4013B [ETC]
(279.66 k) ;
ETC 
HCC/HCF4013B
DUAL ’D’ – TYPE FLIP–FLOP
.
.
SET-RESET CAPABILITY
STATIC FLIP-FLOP OPERATION - RETAINS
STATE INDEFINITELY WITH CLOCK LEVEL
EITHER ”HIGH” OR ”LOW”
MEDIUM-SPEED OPERATION - 16MHz (typ.)
CLOCK TOGGLE RATE AT 10V
QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
5V, 10V, AND 15V PARAMETRIC RATINGS
INPUT CURRENT OF 100nA AT 18V AND 25°C
FOR HCC DEVICE
100% TESTED FOR QUIESCENT CURRENT
MEETS ALLREQUIREMENTS OF JEDECTEN-
TATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIES CMOS DEVICES”
.
.
.
EY
F
(Plastic Package)
(Ceramic Frit Seal Package)
.
.
M1
C1
(Micro Package)
(Plastic Chip Carrier)
.
.
ORDER CODES :
HCC4013BF
HCF4013BEY
HCF4013BM1
HCF4013BC1
PIN CONNECTIONS
DESCRIPTION
The HCC4013B (extended temperature range) and
HCF4013B (intermediate temperature range) are
monolithic integrated circuits, available in 14-lead
dual in-line plastic or ceramic package and plastic
micropackage.
TheHCC/HCF4013B consists oftwoidentical, inde-
pendent data-type flip-flops. Each flip-flop has inde-
pendent data, set, reset, and clockinputs and Q and
Q outputs. These devices can be used for shift reg-
ister applications, and,byconnecting Q output tothe
data input, for counter and toggle applications. The
logic level present at the D input is transferred to the
Q output during the positive-going transition of the
clock pulse. Setting or resetting is independent of
the clock and is accomplished by a high level on the
set or reset line, respectively.
June 1989
1/11
HCC/HFC4013B
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VDD
*
Supply Voltage : HCC Types
HCF Types
– 0.5 to + 20
– 0.5 to + 18
V
V
Vi
II
Input Voltage
– 0.5 to VDD + 0.5
V
DC Input Current (any one input)
± 10
mA
mW
Pt ot
Total Power Dissipation (per package)
Dissipation per Output Transistor
200
for Top = Full Package-temperature Range
100
mW
To p
Tstg
Operating Temperature : HCC Types
HCF Types
– 55 to + 125
– 40 to + 85
°C
°C
Storasge Temperature
– 65 to + 150
°C
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability.
* All voltages are with respect to VSS (GND).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage : HCC Types
HCF Types
Value
Unit
VDD
3 to 18
3 to 15
V
V
VI
Input Voltage
0 to VDD
V
To p
Operating Temperature : HCC Types
HCF Types
– 55 to + 125
– 40 to + 85
°C
°C
LOGIC DIAGRAM AND TRUTH TABLE (one of two identical flip–flops)
CL∆
D
0
R
0
0
0
S
0
0
0
Q
0
Q
1
–
/
–
–
/
1
1
0
–
–
NO CHANGE
\
X
Q
Q
–
X
X
X
X
X
X
1
0
1
0
1
1
0
1
1
1
0
1
LOGIC 0 = LOW
LOGIC 1 = HIGH
∆
X
= LOW LEVEL
= DON’T CARE
N(N) = FF1/FF2 TERMINAL
ASSIGNEMENT
2/11
HCC/HCF4013B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions
Value
Symbol
Parameter
Unit
VI
VO
|IO
|
VD D
T L ow
*
25°C
T Hig h*
(V)
(V)
(µA) (V)
Min. Max. Min. Typ. Max. Min. Max.
IL
Quiescent
Current
0/5
0/10
0/15
0/20
0/5
5
1
2
0.02
0.02
0.02
0.04
0.02
0.02
0.02
1
2
30
60
10
15
20
5
HCC
Types
4
4
120
600
30
µA
20
4
20
4
HCF
Types
0/10
0/15
0/5
10
15
8
8
60
16
16
120
VOH
VOL
VIH
VIL
Output High
Voltage
< 1
< 1
< 1
< 1
< 1
< 1
5
4.95
4.95
9.95
4.95
9.95
V
V
0/10
0/15
5/0
10 9.95
15 14.95
14.95
14.95
Output Low
Voltage
5
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
10/0
15/0
10
15
Input High
Voltage
0.5/4.5 < 1
1/9 < 1
5
10
15
5
3.5
7
3.5
7
3.5
7
V
V
1.5/13.5 < 1
4.5/0.5 < 1
11
11
11
Input Low
Voltage
1.5
3
1.5
3
1.5
3
9/1
< 1
10
15
5
13.5/1.5 < 1
4
4
4
IOH
Output
Drive
Current
0/5
0/5
2.5
4.6
9.5
13.5
2.5
4.6
9.5
13.5
0.4
0.5
1.5
0.4
0.5
1.5
– 2
– 1.6 – 3.2
– 0.51 – 1
– 1.3 – 2.6
– 3.4 – 6.8
– 1.36 – 3.2
– 0.44 – 1
– 1.1 – 2.6
– 3.0 – 6.8
– 1.15
– 0.36
– 0.9
– 2.4
– 1.1
– 0.36
– 0.9
– 2.4
0.36
0.9
5
– 0.64
HCC
Types
0/10
0/15
0/ 5
0/ 5
0/10
0/15
0/5
10 – 1.6
15 – 4.2
mA
5
5
– 1.53
– 0.52
HCF
Types
10 – 1.3
15 – 3.6
IOL
Output
Sink
Current
5
0.64
1.6
0.51
1.3
1
HCC
Types
0/10
0/15
0/5
10
15
5
2.6
6.8
1
4.2
3.4
2.4
mA
0.52
1.3
0.44
1.1
0.36
0.9
HCF
Types
0/10
0/15
10
15
18
2.6
3.6
3.0
6.8
2.4
I
IH, IIL Input
HCC 0/18
Types
± 0.1
± 0.3
±10–5 ± 0.1
±10–5 ± 0.3
± 1
± 1
Leakage
Current
Any Input
Any Input
µA
HCF
Types
0/15
15
CI
Input Capacitance
5
7.5
pF
* TLow= – 55°C for HCC device : – 40°C for HCF device.
