7MBR20UE-060 [ETC]
7 PIM IGBT ; 7 PIM IGBT\n型号: | 7MBR20UE-060 |
厂家: | ETC |
描述: | 7 PIM IGBT
|
文件: | 总4页 (文件大小:76K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Power Semiconductor Development Dept.
Matsumoto Factory
Fuji Electric Co.,Ltd.
7MBR20UE060 Specification (Tentative)
1. Outline Drawing ( Unit : mm )
P1
Gu
U
Eb
Gb
B
Ew Gz Ev Gy
Eu Gx
P
T1
T2
Gv
V
R
S
T
N
Gw
W
Module only designed for mounting on PCB with 1.6~1.8mm thickness
2. Equivalent circuit
Nov 26 ‘02
Nov 27 ‘02
1
MT6M04460
4
Absolute Maximum Ratings ( at Tc= 25oC unless otherwise specified)
3.
Maximum
Ratings
600
Items
Symbols
Conditions
Units
Collector-Emitter voltage
VCES
VGES
Ic
V
V
A
Gate-Emitter voltage
Collector current
±20
20
Continuous
1ms
Tc=TBD
Tc=25oC
Tc=TBD
36
Icp
40
A
Tc=25oC
72
-Ic
Pc
Continuous
1 device
Tc=TBD
20
A
W
V
Collector Power Dissipation
Collector-Emitter voltage
Gate-Emitter voltage
105
600
±20
20
VCES
VGES
Ic
V
Continuous
1ms
Tc=TBD
A
Tc=25oC
Tc=TBD
Tc=25oC
25
Collector current
Icp
40
A
50
Collector Power Dissipation
Average Output Current
Pc
Io
1 device
80
W
A
50Hz/60Hz
sine wave
20
Tj=150oC,10ms
Surge Current (Non-Repetitive)
IFSM
I2t
105
55
A
I2t
(Non-Repetitive)
A2s
oC
oC
V
half sine wave
Junction temperature
Storage temperature
Isolation
Tj
150
Tstg
Viso
-40~ +125
2500
between terminal and copper base(*1)
AC : 1min.
M4
(*2)
voltage
2500
V
between thermistor and others
Mounting Screw Torque
1.3 1.7
~
N.m
(*1) All terminals should be connected together when isolation test will be done.
(*2) Terminal T1 and T2 should be connected together. And another terminals
should be connected together and shorted to copper base.
2
MT6M04460
4
H04-004-03
Electrical characteristics ( at Tj= 25oC unless otherwise specified)
4.
Characteristics
Items
Symbols
Conditions
min.
typ.
Max. Units
Zero gate voltage
Collector current
I
V
V
V
V
=
=
=
=
0 V, V
0 V, V
= 600 V
= +-20 V
-
-
-
0.02
200
7.0
mA
nA
V
CES
GE
CE
CE
GE
CE
GE
Gate-Emitter leakage current
I
-
GES
Gate-Emitter
threshold voltage
V
20 V, Ic =
20 mA
5.0
6.0
GE(th)
Collector-Emitter
saturation voltage
Input capacitance
15 V, chip
-
-
-
1.76
1.81
1550
TBD
TBD
-
V
V
CE(sat)
Cies
Ic =
20 A terminal
V
=
0 V, V
1 MHz
=
CE
10 V
pF
GE
f =
ton
tr
Vcc=
Ic =
300 V
-
-
-
-
-
-
-
-
TBD
TBD
TBD
TBD
TBD
1.49
1.54
-
1.2
0.6
-
Turn-on time
20 A
tr(i)
toff
tf
V
R
=
±15 V
s
µ
GE
=
TBD
1.0
0.35
TBD
TBD
300
G
Ω
Turn-off time
Forward on voltage
V
I =
F
20 A chip
terminal
F
V
Reverse recovery time
Zero gate voltage
Collector current
trr
IF =
20 A
0 V, V
ns
mA
nA
V
I
V
V
V
V
=
=
=
=
= 600 V
-
-
-
-
0.02
200
7.0
CES
GE
CE
CE
GE
CE
GE
Gate-Emitter leakage current
I
0 V, V
= +-20 V
GES
Gate-Emitter
threshold voltage
Collector-Emitter
V
20 V, Ic =
20 mA
5.0
6.0
GE(th)
15 V, chip
-
-
-
2.36
2.41
820
TBD
TBD
-
V
V
CE(sat)
Cies
saturation voltage
Input capacitance
Ic =
20 A terminal
V
=
0 V, V
1 MHz
=
CE
10 V
pF
GE
f =
ton
tr
Vcc=
Ic =
300 V
-
-
-
-
TBD
TBD
TBD
TBD
-
1.2
0.6
1.0
0.35
300
0.02
-
Turn-on time
Turn-off time
20 A
s
µ
toff
tf
V
R
=
±15 V
GE
=
TBD
G
Ω
Reverse recovery time
Reverse current
trr
IF =
20 A
ns
-
-
-
-
I
V
=
R
600 V
-
mA
RRM
Forward on voltage
V
I =
F
20 A chip
terminal
1.1
1.2
-
FM
V
1.5
1.0
-
Reverse current
Resistance
I
V
=
R
800 V
mA
RRM
-
-
T = 25oC
T =100oC
5000
495
Ω
R
465
520
T = 25/50oC
B value
B
3305 3375 3450
K
5. Thermal resistance characteristics
Items
Characteristics
Symbols
Conditions
min.
typ.
Max. Units
TBD
Inverter IGBT
Inverter FWD
Brake IGBT
-
-
-
-
-
-
1.07
1.80
1.42
2.50
1.36
0.05
Thermal resistance
(1 device)
TBD
oC/W
R
th(j-c)
TBD
Brake diode
TBD
TBD
Converter Diode
with Thermal Compound (*)
oC/W
-
Contact Thermal resistance
R
th(c-f)
* This is the value which is defined mounting on the additional cooling fin with thermal compound.
3
4
MT6M04460
H04-004-03
6. Indication on module
ꢀꢀ
ꢀꢀꢀꢀꢀꢀꢀꢀ
ꢀꢀ
TBD
7. Applicable category
This specification is applied to Power Integrated Module named 7MBR20UE060.
8. Storage and transportation notes
The module should be stored at a standard temperature of 5 to 35oC and
humidity of 45 to 75% .
・
・
Store modules in a place with few temperature changes in order to avoid
condensation on the module surface.
Avoid exposure to corrosive gases and dust.
・
・
・
・
Avoid excessive external force on the module.
Store modules with unprocessed terminals.
Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
90%
0V
0V
V
GE
t
rr
L
I
rr
V
Ic
CE
90%
90%
Vcc
10%
10%
10%
V
CE
Ic
0V
0A
R G
V CE
t
t
f
r(i)
V GE
t
Ic
r
t
off
t
on
4
MT6M04460
4
H04-004-03
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