B82422H1682K100 [EPCOS]
GENERAL PURPOSE INDUCTOR;
| 型号： | B82422H1682K100 |
| 厂家： | 
EPCOS |
| 描述： | GENERAL PURPOSE INDUCTOR |
| 文件： | 总8页 (文件大小：475K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMT inductors
SIMID series, SIMID 1210-H100
Series/Type:
B82422H1*100
Date:
October 2012
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@ꢀEPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures
hereto and the information contained therein without EPCOS’ prior express consent is prohibited.
SMT inductors, SIMID series
SIMID 1210-H100
B82422H1*100
High current version
Size 1210 (EIA) or 3225 (IEC)
Rated inductance 1 ... 100 μH
Rated current 90 ... 650 mA
Construction
■ Ferrite core
■ Laser-welded winding
■ Flame-retardant encapsulation
Features
■ Very high current handling capability
■ Qualified to AEC-Q200
■ Suitable for lead-free soldering as referenced in JEDEC J-STD 020
■ RoHS-compatible
Applications
■ Filtering of supply voltages, coupling, decoupling
■ DC/DC converters
■ Automotive electronics
■ Telecommunications
Terminals
■ Base material CuSn6
■ Layer composition Cu, Ag, Sn (lead-free)
■ Electro-plated
Marking
■ Marking on component:
Manufacturer and letter "H",
L value (in nH) and tolerance of L value (coded),
date of manufacture (YWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value,
quantity, date of packing
Delivery mode and packing units
■ 8-mm blister tape, wound on 180-mm or 330-mm # reel
■ Packing units:
180-mm reel: 2000 pcs./reel
330-mm reel: 8000 pcs./reel
Please read Cautions and warnings and
Important notes at the end of this document.
2
10/12
SMT inductors, SIMID series
SIMID 1210-H100
B82422H1*100
Dimensional drawing and layout recommendation
0.5 0.21)
B
C
D
B
IND0053-6
3.2+0.3
A
B
C
D
2.7
1.15
2.1
4.4
2.5+0.3
0.15 max.
Marking
1) Soldering area
IND0073-6-E
Dimensions in mm
Taping and packing
Blister tape
Reel
12.75+0.15
4 0.1
_0
14.4 max.
Component
1.5+0.1
2 0.05
8.4+1.5
_0
62 1.5
_
<
4 0.1
2.6
1.0+0.2
Direction of unreeling
IND0592-V
IND0559-Z-E
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
3
10/12
SMT inductors, SIMID series
SIMID 1210-H100
B82422H1*100
Technical data and measuring conditions
Rated inductance LR
Measured with impedance analyzer Agilent 4294A and
test fixture Agilent 16034H at frequency fL,
RMS voltage 0.1 V, +20 °C
Q factor Qmin
Measured with impedance analyzer Agilent 4294A and
test fixture Agilent 16034H at frequency fQ,
RMS voltage 0.1 V, +20 °C
Rated temperature TR
Rated current IR
+85 ꢁC
Maximum permissible DC with inductance decrease
ꢂL/L0 ꢃ 10% and temperature increase
of ꢃ 20 K at rated temperature
Self-resonance frequency fres,min
Measured with RF impedance / material analyzer
Agilent E4991A and network analyzer Agilent 8362B,
+20 °C
DC resistance Rmax
Measured with Burster Resistomat 2329, +20 ꢁC
Solderability (lead-free)
Sn95.5Ag3.8Cu0.7: +(245 ꢄ5) °C, (5 ꢄ0.3) s
Wetting of soldering area ꢅ 90%
(based on IEC 60068-2-58)
Resistance to soldering heat
Climatic category
+260 ꢁC, 40 s (as referenced in JEDEC J-STD 020)
55/125/56 (to IEC 60068-1)
Storage conditions
Mounted: –55 °C … +125 °C
Packaged: –25 °C … +40 °C, ꢃ 75% RH
Weight
Approx. 50 mg
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/12
SMT inductors, SIMID series
SIMID 1210-H100
B82422H1*100
Characteristics and ordering codes
LR
Tolerance
fL
Qmin
fQ
IR
Rmax
fres, min Ordering code
(# 180-mm reel)
ꢆH
MHz
MHz
mA
ꢇ
MHz
Core material: ferrite
^
1.0
1.5
2.2
3.3
4.7
6.8
ꢄ10% K
1
10
10
10
10
10
10
15
15
15
15
15
15
15
15
27
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
650
600
560
500
430
380
300
260
220
200
180
180
140
110
65
0.22 200
0.27 120
B82422H1102K100
B82422H1152K100
B82422H1222K100
B82422H1332K100
B82422H1472K100
B82422H1682K100
B82422H1103K100
B82422H1153K100
B82422H1223K100
B82422H1273K100
B82422H1333K100
B82422H1393K100
B82422H1473K100
B82422H1683K100
B82422H1104K100
1
1
0.33
0.42
0.48
0.75
1.20
1.50
2.40
3.00
3.30
4.10
4.70
7.70
85
60
46
38
30
26
22
20
17
15
14
9
1
1
1
10
1
15
22
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
27
33
39
47
68
100
11.5
7
Closer tolerances and special versions on request.
Higher currents possible at temperatures <TR on request.
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/12
SMT inductors, SIMID series
SIMID 1210-H100
B82422H1*100
Impedance |Z| versus frequency f
measured with impedance /material analyzer
Agilent E4991A, typical values at +20 °C
Inductance L versus DC load current IDC
measured with LCR meter Agilent 4285A,
typical values at +20 °C
SSB1381-Z
SSB1382-8
3
105
10
Ω
μH
|Z |
L
104
100 μH
2
10
100 μH
103
10 μH
1
0
10
10
10 μH
102
1 μH
1 μH
101
100
10-1
-1
-2
-3
10
10
10
103
104
105
kHz
f
106
-2
-1
0
1
10
10
10
A
10
Ι DC
Q factor versus frequency f
Current derating Iop/IR
measured with impedance/material analyzer
Agilent E4991A, typical values at +20 °C
versus ambient temperature TA
(rated temperature TR = +85 °C)
SSB1383-G
SSB0893-E
100
1,2
Ι B
Ι R
90
Q
1,0
80
70
60
50
40
0,8
0,6
0,4
0,2
0
100 μH
30
1 μH
20
10
10 μH
0
102
103
104
105 kHz 106
0
20
40
60
80
100
C
TA
140
f
6
10/12
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
7
10/12
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of an electronic component could endanger human life or health (e.g.
in accident prevention or life-saving systems), it must therefore be ensured by means of suitable
design of the customer application or other action taken by the customer (e.g. installation of
protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available. The aforementioned does not apply in the case of individual agreements deviating
from the foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS,
DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap
are trademarks registered or pending in Europe and in other countries. Further information will
be found on the Internet at www.epcos.com/trademarks.
8
10/12
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