F49L004UA [ESMT]

4 Mbit (512K x 8) 3V Only CMOS Flash Memory; 4兆位( 512K ×8 )只有3V CMOS闪存
F49L004UA
型号: F49L004UA
厂家: ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC.    ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC.
描述:

4 Mbit (512K x 8) 3V Only CMOS Flash Memory
4兆位( 512K ×8 )只有3V CMOS闪存

闪存
文件: 总46页 (文件大小:354K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
EFST  
preliminary  
F49L004UA / F49L004BA  
4 Mbit (512K x 8)  
3V Only CMOS Flash Memory  
1. FEATURES  
!
!
!
Single supply voltage 2.7V-3.6V  
!
Ready/Busy (RY/  
)
BY  
Fast access time: 70/90 ns  
- RY/  
output pin for detection of program or erase  
BY  
Compatible with JEDEC standard  
- Pinout, packages and software commands  
compatible with single-power supply Flash  
Low power consumption  
operation completion  
End of program or erase detection  
- Data polling  
!
!
- Toggle bits  
- 20mA typical active current  
!
!
Hardware reset  
- 0.2uA typical standby current  
- Hardware pin(  
) resets the internal state machine  
RESET  
!
!
10,000 minimum program/erase cycles  
Command register architecture  
to the read mode  
Sector Protection /Unprotection  
- Hardware Protect/Unprotect any combination of sectors  
from a program or erase operation.  
Low VCC Write inhibit is equal to or less than 2.0V  
Boot Sector Architecture  
- Byte programming (9us typical)  
- Sector Erase(sector structure: one 16 KB, two 8 KB,  
one 32 KB, and seven 64 KB)  
!
!
!
Auto Erase (chip & sector) and Auto Program  
- Any combination of sectors can be erased  
concurrently; Chip erase also provided.  
- Automatically program and verify data at specified  
address  
- U = Upper Boot Sector  
- B = Bottom Boot Sector  
!
Packages available:  
- 40-pin TSOPI  
!
Erase Suspend/Erase Resume  
- Suspend or Resume erasing sectors to allow the  
read/program in another sector  
- 32-pin PLCC  
2. ORDERING INFORMATION  
Part No  
Boot  
Speed  
Package  
Part No  
Boot  
Speed  
Package  
F49L004UA-70T  
F49L004UA-70N  
F49L004BA-70T  
F49L004BA-70N  
Upper  
Upper  
Bottom  
Bottom  
70 ns  
70 ns  
70 ns  
70 ns  
TSOPI  
PLCC  
TSOPI  
PLCC  
F49L004UA-90 T  
F49L004UA-90N  
F49L004BA-90T  
F49L004BA-90N  
Upper  
Upper  
Bottom  
Bottom  
90 ns  
90 ns  
90 ns  
90 ns  
TSOPI  
PLCC  
TSOPI  
PLCC  
3. GENERAL DESCRIPTION  
The F49L004UA/ F49L004BA is a 4 Megabit, 3V only  
CMOS Flash memory device organized as 512K bytes of 8  
bits. This device is packaged in standard 40-pin TSOP and  
32-pin PLCC. It is designed to be programmed and erased  
both in system and can in standard EPROM programmers.  
The F49L004UA/ F49L004BA features a sector erase  
architecture. The device memory array is divided into one  
16 Kbytes, two 8 Kbytes, one 32 Kbytes, and seven 64  
Kbytes. Sectors can be erased individually or in groups  
without affecting the data in other sectors. Multiple-sector  
erase and whole chip erase capabilities provide the  
flexibility to revise the data in the device.  
With access times of 70 ns and 90 ns, the F49L004UA/  
F49L004BA allows the operation of high-speed  
microprocessors. The device has separate chip enable  
The sector protect/unprotect feature disables both  
program and erase operations in any combination of the  
sectors of the memory. This can be achieved in-system or  
via programming equipment.  
, write enable  
, and output enable  
controls.  
OE  
WE  
CE  
EFST's memory devices reliably store memory data even  
after 100,000 program and erase cycles.  
A low V
CC
detector inhibits write operations on loss of  
power. End of program or erase is detected by the  
Ready/Busy status pin, Data Polling of DQ7, or by the  
Toggle Bit I feature on DQ6. Once the program or erase  
cycle has been successfully completed, the device  
internally resets to the Read mode.  
The F49L004UA/ F49L004BA is entirely pin and  
command set compatible with the JEDEC standard for 4  
Megabit Flash memory devices. Commands are written to  
the command register using standard microprocessor write  
timings.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
1/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
4. PIN CONFIGURATIONS  
4.1 40-pin TSOP I  
A17  
40  
1
2
3
4
5
6
7
A16  
A15  
A14  
A13  
A12  
A11  
A9  
VSS  
39  
N C  
38  
N C  
37  
A10  
36  
DQ7  
35  
DQ6  
34  
DQ5  
8
A8  
33  
DQ4  
32  
9
WE  
RESET  
N C  
RY/BY  
A18  
A7  
VCC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
31  
VCC  
30  
N C  
29  
DQ3  
28  
DQ2  
27  
DQ1  
26  
A6  
A5  
A4  
A3  
A2  
A1  
DQ0  
25  
OE  
24  
VSS  
23  
CE  
22  
A0  
21  
4.2 32-pin PLCC  
4
3
2
1 32 31 30  
A14  
A13  
A8  
A9  
A11  
OE  
A10  
CE  
DQ7  
2 9  
2 8  
2 7  
2 6  
2 5  
2 4  
2 3  
2 2  
2 1  
5
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
DQ0  
6
7
8
9
10  
11  
12  
13  
14 15 16 17 18 19 20  
4.3 Pin Description  
Symbol  
A0~A18  
Pin Name  
Address Input  
Functions  
To provide memory addresses.  
To output data when Read and receive data when Write.  
The outputs are in tri-state when OE or CE is high.  
To activate the device when CE is low.  
To gate the data output buffers.  
DQ0~DQ7  
Data Input/Output  
Chip Enable  
Output Enable  
Write Enable  
Reset  
CE  
OE  
To control the Write operations.  
WE  
Hardware Reset Pin/Sector Protect Unprotect (for 40-TSOP)  
RESET  
Ready/Busy  
Power Supply  
Ground  
To check device operation status(for 40 TSOP)  
To provide power  
RY/BY  
VCC  
GND  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 2/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
5. SECTOR STRUCTURE  
Table 1: F49L004UA Sector Address Table  
Sector Address  
A18 A17 A16 A15 A14 A13  
Sector Size  
Sector  
Address range  
(Kbytes)  
SA10  
SA9  
SA8  
SA7  
SA6  
SA5  
SA4  
SA3  
SA2  
SA1  
SA0  
16  
8
7C000H-7FFFFH  
7A000H-7BFFFH  
78000H-79FFFH  
70000H-77FFFH  
60000H-6FFFFH  
50000H-5FFFFH  
40000H-4FFFFH  
30000H-3FFFFH  
20000H-2FFFFH  
10000H-1FFFFH  
00000H-0FFFFH  
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
0
1
1
1
0
X
1
8
1
0
0
32  
64  
64  
64  
64  
64  
64  
64  
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Table 2: F49L004BA Sector Address Table  
Sector Address  
A18 A17 A16 A15 A14 A13  
Sector Size  
(Kbytes)  
Sector  
Address range  
SA10  
SA9  
SA8  
SA7  
SA6  
SA5  
SA4  
SA3  
SA2  
SA1  
SA0  
64  
64  
64  
64  
64  
64  
64  
32  
8
70000H-7FFFFH  
60000H-6FFFFH  
50000H-5FFFFH  
40000H-4FFFFH  
30000H-3FFFFH  
20000H-2FFFFH  
10000H-1FFFFH  
08000H-0FFFFH  
06000H-07FFFH  
04000H-05FFFH  
00000H-03FFFH  
1
1
1
1
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
0
0
0
1
0
1
0
1
0
1
0
0
0
0
X
X
X
X
X
X
X
1
X
X
X
X
X
X
X
X
1
X
X
X
X
X
X
X
X
1
0
8
0
1
0
16  
0
0
X
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 3/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
6. FUNCTIONAL BLOCK DIAGRAM  
CE  
OE  
WE  
WRITE  
PROGRAM / ERASE  
CONTROL  
STATE  
MACHING  
(WSM)  
HIGH VOLTAGE  
INPUT  
LOGIC  
RESET(for40-TSOP)  
STATE  
REGISTER  
F49L004U(B)A  
ADDRESS  
LATCH  
AND  
FLASH  
ARRAY  
SOURCE  
HV  
ARRAY  
A0~A18  
BUFFER  
COMMAND  
DATA  
Y-PASS GATE  
PGM  
DECODER  
DATA  
HV  
SENSE  
COMMAND  
AMPLIFIER  
DATA LATCH  
PROGRAM  
DATA LATCH  
I / O BUFFER  
DQ0~DQ7  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
4/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
7. FUNCTIONAL DESCRIPTION  
7.1 Device operation  
This section describes the requirements and use  
of the device bus operations, which are initiated  
through the internal command register. The  
register is composed of latches that store the  
command, address and data information needed  
to execute the command. The contents of the  
register serve as inputs to the internal state  
machine. The state machine outputs dictate the  
function of the device.  
