5962-8672302RC [ETC]
Bus Transceiver ; 总线收发器\n
| 型号： | 5962-8672302RC |
| 厂家： | 
ETC |
| 描述： | Bus Transceiver
|
| 文件： | 总18页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
90-03-07
APPROVED
W. Heckman
Add device 02. Editorial changes throughout. Change drawing CAGE
tp 67268.
B
C
Changes IAW NOR 5962-R023-99. -ljs
Update to reflect latest changes in format and requirements. Editorial
changes throughout. -les
99-01-27
01-11-28
Raymond Monnin
Raymond Monnin
The original first sheet of this drawing has been replaced.
CURRENT CAGE CODE 67628
REV
SHEET
REV
C
C
C
SHEET
15
16
17
REV STATUS
OF SHEETS
PMIC N/A
REV
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
C
C
C
C
SHEET
10
11
12
13
14
PREPARED BY
Christopher A. Rauch
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
Tim H. Noh
STANDARD
MICROCIRCUIT
DRAWING
http://www.dscc.dla.mil
APPROVED BY
William K. Heckman
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, DIGITAL, BIPOLAR, OCTAL,
3-STATE, BIDIRECTIONAL, BUS TRANSCEIVER,
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
MONOLITHIC SILICON
DRAWING APPROVAL DATE
87-02-09
AMSC N/A
REVISION LEVEL
C
SIZE
A
CAGE CODE
5962-86723
14933
SHEET
1
OF
17
DSCC FORM 2233
APR 97
5962-E007-02
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-86838
01
R
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
2947
2946
Octal, 3-state, bi-directional, bus transceivers noninverting
Octal, 3-state, bi-directional, bus transceivers inverting
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
R
2
GDIP1-T20 or GDIP2-T20
CQCC1-N20
20
20
Dual-in-line
Square chip carrier
1.3 Absolute maximum ratings.
Supply voltage.................................................................
Input voltage range ......................................................
Storage temperature range..............................................
Maximum power dissipation (PD) per device 1/...............
Lead temperature (soldering, 10 seconds) .....................
Thermal resistance, junction-to-case (θJC) .....................
Junction temperature (TJ) ................................................
-0.5 V dc to +7.0 V dc
-1.5 V dc to +5.5 V dc
-65°C to +150°C
775 mW
+300°C
See MIL-STD-1835
+175°C
1.4 Recommended operating conditions.
Supply voltage range (VCC)..............................................
Minimum high level input voltage (VIH).............................
Maximum low level input voltage (VIL) ............................
Ambient operating temperature range (TC) ....................
+4.5 V dc to 5.5 V dc
2.0 V dc
0.7 V dc
-55°C to +125°C
___
1/ Must withstand the added PD due to short circuit test (e.g. IOS).
