B57332V5103F360 [EPCOS]
RESISTOR, TEMPERATURE DEPENDENT, NTC;
| 型号： | B57332V5103F360 |
| 厂家： | 
EPCOS |
| 描述： | RESISTOR, TEMPERATURE DEPENDENT, NTC 温度补偿 电阻器 |
| 文件： | 总29页 (文件大小：536K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NTC thermistors for
temperature measurement
SMD NTC thermistors,
EIA case size 0603 (1608), automotive series
Series/Type:
B573**V5
Date:
January 2018
© EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Applications
Dimensional drawing
Temperature measurement and compensation
Features
Qualification based on AEC-Q200 Rev-D
Multilayer SMD NTC with inner electrodes
Nickel barrier termination
For temperature measurement up to 150 °C
Excellent long-term aging stability in high
temperature and high humidity environment
High mechanical robustness
Short response time
100% Pb free
UL approval (E69802)
Dimensions in mm
Approx. weight 6 mg
Options
Alternative resistance ratings, resistance
tolerances and B value tolerances available on
request.
Delivery mode
Cardboard tape, 180-mm reel
General technical data
Operating temperature range
Max. power
Top
ꢀ40 ... 150
180
°C
mW
%
°C
mW/K
s
1)
(at 25 °C, on PCB) P25
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
∆RR/RR ±1, ±3, ±5
TR
25
1)
(on PCB)
(on PCB)
δth
approx. 3
approx. 4
approx. 12
1)
τc
1)
Cth
mJ/K
1) Depends on mounting situation
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Electrical specification and ordering codes
∆RR/RR
%
R25
Ω
No. of R/T
characteristic
B25/50
K
B25/85
K
B25/100
K
Ordering code
10 k
10 k
10 k
10 k
10 k
22 k
22 k
47 k
47 k
±1, ±3, ±5 8509
±1, ±3, ±5 8553
3380
3568
3590
3940
4386
3940
4386
4050
4050
4386
4200
4250
4386
4386
3435
3610
3635
3980
4455
3980
4455
4108
4108
4455
4260
4311
4455
4455
3455 ±1%
3624 ±1%
3650 ±3%
4000 ±3%
4480 ±3%
4000 ±3%
4480 ±3%
4131 ±1.5%
4131 ±2%
4480 ±3%
4282 ±1%
4334 ±2%
4480 ±1%
4480 ±3%
B57332V5103+360
B57343V5103+360
B57342V5103+060
B57351V5103+060
B57352V5103+060
B57351V5223+060
B57352V5223+060
B57356V5473+260
B57356V5473+160
B57352V5473+060
B57355V5104+360
B57354V5104+160
B57352V5104+360
B57352V5104+060
±3, ±5
±3, ±5
±3, ±5
±3, ±5
±3, ±5
8500
8502
8507
8502
8507
±1, ±3, ±5 8551
±3, ±5
±3, ±5
8551
8507
47 k
100 k
100 k
100 k
100 k
±1, ±3, ±5 8512
±3, ±5 8552
±1, ±3, ±5 8507
±3, ±5 8507
+ = Resistance tolerance
F = ±1%
H = ±3%
J = ±5%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Reliability data
Tests of SMD NTC thermistors are based on AEC-Q200 Rev-D. The parts are mounted on
standardized PCB.
Test
Standard
Test conditions
∆R25/R25
(typical) /
Remarks
Pre- and post-stress
electrical test
Resistance at: 25 °C and 100 °C
High temperature
exposure
(storage)
MIL-STD-202,
method 108
Test temperature: 150 °C
Duration: 1000 h
Unpowered
< 5%
Except
B57332V5103+360
B57355V5104+360
B57356V5473+260
< 1%
< 2%
< 1%
Temperature cycling JESD22,
method JA-104
Lower test temperature: ꢀ40 °C
Upper test temperature: 150 °C
Number of cycles: 1000
Transfer time: < 10 s
Dwell time: 15 min
< 5%
Air ꢀ Air
Biased humidity
MIL-STD-202,
method 103
Test temperature: 85 °C
Rel. humidity of air: 85%
Duration: 1000 h
< 5%
< 5%
Test voltage: VNTC = 0.3 V DC
Operational life
External visual
MIL-STD-202,
method 108
Test temperature: 150 °C
Pmax = 0.35 mW
Duration: 1000 h
MIL-STD-883E, Visual inspection
method 2009
Physical dimensions JESD22,
method JB-100
Measured with calipers
Within the
