AN2051 [ETC]
Multilayer Chip Antenna for 2.4GHz Wireless Communication; 叠层片式天线的2.4GHz无线通信
| 型号： | AN2051 |
| 厂家： | 
ETC |
| 描述： | Multilayer Chip Antenna for 2.4GHz Wireless Communication |
| 文件： | 总9页 (文件大小：274K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AN2051
Multilayer Chip Antenna for
2.4GHz Wireless Communication
技术：+86 158-1062-2705
销售：+86 131-4671-3331
RainSun Corporation
http://www.rainsun.com
Jan, 2008
Ver.2.2
1 of 9
AN2051 Multilayer Chip Antenna
◆ Features
y Light weight and low profile 5.05mm(L)X2.0mm(W)X1.07mm(H)
y Omni‐directional in azimuth
y Lead (Pb) Free
◆ Applications
y 2.4GHz wireless communications
y 2.4GHz Modules
y Bluetooth System
y 802.11b/g Wireless LAN System
Specifications
Center frequency
Peak gain
2.45GHz
0.5dBi
Operation temperature
Storage temperature
VSWR
Input Impedance
Power handling
Bandwidth
‐40 ~ +85 °C
‐40 ~ +85 °C
2.0 (max)
50 Ohm
2W (max)
110MHz
Azimuth beamwidth
Polarization
Omni‐directional
Linear
RainSun Corporation
http://www.rainsun.com
Jan, 2008
Ver.2.2
2 of 9
Pin configuration
Top view
1
Pin No
Pin assignment
Feed termination
Feed point mark
Solder termination
2
1
2
3
3
Dimensions
Symbol
Dimensions (mm)
5.05 ± 0.10
A
B
2.00 ± 0.10
C
H
0.50 ± 0.05
1.07 ± 0.20
RainSun Corporation
http://www.rainsun.com
Jan, 2008
Ver.2.2
3 of 9
Recommended Test Board Pattern
Bottom view
Top view
50 Ohm
Transmission line
Ground Plane
SMA connector
Unit : mm
Board thickness : 0.6mm
Board material : FR4
Fig-1
Testing Setup
Measurement
Testing Instrument:
Anritsu 37369C VNA(Vector Network
Analyzer)
VNA calibrate with 1 path reflection
only calibration sequence on test board
feed point.
The test board dimension and it’s
layout is the same as Fig‐1.
RainSun Corporation
http://www.rainsun.com
Jan, 2008
4 of 9
Ver.2.2
Typical Electrical Characteristics
Return loss
Smith Chart
Marker data:
1 : f=2.389 GHz
2 : f=2.450 GHz
3 : f=2.504 GHz
RainSun Corporation
5 of 9
Jan, 2008
Ver.2.2
http://www.rainsun.com
Typical Radiation Patterns
2.45 GHz H‐Plane
2.45 GHz E‐Plane
RainSun Corporation
http://www.rainsun.com
Jan, 2008
Ver.2.2
6 of 9
Typical Soldering Profile for Lead‐free Process
Peak temp 340°C
340°C
300°C
150°C
5 sec.
25 sec.
Pre-heating
Time (sec.)
Do not exceed 30 secs.
Reflow Soldering
10 sec, max
260°C
230°C
180°C
30 sec.
60 sec.
Pre-heating
Time (sec.)
RainSun Corporation
http://www.rainsun.com
Jan, 2008
Ver.2.2
7 of 9
Packing
Blister Tape Specifications
Symbol
W
Dimension
12.00
4.00
Tolerance
± 0.30
± 0.10
± 0.10
± 0.10
± 0.10
± 0.10
± 0.10
± 0.10
± 0.05
± 0.10
± 0.10
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
P1
P2
5.50
P3
1.75
P4
4.00
P5
2.00
D
1.50
T1
5.40
T2
0.30
T3
2.40
T4
1.40
RainSun Corporation
http://www.rainsun.com
Jan, 2008
Ver.2.2
8 of 9
Reel Specifications
Quantity
Per Reel
Tape Width
(mm)
A
(mm)
C
(mm)
B
(mm)
E
(mm)
W
(mm)
W1
(mm)
3,000
12
180±1
13.0±0.2
62±0.5
2.2±0.5
12±0.5
16±0.2
RainSun Corporation
http://www.rainsun.com
Jan, 2008
Ver.2.2
9 of 9
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