
4.7µ  
C9  
4.7µ  
C11  
4.7µ  
C12  
4.7µ  
C14  
4.7µ  
C16  
10µ  
C18  
4700P  
C22  
0.1µ  
R2  
1MEG  
R IN  
R OUT  
SCL  
SDA  
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for  
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.  
– 9 –  
CXA2022S  
– 10 –  
CXA2022S  
– 11 –  
CXA2022S  
– 12 –  
CXA2022S  
Description of Operation  
AGC circuit  
The AGC circuit is provided at the input. When AGC is set to ON, this circuit is 0dB for small signal input,  
boosts for medium signal input, and achieves gain reduction for large signal input. The sound level  
defference between input sources can be absorbed at this circuit.  
Surround circuit  
The surround circuit provides three modes; MONO (Simulate Stereo), STEREO-1 and STEREO-2.  
MONO mode  
L + R signals, passed through the mono filter and then through four stages of phase shifters (PS1A, PS1B,  
PS2A, PS2B) and 9kHz LPF, are added to L and R channels at opposite phase to each other.  
The surround effect can be changed by the MONO-EFFECT.  
STEREO-1 mode  
L-R signals, passed through two stages of phase shifters (PS1A, PS1B) and 9kHz LPF, are added to L and R  
channels at opposite phase to each other. The surround effect can be changed by the SURR-EFFECT. In  
addition, L + R signals passed through the middle frequency BPF (1kHz BPF) are added to L and R channels at  
in-phase to each other to prevent "vocal missing" in the surround mode. The addition amount of middle  
frequency can be changed by the VOCAL-MIX.  
STEREO-2 mode  
L-R signals, passed through two stages of phase shifters (PS1A, PS1B) and 9kHz LPF, are added to L and R  
channels at opposite phase to each other. The surround effect can be changed by the SURR-EFFECT. In  
addition, L + R signals passed through the middle frequency BPF (1kHz BPF) are added to R channel, and the  
middle frequency signals passed further through two stages of phase shifters (PS3A, PS3B) are added to the L  
channel. The addition amount of middle frequency (L and R) can be changed by the VOCAL-MIX.  
Phase Shifter  
Each of the phase shifters PS1, PS2 and PS3 consists of two stages of phase shifters (A, B). The transfer  
function for a stage of phase shifter is expressed by the following equation.  
1 – SCR  
1 + SCR  
VO =  
Vin  
R: Internal resistance 18k, C: External capacitance  
TONE circuit  
Provides tone controls for BASS and TREBLE. The external capacitance of CL for BASS and CH for TREBLE  
can determine the characteristics. The number of steps is 32.  
BALANCE and VOLUME circuit  
Provides controls for BALANCE and VOLUME. the number of steps is 64 each.  
DAC circuit  
Provides controls for BASS, TREBLE, VOLUME and BALANCE. The internal impedance is approximately  
20kand the LPF capacitance is used externally.  
– 13 –  
CXA2022S  
Example of Representative Characteristics  
TONE characteristics  
20  
10  
BASS-TREBLE MAX.  
BASS-TREBLE MIN.  
0
–10  
–20  
10  
100  
1k  
10k  
100k  
Frequency [Hz]  
CH. vs. TREBLE-CONTROL (MAX)  
17.5  
15.0  
12.5  
10.0  
7.5  
0.047µ  
0.022µ  
2200p  
470p  
4700p  
5.0  
2.5  
0.0  
–2.5  
10  
100  
Frequency [Hz]  
1k  
10k  
100k  
CH. vs. BASS-CONTROL (MAX)  
17.5  
15.0  
12.5  
10.0  
7.5  
0.01µ  
0.1µ  
0.047µ  
1µ  
5.0  
0.47µ  
2.5  
0.0  
–2.5  
10  
100  
Frequency [Hz]  
1k  
10k  
100k  
– 14 –  
CXA2022S  
VOL CONTROL characteristics  
BALANCE CONTROL characteristics  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
OUT R  
OUT L  
10  
20  
30  
3F  
0
10  
20  
30  
3F  
BUS Data (VOL)  
BUS Data (BALANCE)  
BASS CONTROL characteristics  
TREBLE CONTROL characteristics  
12  
10  
8
12  
10  
8
Input = 100Hz  
Input = 10kHz  
6
6
4
4
2
2
0
0
–2  
–4  
–6  
–8  
–10  
–12  
–2  
–4  
–6  
–8  
–10  
–12  
0
4
8
C
10 14 18 1C 1F  
0
4
8
C
10 14 18 1C 1F  
BUS Data (BASS)  
BUS Data (TREBLE)  
AGC characteristics  
1V  
AGC = OFF  
AGC = ON  
100mV  
10  
10  
100mV  
1V  
IN [rms]  
– 15 –  
CXA2022S  
Package Outline  
Unit : mm  
30PIN SDIP (PLASTIC)  
+ 0.4  
26.9 – 0.1  
30  
16  
0° to 15°  
15  
1
1.778  
Two kinds of package surface:  
1.All mat surface type.  
2.All mirror surface type.  
0.5 ± 0.1  
0.9 ± 0.15  
PACKAGE STRUCTURE  
EPOXY RESIN  
MOLDING COMPOUND  
LEAD TREATMENT  
LEAD MATERIAL  
SOLDER/PALLADIUM  
SONY CODE  
EIAJ CODE  
SDIP-30P-01  
PLATING  
COPPER ALLOY  
1.8g  
SDIP030-P-0400  
JEDEC CODE  
PACKAGE MASS  
NOTE : PALLADIUM PLATING  
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).  
– 16 –  

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