specified
values
Resistance to
solvents
MIL-STD-202,
method 215
Not applicable for SMD thermistors
(component has no marking, color coding
or coating)
Mechanical shock
MIL-STD-202,
method 213
Peak value: 1500 g
Half sine
< 5%
Condition F
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Test
Standard
Test conditions
∆R25/R25
(typical) /
Remarks
Vibration
MIL-STD-202,
method 204
Acceleration: 5 g
< 1%
Sweep time: 20 min
Frequency range: 10 ... 2000 Hz
3 × 12 cycles
Resistance to
soldering heat
MIL-STD-202,
method 210
Dip: 260 °C; 10 s
1 heat cycle
< 3%
Except
B57332V5103+360
B57355V5104+360
B57356V5473+260
< 1%
< 1%
< 1%
ESD
AEC-Q200-002, Discharge capacitance: 150 pF
< 5%
method -002
Discharge resistance: 2 kΩ
Charging voltage: 6 kV
Contact discharge
2 pulses in each polarity
Solderability
J-STD-002
a) Dip: 235 °C; 5 s:
95% of
aging 4 h @ 155 °C
b) Dip: 215 °C; 5 s:
termination
wetted
steam aging 8 h @ 92 °C
c) Dip: 260 °C; 7 s:
steam aging 8 h @ 92 °C
Electrical
characterization
R(25 °C), R(100 °C), B(25/100)
Within the
specified
values
Flammability
UL-94,
Not applicable for SMD thermistors
V-0 or V-1
(component is not coated or encapsulated
with plastic materials)
Board flex
AEC-Q200-005, Max. bending: 1 mm
< 2%
< 2%
< 1%
method -005
Duration @ max. bending: 60 s
Terminal strength
AEC-Q200-006, Max. F: 5 N
method -006
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
R/T characteristics
8500
8502
8507
R/T No.
T (°C)
B25/100 = 3650 K
RT/R25
B25/100 = 4000 K
B25/100 = 4480 K
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
ꢀ55.0 63.917
ꢀ50.0 45.889
ꢀ45.0 33.344
ꢀ40.0 24.504
ꢀ35.0 18.201
6.8
6.5
6.3
6.1
5.8
96.158
66.892
47.127
33.606
24.243
7.4
7.1
6.9
6.6
6.4
142.71
96.913
66.637
46.366
32.629
7.9
7.6
7.4
7.1
6.9
ꢀ30.0 13.657
ꢀ25.0 10.347
5.6
5.5
5.3
5.1
4.9
17.681
13.032
9.702
7.2923
5.5314
6.2
6.0
5.8
5.6
5.4
23.213
16.686
12.115
8.8803
6.5692
6.7
6.5
6.3
6.1
5.9
ꢀ20.0
ꢀ15.0
ꢀ10.0
7.9114
6.1019
4.7454
ꢀ5.0
0.0
5.0
10.0
15.0
3.7198
2.938
2.3372
1.8722
1.5096
4.8
4.6
4.5
4.4
4.2
4.2325
3.2657
2.54
1.9907
1.5716
5.3
5.1
4.9
4.8
4.7
4.9025
3.6896
2.7994
2.1406
1.6492
5.8
5.6
5.4
5.3
5.1
20.0
25.0
30.0
35.0
40.0
1.2249
1.0000
0.82111
0.67798
0.56279
4.1
4.0
3.9
3.8
3.7
1.2494
1.0000
0.80552
0.65288
0.53229
4.5
4.4
4.3
4.1
4.0
1.2798
1.0000
0.78663
0.62277
0.4961
5.0
4.9
4.7
4.6
4.5
45.0
50.0
55.0
60.0
65.0
0.46958
0.39374
0.33171
0.28073
0.23863
3.6
3.5
3.4
3.3
3.2
0.43645
0.35981
0.29819
0.24837
0.20787
3.9
3.8
3.7
3.6
3.5
0.39757
0.32044
0.2597
0.21161
0.17331
4.4
4.3
4.1
4.0
3.9
70.0
75.0
80.0
85.0
90.0
0.2037
3.1
3.0
3.0
2.9
2.8
0.17479
0.14763
0.12523
0.10667
0.091227
3.4
3.3
3.2
3.2
3.1
0.14265
0.11799
0.098035
0.081823
0.068589
3.8
3.8
3.7
3.6
3.5
0.17459
0.15022
0.12975
0.11247
95.0
100.0
105.0
110.0
115.0
0.097838
0.085396
0.074781
0.065691
0.057883
2.8
2.7
2.6
2.6
2.5
0.078319
0.067488
0.058363
0.050647
0.044098
3.0
2.9
2.9
2.8
2.7
0.057735
0.048796
0.041403
0.035263
0.030143
3.4
3.3
3.2
3.2
3.1
120.0
125.0
130.0
135.0
140.0
0.051153
0.045335
0.040289
0.0359
2.4
2.4
2.3
2.3
2.2
0.03852
2.7
2.6
2.6
2.5
2.4
0.025858
0.022258
0.019223
0.016655
0.014476
3.0
3.0
2.9
2.8
2.8
0.033752
0.029663
0.026146
0.023111
0.032071
145.0
150.0
0.028723
0.025786
2.2
2.1
0.020484
0.018203
2.4
2.3
0.012619
0.011033
2.7
2.7
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
R/T characteristics
8509
8512
8551
R/T No.