The F49L004UA/  
F49L004BA features various bus operations as  
Table 3.  
Table 3. F49L004UA/F49L004BA Operation Modes Selection  
ADDRESS  
A18 A12  
A8  
A5  
|
A2  
DESCRIPTION  
DQ0~DQ7  
OE  
RESET  
CE  
WE  
|
|
|
A9  
A6  
A1 A0  
A13 A10  
A7  
L, Vss±  
Reset(3)  
X
X
X
X
High Z  
0.3V(4)  
Read  
L
L
L
L
H
H
H
L
H
H
H
AIN  
AIN  
X
Dout  
DIN  
Write  
Output Disable  
H
High Z  
VCC  
±
0.3V  
VCC  
±
0.3V  
Standby  
X
X
X
High Z  
Sector Protect(2)  
L
L
X
H
H
X
L
L
X
VID  
SA  
SA  
X
X
X
X
X
L
X
X
H
H
L
L
DIN  
DIN  
DIN  
Sector Unprotect(2)  
Temporary sector unprotect  
Auto-select  
VID  
X
H
VID  
AIN  
See Table 4  
Notes:  
1. L= Logic Low = VIL, H= Logic High = VIH, X= Don't Care, SA= Sector Address, VID=11.5V to 12.5V.  
AIN= Address In, DIN = Data In, Dout = Data Out.  
2. The sector protect and unprotect functions may also be implemented via programming equipment.  
3.  
pin for 40-TSOP package type only.  
RESET  
4. See “Reset Mode” section.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
5/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Table 4. F49L004UA/F49L004BA Auto-Select Mode (High Voltage Method)  
ADDRESS  
DQ0~DQ7  
A18  
A12  
A8  
DESCRIPTION  
OE  
RESET  
CE  
WE  
|
|
|
A9  
A3 A2 A1 A0  
A13  
A10  
A4  
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
X
X
X
X
X
X
X
X
X
VID  
VID  
VID  
VID  
VID  
VID  
VID  
X
X
X
X
X
X
X
L
H
H
L
H
L
L
L
L
L
L
L
H
L
L
7FH  
7FH  
(Manufacturer ID:EFST)  
X
H
L
L
7FH  
X
L
8CH  
(Device ID: F49L004UA)  
(Device ID: F49L004BA)  
Sector Protection Verify  
X
X
X
X
X
X
X
H
H
X
B5H  
X
B6H  
SA  
Code(2)  
Notes :  
1.Manufacturer and device codes may also be accessed via the software command sequence in Table 5.  
2. Code=00H means unprotected.  
Code =01H means protected.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 6/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Reset Mode :  
Hardware Reset (for 40-TSOP package)  
valid addresses on the device address inputs produce  
valid data on the device data outputs. The device remains  
enabled for read access until the command register  
contents are altered.  
When the  
pin is driven low for at least a period  
RESET  
of tRP, the device immediately terminates any operation  
in progress, tri-states all output pins, and ignores all  
read/write commands for the duration of the  
RESET  
See “Read Command” section for more information. Refer  
to the AC Read Operations table for timing specifications  
and to Figure 5 for the timing diagram. I
CC1
in the DC  
Characteristics table represents the active current  
specification for reading array data.  
pulse. The device also resets the internal state machine  
to reading array data. The operation that was  
interrupted should be reinitiated later once the device is  
ready to accept another command sequence, to ensure  
the data integrity.  
The current is reduced for the duration of the  
RESET  
Write Mode  
pulse. When  
is held at VSS±0.3V, the device  
RESET  
draws CMOS standby current (ICC4). If  
is held  
To write a command or command sequence (which  
includes programming data to the device and erasing  
RESET  
at VIL but not within VSS±0.3V, the standby current will be  
greater.  
sectors of memory), the system must drive  
and  
CE  
WE  
to VIL, and  
to VIH. The “Program Command” section  
OE  
has details on programming data to the device using  
standard command sequences.  
The  
pin may be tied to system reset circuitry. A  
RESET  
system reset would thus reset the Flash memory,  
enabling the system to read the boot-up firm-ware from  
the Flash memory.  
An erase operation can erase one sector, multiple  
sectors, or the entire device. Tables 1 and 2 indicate the  
address space that each sector occupies. A “sector  
address” consists of the address bits required to uniquely  
select a sector. The “Software Command Definitions”  
section has details on erasing a sector or the entire chip,  
or suspending/resuming the erase operation.  
If  
is asserted during a program or erase  
RESET  
embedded algorithm operation, the RY/  
pin remains  
BY  
a "0" (busy) until the internal reset operation is  
complete, which requires a time of tREADY (during  
Embedded Algorithms). The system can thus monitor  
When the system writes the auto-select command  
sequence, the device enters the auto-select mode. The  
system can then read auto-select codes from the internal  
register (which is separate from the memory array) on  
DQ7–DQ0. Standard read cycle timings apply in this  
mode. Refer to the Auto-select Mode and Auto-select  
Command sections for more information. ICC2 in the DC  
Characteristics table represents the active current  
specification for the write mode. The “AC Characteristics”  
section contains timing specification tables and timing  
diagrams for write operations.  
RY/  
to determine whether the reset operation is  
BY  
complete.  
If  
is asserted when a program or erase  
RESET  
operation is not executing , i.e. the RY/  
is “1”, the  
BY  
reset operation is completed within a time of tREADY (not  
during Embedded Algorithms). The system can read  
data after tRH when the  
pin returns to VIH. Refer  
RESET  
to the AC Characteristics tables for Hardware Reset  
section.  
Automatic Sleep Mode  
Read Mode  
The automatic sleep mode minimizes Flash device energy  
consumption. The device automatically enables this mode  
when addresses remain unchanged for over 250ns ns.  
To read array data from the outputs, the system must  
drive the  
and  
pins to VIL.  
is the power  
CE  
OE  
CE  
The automatic sleep mode is independent of the  
,
CE  
control signals. Standard address access  
timings provide new data when addresses are changed.  
While in sleep mode, output data is latched and always  
available to the system. ICC4 in the DC Characteristics  
table represents the automatic sleep mode current  
specification.  
control and selects the device.  
is the output control  
OE  
, and  
WE  
OE  
and gates array data to the output pins.  
should  
WE  
remain at VIH. The internal state machine is set for  
reading array data upon device power-up, or after a  
hardware reset. This ensures that no spurious alteration  
of the memory content occurs during the power  
transition.  
No command is necessary in this mode to obtain array  
data. Standard microprocessor’s read cycles that assert  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
7/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Temporary Sector Unprotect Mode  
This feature allows temporary unprotection of previously  
protected sector to change data in-system. This mode is  
protected and can be programmed or erased by selecting  
the sector addresses. Once VID is removed from the  
activated by setting the  
pin to VID(11.5V-12.5V).  
pin, all the previously protected sectors are  
RESET  
RESET  
During this mode, all formerly protected sectors are un-  
protected again.  
Start  
RESET = VID (Note 1)  
Perform Erase or  
Program Operations  
RESET = VIH  
Temporary Sector  
Unprotect Completed  
(Note 2)  
Notes:  
1. All protected sectors unprotected.  
2. All previously protected sectors are protected once again.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 8/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 16 shows the algorithms and Figure 15 shows  
the timing diagram. This method uses standard  
microprocessor bus cycle timing. For sector unprotect,  
all unprotected sectors must first be protected prior to  
the first sector unprotect write cycle.  
Output Disable Mode  
With the  
is at a logic high level (VIH), outputs from  
OE  
the devices are disabled. This will cause the output pins  
in a high impedance state  
The alternate method intended only for programming  
equipment requires VID on address pin A9,  
RESET  
, and  
OE  
Standby Mode  
.
When  
and  
are both held at VCC ± 0.3V,  
RESET  
CE  
the device enter CMOS Standby mode. If  
and  
CE  
Auto-select Mode  
are held at VIH, but not within the range of VCC  
RESET  
The auto-select mode provides manufacturer and  
device identification and sector protection verification,  
through outputs on DQ7–DQ0. This mode is primarily  
intended for programming equipment to automatically  
± 0.3V, the device will still be in the standby mode, but  
the standby current will be larger.  
If the device is deselected during auto algorithm of  
erasure or programming, the device draws active  
current ICC2 until the operation is completed. ICC3 in the  
DC Characteristics table represents the standby current  
specification.  
match  
a
device to be programmed with its  
corresponding programming algorithm. However, the  
auto-select codes can also be accessed in-system  
through the command register.  
When using programming equipment, this mode  
The device requires standard access time (tCE) for read  
access from either of these standby modes, before it is  
ready to read data.  
requires VID (11.5 V to 12.5 V) on address pin A9. While  
address pins A3, A2, A1, and A0 must be as shown in  
Table 4.  
To verify sector protection, all necessary pins have to  
be set as required in Table 4, the programming  
equipment may then read the corresponding identifier  
code on DQ7-DQ0.  
