22921C1 [ETC]
Migrating between Flash Device Densities ; 闪存器件密度之间迁移\n
| 型号： | 22921C1 |
| 厂家： | 
ETC |
| 描述： | Migrating between Flash Device Densities
|
| 文件： | 总17页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Migrating between Flash Device
Densities
Application Note
-XO\ꢀꢁꢂꢂꢃ
7KHꢀIROORZLQJꢀGRFXPHQWꢀUHIHUVꢀWRꢀ6SDQVLRQꢀPHPRU\ꢀSURGXFWVꢀWKDWꢀDUHꢀQRZꢀRIIHUHGꢀE\ꢀERWKꢀ$GYDQFHG
0LFURꢀ'HYLFHVꢀDQGꢀ)XMLWVXꢄꢀ$OWKRXJKꢀWKHꢀGRFXPHQWꢀLVꢀPDUNHGꢀZLWKꢀWKHꢀQDPHꢀRIꢀWKHꢀFRPSDQ\ꢀWKDWꢀRULJꢅ
LQDOO\ꢀGHYHORSHGꢀWKHꢀVSHFLILFDWLRQꢆꢀWKHVHꢀSURGXFWVꢀZLOOꢀEHꢀRIIHUHGꢀWRꢀFXVWRPHUVꢀRIꢀERWKꢀ$0'ꢀDQG
)XMLWVXꢄ
Continuity of Specifications
7KHUHꢀLVꢀQRꢀFKDQJHꢀWRꢀWKLVꢀGRFXPHQWꢀDVꢀDꢀUHVXOWꢀRIꢀRIIHULQJꢀWKHꢀGHYLFHꢀDVꢀDꢀ6SDQVLRQꢀSURGXFWꢄꢀꢀ$Q\
FKDQJHVꢀWKDWꢀKDYHꢀEHHQꢀPDGHꢀDUHꢀWKHꢀUHVXOWꢀRIꢀQRUPDOꢀGRFXPHQWDWLRQꢀLPSURYHPHQWVꢀDQGꢀDUHꢀQRWHG
LQꢀWKHꢀGRFXPHQWꢀUHYLVLRQꢀVXPPDU\ꢆꢀZKHUHꢀVXSSRUWHGꢄꢀꢀ)XWXUHꢀURXWLQHꢀUHYLVLRQVꢀZLOOꢀRFFXUꢀZKHQꢀDSSURꢅ
SULDWHꢆꢀDQGꢀFKDQJHVꢀZLOOꢀEHꢀQRWHGꢀLQꢀDꢀUHYLVLRQꢀVXPPDU\ꢄ
Continuity of Ordering Part Numbers
$0'ꢀDQGꢀ)XMLWVXꢀFRQWLQXHꢀWRꢀVXSSRUWꢀH[LVWLQJꢀSDUWꢀQXPEHUVꢀEHJLQQLQJꢀZLWKꢀ³$P´ꢀDQGꢀ³0%0´ꢄꢀ7RꢀRUGHU
WKHVHꢀSURGXFWVꢆꢀSOHDVHꢀXVHꢀRQO\ꢀWKHꢀ2UGHULQJꢀ3DUWꢀ1XPEHUVꢀOLVWHGꢀLQꢀWKLVꢀGRFXPHQWꢄ
For More Information
3OHDVHꢀFRQWDFWꢀ\RXUꢀORFDOꢀ$0'ꢀRUꢀ)XMLWVXꢀVDOHVꢀRIILFHꢀIRUꢀDGGLWLRQDOꢀLQIRUPDWLRQꢀDERXWꢀ6SDQVLRQ
PHPRU\ꢀVROXWLRQVꢄ
Publication Number 22921 Revision C Amendment +1 Issue Date November 30, 2000
Migrating Between Flash Device Densities
Application Note
48-Pin TSOP: 1.8 V–5 V x8/x16 or x16-only Devices ........2
INTRODUCTION
40-Pin & 40- to 48-Pin TSOP: 3 V x8-only Devices ..........3
40-Pin TSOP: 5 V x8-only Devices ....................................4
32-Pin TSOP: 3 V/5 V x8-only Devices ..............................5
44-Pin SO: 3 V/5 V x8/x16 Devices ...................................6
44-Pin So to 56-Pin SO: 3 V Devices .................................7
56-Pin SO: 3 V Burst Mode Devices ..................................8
44-Pin SO: 5 V x8-only Devices .........................................9
32-Pin PLCC: 5 V x8-only Devices ..................................10
32-PIN PLCC: 3 V/5 V x8-only Devices ...........................11
32-Pin PDIP: 5 V x8-only Devices ....................................12
48- or 63-Ball FBGA: 3 V x8/x16 Devices ........................13
48- or 63-Ball FBGA: 3 V X8-only Devices ......................14
47- & 48-Ball FBGA, Am29BDS Devices .........................15
Revision Summary ...........................................................16
This application note illustrates the pinout differences
that occur when migrating between densities of AMD
flash memory devices. Each drawing shows at least
one migration path. A “migration path” is a logical pro-
gression from one density to another within a group of
devices sharing a common voltage range, architecture,
bus width. For example, the Am29F200/400/800/160
comprise a group of 5 V, standard architecture, x8/x16-
bit devices that range in density from 2 to 16 Mbits. All
drawings show top view of packages.
