24AA08-/P [ETC]

I2C Serial EEPROM ; I2C串行EEPROM\n
24AA08-/P
型号: 24AA08-/P
厂家: ETC    ETC
描述:

I2C Serial EEPROM
I2C串行EEPROM\n

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总12页 (文件大小:163K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
24AA04/08  
2 ™  
4K/8K 1.8V I C Serial EEPROMs  
PACKAGE TYPES  
DIP  
FEATURES  
• Single supply with operation down to 1.8V  
• Low power CMOS technology  
A0  
1
8
7
VCC  
WP  
A1  
2
- 1 mA active current typical  
- 10 µA standby current typical at 5.5V  
- 3 µA standby current typical at 1.8V  
A2  
3
4
6
5
SCL  
SDA  
• Organized as 2 or 4 blocks of 256 bytes  
(2 x 256 x 8) or (4 x 256 x 8)  
VSS  
• 2-wire serial interface bus, I2C compatible  
• Schmitt trigger, filtered inputs for noise suppres-  
sion  
8-lead  
SOIC  
1
8
A0  
VCC  
WP  
• Output slope control to eliminate ground bounce  
• 100 kHz (1.8V) and 400 kHz (5V) compatibility  
• Self-timed write cycle (including auto-erase)  
• Page-write buffer for up to 16 bytes  
2
3
4
7
6
5
A1  
A2  
SCL  
SDA  
• 2 ms typical write cycle time for page-write  
• Hardware write protect for entire memory  
• Can be operated as a serial ROM  
VSS  
14-Lead  
SOIC  
• ESD protection > 4,000V  
14  
1
2
3
4
5
6
7
NC  
NC  
A0  
• 1,000,000 ERASE/WRITE cycles guaranteed  
• Data retention > 200 years  
13  
12  
11  
VCC  
WP  
NC  
• 8-pin DIP, 8-lead or 14-lead SOIC packages  
• Available for extended temperature ranges  
A1  
NC  
- Commercial (C):  
- Industrial (I):  
0°C to +70°C  
-40°C to +85°C  
10  
9
SCL  
SDA  
NC  
A2  
VSS  
NC  
DESCRIPTION  
8
The Microchip Technology Inc. 24AA04/08 is a 4K bit or  
8K bit Electrically Erasable PROM. The device is orga-  
nized as two or four blocks of 256 x 8-bit memory with  
a two wire serial interface. Low voltage design permits  
operation down to 1.8 volts with standby and active cur-  
rents of only 3 µA and 1 mA respectively. The 24AA04/  
08 also has a page-write capability for up to 16 bytes of  
data. The 24AA04/08 is available in the standard 8-pin  
DIP and both 8-lead and 14-lead surface mount SOIC  
packages.  
BLOCK DIAGRAM  
WP  
HV GENERATOR  
I/O  
CONTROL  
LOGIC  
MEMORY  
CONTROL  
LOGIC  
EEPROM  
ARRAY  
XDEC  
PAGE LATCHES  
SDA  
SCL  
YDEC  
VCC  
VSS  
SENSE AMP  
R/W CONTROL  
I2C is a trademark of Philips Corporation.  
1999 Microchip Technology Inc.  
DS21053G-page 1  
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24AA04/08  
TABLE 1-1:  
Name  
PIN FUNCTION TABLE  
Function  
1.0  
ELECTRICAL  
CHARACTERISTICS  
1.1  
Maximum Ratings*  
VSS  
SDA  
Ground  
VCC...................................................................................7.0V  
All inputs and outputs w.r.t. VSS .............. -0.6V to VCC +1.0V  
Storage temperature ..................................... -65˚C to +150˚C  
Ambient temp. with power applied................. -65˚C to +125˚C  
Soldering temperature of leads (10 seconds) ............. +300˚C  
ESD protection on all pins..................................................≥ 4 kV  
Serial Address/Data I/O  
Serial Clock  
SCL  
WP  
Write Protect Input  
+1.8V to 5.5V Power Supply  
No Internal Connection  
Vcc  
*Notice: Stresses above those listed under “Maximum ratings”  
may cause permanent damage to the device. This is a stress rat-  
ing only and functional operation of the device at those or any  
other conditions above those indicated in the operational listings  
of this specification is not implied. Exposure to maximum rating  
conditions for extended periods may affect device reliability.  
