SR6K20M105X [EPCOS]
Ceramic transient voltage suppressors; 陶瓷瞬态电压抑制器
| 型号： | SR6K20M105X |
| 厂家： | 
EPCOS |
| 描述： | Ceramic transient voltage suppressors |
| 文件： | 总29页 (文件大小：670K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ceramic transient voltage suppressors
Leaded transient voltage/RFI suppressors (SHCVs)
Series/Type:
Date:
August 2011
© EPCOS AG 2011. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
EPCOS type designation system for leaded transient voltage / RFI suppressors
SR
1
S
14
B
M
474
X
G
SR ꢀ Leaded,
SHCV series
EIA case sizes of used chips:
6 ꢀ 12 x 06 / 3.2 x 1.6 mm
1 ꢀ 18 x 12 / 4.5 x 3.2 mm
2 ꢀ 22 x 20 / 5.7 x 5.0 mm
Varistor voltage tolerance:
K ꢀ ±10%
S ꢀ Special tolerance
Maximum RMS operating voltage (VRMS):
14 ꢀ 14 V
Special varistor voltage tolerance:
B ꢀ Special tolerance
Capacitance tolerance:
M ꢀ ±20%
Capacitance value:
474 ꢀ 47 ꢁ 104 pF ꢀ 0.47 µF
Capacitor ceramic:
X ꢀ X7R
Taping mode:
G ꢀ Taped version
ꢂ ꢀ Bulk
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Features
RFI noise suppression and transient overvoltage protection integrated in a
single component
Reliable protection against automotive transients such as load dump and
jump start (for SR1 and SR2 types)
High capacitance (up to 4.7 µF)
Low clamping voltage
RoHS-compatible
Suitable for lead-free soldering
PSpice simulation models available
Applications
RFI noise suppression and transient overvoltage protection on DC lines of
small motors, windscreen wipers, window lifters, mirrors, central locking,
memory seat, sunroof
Design
Combination of multilayer RF filter capacitor and multilayer varistor
Coating: flame-retardant to UL 94 V0, epoxy resin
Terminals: tinned iron wire, RoHS-compatible
V/I characteristics and derating curves
V/I and derating curves are attached to the data sheet. The curves are sorted
by VRMS and then by case size, which is included in the type designation.
General technical data
Maximum RMS operating voltage
Maximum DC operating voltage
Maximum surge current
Maximum load dump energy
Maximum jump start voltage
Maximum clamping voltage
Nominal capacitance
VRMS,max
VDC,max
Isurge,max
WLD
Vjump
Vclamp,max
Cnom
14 ... 35
16 ... 45
100 ... 1200
1.5 ... 12
24.5 ... 26
38 ... 90
V
V
A
J
V
V
(8/20 µs)
(10 pulses)
(5 min)
(8/20 µs)
(1 kHz, 0.5 V)
220 ... 4700 nF
Insulation resistance
Rins
≥ 10
MΩ
Response time
Operating temperature
Storage temperature
tresp
Top
< 25
ꢂ55/+125
ns
°C
°C
LCT/UCT ꢂ55/+150
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Temperature derating
Climatic category: ꢂ55/+125 °C
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Electrical specifications and ordering codes
Maximum ratings (Top,max = 125 °C)
VRMS,max VDC,max Isurge,max
(8/20 µs) (2 ms) (10
pulses)
Wmax
WLD
Pdiss,max
Type
Ordering code
V
V
A
mJ
J
mW
SR1S14BM105X
SR1S14BM155X
SR1S14BM474X
SR2S14BM155X
SR2S14BM474X
SR2S14BM475X
SR6K14M224X
SR1K20M105X
SR1K20M155X
SR1K20M225X
SR1K20M474X
SR2K20M105X
SR2K20M474X
SR6K20M105X
SR6K35M105X
SR6K35M474X
B72587G3140S200 14
B72587H3140S200 14
B72587E3140S200 14
B72547H3140S200 14
B72547E3140S200 14
B72547L3140S200 14
B72527C3140K000 14
B72587G3200K000 20
B72587H3200K000 20
B72587J3200K000 20
B72587E3200K000 20
B72547G3200K000 20
B72547E3200K000 20
B72527G3200K000 20
B72527G3350K000 35
B72527E3350K000 35
16
800
800
800
1200
1200
1200
200
800
800
800
800
1200
1200
200
100
100
2400
2400
2400
5800
5800
5800
500
3000
3000
3000
3000
7800
7800
700
6
6
6
12
12
12
1.5
6
6
6
6
12
12
1.5
1.5
1.5
15
15
15
30
30
30
8
15
15
15
15
30
30
8
16
16
16
16
16
18
26
26
26
26
26
26
26
45
45
400
400
8
8
Characteristics (TA = 25 °C)
VV
(1 mA)
V
∆VV
Vjump
(5 min)
V
Vclamp,max
V
Iclamp
Cnom
∆Cnom
Type
(8/20 µs) (1 kHz, 0.5 V)
A
%
nF
%
SR1S14BM105X
SR1S14BM155X
SR1S14BM474X
SR2S14BM155X
SR2S14BM474X
SR2S14BM475X
SR6K14M224X
SR1K20M105X
SR1K20M155X
SR1K20M225X
SR1K20M474X