Sector Protect / Un-protect Mode  
The hardware sector protect feature disables both  
program and erase operations in any sector. The  
hardware sector unprotect feature re-enables both the  
program and erase operations in previously protected  
sectors. Sector protect/unprotect can be implemented  
via two methods.  
The primary method requires VID on the  
only, and can be implemented either in-system or via  
programming equipment.  
To access the auto-select codes in-system, the host  
system can issue the auto-select command via the  
command register, as shown in Table 5. This method  
does not require VID. See “ Software Command  
pin  
Definitions” for details on using the auto-select mode.  
RESET  
7.2 Software Command Definitions  
Writing specific address and data commands or  
sequences into the command register initiates the  
device operations. Table 5 defines the valid register  
command sequences. Writing incorrect address and  
data values or writing them in the improper sequence  
resets the device to reading array data.  
All addresses are latched on the falling edge of  
WE  
or  
, whichever happens later. All data is latched on  
CE  
the rising edge of  
or  
, whichever happens  
WE  
CE  
first. Refer to the corresponding timing diagrams in the  
AC Characteristics section.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
9/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Table 5. F49L004UA/ F49L004BA Software Command Definitions  
1st Bus  
Cycle  
2nd Bus  
Cycle  
3rd Bus  
Cycle  
4th Bus  
Cycle  
5th Bus  
Cycle  
6th Bus  
Cycle  
Bus  
Command  
Cycles  
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data  
Reset (5)  
Read (4)  
1
1
4
6
6
XXXH F0H  
RA RD  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Program  
555H AAH 2AAH 55H 555H A0H  
PA  
PD  
Chip Erase  
Sector Erase  
555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H 555H 10H  
555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H  
SA  
30H  
Sector Erase  
Suspend (6)  
1
1
XXXH B0H  
XXXH 30H  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Sector Erase Resume  
(7)  
-
-
-
Auto-select  
See Table 6.  
Notes:  
1. X = don’t care  
RA = Address of memory location to be read.  
RD = Data to be read at location RA.  
PA = Address of memory location to be programmed.  
PD = Data to be programmed at location PA.  
SA = Address of the sector.  
2. Except Read command and Auto-select command, all command bus cycles are write operations.  
3. Address bits A18–A11 are don’t cares.  
4. No command cycles required when reading array data.  
5. The Reset command is required to return to reading array data when device is in the auto-select mode, or if  
DQ5 goes high(while the device is providing status data).  
6. The system may read and program in non-erasing sectors, or enter the auto-select mode, when in the Erase  
Suspend mode. The Erase Suspend command is valid only during a sector erase operation.  
7. The Erase Resume command is valid only during the Erase Suspend mode.  
Table 6. F49L004UA/ F49L004BA Auto-Select Command  
1st Bus  
Cycle  
2nd Bus  
Cycle  
3rd Bus  
Cycle  
4th Bus  
Cycle  
5th Bus  
Cycle  
6th Bus  
Cycle  
Bus  
Command  
Cycles  
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data  
4
4
4
4
555H AAH 2AAH 55H 555H 90H X04H 7FH  
555H AAH 2AAH 55H 555H 90H X08H 7FH  
555H AAH 2AAH 55H 555H 90H X0CH 7FH  
555H AAH 2AAH 55H 555H 90H X00H 8CH  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Manufacture ID  
Device ID, Upper  
boot  
4
4
555H AAH 2AAH 55H 555H 90H X01H B5H  
555H AAH 2AAH 55H 555H 90H X01H B6H  
-
-
-
-
-
-
-
-
Device ID, Bottom  
boot  
(SA) 00H  
555H AAH 2AAH 55H 555H 90H  
x02H 01H  
Sector Protect Verify  
4
-
-
-
-
Notes :  
1. The fourth cycle of the auto-select command sequence is a read cycle.  
2. For Sector Protect Verify operation: If read out data is 01H, it means the sector has been protected. If read out  
data is 00H, it means the sector is still not being protected.  
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Reset Command  
Program Command  
Writing the reset command to the device resets the  
device to reading array data. Address bits are all don’t  
cares for this command.  
The program command sequence programs one byte  
into the device. Programming is a four-bus-cycle  
operation. The program command sequence is initiated  
by writing two unlock write cycles, followed by the  
program set-up command. The program address and  
data are written next, which in turn initiate the  
Embedded Program algorithm. The system is not  
required to provide further controls or timings. The  
device automatically provides internally generated  
program pulses and verifies the programmed cell  
margin.  
The reset command may be written between the  
sequence cycles in an erase command sequence  
before erasing begins. This resets the device to reading  
array data. Once erasure begins, however, the device  
ignores reset commands until the operation is complete.  
The reset command may be written between the  
sequence cycles in a program command sequence  
before programming begins. This resets the device to  
reading array data (also applies to programming in  
Erase Suspend mode). Once programming begins,  
however, the device ignores reset commands until the  
operation is complete.  
When the Embedded Program algorithm is complete,  
the device then returns to reading array data and  
addresses are no longer latched. The system can  
determine the status of the program operation by using  
DQ7, DQ6, or RY/  
. See “Write Operation Status”  
BY  
The reset command may be written between the  
sequence cycles in an auto-select command sequence.  
Once in the auto-select mode, the reset command must  
be written to return to reading array data (also applies to  
auto-select during Erase Suspend).  
section for more information on these status bits.  
Any commands written to the device during the  
Embedded Program Algorithm are ignored. Note that a  
hardware  
reset  
immediately  
terminates  
the  
programming operation. The Program command  
sequence should be reinitiated once the device has  
reset to reading array data, to ensure data integrity.  
If DQ5 goes high(see “DQ5: Exceeded Timing Limits”  
section) during a program or erase operation, writing  
the reset command returns the device to reading array  
data (also applies during Erase Suspend).  
Programming is allowed in any sequence and across  
sector boundaries. A bit cannot be programmed from a  
“0” back to a “1”. Attempting to do so may halt the  
operation and set DQ5 to “1”, or cause the Data Polling  
algorithm to indicate the operation was successful.  
However, a succeeding read will show that the data is  
still “0”. Only erase operations can convert a “0” to a  
“1”.  
Read Command  
The device is automatically set to reading array data  
after device power-up. No commands are required to  
retrieve data. The device is also ready to read array  
data after completing an Embedded Program or  
Embedded Erase algorithm.  
Chip Erase Command  
When the device accepts an Erase Suspend command,  
the device enters the Erase Suspend mode. The  
system can read array data using the standard read  
timings, except that if it reads an address within erase-  
suspended sectors, the device outputs status data.  
After completing a programming operation in the Erase  
Suspend mode, the system may once again read array  
data with the same exception. See “Erase  
Suspend/Erase Resume Commands” for more  
information on this mode.  
Chip erase is a six-bus cycle operation. The chip erase  
command sequence is initiated by writing two unlock  
cycles, followed by a set-up command. Two additional  
unlock write cycles are then followed by the chip erase  
command, which in turn invokes the Embedded Erase  
algorithm.  
The device does not require the system to preprogram  
prior to erase. The Embedded Erase algorithm  
automatically preprograms and verifies the entire  
memory for an all zero data pattern prior to electrical  
erase.  
The system must issue the reset command to re-enable  
the device for reading array data if DQ5 goes high, or  
while in the auto-select mode. See the “Reset  
Command” section. See also the “Read Mode” in the  
“Device Operations” section for more information. Refer  
to Figure 5 for the timing diagram.  
Any commands written to the chip during the  
Embedded Erase algorithm are ignored. Note that a  
hardware reset during the chip erase operation  
immediately terminates the operation. The Chip Erase  
command sequence should be reinitiated once the  
device has returned to reading array data, to ensure the  
data integrity.  
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The system can determine the status of the erase  
operation. The Sector Erase command sequence  
should be reinitiated once the device has returned to  
reading array data, to ensure the data integrity.  
operation by using DQ7, DQ6, DQ2, or RY/  
. See  
BY  
“Write Operation Status” section for more information on  
these status bits.  
When the Embedded Erase algorithm is complete, the  
device returns to reading array data and addresses are  
no longer latched. The system can determine the status  
of the erase operation by using DQ7, DQ6, DQ2, or  
When the Embedded Erase algorithm is complete, the  
device returns to reading array data and addresses are  
no longer latched. See the Erase/Program Operations  
tables in “AC Characteristics” for parameters.  
RY/  
. (Refer to “Write Operation Status” section for  
BY  
more information on these status bits.)  
Refer to the Erase/Program Operations tables in the  
“AC Characteristics” section for parameters.  
Sector Erase Command  
Sector erase is a six-bus cycle operation. The sector  
erase command sequence is initiated by writing two  
unlock cycles, followed by a set-up command. Two  
additional unlock write cycles are then followed by the  
address of the sector to be erased, and the sector erase  
command.  
