230-75AB-05 [ETC]
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS; 板级功率半导体散热片
| 型号： | 230-75AB-05 |
| 厂家： | 
ETC |
| 描述： | BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS |
| 文件： | 总20页 (文件大小：922K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
•
•
•
No interface material is needed
Copper with tin-lead plating for improved solderability and assembly
Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
EIA standards and ESD protection are specified
•
•
Can be used with water soluble or no clean SMT solder creams or other pastes
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Package
Format
Package
Quantity
Natural
Forced
Convection)
Convection
217-36CT6 ̆
217-36CTT6
217-36CTR6̆
.390 (9.9)
.390 (9.9)
.390 (9.9)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Bulk
Tube
Tape & Reel
1
20
250
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Material: Copper, Tin, Lead Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
DDPAK DEVICE
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Power Dissipation. W
KEY:
í Device only, NC v Device + HS, NC ̆ Device + HS, 100 lfm Device + HS, 200 lfm ȣ Device + HS, 300 lfm
SECTION A-A
NOTES
TAPE DETAILS
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
REEL DETAILS
Dimensions: in.
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
30
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
MECHANICAL DIMENSIONS
217 SERIES
BOARD LAYOUT RECOMMENDATIONS
TUBE DETAILS
TUBE: 16.25 Inches Long,
Min. ESDMaterial with Nail
Stops
20 Pieces per Tube
217-36CTT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
217-36CT6
Dimensions: in.
230 AND 234 SERIES
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Solderable
Tab
Option
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuation
Mounting
Style
Natural
Forced
Convection)
Convection
230-75AB ̆
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
.750 (19.1)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
.500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Vert./Horiz.
Vertical
No Tab
01
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
Horizontal
Vertical
05
PATENT PENDING
10
Vert./Horiz
Vertical
No Tab
01
234-75AB-01
234-75AB-05
Horizontal
05
Material: Aluminum, Black Anodized
230-75AB-05
230-75AB-01
230-75AB-10
230 AND 234 SERIES
230 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
234 SERIES
234-75AB
234 SERIES
234-75AB-01
234-75AB-05
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
31
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
233 AND 236 SERIES
Self-Locking Wavesolderable Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Mounting
Style
Natural
Forced
Convection
Convection
233-60AB ̆
.600 (15.2) .570 (14.5) x .500 (12.7) Vert./Horiz.
No Tab
01
05
10
No Tab
01
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
233-60AB-01
233-60AB-05
233-60AB-10 ̆
236-150AB
.600 (15.2) .570 (14.5) x .500 (12.7)
.500 (12.7) .600 (15.2) x .570 (14.5)
.725 (18.4) .570 (14.5) x .500 (12.7)
Vertical
Horizontal
Vertical
PATENT PENDING
1.500 (38.1) .570 (14.5) x .500 (12.7) Vert./Horiz
236-150AB-01
236-150AB-05 ̆
236-150AB-10
1.500 (38.1) .570 (14.5) x .500 (12.7)
.500 (12.7) 1.500 (38.1) x .570 (14.5)
1.625 (41.3) .570 (14.5) x .570 (12.7)
Vertical
Horizontal
Vetrical
05
10
Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
233 AND 236 SERIES
233-60AB-01
236-150AB-01
233-60AB-10
236-150AB-10
233-60AB-05
236-150AB-05
236-150AB
Dimensions: in. (mm)
233-60AB
275 AND 231 SERIES
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Thermal Performance at Typical Load
Height Above
Footprint
Dimensions
in. (mm)
Standard
P/N
PC Board
in. (mm)
Mounting
Configuration Tab Options
Solderable
Mounting
Style
Natural
Forced
Convection
Convection
275-75AB
275-75AB-01
275-75AB-10
231-69PAB
231-69PAB-13H
231-69PAB-XXX
231-75PAB
231-75PAB-13H
(14V ̆) 231-75PAB-XXX
231-137PAB
.750 (19.1)
.750 (19.1)
.875 (12.7)
.690 (18.4)
.400 (38.1)
.690 (38.1)
.750 (12.7)
.400 (41.3)
.750 (34.9)
1.375 (10.2)
.400 (10.2)
.835 (21.2) x .400 (12.7) Vert./Horiz.
No Tab
01
10
No Tab
13H
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
44 C @ 2W
44°C @ 2W 7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (14.5)
Vertical
Vertical
44°C @ 2W
45°C @ 2W
45°C @ 2W
45°C @ 2W
43°C @ 2W 7.9°C/W @ 400 LFM
43°C @ 2W 7.9°C/W @ 400 LFM
43°C @ 2W 7.9°C/W @ 400 LFM
32°C @ 2W 5.9°C/W @ 400 LFM
32°C @ 2W 5.9°C/W @ 400 LFM
32°C @ 2W 5.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
.835 (21.2) x .400 (12.7) Vert./Horiz.