A0, A1, A2  
TABLE 1-2:  
DC CHARACTERISTICS  
VCC = +1.8V to +5.5V  
Commercial (C): Tamb = 0˚C to +70˚C  
Industrial (I):  
Tamb = -40°C to +85°C  
Parameter  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
WP, SCL and SDA pins:  
High level input voltage  
VIH  
VIL  
.7 VCC  
.3 VCC  
V
V
V
Low Level input voltage  
Hysteresis of Schmitt trigger  
inputs  
VHYS  
.05 VCC  
(Note)  
Low level output voltage  
Input leakage current  
VOL  
ILI  
-10  
-10  
.40  
10  
10  
10  
V
IOL = 3.0 mA, VCC = 1.8V  
VIN = .1V to VCC  
µA  
µA  
pF  
Output leakage current  
ILO  
VOUT = .1V to VCC  
Pin capacitance  
CIN, COUT  
VCC = 5.0V (Note 1)  
(all inputs/outputs)  
Tamb = 25˚C, FCLK = 1 MHz  
Operating current  
ICC WRITE  
ICC READ  
0.5  
3
1
mA VCC = 5.5V, SCL = 400 kHz  
mA VCC = 1.8V, SCL = 100 kHz  
mA VCC = 5.5V, SCL = 400 kHz  
mA VCC = 1.8V, SCL = 100 kHz  
0.05  
Standby current  
ICCS  
100  
30  
µA  
µA  
µA  
VCC = 5.5V, SDA=SCL=VCC  
VCC = 3.0V, SDA=SCL=VCC  
VCC = 1.8V, SDA=SCL=VCC  
WP = VSS  
3
Note:This parameter is periodically sampled and not 100% tested.  
FIGURE 1-1: BUS TIMING START/STOP  
VHYS  
SCL  
SDA  
THD:STA  
TSU:STA  
TSU:STO  
START  
STOP  
DS21053G-page 2  
1999 Microchip Technology Inc.  
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24AA04/08  
TABLE 1-3:  
AC CHARACTERISTICS  
VCC = 4.5-5.5V  
Fast Mode  
Standard Mode  
Parameter  
Symbol  
Units  
Remarks  
Min  
Max  
Min  
Max  
Clock frequency  
Fclk  
Thigh  
Tlow  
Tr  
4000  
4700  
100  
600  
1300  
400  
kHz  
ns  
Clock high time  
Clock low time  
ns  
SDA and SCL rise time  
SDA and SCL fall time  
1000  
300  
300  
300  
ns  
(Note 1)  
Tf  
ns  
(Note 1)  
START condition hold time THD:STA  
4000  
600  
ns  
After this period the first clock  
pulse is generated  
START condition setup  
time  
TSU:STA  
4700  
600  
ns  
Only relevant for repeated  
START condition  
Data input hold time  
Data input setup time  
THD:DAT  
TSU:DAT  
0
0
ns  
ns  
ns  
ns  
ns  
250  
4000  
100  
600  
STOP condition setup time TSU:STO  
Output valid from clock  
Bus free time  
TAA  
3500  
900  
(Note 2)  
TBUF  
4700  
1300  
Time the bus must be free before  
a new transmission can start  
Output fall time from VIH  
min to VIL max  
TOF  
TSP  
250  
50  
20 + 0.1  
CB  
250  
50  
ns  
ns  
(Note 1), CB 100 pF  
Input filter spike suppres-  
sion (SDA and SCL pins)  
(Note 3)  
Write cycle time  
Endurance  
TWR  
10  
10  
ms Byte or Page mode  
1M  
1M  
cycles 25°C, Vcc = 5.0V, Block Mode  
(Note 4)  
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.  
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region  
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.  
3: The combined TSP and VHYS specifications are due to new Schmitt trigger inputs which provide improved  
noise and spike suppression. This eliminates the need for a TI specification for standard operation.  
4: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific appli-  
cation, please consult the Total Endurance Model which can be obtained on our website.  