Sector Erase Suspend/Resume Command  
The Erase Suspend command allows the system to  
interrupt a sector erase operation and then read data  
from, or program data to, any sector not selected for  
erasure (The device “erase suspends” all sectors  
selected for erasure.). This command is valid only  
during the sector erase operation, including the 50 µs  
time-out period during the sector erase command  
sequence. The Erase Suspend command is ignored if  
written during the chip erase operation or Embedded  
Program algorithm. Addresses are “don’t-cares” when  
writing the Erase Suspend command as shown in Table  
5.  
The device does not require the system to preprogram  
the memory prior to erase. The Embedded Erase  
algorithm  
automatically programs and verifies the sector for an all  
zero data pattern prior to electrical erase. The system is  
not required to provide any controls or timings during  
these operations.  
After the command sequence is written, a sector erase  
time-out of 50 µs begins. During the time-out period,  
additional sector addresses and sector erase  
commands may be written. Loading the sector erase  
buffer may be done in any sequence, and the number of  
sectors may be from one sector to all sectors. The time  
between these additional cycles must be less than 50  
µs, otherwise the last address and command might not  
be accepted, and erasure may begin.  
When the Erase Suspend command is written during a  
sector erase operation, the device requires a maximum  
of 20 µs to suspend the erase operation. However,  
when the Erase Suspend command is written during  
the sector erase time-out, the device immediately  
terminates the time-out period and suspends the erase  
operation.  
Reading at any address within erase-suspended  
sectors produces status data on DQ7–DQ0. The  
system can use DQ7, or DQ6 and DQ2 together, to  
determine if a sector is actively erasing or is erase-  
suspended. See “Write Operation Status” section for  
more information on these status bits.  
It is recommended that processor interrupts be disabled  
during this time to ensure all commands are accepted.  
The interrupts can be re-enabled after the last Sector  
Erase command is written. If the time between  
additional sector erase commands can be assumed to  
be less than 50 µs, the system need not monitor DQ3.  
After an erase-suspended program operation is  
complete, the system can once again read array data  
within non-suspended sectors. The system can  
determine the status of the program operation using the  
DQ7 or DQ6 status bits, just as in the standard program  
operation. See “Write Operation Status” for more  
information.  
Any command other than Sector Erase or Erase  
Suspend during the time-out period resets the device to  
reading array data. The system must rewrite the  
command sequence and any additional sector  
addresses and commands.  
The system can monitor DQ3 to determine if the sector  
erase timer has timed out. (See the “DQ3: Sector Erase  
Timer” section.) The time-out begins from the rising  
edge of the final WE pulse in the command sequence.  
Once the sector erase operation has begun, only the  
Erase Suspend command is valid. All other commands  
are ignored. Note that a hardware reset during the  
sector erase operation immediately terminates the  
The system may also write the auto-select command  
sequence when the device is in the Erase Suspend  
mode. The device allows reading auto-select codes  
even at addresses within erasing sectors, since the  
codes are not stored in the memory array. When the  
device exits the auto-select mode, the device reverts to  
the Erase Suspend mode, and is ready for another  
valid operation.  
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The system must write the Erase Resume command  
(address bits are “don’t care” as shown in Table 5) to  
exit the erase suspend mode and continue the sector  
erase operation. Further writes of the Resume  
command are ignored. Another Erase Suspend  
command can be written after the device has resumed  
erasing.  
The auto-select command sequence is initiated by  
writing two unlock cycles, followed by the auto-select  
command. The device then enters the auto-select  
mode, and the system may read at any address any  
number of times, without initiating another command  
sequence. The read cycles at address 04H, 08H, 0CH,  
and 00H retrieves the EFST manufacturer ID. A read  
cycle at address 01H retrieves the device ID. A read  
cycle containing a sector address (SA) and the address  
02H returns 01H if that sector is protected, or 00H if it is  
unprotected. Refer to Tables 1 and 2 for valid sector  
addresses.  
Auto-select Command  
The auto-select command sequence allows the host  
system to access the manufacturer and devices codes,  
and determine whether or not a sector is protected.  
Table 6 shows the address and data requirements. This  
method is an alternative to that shown in Table 4, which  
The system must write the reset command to exit the  
auto-select mode and return to reading array data.  
is intended for PROM programmers and requires VID on  
address bit A9.  
7.3 Write Operation Status  
The device provides several bits to determine the  
RY/ , DQ7, and DQ6 each offer a method for  
BY  
status of a write operation: RY/ , DQ7, DQ6, DQ5,  
BY  
determining whether a program or erase operation  
is complete or in progress.  
DQ3, DQ2, and. Table 7 and the following  
subsections describe the functions of these bits.  
Table 7. Write Operation Status  
DQ7  
DQ5  
Status  
DQ6  
DQ3 DQ2  
RY/  
BY  
(Note2)  
(Note1)  
No  
N/A  
Embedded Program Algorithm  
Embedded Erase Algorithm  
Toggle  
Toggle  
0
0
0
0
DQ7  
0
Toggle  
1
Toggle  
0
1
Reading Erase Suspended  
No  
In Progress  
1
N/A Toggle  
Sector  
Toggle  
Reading Non-Erase  
Erase Suspended Mode  
Data  
DQ7  
DQ7  
Data  
Data Data Data  
1
0
0
Suspended Sector  
Erase Suspend Program  
Toggle  
Toggle  
0
1
N/A  
N/A  
N/A  
No  
Embedded Program Algorithm  
Toggle  
Exceeded  
Embedded Erase Algorithm  
Erase Suspend Program  
0
Toggle  
Toggle  
1
1
1
Toggle  
0
0
Time Limits  
N/A  
N/A  
DQ7  
Notes:  
1. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for  
further details.  
2. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum  
timing limits. See “DQ5: Exceeded Timing Limits” for more information.  
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Output Enable (  
) is asserted low. Refer to Figure  
OE  
RY/BY :  
21, Data Polling Timings (During Embedded  
Algorithms), Figure 19 shows the Data Polling  
algorithm.  
Ready/Busy (for 40-pin TSOP package)  
The RY/  
is a dedicated, open-drain output pin that  
BY  
indicates whether an Embedded Algorithm is in  
progress or complete. The RY/ status is valid after  
DQ6:Toggle BIT I  
BY  
pulse in the command  
Toggle Bit I on DQ6 indicates whether an Embedded  
Program or Erase algorithm is in progress or complete,  
or whether the device has entered the Erase Suspend  
mode. Toggle Bit I may be read at any address, and is  
the rising edge of the final  
WE  
is an open-drain output,  
sequence. Since RY/  
BY  
several RY/  
pins can be tied together in parallel with  
BY  
a pull-up resistor to VCC  
.
valid after the rising edge of the final  
pulse in the  
WE  
command sequence (prior to the program or erase  
operation), and during the sector erase time-out.  
If the output is low (Busy), the device is actively erasing  
or programming. (This includes programming in the  
Erase Suspend mode.) If the output is high (Ready), the  
device is ready to read array data (including during the  
Erase Suspend mode), or is in the standby mode. Table  
During an Embedded Program or Erase algorithm  
operation, successive read cycles to any address  
cause DQ6 to toggle. The system may use either  
OE  
7 shows the outputs for RY/  
.
BY  
or  
to control the read cycles. When the operation is  
CE  
complete, DQ6 stops toggling.  
DQ7: Data Polling  
When an erase command sequence is written, if all  
sectors selected for erasing are protected, DQ6 toggles  
for approximately 100 µs, then returns to reading array  
data. If not all selected sectors are protected, the  
Embedded Erase algorithm erases the unprotected  
sectors, and ignores the selected sectors that are  
protected.  
The DQ7 indicates to the host system whether an  
Embedded Algorithm is in progress or completed, or  
whether the device is in Erase Suspend mode. The  
Data Polling is valid after the rising edge of the final  
pulse in the program or erase command sequence.  
WE  
During the Embedded Program algorithm, the device  
outputs on DQ7 the complement of the datum  
programmed  
The system can use DQ6 and DQ2 together to  
determine whether a sector is actively erasing or is  
erase-suspended. When the device is actively erasing  
(i.e. the Embedded Erase algorithm is in progress),  
DQ6 toggles. When the device enters the Erase  
Suspend mode, DQ6 stops toggling. However, the  
system must also use DQ2 to determine which sectors  
are erasing or erase-suspended. Alternatively, the  
system can use DQ7.  
to DQ7. This DQ7 status also applies to programming  
during Erase Suspend. When the Embedded Program  
algorithm is complete, the device outputs the true data  
on DQ7. The system must provide the program address  
to read valid status information on DQ7. If a program  
address falls within a protected sector, Data Polling on  
DQ7 is active for approximately 1 µs, then the device  
returns to reading array data.  
If a program address falls within a protected sector,  
DQ6 toggles for approximately 2 µs after the program  
command sequence is written, then returns to reading  
array data.  
During the Embedded Erase algorithm, Data Polling  
produces a “0” on DQ7. When the Embedded Erase  
algorithm is complete, or if the device enters the Erase  
Suspend mode, Data Polling produces a “1” on DQ7.  
The system must provide an address within any of the  
sectors selected for erasure to read valid status  
information on DQ7.  