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
2
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figures 4
through 6.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
3
DSCC FORM 2234
APR 97
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
4
DSCC FORM 2234
APR 97
Conditions
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
VOH1
Min
Max
V
CC = 4.5 V,
I
OH = -0.4 mA
IOH = -3.0 mA
OH = -0.4 mA
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
3.35
V
V
V
High level output voltage,
A0 - A7
T/R = 0.8 V,
CD = 0.7 V
2.7
V
CC = 4.5 V,
I
3.35
High level output voltage,
B0 - B7
VOH2
T/R = 2.0 V,
CD = 0.7 V
IOH = -5.0 mA
IOH = -10 mA
1, 2, 3
1, 2, 3
All
All
2.7
2.4
V
V
Low level output voltage,
A0 - A7
VOL1
1, 2, 3
All
0.4
0.4
V
VCC = 4.5 V, T/R = 0.8 V,
CD = 0.7 V, IOL = 12 mA
VCC = 4.5 V,
I
OL = 20 mA
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
All
V
V
V
V
Low level output voltage,
B0 - B7
VOL 2
T/R = 2.0 V,
CD = 0.7 V
IOL = 48 mA
0.55
-1.5
-1.5
Input clamp voltage,
A0 - A7 and B0 - B7
Input clamp voltage,
VI C1
VI C2
VCC = 4.5 V, CD = 2.0 V,
IIN= -12 mA
VCC = 4.5 V, IIN= -12 mA
CD, T/R
High level input current,
A0 - A7
IIH1
1, 2, 3
1, 2, 3
All
All
80
80
µA
µA
VCC = 5.5 V, T/R = 2.0 V,
CD = 0.7 V, VIN = 2.7 V
High level input current,
B0 - B7
IIH2
VCC = 5.5 V, T/R = CD = 0.7 V,
VIN = 2.7 V
High level input current,
CD, T/R
IIH3
IIH4
IIH5
VCC = 5.5 V,
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
20
1
µA
mA
mA
VIN = 2.7 V
High level input current,
A0 - A7, B0 - B7
VCC = 5.5 V, CD = 2.0 V,
VIN = 5.5 V
High level input current,
VCC = 5.5 V,
1
VIN = 5.5 V
T/R , CD
Low level input current,
A0 - A7
IIL1
IIL2
IIL3
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
-200
-200
-250
µA
µA
µA
VCC = 5.5 V, T/R = 2.0 V,
CD = 0.7 V, VIN = 0.4 V
Low level input current,
B0 - B7
VCC = 5.5 V, T/R = 0.7 V,
CD = 0.7 V, VIN = 0.4 V
VCC = 5.5 V,
Low level input current,
CD, T/R
VIN = 0.4 V
See footnotes at end of table.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
Min
-10
Max
-75
Short circuit output
current, A0 - A7
I OS1
1, 2, 3
1, 2, 3
All
All
mA
mA
VCC = 5.5 V, T/R = 0.8 V,
CD = 0.7 V, VOUT = 0.0 V 1/
Short circuit output
current, B0 - B7
I OS2
-25
-150
VCC = 5.5 V, T/R = 2.0 V,
CD = 0.7 V, VOUT = 0.0 V 1/
See 4.3.1c
Functional tests
7, 8
All
All
All
All
VCC = 5.5 V,
CD = 2.0 V,
VOUT = 4.0 V
A0 - A7
B0 - B7
1, 2, 3
1, 2, 3
1, 2, 3
80
µA
µA
µA
Off state output current
high
I OZH
200
-200
Off state output current
low, A0 - A7, B0 - B7
Supply current
I OZL
ICC
VCC = 5.5 V, CD = 2.0 V,
VOUT = 0.4 V
VCC = 5.5 V,
CD = 2.0 V,
VIN = 0.4 V
IN = 2.0 V
VIN = 0.4 V
IN = 2.0 V
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
01
02
01
02
100
100
140
150
mA
mA
mA
mA
V
T/R = 0.4 V
VCC = 5.5 V,
CD = 0.4 V,
V
T/R = 2.0 V
Propagation delay time,
input B port to output
A port
tPHL1
9
01
02
01
02
01
02
01
02
All
All
18
12
24
19
18
16
24
23
15
21
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CD = T/R = 0.4 V,
R1 = 1 kΩ,
2/
R2 = 5 kΩ,
9, 10, 11
3/
C1 = 30 pF
(See figure 4)
tPLH1
9
2/
9, 10, 11
3/
Disable time,