* THigh= + 125°C for HCC device : + 85°C for HCF device.
TheNoise Margin for both ”1” and ”0” level is : 1V min. withVDD = 5V, 2V min. with VDD = 10V, 2.5 V min. with VDD = 15V.
3/11
HCC/HFC4013B
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25°C, CL = 50pF, RL = 200kΩ,
typical temperature coefficient for all VDD = 0.3%/°C values, all input rise and fall time = 20ns)
Test Conditions
Value
Symbol
Parameter
Unit
V DD (V) Min. Typ. Max.
tPLH, tPHL Propagation Delay Time
(clock to Q or Q outputs)
5
150
65
45
150
65
45
200
85
60
100
50
40
7
300
130
90
ns
10
15
5
tP LH
Propagation Delay Time
(set to Q or reset to Q)
300
130
90
ns
ns
10
15
5
tP HL
Propagation Delay Time
(set to Q or reset to Q)
400
170
120
200
100
80
10
15
5
t
THL, tTLH Transition Time
ns
10
15
5
fCL
*
Maximum Clock Input Frequency
Cock Pulse Width
3.5
8
MHz
ns
10
15
5
16
24
70
30
20
12
140
60
40
tW
tr, tf**
tW
10
15
5
Clock Input Rise or Fall Time
Set or Reset Pulse Width
Data Setup Time
15
4
µs
10
15
5
1
180
80
50
40
20
15
90
40
25
20
10
7
ns
10
15
5
tse tup
ns
10
15
*
Input tr, t = 5ns.
f
** If more than unit is cascaded in a parallel clocked application, tr should be made less than or equal to the sum of the fixed
propagation delay time at 15pF and the transition time of the carry output driving stage for the estimated capacitive load.
4/11
HCC/HCF4013B
Typical Output Low (sink) Current Characteristics.
Minimum Output Low (sink) Current Charac-
teristics.
Typical Output High (source) Current Charac-
teristics.
Minimum Output High (source) Current Charac-
teristics.
Typical Propagation Delay Time vs. Load Capacit-
ance (CLOCK or SET to Q, CLOCK or RESET to
Q).
Typical Propagation Delay Time vs. Load Capacit-
ance (SET to Q or RESET to Q).
5/11
HCC/HFC4013B
Typical Maximum Clock Frequency vs. Supply
Voltage.
Typical Power Dissipation Device vs. Frequency.
TEST CIRCUITS
Quiescent Device Current.
Noise Immunity.
Input Leakage Current.
6/11
HCC/HCF4013B
Plastic DIP14 MECHANICAL DATA
mm
inch
DIM.
MIN.
0.51
1.39
TYP.
MAX.
MIN.
0.020
0.055
TYP.
MAX.
a1
B
b
1.65
0.065
0.5
0.020
0.010
b1
D
E
e
0.25
20
0.787
8.5
2.54
15.24
0.335
0.100
0.600
e3
F
7.1
5.1
0.280
0.201
I
L
3.3
0.130
Z
1.27
2.54
0.050
0.100
P001A
7/11
HCC/HFC4013B
Ceramic DIP14/1 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
TYP.
MAX.
20
MIN.
MAX.
0.787
0.276
A
B
7.0
D
E
3.3
0.130
0.600
0.38
0.015
e3
F
15.24
2.29
0.4
2.79
0.55
1.52
0.31
2.54
10.3
8.05
5.08
0.090
0.016
0.046
0.009
0.060
0.110
0.022
0.060
0.012
0.100
0.406
0.317
0.200
G
H
L
1.17
0.22
1.52
M
N
P
7.8
0.307
Q
P053C
8/11
HCC/HCF4013B
SO14 MECHANICAL DATA
mm
inch
DIM.
MIN.
TYP.
MAX.
1.75
0.2
MIN.
TYP.
MAX.
0.068
0.007
0.064
0.018
0.010
A
a1
a2
b
0.1
0.003
1.65
0.46
0.25
0.35
0.19
0.013
0.007
b1
C
0.5
0.019
c1
D
45° (typ.)
8.55
5.8
8.75
6.2
0.336
0.228
0.344
0.244
E
e
1.27
7.62
0.050
0.300
e3
F
3.8
4.6
0.5
4.0
5.3
0.149
0.181
0.019
0.157
0.208
0.050
0.026
G
L
1.27
0.68
M
S
8° (max.)
P013G
9/11
HCC/HFC4013B
PLCC20 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
9.78
8.89
4.2
TYP.
MAX.
10.03
9.04
MIN.
0.385
0.350
0.165
MAX.
0.395
0.356
0.180
A
B
D
4.57
d1
d2
E
2.54
0.56
0.100
0.022
7.37
8.38
0.290
0.330
0.004
e
1.27
5.08
0.38
0.050
0.200
0.015
e3
F
G
0.101
M
M1
1.27
1.14
0.050
0.045
P027A
10/11
HCC/HCF4013B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
11/11
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