74LVT2240WMX [ETC]
Dual 4-Bit Inverting Buffer/Driver ; 双4位缓冲器/驱动器\n
| 型号： | 74LVT2240WMX |
| 厂家： | 
ETC |
| 描述： | Dual 4-Bit Inverting Buffer/Driver
|
| 文件： | 总7页 (文件大小：78K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
July 1999
Revised November 2000
74LVT2240 • 74LVTH2240
Low Voltage Inverting Octal Buffer/Line Driver
with 3-STATE Outputs
and 25Ω Series Resistors in the Outputs
General Description
Features
■ Input and output interface capability to systems at
The LVT2240 and LVTH2240 are inverting octal buffers
and line drivers designed to be employed as memory
address drivers, clock drivers and bus oriented transmitters
or receivers which provides improved PC board density.
The equivalent 25Ω Series resistors helps reduce output
overshoot and undershoot.
5V VCC
■ Equivalent 25Ω Series resistors on outputs
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH2240),
also available without bushold feature (74LVT2240).
The LVTH2240 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
These inverting octal buffers and line drivers are designed
for low-voltage (3.3V) VCC applications, but with the capa-
■ Outputs source/sink −12 mA/+12 mA
■ Latch-up performance exceeds 500 mA
■ ESD performance:
bility to provide a TTL interface to a 5V environment. The
LVT2240 and LVTH2240 are fabricated with an advanced
BiCMOS technology to achieve high speed operation simi-
lar to 5V ABT while maintaining low power dissipation.
Human-body model > 2000V
Machine model > 200V
Charged-device model > 1000V
Ordering Code:
Order Number
74LVT2240WM
74LVT2240SJ
Package Number
M20B
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
M20D
74LVT2240MTC
74LVTH2240WM
74LVTH2240SJ
74LVTH2240MTC
MTC20
M20B
M20D
MTC20
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
© 2000 Fairchild Semiconductor Corporation
DS500212
www.fairchildsemi.com
Logic Symbol
Pin Descriptions
IEEE/IEC
Pin Names
Description
OE1, OE2
I0–I7
3-STATE Output Enable Inputs
Inputs
O0–O7
Outputs
Truth Tables
Inputs
OE1
Outputs
(Pins 12, 14, 16, 18)
In
L
L
L
H
X
H
L
H
Z
Inputs
OE2
Outputs
(Pins 3, 5, 7, 9)
In
Connection Diagram
L
L
L
H
X
H
L
H
Z
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
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2
Absolute Maximum Ratings(Note 1)
Symbol
VCC
Parameter
Supply Voltage
Value
−0.5 to +4.6
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
−50
Conditions
Units
V
VI
DC Input Voltage
V
VO
DC Output Voltage
Output in 3-STATE
V
Output in HIGH or LOW State (Note 2)
V
IIK
IOK
IO
DC Input Diode Current
DC Output Diode Current
DC Output Current
VI < GND
mA
mA
−50
V
V
V
O < GND
64
O > VCC Output at HIGH State
O > VCC Output at LOW State
mA
128
ICC
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
±64
mA
mA
°C
IGND
TSTG
±128
−65 to +150
Recommended Operating Conditions
Symbol
VCC
Parameter
Min
2.7
0
Max
Units
Supply Voltage
3.6
5.5
−12
12
V
V
VI
Input Voltage
IOH
IOL
TA
HIGH-Level Output Current
LOW-Level Output Current
mA
Free-Air Operating Temperature
−40
85
°C
∆t/∆V
Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V
0
10
ns/V
Note 1: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
Note 2: IO Absolute Maximum Rating must be observed.