PATENT 5381041
.690 (17.5) x .835 (12.7)
.835 (21.2) x .400 (12.7)
Horizontal
Vertical
13V, 14V, 15V Clip/Mtg Hole
No Tab
13H
13V, 14V, 15V Clip/Mtg Hole
No Tab
13H
.835 (21.2) x .400 (14.5) Vert./Horiz.
Clip/Mtg Hole
Clip/Mtg Hole
.750 (19.1) x .835 (12.7)
.835 (21.2) x .400 (12.7)
Horizontal
Vertical
.835 (21.2 x .400 (12.7) Vert./Horiz.
1.375 (34.9) x .835 (12.7) Horizontal
Clip/Mtg Hole
Clip/Mtg Hole
231-137PAB-13H
(15V̆) 231-137PAB-XXX 1.375 (10.2)
.835 (21.2) x .400 (12.7)
Vertical
13V, 14V, 15V Clip/Mtg Hole
Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)
275 AND 231 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL
DIMENSIONS
TAB 13H
All versions No Tab
TAB
13V
TAB
14V
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
TAB 01
TAB 10
TAB 15V
TAB 13H
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
32
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
235 SERIES
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
Convection
235-85AB ̆
235-85AB-01
235-85AB-05
235-85AB-10
.850 (21.6) 1.000 (25.4) x .500 (12.7) Vert./Horiz.
.850 (21.6) 1.000 (25.4) x .500 (12.7) Vertical
.500 (12.7) .850 (21.6) x1.000 (25.4) Horizontal
.975 (24.8) 1.000 (25.4) x .500 (12.7)
No Tab
01
05
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
Vertical
10
PATENT 5381041
Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
235 SERIES
MECHANICAL DIMENSIONS
235-85AB
235-85AB-05
235-85AB-01
235-85AB-10
Dimensions: in. (mm)
243 SERIES
Labor-Saving Clip-On Heat Sinks
Thermal Performance at Typical Load
Height Above
PC Board
Footprint
Dimensions
in. (mm)
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
in. (mm)
Convection
243-1PAB
243-3PAB ̆
1.000 (25.4)
.800 (20.3)
.800 (20.3) x .270 (6.9)
.800 (20.3) x .270 (6.9)
Vert./Horiz.
Verl./Horiz.
No Tab
No Tab
Clip
Clip
50°C@ 2W
78°C@ 2W
4.5°C/W @ 400 LFM
8.2°C/W @ 400 LFM
Material: Aluminum, Pre-anodized Black
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
243 SERIES
VIEW B-B
SECTION A-A
Dimensions: in. (mm)
239 SERIES
Snap-Down Self-Locking Heat Sinks
Thermal Performance at Typical Load
Height Above
PC Board
Footprint
Dimensions
in. (mm)
Standard
P/N
Mounting
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
in. (mm)
Configuration
Convection
239-75AB
239-75AB-03
239-75AB-04
.750 (19.1)
.750 (19.1)
.750 (19.1)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
Vert./Horiz
Vertical
Vertical
No Tab
03
04
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
38°C @ 2W
38°C @ 2W
38°C @ 2W
6°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
PATENT PENDING
Material: Aluminum, Black Anodized
239 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
SECTION A-A
239-75AB
239-75AB-03
239-75AB-04
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
33
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
273 SERIES
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
Convection
273-AB ̆
273-AB-01
273-AB-02
.375 (9.5)
.375 (9.5)
.375 (9.5)
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
Vert./Horiz.