The following is a list of drawings in this document:
.
Publication# 22921 Rev: C Amendment/+1
Issue Date: November 30, 2000
48-PIN TSOP: 1.8 V–5 V X8/X16 OR X16-ONLY DEVICES
1.8 V
1.8 V
3 V
3 V
5 V
Sim R/W
Standard Sim R/W Standard Standard
Am29LV641D
Am29DL32xD, Am29LV320D
Am29DS323D
Am29SL160C, Am29DL16xD, Am29LV160D, Am29F160D
Am29SL800C, Am29DL800B, Am29LV800B, Am29F800B
Am29DL400B, Am29LV400B, Am29F400B
Am29LV200B, Am29F200B
A15
A14
A13
A12
A11
A10
A9
A8
A21
A15
A14
A13
A12
A11
A10
A9
A8
A19
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE#
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
1
2
3
4
5
6
7
8
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
A16
VIO
VSS
DQ15/A-1 DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
9
48-Pin
TSOP
A20
A20
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
WE#
RESET#
ACC
WE#
RESET#
NC
WE#
RESET#
NC
RESET#
RESET# RESET#
NC
NC
NC
RY/BY#
NC
NC
NC
RY/BY#
NC
WP# WP#/ACC
NC
A19
A18
A17
A7
A6
A5
A4
A3
A2
A1
RY/BY#
A18
A17
A7
RY/BY#
A18
A17
A7
RY/BY#
A18
A17
A7
A17
A7
A6
A5
A4
A3
A2
A1
NC
A7
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
OE#
VSS
CE#
A0
OE#
VSS
CE#
A0
Am29SL160C WP#/ACC
Am29DL16xD WP#/ACC
Am29LV160D NC
Am29F160D WP#
* The Am29LV641 is a x16-only device.
2
Migrating Between Flash Device Densities
40-PIN & 40- TO 48-PIN TSOP: 3 V X8-ONLY DEVICES
3 V
Standard
Am29LV033C
Am29LV116B
Am29LV017B
Am29LV008B
Am29LV081B
Am29LV004B
Am29LV002B
A17
VSS
NC
A17
VSS
NC
A17
VSS
A17
VSS
A16
A15
A14
A13
A12
A11
A9
A16
A15
A14
A13
A12
A11
A9
A16
A15
A14
A13
A12
A11
A9
1
2
3
4
5
6
7
8
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A21
DQ3
DQ2
DQ1
DQ0
NC
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A8
WE#
A8
WE#
A8
WE#
9
40-Pin
TSOP
RESET# RESET# RESET#
10
11
12
13
14
15
16
17
18
19
20
ACC
RY/BY#
A18
A7
NC
RY/BY#
A18
A7
NC
RY/BY#
NC
NC
NC
NC
DQ3
DQ2
DQ1
DQ0
OE#
VSS
DQ3
DQ2
DQ1
DQ0
OE#
VSS
DQ3
DQ2
DQ1
DQ0
OE#
VSS
A7
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
OE#
VSS
CE#
A0
CE#
A0
CE#
A0
CE#
A0
Am29LV065D
Am29LV033C
NC
NC
A17
VSS
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VIO
NC
A22
A16
A15
A14
A13
A12
A11
A9
48
47
40 46
39 45
38 44
37 43
36 42
41
40
33 39
32 38
31 37
1
2
3
4
5
6
7
8
48-Pin TSOP
40-Pin TSOP
A17
VSS
A16
A15
A14
A13
A12
A11
A9
1
2
3
4
5
6
7
8
9
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
35
34
9
10
11
A8
WE#
A8
WE#
RESET# RESET#
12 10
13 11
14 12
15 13
16 14
17 15
18 16
19 17
20 18
21 19
22 20
23
30
29
28
27
26
36
35
34
33
32
ACC
RY/BY#
A18
A7
ACC
RY/BY#
A18
A7
NC
NC
DQ3
DQ2
DQ1
DQ0
OE#
VSS
DQ3
DQ2
DQ1
DQ0
OE#
VSS
CE#
A0
NC
NC
A6
A5
A4
A3
A2
A1
NC
NC
A6
A5
A4
A3
A2
A1
25 31
24 30
23 29
22 28
21 27
26
CE#
A0
25
24
Migrating Between Flash Device Densities
3