DQ6 also toggles during the erase-suspend-program  
mode, and stops toggling once the Embedded Program  
algorithm is complete. Table 7 shows the outputs for  
Toggle Bit I on DQ6. Figure 20 shows the toggle bit  
algorithm. Figure 22 shows the toggle bit timing  
diagrams. Figure 25 shows the differences between  
DQ2 and DQ6 in graphical form. Refer to the  
subsection on DQ2: Toggle Bit II.  
After an erase command sequence is written, if all  
sectors selected for erasing are protected, Data Polling  
on DQ7 is active for approximately 100 µs, then the  
device returns to reading array data. If not all selected  
sectors are protected, the Embedded Erase algorithm  
erases the unprotected sectors, and ignores the  
selected sectors that are protected.  
DQ2: Toggle Bit II  
The “Toggle Bit II” on DQ2, when used with DQ6,  
indicates whether a particular sector is actively erasing  
(that is, the Embedded Erase algorithm is in progress),  
or whether that sector is erase-suspended. Toggle Bit II  
is valid after the rising edge of the final WE or CE ,  
whichever happens first, in the command sequence.  
When the system detects DQ7 has changed from the  
complement to true data, it can read valid data at DQ7~  
DQ0 on the following read cycles. This is because DQ7  
may change asynchronously with DQ0–DQ6 while  
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DQ2 toggles when the system reads at addresses  
within those sectors that have been selected for  
exceeded the specified limits(internal pulse count).  
Under these conditions DQ5 will produce a "1". This  
time-out condition indicates that the program or erase  
cycle was not successfully completed. Data Polling and  
Toggle Bit are the only operating functions of the device  
under this condition.  
erasure. (The system may use either  
or  
to  
CE  
OE  
control the read cycles.) But DQ2 cannot distinguish  
whether the sector is actively erasing or is erase-  
suspended.  
If this time-out condition occurs during sector erase  
operation, it specifies that a particular sector is bad and  
it may not be reused. However, other sectors are still  
functional and may be used for the program or erase  
operation. The device must be reset to use other  
sectors. Write the Reset command sequence to the  
device, and then execute program or erase command  
sequence. This allows the system to continue to use  
the other active sectors in the device.  
DQ6, by comparison, indicates whether the device is  
actively erasing, or whether is in erase-suspended, but  
cannot distinguish which sectors are selected for  
erasure. Thus, both status bits are required for sector  
and mode information. Refer to Table 7 to compare  
outputs for DQ2 and DQ6.  
Figure 20 shows the toggle bit algorithm in flowchart  
form. See also the DQ6: Toggle Bit I subsection. Figure  
22 shows the toggle bit timing diagram. Figure 25  
shows the differences between DQ2 and DQ6 in  
graphical form.  
If this time-out condition occurs during the chip erase  
operation, it specifies that the entire chip is bad or  
combination  
of sectors are bad.  
If this time-out condition occurs during the  
programming operation, it specifies that the sector  
containing that byte is bad and this sector may not be  
reused, however other sectors are still functional and  
can be reused.  
Reading Toggle Bits DQ6/ DQ2  
Refer to Figure 20 for the following discussion.  
Whenever the system initially begins reading toggle bit  
status, it must read DQ7–DQ0 at least twice in a row to  
determine whether a toggle bit is toggling. Typically, the  
system would note and store the value of the toggle bit  
after the first read. After the second read, the system  
would compare the new value of the toggle bit with the  
first. If the toggle bit is not toggling, the device has  
completed the program or erase operation. The system  
can read array data on DQ7–DQ0 on the following read  
cycle.  
The time-out condition will not appear if a user tries to  
program a non blank location without erasing. Please  
note that this is not a device failure condition since the  
device was incorrectly used.  
DQ3:Sector Erase Timer  
After writing a sector erase command sequence, the  
system may read DQ3 to determine whether or not an  
erase operation has begun. (The sector erase timer  
does not apply to the chip erase command.) If  
additional sectors are selected for erasure, the entire  
timeout also applies after each additional sector erase  
command.  
However, if after the initial two read cycles, the system  
determines that the toggle bit is still toggling, the system  
should note whether the value of DQ5 is high (see the  
section on DQ5). If it is, the system should then  
determine again whether the toggle bit is toggling, since  
the toggle bit may have stopped toggling just as DQ5  
went high. If the toggle bit is no longer toggling, the  
device has successfully completed the program or  
erase operation. If it is still toggling, the device did not  
completed the operation successfully, and the system  
must write the reset command to return to reading array  
data.  
When the time-out is complete, DQ3 switches from “0”  
to “1.” If the time between additional sector erase  
commands from the system can be assumed to be less  
than 50 µs, the system need not monitor DQ3.  
When the sector erase command sequence is written,  
the system should read the status on DQ7 (Data  
Polling) or DQ6 (Toggle Bit I) to ensure the device has  
accepted the command sequence, and then read DQ3.  
If DQ3 is “1”, the internally controlled erase cycle has  
begun; all further commands (except Erase Suspend)  
are ignored until the erase operation is complete.  
The remaining scenario is that the system initially  
determines that the toggle bit is toggling and DQ5 has  
not gone high. The system may continue to monitor the  
toggle bit and DQ5 through successive read cycles,  
determining the status as described earlier.  
Alternatively, it may choose to perform other system  
tasks. In this case, the system must start at the  
beginning of the algorithm when it returns to determine  
the status of the operation.  
If DQ3 is “0”, the device will accept additional sector  
erase commands. To ensure the command has been  
accepted, the system software should check the status  
of DQ3 prior to and following each subsequent sector  
erase command. If DQ3 is high on the second status  
check, the last command might not have been  
accepted. Table 7 shows the outputs for DQ3.  
DQ5: Exceeded Timing Limits  
DQ5 indicates whether the program or erase time has  
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7.4 More Device Operations  
Hardware Data Protection  
Write cycles are inhibited by holding any one of  
= VIL,  
and  
OE  
= VIH. To initiate a write cycle,  
= VIH or  
WE  
must be a logical zero while  
The command sequence requirement of unlock cycles for  
programming or erasing provides data protection against  
inadvertent writes. In addition, the following hardware  
data protection measures prevent accidental erasure or  
programming, which might otherwise be caused by  
CE  
WE  
CE  
is a logical one.  
OE  
Power Supply Decoupling  
In order to reduce power switching effect, each device  
should have a 0.1uF ceramic capacitor connected  
between  
spurious system level signals during VCC power-up and  
power-down transitions, or from system noise.  
its VCC and GND.  
Low VCC Write Inhibit  
When VCC is less than VLKO, the device does not accept  
Power-Up Sequence  
The device powers up in the Read Mode. In addition, the  
memory contents may only be altered after successful  
completion of the predefined command sequences.  
any write cycles. This protects data during VCC power-up  
and power-down. The command register and all internal  
program/erase circuits are disabled, and the device resets.  
Subsequent writes are ignored until VCC is greater than  
V
LKO. The system must provide the proper signals to the  
control pins to prevent unintentional writes when VCC is  
greater than VLKO  
Power-Up Write Inhibit  
.
If  
=
= VIL and  
= VIH during power up, the  
OE  
WE  
device does not accept commands on the rising edge of  
. The internal state machine is automatically reset to  
CE  
Write Pulse "Glitch" Protection  
WE  
reading array data on power-up.  
Noise pulses of less than 5 ns (typical) on  
WE  
,
or  
OE CE  
do not initiate a write cycle.  
Logical Inhibit  
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8. ABSOLUTE MAXIMUM RATINGS  
Storage Temperature  
2. Minimum DC input voltage on pins A9,  
,
OE  
is -0.5 V. During voltage  
transitions, A9, and may  
Plastic Packages . . . . . . . . . . . . . . –65°C to +150°C  
Ambient Temperature  
and  
RESET  
,
OE  
RESET  
with Power Applied. . . . . . . .. . . . . . –65°C to +125°C  
Voltage with Respect to Ground  
overshoot VSS to –2.0 V for periods of up to 20  
ns. See Figure 1. Maximum DC input voltage  
on pin A9 is +12.5 V which may overshoot to  
14.0 V for periods up to 20 ns.  
VCC (Note 1) . . . . . . . . . . .–0.5 V to +4.0 V  
A9,  
,
OE  
and  
(Note 2) …. . . .. . . . . –0.5 V to +12.5 V  
RESET  
3. No more than one output may be shorted to  
ground at a time. Duration of the short circuit  
should not be greater than one second.  
All other pins (Note 1). . . . . . . . . . –0.5 V to VCC +0.5 V  
Output Short Circuit Current (Note 3) .. . .. 200 mA  
Notes:  
Stresses above those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
This is  
1. Minimum DC voltage on input or I/O pins is –0.5  
V. During voltage transitions, input or I/O pins  
may overshoot VSS to  
a stress rating only; functional operation of the device at  
these or any other conditions above those indicated in the  
operational sections of this data sheet is not implied.  
Exposure of the device to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
–2.0 V for periods of up to 20 ns. See Figure 1.  
Maximum DC voltage on input or I/O pins is  
VCC +0.5 V. During voltage transitions, input or  
I/O pins may overshoot to VCC +2.0 V for  
periods up to 20 ns. See Figure 2.  