Vertical
Vertical
No Tab
01
02
Mtg Hole
Mtg Hole
Mtg Hole
49°C @ 2W
49°C @ 2W
49°C @ 2W
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
273 SERIES
273-AB
273-AB-01
273-AB-02
Dimensions: in. (mm)
274 SERIES
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
Convection
274-1AB ̆
.375 (9.5)
274-1AB-01 ̆ .375 (9.5)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vertical
No Tab
01
02
No Tab
01
02
No Tab
01
02
No Tab
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
56°C @ 2W
56°C @ 2W
56°C @ 2W
50°C @ 2W
50°C @ 2W
50°C @ 2W
62°C @ 2W
62°C @ 2W
62°C @ 2W
56°C @ 2W
50°C @ 2W
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
274-1AB-02
274-2AB ̆
274-2AB-01
274-2AB-02
274-3AB ̆
274-3AB-01
274-3AB-02
281-1AB
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
Material: Aluminum,
Black Anodized
281-2AB
Vertical
No Tab
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
274 SERIES
274-XAB-02
274-XAB-01
274 SERIES
281 SERIES
Dimensions: in. (mm)
240 SERIES
Labor-Saving Twisted Fin Heat Sinks
Thermal Performance at Typical Load
Height Above
PC Board
Footprint
Dimensions
in. (mm)
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Mounting
Style
Natural
Forced
Convection
in. (mm)
Convection
240-118ABH-22 ̆ 1.180 (30.0)
240-118ABS-22 1.180 (30.0)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
Vertical
Vertical
22
22
Clip/Mtg Hole
Clip/Mtg Slot
55°C @ 4W
55°C @ 4W
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
240 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
240-118ABS-22
240-118ABH-22
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
34
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
242 SERIES
Low-Height, Low-Profile Twisted Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
Convection
242-125AB-22 1.285 (32.6)
.875 (22.2) x .250 (6.4)
Vertical
22
Mtg Hole
48°C @ 2W
6.2°C/W @ 400 LFM
Material: Aluminum, Black Anodized
242-125AB-22
242 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
232 AND 238 SERIES
Staggered Fin Heat Sinks for Vertical Mounting
Thermal Performance at Typical Load
Height Above
PC Board
Footprint
Dimensions
in. (mm)
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
in. (mm)
Convection
232-200AB
232-200AB-23 2.000 (50.8)
238-200AB 2.000 (50.8)
2.000 (50.8)
1.380 (35.1) x .500 (12.7)
1.380 (35.1) x .500 (12.7)
1.380 (35.1) x .500 (12.7)
Vertical
Vertical
Verlical
Verlical
2, Twisted
2, Solderable Clip/Mtg Hole
2, Twisted
2, Solderable
Clip/Mtg Hole
48°C @ 4W
48°C @ 4W
48°C @ 4W
48°C @ 4W
3.3°C/W @ 400 LFM
3.3°C/W @ 400 LFM
3.3°C/W @ 400 LFM
3.3°C/W @ 400 LFM
Mtg Slot
Mtg Slot
Material: Aluminum,
Black Anodized
238-200AB-23 2.000 (50.8) 1.380 (35.1) x .500 (12.7)
MECHANICAL DIMENSIONS
238-200AB
238-200AB-23
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
232-200AB
232-200AB-23
238 SERIES
232 AND 238 SERIES
Dimensions: in. (mm)
251 SERIES
Slim-Profile Heat Sinks With Integral Clips
Thermal Performance at Typical Load
Height Above
PC Board
Footprint
Dimensions
in. (mm)
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
in. (mm)
Convection
251-62AB
251-80AB
251-80AB-19
.620 (15.7)
.845 (21.5)
.875 (22.2)
.910 (23.1) x .380 (9.7)
.910 (23.1) x .380 (9.7)
.910 (23.1) x .380 (9.7)
Vert./Horiz.
Vert./Horiz.
Vertical
No Tab
No Tab
19
Clip
Clip
Clip
66°C @ 3W
64°C @ 3W
64°C @ 3W
66°C/W @ 400 LFM
66°C/W @ 400 LFM
66°C/W @ 400 LFM
Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
251 SERIES
251-80AB
251-80AB-19
251-62AB
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
35
Board Level
Heat Sinks
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
244 SERIES
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
244-145AB
244-145AB-50
1.450 (36.8) 1.300 (33.0) x 480 (12.1)
1.650 (41.9) 1.300 (33.0) x 480 (12.1)
Vert/Horiz,
Vertical
No Tab
50
44°C @ 4W
44°C @ 4W
4.4°C/W @ 400 LFM
4.4°C/W @ 400 LFM
.0160 (7.25)
.0170 (7.20)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
245 SERIES
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
245-145AB
245-145AB-50
1.450 (36.8)
1.650 (41.9)
1.750 (44.5) x .380 (9.7)
1.750 (44.5) x .380 (9.7)
Ver.t/Horiz.
Vertical
No Tab
50
38°C @ 4W
38°C @ 4W
3.2°C/W @ 400 LFM
3.2°C/W @ 400 LFM
.0160 (7.25)
.0170 (7.20)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
246 SERIES
Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
246-197AB
246-197AB-50
1.968 (50.0)
2.168 (55.1)
1.986 (50.4) x 3.75 (9.5)
1.986 (50.4) x 3.75 (9.5)
Vert./Horiz.
Vertical
No Tab
50
35°C @ 4W
35°C @ 4W
2.8°C/W @ 400 LFM
2.8°C/W @ 400 LFM
.0240 (10.90)
.0250 (11.40)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
36
Board Level
Heat Sinks
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
247 SERIES
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
247-195AB
1.950 (49.5) 1.900 (48.3) x .950 (24.1)
Vert./Horiz.