40-PIN TSOP: 5 V X8-ONLY DEVICES
5 V
Standard
Am29F032B
Am29F016B
Am29F017B
Am29F080B
NC
NC
WE#
OE#
A20
NC
WE#
OE#
A20
A21
A19
A18
A17
A16
A15
A14
A13
A12
1
2
3
4
5
6
7
8
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
WE#
OE#
RY/BY#
DQ7
DQ6
DQ5
DQ4
VCC
RY/BY# RY/BY#
DQ7
DQ6
DQ5
DQ4
VCC
VSS
VSS
DQ3
DQ2
DQ1
DQ0
A0
DQ7
DQ6
DQ5
DQ4
VCC
VSS
VSS
DQ3
DQ2
DQ1
DQ0
A0
9
CE#
VCC
NC
40-Pin
TSOP
10
11
12
13
14
15
16
17
18
19
20
VSS
RESET#
A11
A10
A9
VSS
DQ3
DQ2
DQ1
DQ0
A0
A1
A2
A3
A8
A7
A6
A5
A1
A2
A3
A1
A2
A3
A4
4
Migrating Between Flash Device Densities
32-PIN TSOP: 3 V/5 V X8-ONLY DEVICES
3 V
5 V
Standard Standard
Am29LV040B, Am29F040B
Am29LV010B, Am29F010B
A11
A9
A8
A11
A9
A8
OE#
A10
CE#
1
2
3
32
31
30
A13
A14
A17
WE#
VCC
A18
A16
A15
A12
A7
A13
A14
NC
WE#
VCC
NC
A16
A15
A12
A7
4
5
6
7
8
9
10
11
12
13
14
15
16
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
29
28
27
26
25
24
23
22
21
20
19
18
17
32-Pin
TSOP
A6
A5
A4
A6
A5
A4
A1
A2
A3
Migrating Between Flash Device Densities
5
44-PIN SO: 3 V/5 V X8/X16 DEVICES
3 V
3 V
5 V
Sim R/W Standard Standard
Am29LV160D
Am29DL800B, Am29LV800B, Am29F800B
Am29DL400B
Am29LV400B, Am29F400B
Am29LV200B, Am29F200B
RY/BY#
A18
A17
A7
RY/BY#
NC
NC
RY/BY#
A17
A7
NC
1
2
3
4
5
6
7
8
9
44 RESET#
WE#
A19
A8
RY/BY#
NC
A7
43 WE#
42 A8
41 A9
A17
A7
A9
A6
A6
A6
A6
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE#
32 VSS
A10
A11
A12
A13
A14
A15
A16
BYTE#
VSS
A5
A5
A5
A5
A4
A4
A4
A4
A3
A3
A3
A3
A2
A2
A2
A2
A1
A1
A1
A1 10
A0 11
44-Pin
SO
A0
A0
A0
CE#
VSS
CE#
VSS
CE#
VSS
CE# 12
VSS 13
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE# 14
DQ0 15
DQ8 16
DQ1 17
DQ9 18
DQ2 19
DQ10 20
DQ3 21
DQ11 22
31 DQ15/A-1 DQ15/A-1
30 DQ7
29 DQ14
28 DQ6
27 DQ13
26 DQ5
25 DQ12
24 DQ4
23 VCC
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
6
Migrating Between Flash Device Densities
44-PIN SO TO 56-PIN SO: 3 V DEVICES
Am29LV640D
Am29LV160D
56-Pin SO
ACC
WP#
A19
A18
A17
A7
1
56 RESET#
55 WE#
54 A20
53 A19
52 A8
2
3 RESET#
1
2
3
4
5
6
7
8
9
10
44
WE#
A19
A8
4
5
6
7
8
9
A18
A17
A7
43
42
41
40
39
38
37
36
35
A9
51 A9
A6
A6
A10
A11
A12
A13
A14
A15
50 A10
49 A11
48 A12
47 A13
46 A14
45 A15
44 NC
43 NC
42 NC
41 NC
40 A16
39 VIO
44-Pin SO
(upper)
A5
A4
A3 10
A2 11
A1 12
A5
A4
A3
A2
A1
NC
NC
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
NC
NC
A0
A0
CE#
VSS
11
12
13
14
15
16
17
18
19
20
21
22
A16
BYTE#
VSS
34
33
32
31
30
29
28
27
26
25
24
23
CE#
VSS
38 VSS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
DQ15/A-1 37 DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
36 DQ7
35 DQ14
34 DQ6
33 DQ13
32 DQ5
31 DQ12
30 DQ4
29 VCC
44-Pin SO
(lower)
Note: Dotted lines indicate pinouts for 44-pin package. RESET# on 44-pin package requires rerouting to opposite side of 56-pin
package.