Figure 1. Maximum Negative Overshoot Waveform  
20ns  
20ns  
+0 . 8 V  
- 0. 5V  
- 2. 0V  
20ns  
Figure 2. Maximum Positive Overshoot Waveform  
20ns  
Vc c  
+2 . 0 V  
Vc c  
+0 . 5 V  
2. 0V  
20ns  
20ns  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 17/46  
EFST  
OPERATING RANGES  
preliminary  
F49L004UA / F49L004BA  
Commercial (C) Devices Ambient Temperature (TA) . . . . . . . . . . . 0°C to +70°C  
VCC Supply Voltages VCC for all devices . . . . . . . . . . . . . . . . . . . . .2.7 V to 3.6 V  
Operating ranges define those limits between which the functionality of the device is guaranteed.  
Table 8. Capacitance TA = 25°C , f = 1.0 MHz  
Symbol  
CIN1  
Description  
Conditions  
VIN = 0V  
Min.  
Typ.  
Max.  
8
Unit  
pF  
Input Capacitance  
CIN2  
Control Pin  
VIN = 0V  
12  
pF  
Capacitance  
COUT  
Output Capacitance  
VOUT = 0V  
12  
pF  
9. DC CHARACTERISTICS  
Table 9. DC Characteristics TA = 0C to 70C, VCC = 2.7V to 3.6V  
Symbol  
Description  
Conditions  
Min.  
Typ.  
Max.  
±1  
35  
Unit  
uA  
ILI  
Input Leakage Current  
A9 Input Leakage Current  
Output Leakage Current  
VIN = VSS or VCC, VCC = VCC max.  
VCC = VCC max; A9=12.5V  
VOUT = VSS or VCC, VCC = VCC max  
ILIT  
ILO  
uA  
±1  
12  
uA  
@5MHz  
@1MHz  
7
2
mA  
mA  
mA  
uA  
= V ,  
CE  
IL  
ICC1  
VCC Active Read Current  
= V  
OE  
4
IH  
ICC2  
ICC3  
VCC Active write Current  
VCC Standby Current  
= V ,  
= V  
15  
0.2  
30  
5
CE  
OE  
= VCC ± 0.3V  
IL  
IH  
;
CE RESET  
= VSS ± 0.3V  
VCC Standby Current  
ICC4  
0.2  
0.2  
5
uA  
RESET  
During Reset  
ICC5  
VIL  
Automatic sleep mode  
Input Low Voltage(Note 1)  
Input High Voltage  
VIH = VCC ± 0.3V; VIL = VSS ± 0.3V  
5
uA  
V
-0.5  
0.8  
VIH  
0.7x VCC  
VCC + 0.3  
V
Voltage for Auto-Select  
and Temporary Sector  
Unprotect  
Output Low Voltage  
Output High Voltage(TTL)  
Output High Voltage  
VID  
VCC =3.3V  
11.5  
12.5  
0.45  
V
V
VOL  
VOH1  
VOH2  
VLKO  
IOL = 4.0mA, VCC = VCC min  
IOH = -2mA, VCC = VCC min  
IOH = -100uA, VCC min  
0.85x VCC  
VCC -0.4  
2.3  
Low VCC Lock-out Voltage  
2.5  
V
Notes :  
1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns.  
VIL min. = -2.0V for pulse width is equal to or less than 20 ns.  
2. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns  
If VIH is over the specified maximum value, read operation cannot be guaranteed.  
3. Automatic sleep mode enable the low power mode when addresses remain stable for 250 ns  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 18/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
10. AC CHARACTERISTICS  
TEST CONDITIONS  
Figure 3. Test Setup  
2.7K  
Ω
DEVICE UNDER  
TEST  
+3.3V  
DIODES = IN3064  
OR EQUIVALENT  
CL  
6.2K  
Ω
CL = 100pF Including jig capacitance  
CL = 30pF for F49L004U(B)A  
Figure 4. Input Waveforms and Measurement Levels  
3. 0V  
0V  
1. 5V  
1. 5V  
Test Poin t s  
Inpu t  
Out pu t  
A C TE S TIN G  
:
In p u t s a r e d r i v e n a t 3 . 0 V f o r  
5 n s .  
a
l o g i c " 1 " a n d 0 V f o r  
a
l o g i c " 0 "  
In p ut p ul s e r i s e a nd f a l l ti m e s a r e  
<
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 19/46  
EFST  
10.1 Read Operation  
preliminary  
F49L004UA / F49L004BA  
TA = 0C to 70C, VCC = 2.7V~3.6V  
Table 10. Read Operations  
-70  
-90  
Symbol  
Description  
Conditions  
Unit  
Min.  
70  
Max.  
Min.  
90  
Max.  
tRC  
Read Cycle Time (Note 1)  
Address to Output Delay  
ns  
ns  
tACC  
=
= V  
70  
70  
30  
90  
90  
35  
CE OE  
IL  
to Output Delay  
CE  
tCE  
tOE  
= V  
ns  
ns  
OE  
CE  
IL  
= V  
to Output Delay  
OE  
IL  
High to Output Float  
(Note1)  
OE  
= V  
tDF  
25  
30  
ns  
ns  
ns  
ns  
CE  
IL  
tOEH  
Output Enable  
Read  
0
10  
0
0
10  
0
Toggle and  
Data Polling  
Hold Time  
=
= V  
tOH  
Address to Output hold  
CE OE  
IL  
Notes :  
1. Not 100% tested.  
2. tDF is defined as the time at which the output achieves the open circuit condition and data is no longer  
driven.  
Figure 5. Read Timing Waveform  
tR C  
Addresses Stabl e  
tA C C  
Addr es s  
C E  
tD F  
t O E  
OE  
tO E H  
W E  
tC E  
tO H  
H i gh - Z  
H i gh - Z  
Output Vali d  
Outputs  
RE S E T  
RY/B Y  
0V  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 20/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
10.2 Program/Erase Operation  
Table 11.  
Controlled Program/Erase Operations(TA = 0C to 70C, VCC = 2.7V~3.6V)  
WE  
-70  
-90  
Symbol  
Description  
Unit  
Min.  
70  
Max.  
Min.  
90  
Max.  
Write Cycle Time (Note 1)  
Address Setup Time  
Address Hold Time  
Data Setup Time  
ns  
ns  
ns  
ns  
ns  
ns  
tWC  
tAS  
0
45  
35  
0
0
45  
35  
0
tAH  
tDS  
Data Hold Time  
tDH  
tOES  
Output Enable Setup Time  
Read Recovery Time Before  
0
0
0
0
ns  
tGHWL  
Write (  
High to  
low)  
WE  
OE  
Setup Time  
Hold Time  
0
0
0
0
ns  
ns  
ns  
ns  
CE  
CE  
tCS  
tCH  
tWP  
tWPH  
Write Pulse Width  
Write Pulse Width High  
35  
30  
35  
30  
Programming Operation (Note 2)  
(Byte program time)  
9(typ.)  
9(typ.)  
us  
tWHWH1  
Sector Erase Operation (Note 2)  
VCC Setup Time (Note 1)  
0.7(typ.)  
0.7(typ.)  
sec  
us  
tWHWH2  
tVCS  
50  
0
50  
0
ns  
Recovery Time from RY/  
tRB  
BY  
90  
90  
ns  
Program/Erase Valid to RY/  
Delay  
BY  
tbusy  
Notes :  
1. Not 100% tested.  
2. See the "Erase and Programming Performance" section for more information.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 21/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Table 12.  
Controlled Program/Erase Operations(TA = 0C to 70C, VCC = 2.7V~3.6V)  
CE  
-70  
-90  
Symbol  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
Write Cycle Time (Note 1)  
Address Setup Time  
Address Hold Time  
Data Setup Time  
70  
90  
ns  
tWC  
tAS  
0
45  
35  
0
0
45  
35  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
us  
sec  
tAH  
tDS  
Data Hold Time  
tDH  
Output Enable Setup Time  
0
0
tOES  
tGHEL  
tWS  
Read Recovery Time Before Write  
0
0
0
0
Setup Time  
Hold Time  
WE  
WE  
CE  
0
0
tWH  
Pulse Width  
35  
30  
35  
30  
tCP  
Pulse Width High  
CE  
tCPH  
tWHWH1  
tWHWH2  
Programming Operation(note2)  
Sector Erase Operation (note2)  
9(typ.)  
9(typ.)  
0.7(typ.)  
0.7(typ.)  