Vertical
No Tab
50
25°C@ 4W
25°C@ 4W
2.4°C/W @ 400 LFM
2.4°C/W @ 400 LFM
.0330 (15.10)
.0340 (15.60)
247-195AB-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
248 SERIES
Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
248-162AB
1.620 (41.1) 2.000 (50.8) x .750 (19.1)
Vert/Horiz.
Vertical
No Tab
50
35°C @ 4w
35°C @ 4w
2.5°C/W @ 400 LFM
2.5°C/W @ 400 LFM
.026 (11.60)
.027 (12.20)
248-162AB-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1)
Order SpeedClip™ 285SC or 330SC separately.
Material: Aluminum, Black Anodized
Order SpeedClips™ separatley for use
with Series 246, 247, 248 or 249
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
249 SERIES
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration Tab Options
Solderable
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
249-113AB
1.130 (28.7) 1.900 (48.3) x .950 (24.1)
Vert./Horiz,
Vertical
No Tab
50
35°C@ 4W
35°C@ 4W
3.29°C/W @ 400 LFM
3.29°C/W @ 400 LFM
.020 (8.90)
.021 (9.40)
249-113AB-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
37
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
288 SERIES
Compact Wave-Solderable Low-Cost Heat Sinks
Height Above
PC Board
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
288-1AB ̆
1.250 (31.8)
0.875 (22.2) x 0.215 (5.5)
85°C @ 4W
12°C/W @ 200 LFM
0.0057 (2.59)
Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
electrical connections for vertical mounting of TO-220 and TO-202 semicon-
ductor packages. These heat sinks are designed for use where minimum PC
board space is available. The 288-1AB is a stamped aluminum heat sink, black
anodized, designed for applications requiring good heat dissipation from a heat
sink occupying minimum space, available at minimum cost.
288 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
271 SERIES
Top-Mount Booster Heat Sinks for Use with 270/272/280 Series
Horizontal
Mounting Footprint
Dimensions
Height Above
Semiconductor Case
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Natural
Forced
Convection
Weight
lbs. (grams)
in. (mm)
Convection
271-AB ̆
0.500 (12.7)
1.750 (44.5) x 0.700 (17.8)
62°C @ 4W (NOTE A)
31 °C @ 4W (NOTE B)
5.1°C/W @ 400 LFM
1.8°C/W 400 LFM (NOTE B)
0.0052 (2.36)
Material: Aluminum, Black Anodized
This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for
improved performance.
NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown
with (2) 271-AB types added to (1) 272-AB type.
271 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
38
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
270/272/280 SERIES
Small Footprint Low-Cost Heat Sinks
Height Above
PC Board
in. (mm)
Horizontal Mounting
Maximum Footing
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Solderable
Tab Options
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
270-AB ̆
272-AB ̆
280-AB
0.375 (9.4)
0.375 (9.4)
0.375 (9.4)
1.750 (44.5) x 0.700 (17.8)
1.750 (44.5) x 1.450 (36.8)
1.750 (44.5) x 0.700 (17.8)
—
01,02
—
70°C @ 4W
42°C @ 4W
70°C @ 4W
6.0°C/W @ 400 LFM
3.6°C/W @ 400 LFM
6.0°C/W @ 400 LFM
0.0052 (2.36)
0.0105 (5.72)
0.0048 (2.18)
Material: Aluminum, Black Anodized
These exceptionally low-cost heat sinks can be mounted horizontally under a
TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4).
For added performance, a 271 Series heat sink can also be used for double-sided heat dissi-
pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for
two power semiconductors. Specify solderable tab options for the 272 Series by the addition
of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
270 SERIES
280 SERIES
272AB01
272AB02
272 SERIES
Dimensions: in. (mm)
289 AND 290 SERIES
Low-Cost Single or Dual Package Heat Sinks
Height Above
PC Board
in. (mm)
Horizontal Mounting
Maximum Footing
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
289-AB ̆
289-AP
290-1AB ̆
290-2AB ̆
0.500 (12.7)
0.500 (12.7)
0.500 (12.7)
0.500 (12.7)
1.000 (25.4) x O.710 (18.1)
1.000 (25.4) x 0.710 (18.1)
1.000 (25.4) x 1.180 (30.0)
1.000 (25.4) x 1.180 (30.0)
50°C @ 2W
50°C @ 2W
44°C @ 2W
44°C @ 2W
44°C/W @ 400 LFM
44°C/W @ 400 LFM
35°C/W @ 400 LFM
35°C/W @ 400 LFM
0.0055 (2.49)
0.0055 (2.49)
0.0082 (3.72)
0.0081 (3.67)
Material: Aluminum, Black Anodized
Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate
one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with
no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
289 SERIES
290 SERIES
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
39
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
250 SERIES
High-Performance Slim Profile Heat Sinks With Integral Clips
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
Convection
Convection
250-122AB
1.220 (31.0)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
Vert./Horiz.