Migrating Between Flash Device Densities
7
56-PIN SO: 3 V BURST MODE DEVICES
Am29BL162C
Am29BL802C
WE#
WE#
1
2
3
4
5
6
7
8
9
56 LBA#
55 VCC
54 NC
LBA#
VCC
RESET# RESET#
RY/BY# RY/BY#
NC
A18
A17
A7
A18
A17
A7
53 NC
A19
A8
A9
52 A8
51 A9
A6
A6
50 A10
49 A11
48 A12
47 A13
46 A14
45 A15
44 A16
43 NC
A10
A11
A12
A13
A14
A15
A16
NC
A5
A5
A4
A4
A3
A3 10
A2 11
A2
A1
A1 12
A0 13
CE# 14
NC 15
VSS 16
OE# 17
DQ0 18
DQ8 19
DQ1 20
DQ9 21
DQ2 22
DQ10 23
DQ3 24
DQ11 25
VSS 26
A0
56-pin SO
CE#
NC
42 NC
NC
VSS
VSS
41 VSS
40 DQ15
39 DQ7
38 DQ14
37 DQ6
36 DQ13
35 DQ5
34 DQ12
33 DQ4
32 VCC
31 VCC
30 IND#
29 NC
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
VSS
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
VCC
IND#
NC
CLK
BAA#
CLK 27
BAA# 28
8
Migrating Between Flash Device Densities
44-PIN SO: 5 V X8-ONLY DEVICES
5 V
Standard
Am29F032B
Am29F016B
Am29F080B
NC
RESET#
A11
A10
A9
1
2
3
4
5
6
7
8
9
44 VCC
43 CE#
42 A12
41 A13
40 A14
39 A15
38 A16
37 A17
36 A18
35 A19
34 NC
VCC
VCC
CE#
A12
A13
A14
A15
A16
A17
A18
A19
NC
CE#
A12
A13
A14
A15
A16
A17
A18
A19
NC
A8
A7
A6
A5
A4 10
NC 11
NC 12
A3 13
44-Pin
SO
33 NC
NC
A20
NC
NC
32 NC
31 NC
A20
A21
WE#
OE#
RY/BY#
DQ7
DQ6
DQ5
DQ4
VCC
A2 14
A1 15
30 WE#
29 OE#
28 RY/BY#
27 DQ7
26 DQ6
25 DQ5
24 DQ4
23 VCC
WE#
OE#
RY/BY#
DQ7
DQ6
DQ5
DQ4
VCC
A0 16
DQ0 17
DQ1 18
DQ2 19
DQ3 20
VSS 21
VSS 22
Migrating Between Flash Device Densities
9
32-PIN PLCC: 5 V X8-ONLY DEVICES
5 V
Standard
Am29F004B
Am29F002B
Am29F002NB
14
15
16
17
18
19
20
4
3
DQ1
DQ2
VSS
A12
A15
A16
NC
A12
A15
A16
A12
A15
A16
2
32-Pin
PLCC
1
DQ3
DQ4
DQ5
DQ6
RESET# A18
32
31
30
VCC
WE#
A17
VCC
WE#
A17
VCC
WE#
A17
Note: The figure shows boot sector devices.