SR2K20M105X
SR2K20M474X
SR6K20M105X
SR6K35M105X
SR6K35M474X
22
22
22
22
22
22
22
33
33
33
33
33
33
33
56
56
+23/ꢂ0 24.5
+23/ꢂ0 24.5
+23/ꢂ0 24.5
+23/ꢂ0 24.5
+23/ꢂ0 24.5
+23/ꢂ0 24.5
40
40
40
40
40
40
38
58
58
58
58
58
58
54
90
90
5
5
5
10
10
10
1
5
5
5
5
10
10
1
1
1
1000
1500
470
1500
470
4700
220
1000
1500
2200
470
1000
470
1000
1000
470
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
-
26
26
26
26
26
26
-
-
-
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Dimensional drawing
Dimensions in mm
Type
wmax
hmax
smax
SHCV
SR1 ... 474X
SR1 ... 105X
SR1 ... 155X
SR1 ... 225X
SR2 ... 474X
SR2 ... 105X
SR2 ... 155X
SR2 ... 475X
SR6 ...
7.3
7.3
7.3
7.3
7.8
7.8
7.8
7.8
6.0
7.8
7.8
7.8
7.8
9.0
9.0
9.0
9.0
7.5
3.7
3.7
3.7
4.1
3.6
4.1
4.1
4.1
4.5
Delivery mode
Designation
Taping mode
Bulk
Ordering code, last two digits
B725*********00
-
G
Taped on reel
Taped in AMMO pack
Lead length 14 mm
B725*********51
GA
M14
B725*********54
B725*********33
Standard delivery mode for SHCV types is bulk. Taped versions on reel, AMMO pack and special
lead length available upon request.
For further information on taping please contact EPCOS.
Packing units for:
Type
Pieces
2000
SR6
SR1 / SR2
1000
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Typical characteristics
Capacitance change ∆C/C25 versus temperature T
Note:
The capacitance and the dissipation factor shall meet the specified values 1000 hours after the
last heat treatment above the curie temperature.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
V/I characteristics
SR1S14B*
SR2S14B*
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
V/I characteristics
SR6K14*
SR1K20*
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
V/I characteristics
SR2K20*
SR6K20*
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
V/I characteristics
SR6K35*
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
SHCV-SR1 ...
SHCV-SR2 ...
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
SR6K14 , SR6K20
SR6K35 ...
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Soldering directions
1
Terminations
1.1
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-
allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-
vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-
rier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination
1.2
Silver-palladium termination
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-
tended for conductive adhesion. This metallization improves the resistance of large chips to ther-
mal shock.
In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-
sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-
cations as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
1.3
Silver-platinum termination
Silver-platinum terminations are mainly used for the large case sizes 1812 and 2220. The silver-
platinum termination is approved for reflow soldering, SnPb soldering and lead-free soldering with
a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is rec-
ommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is rec-
ommended.
Multilayer varistor: Structure of silver-platinum termination
2
Recommended soldering temperature profiles
Reflow soldering temperature profile
2.1
Recommended temperature characteristic for reflow soldering following
JEDEC J-STD-020D
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Profile feature
Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min
- Temperature max
- Time
Tsmin
Tsmax
100 °C
150 °C
150 °C
200 °C
tsmin to tsmax 60 ... 120 s
60 ... 180 s
Average ramp-up rate
Tsmax to Tp 3 °C/ s max.
3 °C/ s max.
Liquidous temperature
Time at liquidous
TL
tL
183 °C
217 °C
60 ... 150 s
60 ... 150 s
1)
Peak package body temperature Tp
220 °C ... 235 °C2)
245 °C ... 260 °C2)
Time (tP)3) within 5 °C of specified
classification temperature (Tc)
20 s3)
30 s3)
Average ramp-down rate
Tp to Tsmax 6 °C/ s max.