Vertical
Vertical
No Tab
09
25
Clip
Clip
Clip
50°C @ 4W
50°C @ 4W
50°C @ 4W
3.7°C/W @ 400 LFM
3.7°C/W @ 400 LFM
3.7°C/W @ 400 LFM
250-122AB-09 ̆ 1.220 (31.0)
250-122AB-25 1.380 (35.1)
Material: Aluminum, Black Anodized
250-122AB-09
250-122AB-25
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
250 SERIES
MECHANICAL DIMENSIONS
250-122AB
Dimensions: in. (mm)
237 AND 252 SERIES
High-Performance, High-Power Vertical Mount Heat Sinks
Thermal Performance at Typical Load
Height Above
PC Board
Footprint
Dimensions
in. (mm)
Standard
P/N
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Natural
Forced
in. (mm)
Convection
Convection
237-167AB2
237-167AB3
237-167AB2-24 1.675 (42.5)
252-167AB2
252-167AB3
252-167AB2-24 1.675 (42.5)
1.675 (42.5)
1.675 (42.5)
1.000 (25-4) x 1.000 (25.4)
1.000 (25.4) x 1.000 (25.4)
1.000 (25.4) x 1.000 (25.4)
1.000 (25.4) x 1.000 (25.4)
1.000 (25.4) x 1.000 (25.4)
1.000 (25.4) x 1.000 (25.4)
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
2, Twisted
3, Twisted
2, Solderable
2, Twisted
3, Twisted
2, Solderable
Clip/Mtg Slot
Clip/Mtg Slot
Clip/Mtg Slot
Clip/Mtg Slot
Clip/Mtg Slot
Clip/Mtg Slot
46°C @ 4W
46°C @ 4W
46°C @ 4W
40°C @ 4W
40°C @ 4W
40°C @ 4W
4.5°C/W @ 200 LFM
4.5°C/W @ 200 LFM
4.5°C/W @ 200 LFM
4.5°C/W @ 200 LFM
4.5°C/W @ 200 LFM
4.5°C/W @ 200 LFM
1.675 (42.5)
1.675 (42.5)
Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
227-167
252-167
237-167AB2 237-167AB2-24
252-167AB2 252-167AB2-24
237 AND 252 SERIES
237-167AB3
252-167AB3
237 AND 252 SERIES
237-167AB3
252-167AB3
Dimensions: in. (mm)
291 SERIES
Labor-Saving Clip-on Heat Sinks
Vertical
Height Above
PC Board
in. (mm)
Mounting Footprint
Dimensions
Thermal Performance at Typical Load
Standard
P/N
Mounting
Style
Natural
Forced
Weight
lbs. (grams)
in. (mm)
Convection
Convection
291-C236AB
291-H36AB ̆
0.860 (21.)9
0.860 (21.9)
1.100 (27.0) x 0.360 (9.1)
1.100 (27.0) x 0.360 (9.1)
TO-220 (Clip)
TO-220 (Mtg. Hole)
80°C @ 2W
68°C @ 2W
24°C/W @ 600 LFM
16°C/W @ 600 LFM
0.0026 (1.18)
0.0026 (1.18))
Material: Aluminum, Black Anodized
Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks
employ a unique clip for attachment of TO-220 case styles.
One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting
hole only.
291 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
291-C2
291-H
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
40
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
286 SERIES
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Height Above
PC Board
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Maximum Footprint
in. (mm)
Natural
Forced
Convection
Weight
lbs. (grams)
Material
Convection
286-AB ̆
1.190 (30.2) 1.000 (25.4) x 0.500 (12.7)
Aluminum, Anodized
Copper, Black
Copper, Tinned
58°C @ 4W
58°C @ 4W
58°C @ 4W
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
0.0085 (3.86)
0.0250 (11.34)
0.0250 (11.34)
286-CBT ̆ 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7)
286-CT
1.190 (30.2) 1.000 (25.4) x 0.500 (12.7)
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-
drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili-
ty. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum,
black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
286 SERIES
Dimensions: in. (mm)
287 SERIES
Wave-Solderable Low-Cost Heat Sinks
Height Above
PC Board
in. (mm)
Maximum
Footprint “A”
in. (mm)
Thermal Performance at Typical Load
Standard P/N
Mounting Slot Mounting Hole
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
287-1AB ̆
287-2AB ̆
287-1ABH ̆
287-2ABH ̆
1.180 (30.0)
1.180 (30.0)
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 1.000 (25.4)
65°C @ 4W
55°10 @ 4W
7.8°CW @ 200 LFM
6.4°CW @ 200 LFM
0.0090 (4.08)
0.0140 (6.35)
Material: Aluminum, Black Anodized
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards.
Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm)
mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.
287 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Standard P/N Dim. “A”
287-1AB
287-2AB
287-1ABH
287-2ABH
0.500 (12.7)
1.000 (25.4)
0.500 (12.7)
1.000 (25.4)
Dimensions: in. (mm)
695 SERIES
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
Maximum
Width
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Height
in. (mm)
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
695-1B ̆
1.330 (33.8)
0.530 (13.7)
72°C @ 4.0W
5.2°C/W @ 400 LFM
0.0030 (1.36)
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
provides good heat dissipation for use where height is limited above the print-
ed circuit board or base plate.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
695 SERIES
MECHANICAL
DIMENSIONS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
41
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
256 SERIES
Thermal Retainers
256-DM
Height (Less
Mounting Tab)
in. (mm)
Standard
P/N
Weight
lbs. (grams)
Material
256-DM ̆
0.190 (4.0)
Beryllium Copper
0.0005 (0.23)
260 SERIES
Cup Clips for TO-5 Case Style Semiconductors
Thread
Size:
4
6
10
T
S
P
=
=
=
=
=
=
#4-40 UNC
#6-32 UNC
#10-32 UNF
tapped
stud
plain
Base Style: H = hex
Semiconductor
Case Style: 5 = TO-5
Insulation E = epoxy
Mounting
Style:
Type: B = beryllium
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”; Ceramic Spacers – beryllium oxide
Base Mounting Configurations — TO-5
Plain Type — Epoxy bonded, or used with #4 pan head screws.
Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care
should be taken not to use too long a screw, which could short against the
semiconductor case. For correct screw lengths:
Correct Screw Length (L) =
+
+
Depth of Base Panel Thickness Washer Thickness
To determine the correct mounting screw lengths, add dimensions as follows:
Correct Screw Length (L) =
Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not
supplied. Stud hole must be slightly countersunk to ensure flat mounting.
+
+
Depth of Base Panel Thickness Washer Thickness
Epoxy Insulated For TO-5
Beryllium Oxide Insulated For TO-5
̆ 260-4TH5E
̆ 260-4T5E
̆ 260-4TH5B
260-6SH5E
260-10SH5E
̆ 260-6SH5B
260-10SH5B
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
42
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
200 SERIES
High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors
Single-Level Star
201,202,204,205,211 Series
Dual-Level Star
203,207,213 Series
Dual-Level Sunburst
209, 215 Series
Available
Standard P/N
& Finish
Types
Semiconductor
Case Diameter
Min/Max
Heat Sink
Inside Dia.
“A”
Heat Sink
Outside Dia.
“B”
Heat Sink
Height
“C”
Natural
Convection
Case Rise
Applicable
Power
Semiconductor
Case Types
Forced
Convection
in. (mm)
in. (mm)
in. (mm)
in. (mm)
Above Ambient (QCA@200 LFM)
̆ 201CB, 201AB
202CB
203CB
0.161 (4.1)/0.240 (6.1)
0.161 (4.1)/0.240 (6.1)
0.161 (4.1)/0.240 (6.1)
0.150 (3.8)
0.150 (3.8)
0.150 (3.8)
0.640 (16.2)
0.490 (12.5)
0.640 (16.2)
0.187 (4.8)
0.187 (4.8)
0.375 (9.5)
65°C @ 1W
73°C @ 1W
53°C @ 1W
31°C/W
43°C/W
23°C/W
TO-18, TO-24, TO-28,
TO-40, TO-44
204CB ̆, 204SB
205CB ̆, 205SB
205AB, 205AP
207CB ̆, 207SB ̆ 0.275 (7.0)/0.370 (9.4)
207AB ̆, 207AP
209CB, 209SB
0.275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
0,275 (7.0)/0.370 (9.4)
0.255 (6.5)
0.255 (6.5)
0.255 (6.5)
0.255 (6,5)
0.255 (6.5)
0.255 (6.5)
0.550 (4.8)
0.720 (18.3)
0.720 (18.3)
0.720 (18.3)
0.720 (18.3)
1.280 (32.5)
0.187 (4.8)
0.187 (4.8)
0.187 (4.8)
0.375 (9.5)
0.375 (9.5)
0.437 (11.1)
68°C @ 1W
59°C @ 1W
68°C @ 1W
46°C @ 1W
53°C @ 1W
30°C @ 1W
35°C/W
28°C/W
28°C/W
20°C/W
20°C/W
13°C/W
TO-5, TO-9, TO-11,
TO-12, TO-26, TO-29,
TO-33, TO-43, TO-45
0.275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
211CB
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.830 (21.1)
0.830 (21.1)
0.830 (21.1)
1.400 (35.6)
1.400 (35.6)
0.187 (4.8)
0.375 (9.5)
0.375 (9.5)
0.437 (11.1)
0.437 (11.1)
50°C @ 1W
44°C @ 1W
51°C @ 1W
28°C @ 1W
32°C @ 1W
24°C/W
19°C/W
19°C/W
15°C/W
15°C/W
TO-8, TO-38
213CB, 213SB
213AB, 213AP
215CB, 215AB
215AP
NATURAL AND FORCED CONVECTION CHARACTERISTICS
258 SERIES
Thermal Links for Fused Glass Diodes
Standard
P/N
Dimensions
in. (mm)
Weight
lbs. (grams)
Material
Finish
258 ̆
0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6)
Aluminum
DeltaCoate™ 151 on all surfaces
except solder pads and base
0.0018 (0.82)
MECHANICAL DIMENSIONS
The thermal resistance from diode leads to chassis