T (°C)
B25/100 = 3455 K
RT/R25
B25/100 = 4282 K
B25/100 = 4131 K
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
ꢀ55.0 44.605
ꢀ50.0 33.281
ꢀ45.0 25.044
ꢀ40.0 19.003
ꢀ35.0 14.536
5.9
5.8
5.6
5.4
5.3
130.38
88.097
60.444
42.065
29.666
8.0
7.7
7.4
7.1
6.9
111.73
76.28
52.88
37.187
26.498
7.8
7.5
7.2
6.9
6.7
ꢀ30.0 11.206
5.1
5.0
4.8
4.7
4.6
21.185
15.307
11.183
8.2558
6.1553
6.6
6.4
6.2
6.0
5.8
19.117
13.954
10.297
7.677
6.4
6.2
6.0
5.8
5.6
ꢀ25.0
ꢀ20.0
ꢀ15.0
ꢀ10.0
8.7041
6.8104
5.3665
4.2576
5.780
ꢀ5.0
0.0
5.0
10.0
15.0
3.4001
2.7326
2.2096
1.7973
1.4703
4.4
4.3
4.2
4.1
4.0
4.6324
3.5175
2.6935
2.0792
1.6173
5.6
5.4
5.3
5.1
4.9
4.3916
3.3661
2.6014
2.0262
1.5901
5.4
5.2
5.1
4.9
4.8
20.0
25.0
30.0
35.0
40.0
1.2093
1.0000
0.83113
0.69418
0.58255
3.9
3.7
3.6
3.6
3.5
1.2673
1.0000
0.79435
0.63504
0.51079
4.8
4.7
4.5
4.4
4.3
1.2567
1.0000
0.8009
0.6454
0.5232
4.6
4.5
4.4
4.3
4.1
45.0
50.0
55.0
60.0
65.0
0.49112
0.41587
0.35365
0.30197
0.25888
3.4
3.3
3.2
3.1
3.0
0.41327
0.33625
0.27507
0.22618
0.18692
4.2
4.1
4.0
3.9
3.8
0.42650
0.34959
0.28804
0.23851
0.19844
4.0
3.9
3.8
3.7
3.6
70.0
75.0
80.0
85.0
90.0
0.22278
0.19243
0.16681
0.1451
3.0
2.9
2.8
2.8
2.7
0.15521
0.12948
0.10850
0.091301
0.077149
3.7
3.6
3.5
3.4
3.3
0.16587
0.13926
0.11742
0.09941
0.08449
3.5
3.5
3.4
3.3
3.2
0.12663
95.0
100.0
105.0
110.0
115.0
0.11088
2.6
2.6
2.5
2.4
2.4
0.065451
0.055740
0.047647
0.040874
0.035186
3.2
3.2
3.1
3.0
3.0
0.07209
0.06174
0.05305
0.04575
0.039583
3.1
3.1
3.0
2.9
2.9
0.097381
0.085788
0.075795
0.067155
120.0
125.0
130.0
135.0
140.0
0.059663
0.053146
0.047463
0.042493
0.038134
2.3
2.3
2.2
2.2
2.1
0.030391
0.026334
0.022890
0.019957
0.017451
2.9
2.8
2.8
2.7
2.7
0.034356
0.029912
0.026120
0.022875
0.020089
2.8
2.7
2.7
2.6
2.6
145.0
150.0
0.034302
0.030925
2.1
2.1
0.015303
0.013456
2.6
2.5
0.017690
0.015619
2.5
2.5
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
R/T characteristics
8552
8553
R/T No.