6 °C/ s max.
Time 25 °C to peak temperature
maximum 6 min
maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
2.2
Wave soldering temperature profile
Temperature characteristics at component terminal with dual-wave soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
2.3
Lead-free soldering processes
EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free
soldering processes only.
Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommenda-
tions.
3
Recommended soldering methods - type-specific releases by EPCOS
Overview
3.1
Reflow soldering
SnPb
Wave soldering
SnPb
Type
Case size
Lead-free
Approved
Approved
No
Lead-free
No
CT... / CD...
CT... / CD...
CN...
0201/ 0402
Approved
No
0603 ... 2220 Approved
0603 ... 2220 Approved
Approved
Approved
No
Approved
No
CN...K2
Arrays
1812, 2220
Approved
Approved
Approved
Approved
Approved
No
No
0405 ... 1012 Approved
No
No
ESD/EMI filters 0405, 0508
Approved
Approved
No
No
No
CU
3225, 4032
-
Approved
Approved
Approved
Approved
SHCV
3.2
Nickel barrier and AgPt terminated multilayer CTVS
All EPCOS MLVs with nickel barrier and AgPt termination are suitable and fully qualiyfied for lead-
free soldering. The nickel barrier layer is 100% matte tin-plated.
3.3
Silver-palladium terminated MLVs
AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-
al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb
solder.
Note:
Lead-free soldering is not approved for MLVs with AgPd termination.
3.4
Silver-platinum terminated MLVs
The silver-platinum termination is approved for reflow soldering, SnPb soldering and lead-free
with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is
recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is
recommended.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
3.5
Tinned copper alloy
All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering.
3.6
Tinned iron wire
All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.
4
Solder joint profiles / solder quantity
Nickel barrier termination
4.1
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may
break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-
ed as leaching of the external terminations.
If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.
As the solder cools down, the solder contracts in the direction of the component. If there is too
much solder on the component, it has no leeway to evade the stress and may break, as in a vise.
The figures below show good and poor solder joints for dual-wave and infrared soldering.
4.1.1 Solder joint profiles for nickel barrier termination - dual-wave soldering
Good and poor solder joints caused by amount of solder in dual-wave soldering.
4.1.2 Solder joint profiles for nickel barrier termination / silver-palladium / silver-platinum
termination - reflow soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Good and poor solder joints caused by amount of solder in reflow soldering.
5
Conductive adhesion
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-
cially attractive method of component connection to supplement or even replace conventional sol-
dering methods.
Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or
silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-
bedded. Electrical conduction is effected by contact between the metal particles.
Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives
can be deposited ready for production requirements by screen printing, stamping or by dis-
pensers. As shown in the following table, conductive adhesion involves two work operations fewer
than soldering.
Reflow soldering
Screen-print solder paste
Mount SMD
Wave soldering
Apply glue dot
Mount SMD
Cure glue
Conductive adhesion
Screen-print conductive adhesive
Mount SMD
Predry solder paste
Reflow soldering
Wash
Cure adhesive
Wave soldering
Wash
Inspect
Inspect
Inspect
Please read Cautions and warnings and
Important notes at the end of this document.
Page 19 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 °C and 180 °C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Solderability tests
Test
Standard
Test conditions
Sn-Pb soldering
Test conditions
Pb-free soldering
Criteria/ test results
Covering of 95% of
Wettability
IEC
Immersion in
Immersion in
60068-2-58 60/40 SnPb solder Sn96.5Ag3.0Cu0.5 end termination,
using non-activated solder using non- or checked by visual
flux at 215 ± 3 °C
for 3 ± 0.3 s
low activated flux
at 245 ± 5 °C
for 3 ± 0.3 s
inspection
Leaching
IEC
Immersion in
Immersion in
No leaching of
resistance
60068-2-58 60/40 SnPb
solder using
Sn96.5Ag3.0Cu0.5 contacts
solder using non- or
mildly activated flux low activated flux
without preheating without preheating
at 260 ± 5 °C
for 10 ±1 s
at 255 ± 5 °C
for 10 ±1 s
Thermal shock
(solder shock)
Dip soldering at
300 °C/5 s
Dip soldering at
300 °C/5 s
No deterioration of
electrical parameters.