Notes :  
1. Not 100% tested.  
2. See the "Erase and Programming Performance" section for more information.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 22/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 6. Write Command Timing Waveform  
V C C  
3V  
V I H  
V I L  
Addr es s  
AD D V al i d  
tA H  
t A S  
V I H  
V I L  
W E  
t O E S  
t W P  
tW P H  
tC W C  
tC H  
V I H  
V I L  
C E  
OE  
tC S  
V I H  
V I L  
tD H  
tD H  
V I H  
V I L  
D I N  
Dat a  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 23/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 7. Embedded Programming Timing Waveform  
5 5 5 f o r p r o g r a m P A f o r p r o g r a m  
2 A A f o r e r a s e  
S A f o r s e c t o r e r a s e  
5 5 5 f o r c h i p  
e r a sDe ata P ol li n g  
P D  
Addr es s  
tW C  
tW H  
t A S  
tA H  
W E  
OE  
tG H E L  
tC P  
tW H W H 1 o r  
2
C E  
t W S  
tD S  
tC P H  
tD H  
tB U S Y  
Dat a  
DO U T  
DQ7  
P D f o r p r o g r a m  
A0 f o r p r o g r a m  
5 5 f o r e r a s e  
3 0 f o r s e c t o r e r a s e  
1 0 f o r c h i p e r a s e  
tR H  
RE S E T  
RY/B Y  
Notes :  
1. PA = Program Address, PD = Program Data, DOUT = Data Out , DQ7 = complement of data written to device  
2. Figure indicates the last two bus cycles of the command sequence..  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 24/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 8. Embedded Programming Algorithm Flowchart  
Start  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data A0H Address 555H  
Data Poll  
from system  
Increment  
address  
No  
No  
Verify Work OK?  
Yes  
Last address?  
Yes  
Embedded Program Completed  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 25/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 9. CE Controlled Program Timing Waveform  
5 5 5 f o r p r o g r a mP A f o r p r o g r a m  
2 A A f o r e r a s e S A f o r s e c t o r e r a s e  
5 5 5 f o r c h i p  
e r a sDe ata P ol li n g  
P D  
Addr es s  
tW C  
tW H  
t A S  
tA H  
W E  
OE  
tG H E L  
tC P  
tW H W H 1 o r  
2
C E  
tC P H  
tD H  
t W S  
tB U S Y  
tD S  
Dat a  
D O U T  
DQ7  
P D f o r p r o g r a m  
A0 f o r p r o g r a m  
5 5 f o r e r a s e  
3 0 f o r s e c t o r e r a s e  
1 0 f o r c h i p e r a s e  
tR H  
RE S E T  
RY/B Y  
Notes :  
1. PA = Program Address, PD = Program Data, DOUT = Data Out , DQ7 = complement of data written to device  
2. Figure indicates the last two bus cycles of the command sequence..  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 26/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 10. Embedded Chip Erase Timing Waveform  
Read Statu s Dat a  
Er as e Com mand S equ en ce( last t w o cycl e)  
t A S  
tW C  
2AAAh  
VA  
VA  
Addr es s  
C E  
555h  
tA H  
tC H  
tG H W L  
OE  
tW H W H 1  
t W P  
W E  
tW P H  
tC S  
tD S  
tD H  
I n  
P r o g r e s s  
C o m p l e t e  
10h  
55h  
Dat a  
tB U S Y  
tR B  
RY/B Y  
tV C S  
V C C  
Notes :  
SA = Sector Address (for Sector Erase, VA = Valid Address for reading status data  
(see "Write Operation Status")  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 27/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 11. Embedded Chip Erase Algorithm Flowchart  
Start  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 80H Address 555H  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 10H Address 555H  
Data Poll from System  
No  
Data = FFh?  
Yes  
Embedded Chip Erease Completed  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 28/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 12. Embedded Sector Erase Timing Waveform  
Read Statu s Dat a  
Er as e Com m and S equ en ce( last t w o cycl e)  
t A S  
tW C  
2AAAh  
VA  
VA  
SA  
Addr es s  
C E  
tA H  
tC H  
tG H W L  
OE  
tW H W H 1  
t W P  
W E  
tW P H  
tC S  
tD S  
tD H  
I n  
P r o g r e s s  
C o m p l e t e  
30h  
55h  
Dat a  
tB U S Y  
tR B  
RY/ B  
Y
tV C S  
V C C  
Notes :  
SA = Sector Address (for Sector Erase, VA = Valid Address for reading status data  
(see "Write Operation Status")  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 29/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 13. Embedded Sector Erase Algorithm Flowchart  
Start  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 80H Address 555H  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 30H Address SA  
No  
Last Sector  
to Erase  
Yes  
Data Poll from System  
No  
Data = FFh?  
Embedded Sector Erease Completed  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 30/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 14. Erase Suspend/Erase Resume Flowchart  
Start  
Write Data B0H  
ERASE SUSPEND  
No  
Toggle Bit checking Q6  
not toggled  
Yes  
Read Array or  
Program  
No  
Reading or  
Programming End  
Yes  
Write Data 30H  
ERASE RESUME  
Continue Erase  
No  
Another  
Erase Suspend?  
Yes  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
31/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 15. In-System Sector Protect/Unprotect Timing Waveform (  
Control)  
RESET  
RE S E T  
SA,A6  
Val i d*  
Val i d*  
Val i d*  
Status  
A1,A0  
Sec tor P rotec t Sec tor U npr ot ec t  
Ver i f y  
40h  
60h  
60h  
Dat a  
S e c t o r P r o t e c t  
=
1 5 0 u s  
1 5 m s  
S e c t o r U n p r o t e c t  
=
t W P  
C E  
W E  
OE  
Notes :  
When sector protect, A6=0, A1=1.  
When sector unprotect, A6=1, A1=1, A0=0.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 32/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 16. In-System Sector Protect/Unprotect Algorithm (  
= V )  
RESET  
ID  
Start  
Start  
PLSCNT = 1  
PLSCNT = 1  
Protect all sector :  
The indicated portion  
RESET = VID  
RESET = VID  
of the sector protect  
algorithm must be  
performed for all  
unprotected sectors  
μ
Wait 1  
s
μ
Wait 1  
s
prior to issuing the  
first sector  
unprotect address  
No  
First W rite  
No  
Temporary Sector  
Unprotect Mode  
First W rite  
Temporary Sector  
Unprotect Mode  
Cycle  
= 60h?  
Cycle  
= 60h?  
Yes  
Yes  
Set up sector  
address  
No  
All sectors  
protected?  
Yes  
Sector Protect :  
Write 60h to sector  
address with  
A6 = 0, A1 = 1,  
A0 = 0  
Set up first  
sector address  
Sector Unprotect :  
Write 60h to sector  
address with  
A6 = 1, A1 = 1,  
A0 = 0  
μ
Wait 150  
s
Verify Sector  
Protect : Write 40h  
to sector address  
with A6 = 0,  
Reset  
PLSCNT = 1  
Wait 15 ms  
Increment  
PLSCNT  
A1 = 1, A0 = 0  
Verify Sector  
Unprotect : Write  
40h to sector  
address with  
A6 = 1, A1 = 1,  
A0 =0  
Read from  
sector address  
with A6 = 0,  
Increment  
PLSCNT  
A1 = 1, A0 = 0  
No  
No  
Data = 01h?  
Yes  
PLSCNT = 25?  
Read from  
sector address  
with A6 = 1,  
Yes  
A1 = 1, A0 =0  
Device failed  
Yes  
Protect another  
sector?  
No  
Set up  
next sector  
address  
No  
No  
PLSCNT  
= 1000?  
Data = 00h?  
Yes  
Remove VID  
from RESET  
Yes  
Device failed  
No  
Last sector  
verified?  
Write reset  
command  
Yes  
Sector Protect  
complete  
Sector Protect  
Algorithm  
Remove VID  
from RESET  
Sector Unprotect  
Algorithm  
Write reset  
command  
Sector Protect  
complete  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 33/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 17. Sector Protect Timing Waveform (A9,  
Control)  
OE  
A0,A1  
A6  
12V  
3V  
A9  
t V L H T  
12V  
3V  
Ver i f y  
OE  
t V L H T  
t V L H T  
tW P P 1  
W E  
C E  
t O E S P  
01H  
t O E  
F 0 H  
Dat a  
Sec tor Addr es s  
A18~ A12  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 34/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 18. Sector Protection Algorithm (A9,  
Control)  
OE  
Start  
Set up sector address  
PLSCNT = 1  
OE = VID, A9 = VID, CE = VIL  
A6 = VIL  
Activate WE Pluse  
Time out 150us  
Set WE = VIH , CE = OE = VIL  
A9 should remain VID  
Read from Sector  
Address = SA, A0 = 1, A1 = 1  
No  
No  
Data = 01H?  
PLSCNT = 32?  
Yes  
Device Failed  
Yes  
Protect Another  
Sector?  
Remove VID from A9  
Write reset command  
Sector Protection  
Complete  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 35/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
WRITE OPERATION STATUS  
Figure 19. Data Polling Algorithm  
Start  
Read Q7~Q0  
Add. = VA(1)  
Yes  
Q7 = Data?  
No  
No  
Q5 = 1?  
Yes  
Read Q7~Q0  
Add. = VA  
Yes  
Q7 = Data?  
(2)  
No  
Pass  
FAIL  
Notes :  
1. VA =Valid address for programming.  
2. Q7 should be re-checked even Q5 = "1" because  
Q7 may change simultaneously with Q5.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
36/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 20. Toggle Bit Algorithm  
Start  
Read Q7 ~ Q0  
Read Q7 ~ Q0  
(Note 1)  
No  
Toggle Bit = Q6  
Toggle?  