FIGURE 1-2: BUS TIMING DATA  
TR  
TF  
THIGH  
TLOW  
SCL  
TSU:STA  
THD:DAT  
TSU:DAT  
TSU:STO  
THD:STA  
SCL  
IN  
TSP  
TBUF  
TAA  
TAA  
THD:STA  
SCL  
OUT  
1999 Microchip Technology Inc.  
DS21053G-page 3  
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24AA04/08  
3.4  
Data Valid (D)  
2.0  
FUNCTIONAL DESCRIPTION  
The 24AA04/08 supports a Bi-directional 2-wire bus  
and data transmission protocol. A device that sends  
data onto the bus is defined as transmitter, and a  
device receiving data as receiver. The bus has to be  
controlled by a master device which generates the  
serial clock (SCL), controls the bus access, and gener-  
ates the START and STOP conditions, while the  
24AA04/08 works as slave. Both master and slave can  
operate as transmitter or receiver, but the master  
device determines which mode is activated.  
The state of the data line represents valid data when,  
after a START condition, the data line is stable for the  
duration of the HIGH period of the clock signal.  
The data on the line must be changed during the LOW  
period of the clock signal. There is one clock pulse per  
bit of data.  
Each data transfer is initiated with a START condition  
and terminated with a STOP condition. The number of  
the data bytes transferred between the START and  
STOP conditions is determined by the master device  
and is theoretically unlimited, although only the last six-  
teen will be stored when doing a write operation. When  
an overwrite does occur it will replace data in a first in  
first out fashion.  
3.0  
BUS CHARACTERISTICS  
The following bus protocol has been defined:  
• Data transfer may be initiated only when the bus  
is not busy.  
• During data transfer, the data line must remain  
stable whenever the clock line is HIGH. Changes  
in the data line while the clock line is HIGH will be  
interpreted as a START or STOP condition.  
3.5  
Acknowledge  
Each receiving device, when addressed, is obliged to  
generate an acknowledge after the reception of each  
byte. The master device must generate an extra clock  
pulse which is associated with this acknowledge bit.  
Accordingly, the following bus conditions have been  
defined (Figure 3-1).  
Note: The 24AA04/08 does not generate any  
acknowledge bits if an internal program-  
ming cycle is in progress.  
3.1  
Bus not Busy (A)  
Both data and clock lines remain HIGH.  
The device that acknowledges, has to pull down the  
SDA line during the acknowledge clock pulse in such a  
way that the SDA line is stable LOW during the HIGH  
period of the acknowledge related clock pulse. Of  
course, setup and hold times must be taken into  
account. A master must signal an end of data to the  
slave by not generating an acknowledge bit on the last  
byte that has been clocked out of the slave. In this  
case, the slave must leave the data line HIGH to enable  
the master to generate the STOP condition.  
3.2  
Start Data Transfer (B)  
A HIGH to LOW transition of the SDA line while the  
clock (SCL) is HIGH determines a START condition.  
All commands must be preceded by a START condi-  
tion.  
3.3  
Stop Data Transfer (C)  
A LOW to HIGH transition of the SDA line while the  
clock (SCL) is HIGH determines a STOP condition. All  
operations must be ended with a STOP condition.  
FIGURE 3-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS  
(A)  
(B)  
(D)  
(D)  
(C)  
(A)  
SCL  
SDA  
START  
CONDITION  
STOP  
CONDITION  
ADDRESS OR  
ACKNOWLEDGE  
VALID  
DATA  
ALLOWED  
TO CHANGE  
DS21053G-page 4  
1999 Microchip Technology Inc.  
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24AA04/08  
3.6  
Device Addressing  
4.0  
WRITE OPERATION  
A control byte is the first byte received following the  
start condition from the master device.The control byte  
consists of a four bit control code, for the 24AA04/08  
this is set as 1010 binary for read and write operations.  
The next three bits of the control byte are the block  
select bits (B2, B1, B0). B2 is a don't care for both the  
24AA04 and 24AA08; B1 is a don't care for the  
24AA04. They are used by the master device to select  
which of the two or four 256 word blocks of memory are  
to be accessed.These bits are in effect the most signif-  
icant bits of the word address.  
