ET830 [ESTEK]

5 Amps,500Volts; 5安培, 500Volts
ET830
型号: ET830
厂家: Estek Electronics Co. Ltd    Estek Electronics Co. Ltd
描述:

5 Amps,500Volts
5安培, 500Volts

文件: 总5页 (文件大小:331K)
中文:  中文翻译
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ET830  
5 Amps500Volts  
N-Channel MOSFET  
Description  
The ET830 NꢀChannel enhancement mode silicon gate power  
MOSFET is designed for high voltage, high speed power switching  
applications such as switching regulators, switching converters,  
solenoid, motor drivers, relay drivers  
.
Features  
RDS(ON) = 1.5ꢁ@VGS = 10 V  
Low gate charge ( typical 20nC)  
Fast switching capability  
Avalanche energy specified  
Improved dv/dt capability  
Symbol  
Absolute Maximum Ratings(Tc=25,unless otherwise specified)  
Ratings  
Parameter  
Symbol  
Units  
TOꢀ220  
TOꢀ220F  
DrainꢀSource Voltage  
GateꢀSource Voltage  
VDSS  
VGSS  
500  
±30  
V
V
Tc=25℃  
5.0  
3.0  
20  
5.0*  
3.0*  
20*  
A
Drain Currenet Continuous  
ID  
Tc=100℃  
A
Drain Current Pulsed  
Avalanche Energy  
(Note 1)  
(Note 1)  
IDP  
EAR  
EAS  
A
Repetitive  
7.6  
305  
4.5  
mJ  
mJ  
V/ns  
W
Single Pulse (Note 2)  
(Note 3)  
Peak Diode Recovery dv/dt  
Total Power Dissipation  
dv/dt  
Tc=25℃  
76  
40  
PD  
Derate above 25℃  
0.6  
0.32  
W/℃  
Junction Temperature  
TJ  
+150  
ꢀ55~+150  
Storage Temperature  
TSTG  
Drain current limited by maximum junction temperature.  
BEIJING ESTEK ELECTRONICS CO.,LTD  
1
ET830  
Thermal Characteristics  
Ratings  
TOꢀ220 TOꢀ220F  
Parameter  
Symbol  
Units  
Thermal Resistance JunctionꢀAmbient  
Thermal Resistance, CaseꢀtoꢀSink Typ.  
Thermal Resistance JunctionꢀCase  
RthJA  
RthCS  
RthJC  
62.5  
/W  
0.5  
1.2  
ꢀꢀ  
3.65  
Electrical CharacteristicsTJ=25,unless Otherwise specified.)  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
DrainꢀSource Breakdown Voltage  
BVDSS  
IDSS  
VGS=0V,ID=250ꢂA  
VDS=500V,VGS=0V  
VDS=400V,TC=125℃  
VGS=30V,VDS=0V  
VGS=ꢀ30V,VDS=0V  
ID=250ꢂA  
500  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
1
V
ꢂA  
Zero Gate Voltage Drain Current  
ꢀꢀ  
ꢀꢀ  
10  
100  
ꢀ100  
ꢀꢀ  
ꢂA  
GateꢀBody Leakage  
Current  
Forward  
Reverse  
ꢀꢀ  
ꢀꢀ  
nA  
IGSS  
ꢀꢀ  
ꢀꢀ  
nA  
Breakdown Voltage Temperature  
Coefficient  
BVDSS/TJ  
ꢀꢀ  
0.6  
V/℃  
On Characteristics  
Gate Threshold Voltage  
Static DrainꢀSource OnꢀResistance  
Dynamic Characteristics  
Input Capacitance  
VGS(TH)  
RDS(ON)  
VDS=VGS, ID=250ꢂA  
VDS=10V,ID=2.5A  
2.0  
ꢀꢀ  
ꢀꢀ  
4.0  
1.5  
V
1.10  
CISS  
COSS  
CRSS  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
520  
80  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
pF  
pF  
pF  
VDS=25V,VGS=0V,  
f=1MHZ  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
TurnꢀOn Delay Time  
15  
tD(ON)  
tR  
tD(OFF)  
tF  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
10  
50  
50  
50  
20  
2.5  
10  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ns  
ns  
VDD=250V,ID=5.0A,  
RG=25ꢁ  
Rise Time  
TurnꢀOff Delay Time  
(Note 4, 5)  
ns  
Fall Time  
ns  
Total Gate Charge  
QG  
nC  
nC  
nC  
VDS=400V, ID=5.0A,  
VGS=10V  
GateꢀSource Charge  
QGS  
QGD  
(Note 4, 5)  
GateꢀDrain Charge  
Drain-Source Diode Characteristics  
DrainꢀSource Diode Forward Voltage  
Continuous DrainꢀSource Current  
Pulsed DrainꢀSource Current  
Reverse Recovery Time  
Reverse Recovery Charge  
VSD  
ISD  
VGS=0V,ISD=5.0A  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
ꢀꢀ  
1.4  
5.0  
20.0  
ꢀꢀ  
V
A
ISM  
ꢀꢀ  
A
ISD=5.0A,  
dISD/dt=100A/ꢂs  
tRR  
260  
2.0  
ns  
ꢂC  
QRR  
(Note 4)  
ꢀꢀ  
1. Repetitive Rating : Pulse width limited by maximum junction temperature  
2. L = 22 mH, IAS = 5.0 A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C  
3. ISD 5.0 A, di/dt 200A/μs, VDDBVDSS, Starting TJ = 25°C  
4. Pulse Test : Pulse width 300μs, Duty cycle2%  
5. Essentially independent of operating temperature  
BEIJING ESTEK ELECTRONICS CO.,LTD  
2
ET830  
Typical Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
Figure 3. On-Resistance Variation vs  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation with Source Current  
and Temperature  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
BEIJING ESTEK ELECTRONICS CO.,LTD  
3
ET830  
Typical Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs Temperature  
Figure 8. On-Resistance Variation  
vs Temperature  
Figure 9-1. Maximum Safe Operating Area  
for TO220  
Figure 9-2. Maximum Safe Operating Area  
for TO220F  
Figure 10. Maximum Drain Current  
vs Case Temperature  
BEIJING ESTEK ELECTRONICS CO.,LTD  
4
ET830  
Typical Characteristics (Continued)  
Figure 11-1. Transient Thermal Response Curve for TO220  
Figure 11-2. Transient Thermal Response Curve for TO220F  
5
BEIJING ESTEK ELECTRONICS CO.,LTD  

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