357-BG19002-71V [ETC]
IC SOCKET BGA 357 WAY ; IC SOCKET BGA 357路\n
| 型号： | 357-BG19002-71V |
| 厂家： | 
ETC |
| 描述： | IC SOCKET BGA 357 WAY
|
| 文件： | 总1页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BallLock™ BGA Socket
Covered by patents and/or patents applied for.
FEATURES:
• Any grid size available on either 1.27mm [.050”] or 1.50mm [.059”]
pitch.
• Lidless design - ball locks into two-fingered contact.
• Ultra-low profile socket adds only .050 [1.27] to overall package height
(.100 [2.54] with SnapAdapt™ pins).
• Optional Corner guides aid in package insertion (not used with
SnapAdapt™ pins).
• Consult Data Sheet Nos. 23003 and 23004 for Aries BallNest™
Socket.
SPECIFICATIONS:
• Socket body is UL 94V-0 FR-4.
• Optional lead-in guides are black UL 94V-0 glass-filled Thermoplastic
(PPS).
• Contacts are Beryllium Copper Alloy per QQ-C-533.
• Contact plating is either 100µ [2.54µm] min. 90/10 Tin/Lead per MIL-T-
10727 or 10µ [.25µm] min. Gold per MIL-G-45204 over 30µ [.76µm]
Nickel per QQ-N-290.
• Solder ball terminations are 90/10 Lead/Tin.
• Solder paste is 63/37 eutectic.
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
• Solder mask is “dryfilm.”
• Inductance≤1ηH/cont. @ 100MHz approx. (under testing).
• Capacitance≤1pf/contact @ 100MHz approx. (under testing).
• Contact resistance=10mOhms initial, 20mOhms @10 cycles
(under testing).
ORDERING INFORMATION
(for socket w/out corner guides only)
XXX-BGXXXXX-7XX
• Durability=10 cycles max.; up to 50 cycles with SnapAdaptTM pin.
• Insertion Force=50 grams/contact avg. (approximate);
40 grams/contact initial when used with SnapAdaptTM pin.
• Withdrawal Force=20 grams/contact max. (approximate).
• Socket accepts BGA devices with .030 [.76] dia. balls.
MOUNTING CONSIDERATIONS:
Pitch
U=1.50mm
V=1.27mm
No. of positions
(256 shown)
Ball Grid Array
Plating:
0=Tin
1=Gold
Footprint designator
(assigned by factory)
• Suggested PCB pad size=.025±.003 [.64±.08] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS]
Contact Type:
7=BallLock surface mount
solder ball contact
All tolerances ± .005 [.13]
unless otherwise specified
“A”=BGA PACKAGE SIZE + .085 [2.29]
“B”=(NO. OF POSITIONS PER ROW - 1) X BGA PITCH
“C”=BGA PACKAGE SIZE + .015 [.25]
Use Aries’ BGA
Note: Part number assigned by
“D”=BGA PACKAGE SIZE + .060 [1.52]
factory when ordering
socket with corner guides.
Order Sheet, Data
Sheet No. 23000, for
prompt quotations.
BGA Package with SMT
SnapAdapt™ pins in lieu of solder
balls. Consult Data Sheet No.
23012 and 23013 for details.
BGA Package w/ .030 [.76] dia.
solder balls
Optional
corner
guides
BallLock™ CONTACT
Corner guides not used
with SnapAdapt™ pins.
NORTH AMERICA
UK/IRELAND/GB
EUROPE/MAINLAND/HOLLAND
TEL: +31 78 615 94 65
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX: (908) 996-3891
TEL: +44 870 240 0249
FAX: +44 1653 600493
uking@arieselec.com
FAX: +31 78 615 43 11
23002
REV.E
europe@arieselec.com
http://www.arieselec.com • info@arieselec.com
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