4.1  
Byte Write  
Following the start condition from the master, the  
device code (4 bits), the block address (3 bits), and the  
R/W bit which is a logic low is placed onto the bus by  
the master transmitter. This indicates to the addressed  
slave receiver that a byte with a word address will follow  
after it has generated an acknowledge bit during the  
ninth clock cycle.Therefore the next byte transmitted by  
the master is the word address and will be written into  
the address pointer of the 24AA04/08. After receiving  
another acknowledge signal from the 24AA04/08 the  
master device will transmit the data word to be written  
into the addressed memory location. The 24AA04/08  
acknowledges again and the master generates a stop  
condition.This initiates the internal write cycle, and dur-  
ing this time the 24AA04/08 will not generate acknowl-  
edge signals (Figure 4-1).  
The last bit of the control byte defines the operation to  
be performed. When set to one a read operation is  
selected, when set to zero a write operation is selected.  
Following the start condition, the 24AA04/08 monitors  
the SDA bus checking the device type identifier being  
transmitted, upon a 1010 code the slave device outputs  
an acknowledge signal on the SDA line. Depending on  
the state of the R/W bit, the 24AA04/08 will select a  
read or write operation.  
4.2  
Page Write  
The write control byte, word address, and the first data  
byte are transmitted to the 24AA04/08 in the same way  
as in a byte write. But instead of generating a stop con-  
dition, the master transmits up to 16 data bytes to the  
24AA04/08 which are temporarily stored in the on-chip  
page buffer and will be written into the memory after the  
master has transmitted a stop condition. After the  
receipt of each word, the four lower order address  
pointer bits are internally incremented by one. The  
higher order seven bits of the word address remains  
constant. If the master should transmit more than 16  
words prior to generating the stop condition, the  
address counter will roll over and the previously  
received data will be overwritten. As with the byte write  
operation, once the stop condition is received an inter-  
nal write cycle will begin (Figure 4-2).  
Control  
Code  
Operation  
Block Select  
R/W  
Read  
Write  
1010  
1010  
Block Address  
Block Address  
1
0
FIGURE 3-2: CONTROL BYTE  
ALLOCATION  
START  
READ/WRITE  
SLAVE ADDRESS  
R/W  
A
1
0
1
0
X
B1  
B0  
X = don't care, B1 is don't care for 24AA04  
Note: Page write operations are limited to writing  
bytes within a single physical page, regard-  
less of the number of bytes actually being  
written. Physical page boundaries start at  
addresses that are integer multiples of the  
page buffer size (or Ôpage sizeÕ) and end at  
addresses that are integer multiples of  
[page size - 1]. If a page write command  
attempts to write across a physical page  
boundary, the result is that the data wraps  
around to the beginning of the current page  
(overwriting data previously stored there),  
instead of being written to the next page as  
might be expected. It is therefore neces-  
sary for the application software to prevent  
page write operations that would attempt to  
cross a page boundary.  
1999 Microchip Technology Inc.  
DS21053G-page 5  
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24AA04/08  
FIGURE 4-1: BYTE WRITE  
S
T
A
R
T
S
T
O
P
BUS ACTIVITY  
MASTER  
CONTROL  
BYTE  
WORD  
ADDRESS  
DATA  
SDA LINE  
S
P
A
C
K
A
C
K
A
C
K
BUS ACTIVITY  
FIGURE 4-2: PAGE WRITE  
S
S
T
O
P
T
BUS ACTIVITY  
MASTER  
A
R
T
CONTROL  
BYTE  
WORD  
ADDRESS (n)  
DATA n  
DATA n + 1  
DATA n + 15  
SDA LINE  
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY  
DS21053G-page 6  
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24AA04/08  
5.0  
ACKNOWLEDGE POLLING  
7.0  
READ OPERATION  
Since the device will not acknowledge during a write  
cycle, this can be used to determine when the cycle is  
complete (this feature can be used to maximize bus  
throughput). Once the stop condition for a write com-  
mand has been issued from the master, the device ini-  
tiates the internally timed write cycle. ACK polling can  
be initiated immediately.This involves the master send-  
ing a start condition followed by the control byte for a  
write command (R/W = 0). If the device is still busy with  
the write cycle, then no ACK will be returned. If the  
cycle is complete, then the device will return the ACK  
and the master can then proceed with the next read or  
write command. See Figure 5-1 for flow diagram.  