or heat sink is 12°C/watt, when unit is mounted
with TYPE 120 Joint Compound. If a 10°C/watt
chassis or sink to ambient impedance is available,
the thermal resistance from the diode leads to
ambient is reduced from about 150°C/watt to
22°C/watt.
258 SERIES
Dimensions: in. (mm)
292 SERIES
Heat Sink for Single TO-92
Height Above
PC Board
in. (mm)
Overall
Fin Width
in. (mm)
Standard
P/N
Thermal Performance
Natural Convection
Weight
lbs. (grams)
Finish
292-AB ̆
0.750 (19.1)
0. 600 (15.3)
0.225°C/W @ 0.250 W
Black Anodized
0.00049 (0.22)
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
292 SERIES
Power semiconductors packaged in a TO-92 style
plastic case can be cooled effectively at little addi-
tional cost with the addition of the 292-AB heat
sink. The 292-AB is effective over the typical power
range of such devices. Material: Aluminum, Black
Anodized.
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
43
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Weight
lbs. (grams)
Plain Pin
Without Pin
634-10ABP ̆
634-15ABP
634-20ABP ̆
634-10AB
634-15AB
634-20AB
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.016 (7.48)
0.025 (11.21)
0.033 (14.95)
Material: Aluminum, Black Anodized.
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
634 SERIES
MECHANICAL DIMENSIONS
TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Notes:
1. Thermal compound is
assumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
Dimensions: in. (mm)
637 SERIES
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Maximum Footprint
in. (mm)
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
637-10ABP ̆
637-15ABP ̆
637-20ABP ̆
637-25ABP ̆
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
76°C @ 6W
65°C @ 6w
55°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
0.023 (10.43)
0.035 (15.88)
0.050 (22.68)
0.062 (28.12)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards.
Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight
and board space occupied must be minimized. Refer to the Accessory products section for
thermal interface materials, thermal compounds, and other accessories products.
637 SERIES
(EXTRUSION PROFILE 5183)
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
44
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
626 AND 627 SERIES
High-Efficiency Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Standard
P/N
Natural
Forced
Convection
Convection
626-10ABP
626-15ABP
626-20ABP
626-25ABP
627-10ABP
627-15ABP
627-20ABP
627-25ABP
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63-5)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
76°C @ 6W
65°C @ 6W
55°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/M @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
626 AND 627 SERIES
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
657 SERIES
High-Performance Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Natural
Forced
Convection
Weight
lbs (grams)
Convection
657-10ABP ̆
657-15ABP ̆
1.000 (25.4)
1.500 (38.1)
657-20ABP ̆ 2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
0.0515 (23.36)
0.0760 (34.60)
0.1030 (47.00)
0.1250 (57.00)
657-25ABP ̆ 2.500 (63.5)
Wave-solderable pins. Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
657 SERIES
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
46
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
657 SERIES
High-Performance Notched Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Natural
Forced
Convection
Convection
657-10ABPN
657-15ABPN ̆
657-20ABPN
657-25ABPN
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
657 SERIES
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
657 SERIES
High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Natural
Forced
Convection
Convection
657-10ABPSC
657-15ABPSC
657-20ABPSC
657-25ABPSC ̆
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
677 SERIES
High-Performance, High-Power Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Natural
Forced
Convection
Convection
677-10ABP
677-15ABP
677-20ABP
677-25ABP
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
52°C @ 6W
46°C @ 6W
40°C @ 6W
35°C @ 6W
3.1°C/W @ 200 LFM
2.8°C/W @ 200 LFM
2.5°C/W @ 200 LFM
2.2°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
677 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
677 SERIES
(EXTRUSION PROFILE 8719)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
47
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
690 SERIES
HIghest Efficiency/Lowest Unit Cost Heat Sinks