Capacitance change:
≤ ±15%
Tests of resistance IEC
Immersion in
Immersion in
Change of varistor
to soldering heat
for SMDs
60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5 voltage:
at 260 °C
for 10 s at 260 °C
≤ ±5%
Tests of resistance IEC
Immersion
Immersion
of leads in
Sn96.5Ag3.0Cu0.5 Change of
for 10 s at 260 °C capacitance X7R:
≤ ꢂ5/+10%
Change of varistor
voltage: ≤ ±5%
to soldering heat
for radial leaded
components
(SHCV)
60068-2-20 of leads in
60/40 SnPb
for 10 s at 260 °C
Please read Cautions and warnings and
Important notes at the end of this document.
Page 20 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
As mounted on substrate
7
Notes for proper soldering
Preheating and cooling
7.1
According to JEDEC J-STD-020D. Please refer to chapter 2.
7.2
Repair / rework
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
Cleaning
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 °C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
Solder paste printing (reflow soldering)
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 21 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
7.5
Adhesive application
Thin or insufficient adhesive causes chips to loosen or become disconnected during curing.
Low viscosity of the adhesive causes chips to slip after mounting. It is advised to consult the
manufacturer of the adhesive on proper usage and amounts of adhesive to use.
7.6
Selection of flux
Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue
after soldering could lead to corrosion of the termination and/or increased leakage current on the
surface of the component. Strong acidic flux must not be used. The amount of flux applied should
be carefully controlled, since an excess may generate flux gas, which in turn is detrimental to sol-
derability.
7.7
Storage of CTVSs
Solderability is guaranteed for one year from date of delivery for multilayer varistors, CeraDiodes
and ESD/EMI filters (half a year for chips with AgPd and AgPt terminations) and two years for
SHCV and CU components, provided that components are stored in their original packages.
Storage temperature:
Relative humidity:
ꢂ25 °C to +45 °C
≤75% annual average, ≤95% on 30 days a year
The solderability of the external electrodes may deteriorate if SMDs and leaded components are
stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous
acid gas or hydrogen sulfide).
Do not store SMDs and leaded components where they are exposed to heat or direct sunlight.
Otherwise the packing material may be deformed or SMDs/ leaded components may stick togeth-
er, causing problems during mounting.
After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the
SMDs or leaded components as soon as possible.
7.8
Placement of components on circuit board
Especially in the case of dual-wave soldering, it is of advantage to place the components on the
board before soldering in that way that their two terminals do not enter the solder bath at different
times.
Ideally, both terminals should be wetted simultaneously.
7.9
Soldering cautions
An excessively long soldering time or high soldering temperature results in leaching of the outer
electrodes, causing poor adhesion and a change of electrical properties of the varistor due to
the loss of contact between electrodes and termination.
Wave soldering must not be applied for MLVs designated for reflow soldering only.
Keep the recommended down-cooling rate.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 22 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
7.10
Standards
CECC 00802
IEC 60068-2-58
IEC 60068-2-20
JEDEC J-STD-020D
Please read Cautions and warnings and
Important notes at the end of this document.
Page 23 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Symbols and terms
Symbol
Cline,typ
Cmax
Cmin
Term
Typical capacitance per line
Maximum capacitance
Minimum capacitance
Cnom
∆Cnom
Ctyp
Nominal capacitance
Tolerance of nominal capacitance
Typical capacitance
fcut-off,min
I
Iclamp
Ileak
Ileak,typ
IPP
Minimum cut-off frequency
Current
Clamping current
Leakage current
Typical leakage current
Peak pulse current
Isurge,max
LCT
Ltyp
Maximum surge current (also termed peak current)
Lower category temperature
Typical inductance
Pdiss,max
PPP
Maximum power dissipation
Peak pulse power
Rins
Insulation resistance
Rmin
Minimum resistance
RS
Resistance per line
TA
Ambient temperature
Top
Operating temperature
Storage temperature
Tstg
tr
Duration of equivalent rectangular wave
Response time
tresp
UCT
V
Upper category temperature
Voltage
VBR,min
Vclamp,max
VDC,max
VESD,air
VESD,contact
Vjump
Minimum breakdown voltage
Maximum clamping voltage
Maximum DC operating voltage (also termed working voltage)
Air discharge ESD capability
Contact discharge ESD capability
Maximum jump start voltage
Please read Cautions and warnings and
Important notes at the end of this document.