Read operations are initiated in the same way as write  
operations with the exception that the R/W bit of the  
slave address is set to one. There are three basic types  
of read operations: current address read, random  
read, and sequential read.  
7.1  
Current Address Read  
The 24AA04/08 contains an address counter that  
maintains the address of the last word accessed, inter-  
nally incremented by one. Therefore, if the previous  
access (either a read or write operation) was to  
address n, the next current address read operation  
would access data from address n + 1. Upon receipt of  
the slave address with R/W bit set to one, the 24AA04/  
08 issues an acknowledge and transmits the 8-bit data  
word. The master will not acknowledge the transfer but  
does generate a stop condition and the 24AA04/08 dis-  
continues transmission (Figure 7-1).  
FIGURE 5-1: ACKNOWLEDGE POLLING  
FLOW  
Send  
Write Command  
7.2  
Random Read  
Random read operations allow the master to access  
any memory location in a random manner. To perform  
this type of read operation, first the word address must  
be set.This is done by sending the word address to the  
24AA04/08 as part of a write operation. After the word  
address is sent, the master generates a start condition  
following the acknowledge. This terminates the write  
operation, but not before the internal address pointer is  
set. Then the master issues the control byte again but  
with the R/W bit set to a one. The 24AA04/08 will then  
issue an acknowledge and transmits the 8-bit data  
word. The master will not acknowledge the transfer but  
does generate a stop condition and the 24AA04/08 dis-  
continues transmission (Figure 7-2).  
Send Stop  
Condition to  
Initiate Write Cycle  
Send Start  
Send Control Byte  
with R/W = 0  
7.3  
Sequential Read  
Did Device  
NO  
Acknowledge  
Sequential reads are initiated in the same way as a ran-  
dom read except that after the 24AA04/08 transmits the  
first data byte, the master issues an acknowledge as  
opposed to a stop condition in a random read. This  
directs the 24AA04/08 to transmit the next sequentially  
addressed 8-bit word (Figure 7-3).  
(ACK = 0)?  
YES  
Next  
Operation  
To provide sequential reads the 24AA04/08 contains an  
internal address pointer which is incremented by one at  
the completion of each operation. This address pointer  
allows the entire memory contents to be serially read  
during one operation.  
6.0  
WRITE PROTECTION  
The 24AA04/08 can be used as a serial ROM when the  
WP pin is connected to VCC. Programming will be inhib-  
ited and the entire memory will be write-protected.  
7.4  
Noise Protection  
The 24AA04/08 employs a VCC threshold detector cir-  
cuit which disables the internal erase/write logic if the  
VCC is below 1.5 volts at nominal conditions.  
The SCL and SDA inputs have Schmitt trigger and filter  
circuits which suppress noise spikes to assure proper  
device operation even on a noisy bus.  
1999 Microchip Technology Inc.  
DS21053G-page 7  
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24AA04/08  
FIGURE 7-1: CURRENT ADDRESS READ  
S
T
O
P
S
T
A
R
T
BUS ACTIVITY  
MASTER  
CONTROL  
BYTE  
DATA n  
SDA LINE  
S
P
A
C
K
N
O
BUS ACTIVITY  
A
C
K
FIGURE 7-2: RANDOM READ  
S
T
O
P
S
T
A
R
T
S
T
A
R
T
BUS ACTIVITY  
MASTER  
CONTROL  
BYTE  
WORD  
ADDRESS (n)  
CONTROL  
BYTE  
DATA (n)  
S
P
S
SDA LINE  
A
C
K
A
C
K
A
C
K
N
O
BUS ACTIVITY  
A
C
K
FIGURE 7-3: SEQUENTIAL READ  
S
T
O
P
BUS ACTIVITY  
MASTER  
CONTROL  
BYTE  
DATA n  
DATA n + 1  
DATA n + 2  
DATA n + X  
SDA LINE  
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
BUS ACTIVITY  
A
C
K
8.3  
WP  
8.0  
PIN DESCRIPTIONS  
This pin must be connected to either VSS or VCC.  
8.1  
SDA Serial Address/Data Input/Output  
If tied to Vss, normal memory operation is enabled  
(read/write the entire memory).  