Height Above
PC Board
in. (mm)
Thermal Performance at Typical Load
Semiconductor
Mounting
Hole Pattern
Standard
P/N
Outline Dimensions
in. (mm)
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
690-3B ̆
690-66B
690-220B
1.310 (33.3)
1.310 (33.3)
1.310 (33.3)
1.860 (47.2)-sq
1.860 (47.2)-sq
1.860 (47.2)-sq
44°C @ 7.5W
44°C @ 7.5W
44°C @ 7.5W
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
(1) TO-3
(1) TO-66
(2) TO-220
0.0700 (31.75)
0.0700 (31.75)
0.0700 (31.75)
Material: Aluminum, Black Anodized
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are
available in three standard types to mount and cool one TO-3 or TO-66 metal power semicon-
ductor type or two plastic package TO-220 power semiconductor types. For higher power
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting
surface temperature rise above ambient air temperature of no more than 91°C.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
690 SERIES
TO-66
*TWO TO-220’S
TO-3
Dimensions: in. (mm)
680 SERIES
Maximum Efficiency Omnidirectional Heat Sinks
Height Above
PC Board “A”
in. (mm)
Horizontal Mounting
Footprint Dimensions
in. (mm)
Thermal Performance at Typical Load
Semiconductor
Mounting
Hole Pattern
Standard
P/N
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
680-5A ̆
0.500 (12.7)
0.750 (19.1)
1.000 (25.4)
1.250 (31.8)
0.500 (12.7)
0.750 (19.1)
1.000 (25.4)
1.250 (31.8)
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
70°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
7O°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
(1) TO-3
(1) TO-3
(1) TO-3
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
680-75A ̆
680-10A ̆
680-125A ̆
680-5220
(1) TO-3
(2) TO-220
(2) TO-220
(2) TO-220
(2) TO-220
680-75220
680-10220 ̆
680-125220 ̆
Material: Aluminum, Black Anodized
Achieve optimum natural convection cooling per unit volume occupied above the printed
circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style
cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation
of air in natural convection applications. These 680 Series heat sinks can also be specified with-
out any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL
DIMENSIONS
680 SERIES
SEMICONDUCTOR MOUNTING HOLES
220
A
K
Dimensions: in. (mm)
TO-3
*TWO TO-220’S
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
48
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
601 AND 603 SERIES
Low-Height Heat Sinks
Footprint
Dimensions
in. (mm)
Mounting
Hole Dia.
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Height
in. (mm)
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
601E
601F
601K
603K
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 2.000 (50.8)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.200 (5.1)
0.270 (6.9)
None
52°C @ 5.0W
52°C @ 5.0W
52°C @ 5.0W
41°C @ 5.0W
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.0°C/W @ 175 LFM
0.0500 (22.68)
0.0500 (22.68)
0.0500 (22.68)
0.0810 (36.74)
None
Material: Aluminum Alloy, Black Anodized
Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-
conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient
heat dissipation are required. The 601 and 603 Series may also be attached to enclosure pan-
els or brackets using isolation hardware where necessary.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
603 SERIES
(EXTRUSION PROFILE 1284)
601 SERIES
(EXTRUSION PROFILE 1284)
SEMICONDUCTOR MOUNTING HOLES
E
K
F
Dimensions: in. (mm)
635 SERIES
Space-Saving Low-Cost Heat Sinks
Height Above
PC Board “A”
in. (mm)
Outline
Dimensions
in. (mm)
Thermal Performance at Typical Load Semiconductor
Standard
P/N
Natural
Forced
Convection
Mounting
Hole Pattern
Weight
lbs. (grams)
Convection
635-5B2
0.500 (12.7)
0.750 (19.1)
1.000 (25.4)
1.250 (31.8)
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
90°C @ 8.0W
77°C @ 8.0W
61°C @ 8.0W
53°C @ 8.0W
6.0°C/W @ 300 LFM
4.8°C/W @ 300 LFM
3.6°C/W @ 300 LFM
3.1°C/W @ 300 LFM
TO-3
TO-3
TO-3
T0-3
0.0200 (9.07)
0.0220 (9.98)
0.024 (10.89)
0.028 (12.70)
635-75B2
635-10B2
635-125B2
Material: Aluminum Alloy, Black Anodized
Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed cir-
cuit board, where two or more TO-3s must be placed in proximity and minimum space is
available for heat sinking. Four different heights are available, all with TO-3 mounting hole
pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
635 SERIES
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
49
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