CD to A port
tPLZ1
B0 - B7 = 0.4 V
S3 = 1
9 2/
T/R = 0.4 V,
R5 = 1 kΩ,
9, 10, 11
3/
C4 = 15 pF
(See figure 6)
tPHZ1
B0 - B7 = 2.4 V
S3 = 0
9 2/
All
All
15
21
ns
ns
9, 10, 11
3/
See footnotes at end of table.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
tPZL1
unless otherwise specified
Min
Max
25
Enable time,
C4 = 30 pF,
B0 - B7 = 0.4 V
9 2/
All
All
All
All
ns
ns
ns
ns
CD to A port
S3 = 1
T/R = 0.4 V,
(See figure 6)
9, 10, 11
3/
33
25
33
R5 = 1 kΩ
tPZH1
B0 - B7 = 2.4 V
S3 = 0
9 2/
4/
9, 10, 11
3/
R5 = 5 kΩ
Propagation delay time,
input A port to output
B port
tPHL2
CD = 0.4 V,
9 2/
01
02
01
02
01
02
01
02
01
02
01
02
01
02
01
02
23
18
34
29
18
12
25
19
23
20
34
30
18
14
25
22
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
R1 = 100Ω
R2 = 1 kΩ
T/R = 2.4 V,
(See figure 4)
C1 = 300 pF
9, 10, 11
3/
4/
9 2/
R1 = 667Ω
R2 = 5 kΩ
C1 = 45 pF
9, 10, 11
3/
tPLH2
9 2/
R1 = 100Ω
R2 = 1 kΩ
C1 = 300 pF
9, 10, 11
3/
9 2/
R1 = 667Ω
R2 = 5 kΩ
C1 = 45 pF
9, 10, 11
3/
See footnotes at end of table.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
tPLZ2
unless otherwise specified
Min
Max
18
Disable time,
A0 - A7 = 0.4 V
9 2/
All
All
All
All
All
ns
ns
ns
ns
ns
T/R = 2.4 V,
CD to B port
S3 = 1
R5 = 1 kΩ
9, 10, 11
3/
26
15
21
35
C4 = 15 pF,
(See figure 6)
tPHZ2
A0 - A7 = 2.4 V
S3 = 0
9 2/
4/
9, 10, 11
3/
Enable time,
CD to B port
tPZL2
A0 - A7 = 0.4 V,
9 2/
R5 = 100Ω
C4 = 300 pF
T/R = 2.4 V,
S3 = 1,
9, 10, 11
3/
All
All
All
43
22
30
ns
ns
ns
(See figure 6)
4/
9 2/
R5 = 667Ω
C4 = 45 pF
9, 10, 11
3/
tPZH2
A0 - A7 = 2.4 V,
9 2/
All
All
35
43
ns
ns
R5 = 1 kΩ
C4 = 300 pF
T/R = 2.4 V,
S3 = 0,
9, 10, 11
3/
(See figure 6)
9 2/
All
All
22
30
ns
ns
R5 = 5 kΩ
C4 = 45 pF
9, 10, 11
3/
4/
See footnotes at end of table.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
tTRL
unless otherwise specified
Min
Max
38
Propagation delay time,
from transmit mode to
A port; S2 = 1; C2 = 30 pF;
9 2/
01
02
01
02
01
02
01
02
01
02
01
02
01
02
01
02
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CD = 0.4 V, R3 = 1 kΩ
33
48
43
38
33
48
43
38
33
48
43
38
33
48
43
(See figure 5)
4/
receive, T/R to A port
9, 10, 11
3/
9 2/
B port; S1 = 0; R4 = 100Ω;
C3 = 5 pF
(See figure 5)
4/
9, 10, 11
3/
tTRH
A port; S2 = 0; C2 = 30 pF;
9 2/
CD = 0.4 V, R3 = 5 kΩ
(See figure 5)
4/
9, 10, 11
3/
9 2/
B port; S1 = 1; R4 = 100Ω;
C3 = 5 pF
(See figure 5)
4/
9, 10, 11
3/
See footnotes at end of table.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
tRTL
unless otherwise specified
Min
Max
40
Propagation delay time,
from transmit mode to
A port; S2 = 0; C2 = 5 pF;
9 2/
01
02
01
02
01
02
01
02
01
02
01
02
01
02
01
02
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CD = 0.4 V, R3 = 300Ω
35
51
47
40
35
51
47
40
35
51
47
40
35
51
47
(See figure 5)
4/
receive, T/R to B port
9, 10, 11
3/
9 2/
B port; S1 = 1; R4 = 100Ω;
C3 = 300 pF
(See figure 5)
4/
9, 10, 11
3/
tRTH
A port; S2 = 1; C2 = 5 pF;
9 2/
CD = 0.4 V, R3 = 300Ω
(See figure 5)
4/
9, 10, 11
3/
9 2/
B port; S1 = 0; R4 = 1 kΩ;
C3 = 300 pF
(See figure 5)
4/
9, 10, 11
3/
1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed
one second.