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Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
VRMS,max
VV
Maximum AC operating voltage, root-mean-square value
Varistor voltage (also termed breakdown voltage)
Minimum varistor voltage
VV,min
VV,max
∆VV
Maximum varistor voltage
Tolerance of varistor voltage
WLD
Maximum load dump
Wmax
Maximum energy absorption (also termed transient energy)
αtyp
Typical insertion loss
Lead spacing
ꢃ*ꢄ
Maximum possible application conditions
All dimensions are given in mm.
The commas used in numerical values denote decimal points.
Please read Cautions and warnings and
Important notes at the end of this document.
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Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Cautions and warnings
General
Some parts of this publication contain statements about the suitability of our ceramic transient
voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI
filters, SMD disk varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types))
for certain areas of application, including recommendations about incorporation/design-in of these
products into customer applications. The statements are based on our knowledge of typical
requirements often made of our CTVS devices in the particular areas. We nevertheless expressly
point out that such statements cannot be regarded as binding statements about the suitability of
our CTVS components for a particular customer application. As a rule, EPCOS is either unfamiliar
with individual customer applications or less familiar with them than the customers themselves.
For these reasons, it is always incumbent on the customer to check and decide whether the
CTVS devices with the properties described in the product specification are suitable for use in a
particular customer application.
Do not use EPCOS CTVS components for purposes not identified in our specifications,
application notes and data books.
Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always
evaluate a CTVS component under worst-case conditions.
Pay special attention to the reliability of CTVS devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Always connect a CTVS in parallel with the electronic circuit to be protected.
Consider maximum rated power dissipation if a CTVS has insufficient time to cool down
between a number of pulses occurring within a specified isolated time period. Ensure that
electrical characteristics do not degrade.
Consider derating at higher operating temperatures. Choose the highest voltage class
compatible with derating at higher temperatures.
Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will
burst.
If steep surge current edges are to be expected, make sure your design is as low-inductance
as possible.
In some cases the malfunctioning of passive electronic components or failure before the end of
their service life cannot be completely ruled out in the current state of the art, even if they are
operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line
applications such as clamp 30), ensure by suitable design of the application or other measures
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of such a malfunction or failure. Only use CTVS components from the
automotive series in safety-relevant applications.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 26 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Specified values only apply to CTVS components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures like
thermal fuses.
Storage
Only store CTVS in their original packaging. Do not open the package before storage.
Storage conditions in original packaging: temperature ꢂ25 to +45°C, relative humidity ≤75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CTVS may stick together, causing problems during
mounting.
Avoid contamination of the CTVS surface during storage, handling and processing.
Avoid storing CTVS devices in harmful environments where they are exposed to corrosive
gases for example (SOx, Cl).
Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CTVS components after shipment from EPCOS within the time specified:
ꢂ
ꢂ
ꢂ
CTVS with Ni barrier termination, 12 months
CTVS with AgPd and AgPt termination, 6 months
SHCV and CU series, 24 months
Handling
Do not drop CTVS components and allow them to be chipped.
Do not touch CTVS with your bare hands - gloves are recommended.
Avoid contamination of the CTVS surface during handling.
Mounting
When CTVS devices are encapsulated with sealing material or overmolded with plastic
material, electrical characteristics might be degraded and the life time reduced.
Make sure an electrode is not scratched before, during or after the mounting process.
Make sure contacts and housings used for assembly with CTVS components are clean before
mounting.
The surface temperature of an operating CTVS can be higher. Ensure that adjacent
components are placed at a sufficient distance from a CTVS to allow proper cooling.
Avoid contamination of the CTVS surface during processing.
Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.
Soldering
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 27 of 29
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
Conductive adhesive gluing
Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive
adhesive gluing.
Operation
Use CTVS only within the specified operating temperature range.
Use CTVS only within specified voltage and current ranges.
Environmental conditions must not harm a CTVS. Only use them in normal atmospheric
conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited.
Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS
(e.g. through plug terminals).
Avoid dewing and condensation.
EPCOS CTVS components are mainly designed for encased applications. Under all
circumstances avoid exposure to:
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
direct sunlight
rain or condensation
steam, saline spray
corrosive gases
atmosphere with reduced oxygen content
EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where
static power dissipation is required.
Multilayer varistors (MLVs) are designed for ESD protection and transient suppression.
CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and
EMI protection only.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 28 of 29
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DeltaCap,
DigiSiMic, DSSP, FormFit, MiniBlue, MiniCell, MKK, MKD, MLSC, MotorCap, PCC,
PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap,
SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trade-
marks registered or pending in Europe and in other countries. Further information will be
found on the Internet at www.epcos.com/trademarks.
Page 29 of 29
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