10
Migrating Between Flash Device Densities
32-PIN PLCC: 3 V/5 V X8-ONLY DEVICES
3 V
5 V
Standard Standard
Am29LV040B Am29F040B
Am29LV010B, Am29F010B
14
15
16
17
18
19
20
4
3
DQ1
DQ2
VSS
A12
A15
A16
NC
A12
A15
A16
A18
VCC
WE#
A17
2
32-Pin
PLCC
1
DQ3
DQ4
DQ5
DQ6
32
31
30
VCC
WE#
NC
Note: The figure shows uniform sector devices.
Migrating Between Flash Device Densities
11
32-PIN PDIP: 5 V X8-ONLY DEVICES
5 V
Standard
Am29F004B
Am29F040B
Am29F002B
Am29F002NB
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A18
A16
A15
A12
A7
RESET#
A16
A15
A12
A7
NC
A16
A15
A12
A7
2
WE#
A17
A14
A13
A8
3
4
5
A6
A6
A6
6
A5
A5
A5
7
A9
32-Pin
PDIP
A4
A4
A4
8
A11
OE#
A10
CE#
DQ7
DQ6
A3
A3
A3
9
A2
A2
A2
10
11
12
13
14
15
16
A1
A1
A1
A0
A0
A0
DQ0
DQ0
DQ0
DQ1
DQ2
DQ1
DQ2
DQ1
DQ2
DQ5
DQ4
DQ3
V
SS
V
SS
V
SS
12
Migrating Between Flash Device Densities
48- OR 63-BALL FBGA: 3 V X8/X16 DEVICES
63-ball Grid Array
A
B
C
D
E
F
G
H
F
J
K
L
M
8
7
6
48-ball Grid Array
NC*
NC*
NC*
NC*
NC
NC
NC
NC
A
B
C
D
E
G
H
6
5
4
3
2
1
VSS
A13
A12
A14
A15
A16
DQ15/A-1
A9
A8
A10
A11
DQ7
DQ5
DQ2
DQ0
A0
DQ14
DQ12
DQ10
DQ8
DQ13
VCC
DQ6
DQ4
DQ3
5
4
3
2
1
WE# RESET#
RY/BY#
DQ11
DQ9
OE#
A7
A3
A17
A4
A6
A2
A5
A1
DQ1
VSS
CE#
NC*
NC*
NC*
NC*
NC*
NC*
NC*
1.8 V
1.8 V
3 V
3 V
Package
Body
Ball Grid
Array
Standard Sim R/W Standard Sim R/W
6 x 8 mm
6 x 9 mm
8 x 9 mm
8 x 9 mm
8 x 14 mm
48 balls
48 balls
48 balls
48 balls
63 balls
Am29LV400B
Am29SL800C
NC
NC
A18 NC
A18 NC
NC
NC
NC
NC BYTE#
NC BYTE#
Am29LV800B Am29DL800B NC
Am29SL160C
Am29LV160D
NC
A19 NC BYTE#
A19 NC BYTE#
A19 A20 BYTE#
Am29DL16xD WP#/ACC A18 NC
Am29LV320D Am29DL32xD WP#/ACC A18 NC
Am29LV640D Am29DL640D ACC
Am29DS163D
Am29DS323D
11 x 12 mm 63 balls
A18 A21 A19 A20 VI/O
Top view shown, with balls facing down. All grid arrays have 0.8 mm pitch. Products listed in italics are not yet introduced.
* Balls are shorted together via the substrate but not connected to the die.
Migrating Between Flash Device Densities
13
48- OR 63-BALL FBGA: 3 V X8-ONLY DEVICES
63-ball Grid Array
A
B
C
D
E
F
G
H
F
J
K
L
M
8
7
6
48-ball Grid Array
NC*
NC*
NC*
NC*
NC
NC
NC
NC
A
B
C
D
E
G
H
6
5
4
3
2
1
VSS
A14
A13
A15
A16
A17
A20
A9
A8
A11
A12
NC
A20
A5
A19
DQ5
DQ2
DQ0
A0
A10
NC
DQ6
VCC
DQ7
DQ4
5
4
3
2
1
WE# RESET#
RY/BY#
NC
A6
A2
DQ3
NC
A7
A3
A18
A4
NC
DQ1
VSS
A1
CE#
OE#
NC*
NC*
NC*
NC*
NC*
NC*
NC*
3 V
Standard
Package Body Ball Grid Array
Am29LV017D NC
Am29LV033C ACC
Am29LV065D ACC
NC
NC
A22
VCC
VCC
VIO
NC
A21
A21
8 x 9 mm
8 x 14 mm
8 x 14 mm
48 balls
63 balls
63 balls
Top view shown, with balls facing down. All grid arrays have 0.8 mm pitch.