This is a Bi-directional pin used to transfer addresses  
and data into and data out of the device. It is an open  
drain terminal, therefore the SDA bus requires a pullup  
resistor to VCC (typical 10 kfor 100 kHz, 2 kfor  
400 kHz).  
If tied to VCC, WRITE operations are inhibited. The  
entire memory will be write-protected. Read opera-  
tions are not affected.  
This feature allows the user to use the 24AA04/08 as a  
serial ROM when WP is enabled (tied to Vcc).  
For normal data transfer SDA is allowed to change only  
during SCL low. Changes during SCL high are  
reserved for indicating the START and STOP condi-  
tions.  
8.4  
A0, A1, A2  
These pins are not used by the 24AA04/08. They may  
be left floating or tied to either VSS or VCC.  
8.2  
SCL Serial Clock  
This input is used to synchronize the data transfer from  
and to the device.  
DS21053G-page 8  
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24AA04/08  
NOTES:  
1999 Microchip Technology Inc.  
DS21053G-page 9  
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24AA04/08  
NOTES:  
DS21053G-page 10  
1999 Microchip Technology Inc.  
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24AA04/08  
24AA04/08 Product Identification System  
To order or obtain information (e.g., on pricing or delivery), please use listed part numbers, and refer to factory or listed sales  
offices.Sales and Support  
24AA04/08  
-
/P  
P = Plastic DIP (300 mil Body), 8-lead  
SL = Plastic SOIC (150 mil Body), 14-lead  
SN = Plastic SOIC (150 mil Body), 8-lead  
SM = Plastic SOIC (207 mil Body), 8-lead  
Package:  
Temperature  
Range:  
Blank = 0°C to +70°C  
I = -40°C to +85°C  
2
24AA04 1.8K, 4K I C Serial EEPROM  
2
24AA04T 1.8K, 4K I C Serial EEPROM (Tape and Reel)  
Device:  
2
24AA08 1.8K, 8K I C Serial EEPROM  
2
24AA08T 1.8K, 8K I C Serial EEPROM (Tape and Reel)  
Sales and Support  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-  
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:  
1. Your local Microchip sales office  
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277  
3. The Microchip Worldwide Site (www.microchip.com)  
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.  
New Customer Notification System  
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  
1999 Microchip Technology Inc.  
DS21053G-page 11  
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WORLDWIDE SALES AND SERVICE  
AMERICAS  
AMERICAS (continued)  
ASIA/PACIFIC (continued)  
Corporate Office  
Toronto  
Singapore  
Microchip Technology Inc.  
Microchip Technology Inc.  
Microchip Technology Singapore Pte Ltd.  
200 Middle Road  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-786-7200 Fax: 480-786-7277  
Technical Support: 480-786-7627  
Web Address: http://www.microchip.com  
5925 Airport Road, Suite 200  
Mississauga, Ontario L4V 1W1, Canada  
Tel: 905-405-6279 Fax: 905-405-6253  
#07-02 Prime Centre  
Singapore 188980  
Tel: 65-334-8870 Fax: 65-334-8850  
Taiwan, R.O.C  
Microchip Technology Taiwan  
10F-1C 207  
Tung Hua North Road  
Taipei, Taiwan, ROC  
ASIA/PACIFIC  
Hong Kong  
Microchip Asia Pacific  
Unit 2101, Tower 2  
Atlanta  
Microchip Technology Inc.  
500 Sugar Mill Road, Suite 200B  
Atlanta, GA 30350  
Metroplaza  
223 Hing Fong Road  
Kwai Fong, N.T., Hong Kong  
Tel: 852-2-401-1200 Fax: 852-2-401-3431  
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139  
Tel: 770-640-0034 Fax: 770-640-0307  
Boston  
EUROPE  
Microchip Technology Inc.  
5 Mount Royal Avenue  
Marlborough, MA 01752  
Tel: 508-480-9990 Fax: 508-480-8575  
Beijing  
United Kingdom  
Microchip Technology, Beijing  
Unit 915, 6 Chaoyangmen Bei Dajie  
Dong Erhuan Road, Dongcheng District  
New China Hong Kong Manhattan Building  
Beijing 100027 PRC  
Arizona Microchip Technology Ltd.  