2/ VCC = 5.0 V.
3/ VCC = 4.5 V to 5.5 V.
4/ All ac loads are correlated from load of 50 pF during test.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
10
DSCC FORM 2234
APR 97
Device types
01
02
Case outlines
R, 2
R, 2
Terminal number
Terminal symbols
1
2
A0
A1
A0
A1
3
A2
A2
4
A3
A3
5
A4
A4
6
A5
A5
7
A6
A6
8
A7
A7
9
10
11
CD
GND
CD
GND
T/R
B7
B6
B5
B4
B3
B2
B1
B0
T/R
B7
B6
B5
B4
B3
B2
B1
B0
12
13
14
15
16
17
18
19
20
VCC
VCC
FIGURE 1. Terminal connections.
Inputs
Conditions
Chip disable
L
L
L
H
H
X
H = high level
L = low level
Transmit/Receive
A Port
B Port
Out
In
In
Out
Z
Z
Z = high impedance state
X = irrelevant
FIGURE 2. Truth table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-86723
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
11
DSCC FORM 2234
APR 97
FIGURE 3. Logic diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-86723
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
12
DSCC FORM 2234
APR 97
NOTE: C1 includes test fixture capacitance.
From A/B port to B/A port.
FIGURE 4. Test circuit and switching waveforms.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
13
DSCC FORM 2234
APR 97
NOTE: C2 and C3 include test fixture capacitance.
FIGURE 5. Test circuit and switching waveforms - From T/R to A or B port.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
14
DSCC FORM 2234
APR 97
NOTE: C4 includes test fixture capacitance, port input is in a fixed logical condition.
FIGURE 6. Test circuit and switching waveforms - From CD to A or B port.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-86723
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
15
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004)
- - -
Final electrical test parameters
(method 5004)
1*, 2, 3, 7, 8, 9
1, 2, 3, 7, 8, 9, 10**, 11**
1, 2, 3
Group A test requirements
(method 5005)
Groups C and D end-point
electrical parameters
(method 5005)
* PDA applies to subgroup 1.
** Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in table I.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroups 7 and 8 shall include verification of the truth table.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
16
DSCC FORM 2234
APR 97
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1005 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-
HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by
DSCC-VA.
SIZE
STANDARD
5962-86723
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
C
17
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 01-11-07
Approved sources of supply for SMD 5962-86723 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of
MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
3V146
0DKS7
3/
Vendor
similar
PIN 2/
5962-8672301RA
2947/BRA
GEM07501BRA
AM2947/BRA
GEM07501BRC
2947/B2A
5962-8672301RC
5962-86723012A
0DKS7
3V146
0DKS7
3/
GEM07501B2A
AM2947/B2A
GEM07501B2C
2946/BRA
5962-86723012C
5962-8672302RA
0DKS7
3V146
0DKS7
3/
GEM13302BRA
AM2947/BRA
GEM13302BRC
2946/B2A
5962-8672302RC
5962-86723022A
0DKS7
3V146
0DKS7
3/
GEM13302B2A
AM2947/B2A
GEM13302B2C
5962-86723022C
0DKS7
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance
requirements of this drawing.
3/ No current source.
Vendor CAGE
number
Vendor name
and address
3V146
ROCHESTER ELECTRONICS
10 Malcom Hoyt Drive
Newburyport, MA 01950
0DKS7
SARNOFF, DAVID RESEARCH CENTER
201 Washington Road
Princeton, NJ 08540-5300
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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