* Balls are shorted together via the substrate but not connected to the die.
14
Migrating Between Flash Device Densities
47- & 48-BALL FBGA, AM29BDS DEVICES
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
NC
RDY
GND
CLK
VCC
WE#
VPP
A19
A17
B1
B2
B3
B4
B5
PS
B6
B7
B8
B9
B10
VCC
A16
A20
AVD#
RESET# WP#
A18
CE#
GND
C1
C2
C3
C4
C5
C6 C7
C8
C9
C10
OE#
GND
A/DQ7 A/DQ6 A/DQ13 A/DQ12 A/DQ3 A/DQ2 A/DQ9 A/DQ8
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
A/DQ15 A/DQ14 GND
A/DQ5 A/DQ4 A/DQ11 A/DQ10
VCC
A/DQ1 A/DQ0
Ball not present
on Am29BDS323D.
Am29BDS323D NC 7 x 10 mm body, 0.8 mm pitch
Am29BDS643D A21 11 x 10 mm body, 0.8 mm pitch
Dotted line indicates ball grid array area has been
enlarged relative to package for illustrative purposes.
Migrating Between Flash Device Densities
15
REVISION SUMMARY
Am29SL and Am29DS devices to 48-/63-ball FBGA
illustration.
Revision B (September 10, 1999)
Added the ball grid array column to both FBGA
diagrams.
Added illustrations for 47- & 48-
Ball FBGA, Am29BDS devices, 44-pin SO to 56-pin SO
3 V devices, and 56-pin SO: 3 V burst mode devices.
Revision C (October 5, 2000)
Globally changed process technology designators in
part number as required to reflect current product
offerings.
Revision C+1 (November 30, 2000)
Updated the following two diagrams to include V for
IO
Am29LV065 devices:
40-Pin & 40- to 48-Pin TSOP: 3 V x8-only Devices
48- or 63-Ball FBGA: 3 V X8-only Devices
Added 1.8 V Am29DS simultaneous read/write devices
to 48-pin TSOP illustration. Added 40-pin to 48-pin mi-
gration to 40-pin TSOP illustration. Added 1.8 V
Trademarks
Copyright © 2000 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
16
Migrating Between Flash Device Densities
相关型号：
229260115188
Ceramic Capacitor, Ceramic, 100V, 13.8889% +Tol, 13.8889% -Tol, NP0, -/+30ppm/Cel TC, 0.0000018uF, 0805,
YAGEO
229260115228
Ceramic Capacitor, Ceramic, 100V, 11.3636% +Tol, 11.3636% -Tol, NP0, -/+30ppm/Cel TC, 0.0000022uF, 0805,
YAGEO
229260175188
Ceramic Capacitor, Ceramic, 100V, 13.8889% +Tol, 13.8889% -Tol, NP0, -/+30ppm/Cel TC, 0.0000018uF, 0805,
YAGEO
229260175398
Ceramic Capacitor, Ceramic, 100V, 6.4103% +Tol, 6.4103% -Tol, NP0, -/+30ppm/Cel TC, 0.0000039uF, 0805,
YAGEO
229260175568
Ceramic Capacitor, Ceramic, 100V, 8.9286% +Tol, 8.9286% -Tol, NP0, -/+30ppm/Cel TC, 0.0000056uF, 0805,
YAGEO
229260175828
Ceramic Capacitor, Ceramic, 100V, 6.0976% +Tol, 6.0976% -Tol, NP0, -/+30ppm/Cel TC, 0.0000082uF, 0805,
YAGEO
229260315278
Ceramic Capacitor, Ceramic, 100V, 0.25% +Tol, 0.25% -Tol, NP0, -/+30ppm/Cel TC, 0.0000027uF, 1206,
YAGEO
229260374568
Ceramic Capacitor, Ceramic, 100V, 0.25% +Tol, 0.25% -Tol, NP0, -/+30ppm/Cel TC, 0.0000056uF, 1206,
YAGEO
©2020 ICPDF网 联系我们和版权申明