505 Eskdale Road  
Winnersh Triangle  
Wokingham  
Berkshire, England RG41 5TU  
Tel: 44 118 921 5858 Fax: 44-118 921-5835  
Denmark  
Microchip Technology Denmark ApS  
Regus Business Centre  
Lautrup hoj 1-3  
Ballerup DK-2750 Denmark  
Tel: 45 4420 9895 Fax: 45 4420 9910  
Chicago  
Microchip Technology Inc.  
333 Pierce Road, Suite 180  
Itasca, IL 60143  
Tel: 86-10-85282100 Fax: 86-10-85282104  
India  
Tel: 630-285-0071 Fax: 630-285-0075  
Dallas  
Microchip Technology Inc.  
4570 Westgrove Drive, Suite 160  
Addison, TX 75248  
Microchip Technology Inc.  
India Liaison Office  
No. 6, Legacy, Convent Road  
Bangalore 560 025, India  
Tel: 91-80-229-0061 Fax: 91-80-229-0062  
Tel: 972-818-7423 Fax: 972-818-2924  
Dayton  
Microchip Technology Inc.  
Two Prestige Place, Suite 150  
Miamisburg, OH 45342  
Tel: 937-291-1654 Fax: 937-291-9175  
Detroit  
Microchip Technology Inc.  
Tri-Atria Office Building  
32255 Northwestern Highway, Suite 190  
Farmington Hills, MI 48334  
Tel: 248-538-2250 Fax: 248-538-2260  
Japan  
France  
Microchip Technology Intl. Inc.  
Benex S-1 6F  
Arizona Microchip Technology SARL  
Parc d’Activite du Moulin de Massy  
43 Rue du Saule Trapu  
3-18-20, Shinyokohama  
Kohoku-Ku, Yokohama-shi  
Kanagawa 222-0033 Japan  
Tel: 81-45-471- 6166 Fax: 81-45-471-6122  
Batiment A - ler Etage  
91300 Massy, France  
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79  
Germany  
Arizona Microchip Technology GmbH  
Gustav-Heinemann-Ring 125  
D-81739 München, Germany  
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44  
Korea  
Microchip Technology Korea  
168-1, Youngbo Bldg. 3 Floor  
Samsung-Dong, Kangnam-Ku  
Seoul, Korea  
Tel: 82-2-554-7200 Fax: 82-2-558-5934  
Shanghai  
Microchip Technology  
RM 406 Shanghai Golden Bridge Bldg.  
2077 Yan’an Road West, Hong Qiao District  
Shanghai, PRC 200335  
Italy  
Los Angeles  
Arizona Microchip Technology SRL  
Centro Direzionale Colleoni  
Palazzo Taurus 1 V. Le Colleoni 1  
20041 Agrate Brianza  
Microchip Technology Inc.  
18201 Von Karman, Suite 1090  
Irvine, CA 92612  
Tel: 949-263-1888 Fax: 949-263-1338  
New York  
Microchip Technology Inc.  
150 Motor Parkway, Suite 202  
Hauppauge, NY 11788  
Tel: 631-273-5305 Fax: 631-273-5335  
Milan, Italy  
Tel: 39-039-65791-1 Fax: 39-039-6899883  
Tel: 86-21-6275-5700 Fax: 86 21-6275-5060  
11/15/99  
San Jose  
Microchip received QS-9000 quality system  
certification for its worldwide headquarters,  
design and wafer fabrication facilities in  
Chandler and Tempe, Arizona in July 1999. The  
Company’s quality system processes and  
procedures are QS-9000 compliant for its  
PICmicro® 8-bit MCUs, KEELOQ® code hopping  
devices, Serial EEPROMs and microperipheral  
products. In addition, Microchips quality  
system for the design and manufacture of  
development systems is ISO 9001 certified.  
Microchip Technology Inc.  
2107 North First Street, Suite 590  
San Jose, CA 95131  
Tel: 408-436-7950 Fax: 408-436-7955  
All rights reserved. © 1999 Microchip Technology Incorporated. Printed in the USA. 11/99  
Printed on recycled paper.  
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed  
by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchips products  
as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip  
logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.  
1999 Microchip Technology Inc.  
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