DC Electrical Characteristics
T
A =−40°C to +85°C
VCC
(V)
Symbol
Parameter
Units
Conditions
Typ
Min
Max
(Note 3)
VIK
Input Clamp Diode Voltage
Input HIGH Voltage
2.7
2.7–3.6
2.7–3.6
2.7–3.6
3.0
−1.2
V
V
II = −18 mA
O ≤ 0.1V or
O ≥ VCC − 0.1V
VIH
VIL
2.0
V
Input LOW Voltage
0.8
V
VOH
Output HIGH Voltage
VCC − 0.2
V
IOH = −100 µA
IOH = −12 mA
IOL = 100 µA
IOL = 12 mA
2.0
V
VOL
Output LOW Voltage
2.7
0.2
0.8
V
3.0
V
II(HOLD)
(Note 4)
II(OD)
Bushold Input Minimum Drive
3.0
75
−75
µA
µA
µA
µA
µA
µA
µA
µA
µA
VI = 0.8V
VI = 2.0V
Bushold Input Over-Drive
Current to Change State
Input Current
500
(Note 5)
3.0
(Note 4)
II
−500
(Note 6)
3.6
3.6
10
±1
VI = 5.5V
Control Pins
Data Pins
Power Off Leakage Current
VI = 0V or VCC
VI = 0V
−5
3.6
0
1
VI = VCC
IOFF
±100
0V ≤ VI or VO ≤ 5.5V
IPU/PD
Power up/down 3-STATE
Output Current
V
O = 0.5V to 3.0V
0–1.5V
±100
µA
VI = GND or VCC
IOZL
IOZH
IOZH
3-STATE Output Leakage Current
3-STATE Output Leakage Current
3-STATE Output Leakage Current
Power Supply Current
3.6
3.6
3.6
3.6
3.6
3.6
−5
5
µA
µA
V
V
V
O = 0.5V
O = 3.0V
+
10
µA
CC < VO ≤ 5.5V
ICCH
ICCL
ICCZ
0.19
5
mA
mA
mA
Outputs HIGH
Outputs LOW
Power Supply Current
Power Supply Current
0.19
Outputs Disabled
3
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DC Electrical Characteristics (Continued)
T
A =−40°C to +85°C
VCC
(V)
Symbol
Parameter
Units
mA
Conditions
Typ
Min
Max
(Note 3)
ICCZ+
Power Supply Current
3.6
0.19
0.2
VCC ≤ VO ≤ 5.5V,
Outputs Disabled
∆ICC
Increase in Power Supply Current
(Note 7)
3.6
mA
One Input at VCC − 0.6V
Other Inputs at VCC or GND
Note 3: All typical values are at VCC = 3.3V, TA = 25°C.
Note 4: Applies to bushold versions only (74LVTH2240).
Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
Note 7: This is the increase in supply current for each, input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics (Note 8)
VCC
T
A = 25°C
Conditions
Symbol
Parameter
Units
C
L = 50 pF, RL = 500Ω
(V)
3.3
3.3
Min
Typ
0.8
Max
VOLP
VOLV
Quiet Output Maximum Dynamic VOL
Quiet Output Minimum Dynamic VOL
V
V
(Note 9)
−0.8
Note 8: Characterized in SOIC package. Guaranteed parameter, but not tested.
Note 9: Max number of outputs defined as (n). n−1 data inputs are driven 0V to 3V. Output under test held LOW.
AC Electrical Characteristics
T
A = −40°C to +85°C
CL = 50 pF, RL = 500Ω
Symbol
Parameter
Units
VCC = 3.3V ± 0.3V
VCC = 2.7V
Min
Typ
Max
Min
Max
(Note 10)
tPLH
Propagation Delay Data to Output
Output Enable Time
1.0
1.0
1.0
1.1
1.9
1.8
4.0
4.1
5.0
5.0
4.8
4.5
1.0
1.0
1.0
1.1
1.9
1.8
4.8
4.4
6.0
5.6
5.5
4.5
ns
ns
ns
ns
tPHL
tPZH
tPZL
tPHZ
tPLZ
tOSHL
tOSLH
Output Disable Time
Output to Output Skew
(Note 11)
1.0
1.0
Note 10: All typical values are at VCC = 3.3V, TA = 25°C.
Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Capacitance (Note 12)
Symbol
Parameter
Input Capacitance
Output Capacitance
Conditions
CC = 0V, VI = 0V or VCC
CC = 3.0V, VO = 0V or VCC
Typical
Units
pF
CIN
V
V
3
6
COUT
pF
Note 12: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883B, Method 3012.
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4
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
5
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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7
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