Yes  
No  
Q5 = 1?  
Yes  
(Note 1,2)  
No  
Read Q7~Q0 Twice  
Toggle bit Q6  
=
Toggle?  
Yes  
Program / Erase operation  
Not complete, write  
reset command  
Program / Erase  
operation complete  
Note :  
1. Read toggle bit twice to determine whether or not it is toggle.  
2. Recheck toggle bit because it may stop toggling as Q5 change to "1".  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2  
37/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 21. Data Polling Timings (During Embedded Algorithms)  
tR C  
VA  
Addr es s  
VA  
tA C C  
tC E  
C E  
tC H  
t O E  
OE  
tO E H  
tD F  
W E  
tO H  
H i gh - Z  
H i gh - Z  
C o m p l e m e n t  
V a i l d D a t a  
Va i l d D a t a  
C o m p l e m e n t  
S t a t u s D a t a  
T r u e  
T r u e  
DQ7  
S t a t u s D a t a  
DQ 0~ DQ 6  
tB U S Y  
RY/B Y  
Notes :  
VA = Valid Address. Figure shows first status cycle after command sequence, last status read cycle, and array  
data read cycle.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 38/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 22. Toggle Bit Timing Waveforms (During Embedded Algorithms)  
tR C  
VA  
VA  
Addr es s  
VA  
VA  
tAC C  
tC E  
C E  
tC H  
t O E  
OE  
W E  
tO E H  
tD F  
tO H  
H i gh - Z  
V
a i l d  
S t a t u s  
V a i l d  
S t a t u s  
V a i l d  
D a t a  
V a i l d  
D a t a  
DQ6/DQ 2  
( s e c o n d r e a d )  
( f i r s t r e a d )  
( s t o p s t o g g l i n g )  
tB U S Y  
RY/B Y  
Notes :  
VA = Valid Address; not required for DQ6. Figure shows first status cycle after command sequence, last status  
read cycle, and array data read cycle.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 39/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
10.3 Hardware Reset Operation  
Table 13. AC CHARACTERISTICS (for 40-pin TSOP package type)  
Symbol  
Description  
All Speed Options  
Unit  
Pin Low (During Embedded Algorithms)  
RESET  
TREADY1  
Max  
Max  
20  
us  
to Read or Write (See Note)  
Pin Low (NOT During Embedded  
Algorithms) to Read or Write (See Note)  
RESET  
TREADY2  
500  
ns  
Pulse Width (During Embedded Algorithms)  
RESET  
Min  
Min  
Min  
500  
50  
0
ns  
ns  
ns  
TRP  
TRH  
TRB  
High Time Before Read(See Note)  
RESET  
RY/  
Recovery Time(to  
,
go low)  
BY  
CE OE  
Notes :  
Not 100% tested  
Figure 23.  
Timing Waveform (for 40-pin TSOP package type)  
RESET  
RY/B Y  
CE, O E  
RE S E T  
tR H  
tR P  
tR e a d y 2  
Reset T i mi ng NO T dur i ng Au tom at i c Al gor i th m s  
tR e a d y 1  
RY/B Y  
tR B  
CE, O E  
RE S E T  
tR P  
Reset T im in g dur i ng A ut om ati c A lgori th m s  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 40/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
10.4 TEMPORARY SECTOR UNPROTECT Operation  
Table 14. Temporary Sector Unprotect  
Symbol  
Description  
VID Rise and Fall Time (See Note)  
All Speed Options  
Unit  
Min  
Min  
500  
ns  
TVIDR  
Setup Time for Temporary Sector  
RESET  
4
us  
TRSP  
Unprotect  
Notes:  
Not 100% tested  
Figure 24. Temporary Sector Unprotect Timing Diagram  
0 or VC C  
t V I D R  
0 or VC C  
RE S E T  
C E  
t V I D R  
P r o g r a m o r E r a s e C o m m a n d S e q u e n c e  
W E  
tR S P  
RY/B Y  
Figure 25. Q6 vs Q2 for Erase and Erase Suspend Operations  
Ente r E r as e  
Suspend Pro gra m  
En ter E m bedde d  
Er as in g  
Er as e  
Suspen d  
Er as e  
Resu m e  
W E  
DQ6  
DQ 2  
Er as e  
Co m pl e t e  
Er as e  
Su spend  
Read  
Er as e  
Su spend  
Pr o gr a m  
Er as e  
Notes :  
The system can use OE or CE to toggle DQ2 / DQ6, DQ2 toggles only when read at an address within an  
erase-suspended.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 41/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 26. Temporary Sector Unprotect Algorithm  
Start  
RESET = VID (Note 1)  
Program Erase or Program Operation  
Operation Completed  
RESET = VIH  
Temporary Sector Unprotect Completed (Note 2)  
Notes :  
1. All protected status are temporary unprotect.  
V
ID = 11.5V~12.5V  
2. All previously protected sectors are protected again.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 42/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Figure 27. ID Code Read Timing Waveform  
V C C  
3V  
V I D  
V I H  
V I L  
A D D  
A9  
V I H  
A D D  
A0  
V I L  
tAC C  
tA C C  
V I H  
V I L  
A1  
A D D  
A2~ A8  
A10~ A18  
V I H  
V I L  
V I H  
V I L  
C E  
tC E  
V I H  
V I L  
W E  
t O E  
V I H  
V I L  
tD F  
tO H  
OE  
tO H  
V I H  
V I L  
Dat a  
DQ 0~ DQ 7  
Data Out  
B5H/B6 H  
Data Out  
C 2 H  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 43/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
11. ERASE AND PROGRAMMING PERFORMANCE  
Table 15. Erase And Programming Performance (Note.1)  
Limits  
Typ.(2)  
0.7  
Parameter  
Min.  
Unit  
Max.(3)  
Sector Erase Time  
15  
sec  
sec  
Chip Erase Time  
11  
Byte Programming Time  
Chip Programming Time  
9
300  
us  
4.5  
13.5  
sec  
Erase/Program Cycles  
100,000  
Cycles  
Notes:  
1.Not 100% Tested, Excludes external system level over head.  
2.Typical values measured at 25°C, 3V.  
3.Maximum values measured at 25°C, 2.7V.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 44/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
12. PACKAGE DIMENSION  
32-pin PLCC  
D
1
D
c
1
32  
30  
4
5
29  
2
E
3
E
E1  
E
2
E
13  
21  
14  
20  
1
A
-C-  
A
2
A
Seating Plane  
0.020" MIN  
-C-  
b
b
O
e
2
D
3
0.004  
D
2
D
2
Symbol  
Dimension in mm  
Dimension in inch  
Norm  
Min  
Norm  
-------  
-------  
2.79 REF  
-------  
Max  
Min  
0.125  
0.060  
Max  
0.140  
0.095  
A
A 1  
A 2  
b
b2  
c
3.18  
1.53  
3.55  
2.41  
-------  
-------  
0.110 REF  
-------  
0.33  
0.66  
0.20  
0.54  
0.82  
0.36  
0.013  
0.026  
0.008  
0.021  
0.032  
0.014  
-------  
-------  
-------  
-------  
e
θ
E
1.27 BSC  
-------  
0.050 BSC  
-------  
0O  
10O  
15.11  
14.04  
6.93  
0O  
10O  
0.595  
0.553  
0.273  
14.86  
13.90  
6.05  
14.99  
0.585  
0.547  
0.238  
0.590  
E 1  
E 2  
E 3  
D
13.97  
-------  
10.16 BSC  
12.45  
11.43  
-------  
7.62 BSC  
0.550  
-------  
0.400 BSC  
0.490  
0.450  
-------  
0.300 BSC  
12.32  
11.36  
4.78  
12.57  
11.50  
5.66  
0.485  
0.447  
0.188  
0.495  
0.453  
0.223  
D 1  
D 2  
D 3  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 45/46  
EFST  
preliminary  
F49L004UA / F49L004BA  
Important Notice  
All rights reserved.  
No part of this document may be reproduced or duplicated in any form or  
by any means without the prior permission of EFST.  
The contents contained in this document are believed to be accurate at  
the time of publication. EFST assumes no responsibility for any error in  
this document, and reserves the right to change the products or  
specification in this document without notice.  
The information contained herein is presented only as a guide or  
examples for the application of our products. No responsibility is  
assumed by EFST for any infringement of patents, copyrights, or other  
intellectual property rights of third parties which may result from its use.  
No license, either express , implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of EFST or  
others.  
Any semiconductor devices may have inherently a certain rate of failure.  
To minimize risks associated with customer's application, adequate  
design and operating safeguards against injury, damage, or loss from  
such failure, should be provided by the customer when making  
application designs.  
EFST 's products are not authorized for use in critical applications such  
as, but not limited to, life support devices or system, where failure or  
abnormal operation may directly affect human lives or cause physical  
injury or property damage. If products described here are to be used for  
such kinds of application, purchaser must do its own quality assurance  
testing appropriate to such applications.  
Elite Flash Storage Technology Inc.  
Publication Date : Aug. 2003  
Revision: 0.2 46/46  

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