T (°C)
B25/100 = 4334 K
RT/R25
B25/100 = 3624 K
α (%/K) RT/R25
α (%/K)
ꢀ55.0 138.15
8.1
7.8
7.5
7.2
6.9
63.618
45.642
33.144
24.345
18.077
6.8
6.5
6.3
6.1
5.8
ꢀ50.0
ꢀ45.0
ꢀ40.0
ꢀ35.0
92.920
63.468
43.979
30.888
ꢀ30.0
ꢀ25.0
ꢀ20.0
ꢀ15.0
ꢀ10.0
21.969
15.812
11.509
8.4659
6.2899
6.7
6.5
6.2
6.0
5.8
13.562
10.275
7.8576
6.0623
4.7168
5.6
5.5
5.3
5.1
4.9
ꢀ5.0
0.0
5.0
10.0
15.0
4.7178
3.5705
2.7255
2.0974
1.6266
5.7
5.5
5.3
5.2
5.0
3.6995
2.9240
2.3280
1.8664
1.5064
4.8
4.6
4.5
4.4
4.2
20.0
25.0
30.0
35.0
40.0
1.2709
1.0000
0.79218
0.63161
0.50672
4.9
4.7
4.6
4.5
4.3
1.2236
1
0.82203
0.67952
0.56473
4.1
4.0
3.9
3.8
3.6
45.0
50.0
55.0
60.0
65.0
0.40894
0.33191
0.27087
0.22222
0.18322
4.2
4.1
4.0
3.9
3.8
0.47175
0.39603
0.33404
0.28303
0.24086
3.5
3.5
3.4
3.3
3.2
70.0
75.0
80.0
85.0
90.0
0.15181
0.12637
0.10566
0.088735
0.074831
3.7
3.6
3.5
3.4
3.4
0.20584
0.17662
0.15214
0.13154
0.11414
3.1
3.0
2.9
2.9
2.8
95.0
100.0
105.0
110.0
115.0
0.063360
0.053856
0.045950
0.039346
0.033810
3.3
3.2
3.1
3.1
3.0
0.099391
0.086835
0.076111
0.066919
0.059014
2.7
2.7
2.6
2.5
2.5
120.0
125.0
130.0
135.0
140.0
0.029151
0.025217
0.021882
0.019047
0.016628
2.9
2.9
2.8
2.7
2.7
0.052194
0.046292
0.041168
0.036708
0.032814
2.4
2.4
2.3
2.3
2.2
145.0
150.0
0.014559
0.012782
2.6
2.6
0.029405
0.026412
2.2
2.1
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Taping and packing
1
Taping of SMD NTC thermistors
Tape and reel packing according to IEC 60286-3.
Tape material: Cardboard or blister, tape width 8 ±0.30 mm
2
Reel packing
Dimensions in mm
8-mm tape
180-mm reel
330-mm reel
330 +0/ꢀ2.0
8.4 +1.5/ꢀ0
14.4 max.
A
180 +0/ꢀ3
8.4 +1.5/ꢀ0
14.4 max.
W1
W2
Leader, trailer
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Packing units for discrete chip
Case size Chip thickness
Cardboard tape Blister tape
180-mm reel
pcs.
10000
4000
2000/ 4000
3000
330-mm reel
inch/mm
th
0.5 mm
W
W
pcs.
50000
16000
16000
12000
12000
12000
0402/1005
0603/1608
0805/2012
8 mm
ꢀ
0.8 mm
0.8 mm
1.2 mm
0.8 mm
1.2 mm
8 mm
ꢀ
ꢀ
8 mm
8 mm
8 mm
8 mm
8 mm
1206/3216
ꢀ
ꢀ
2000
4000
3
Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
60
62
70
72
SMD
SMD
SMD
SMD
Cardboard tape
Blister tape
180-mm reel packing
180-mm reel packing
330-mm reel packing
330-mm reel packing
Cardboard tape
Blister tape
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
4
Taping of radial leaded NTC thermistors
Dimensions and tolerances
Lead spacing F = 2.5 mm and 5.0 mm (taping to IEC 60286-2)
Dimensions (mm)
Lead
spacing
2.5 mm
Lead
spacing
5 mm
Tolerance of
lead spacing
2.5/5 mm
Remarks
w
11.0
5.0
11.5
6.0
max.
max.
th
d
0.5/0.6
12.7
5.1
0.5/0.6
12.7
3.85
5.0
±0.05
±0.3
P0
P1
F
±1 mm / 20 sprocket holes
±0.7
2.5
+0.6/ꢀ0.1
±2.0
∆h
∆p
W
W0
W1
W2
H
0
0
measured at top of component body
0
0
±1.3
18.0
5.5
18.0
5.5
±0.5
min.
peel-off force ≥5 N
9.0
9.0
+0.75/ꢀ0.5
max.
3.0
3.0
18.0
16.0
32.2
4.0
18.0
16.0
32.2
4.0
+2.0/ꢀ0
±0.5
H0
H1
D0
t
max.
±0.2
0.9
0.9
max.
without wires
L
11.0
4.0
11.0
4.0
max.
L1
max.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Types of packing
Ammo packing
Ammo
type
x
y
z
I
80
240
210
Packing unit: 1000 - 2000 pcs./reel
Reel packing
Packing unit: 1000 - 2000 pcs./reel
Reel dimensions (in mm)
Reel type
I
d
f
n
w
360 max.
31 ±1
approx. 45
54 max.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Cassette packing
Packing unit: 1000 - 2000 pcs./cassette
Bulk packing
The components are packed in cardboard boxes, the size of which depends on the order quantity.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
5
Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
00, 01, 02, 03,04,
05, 06, 07, 08
ꢀ
Bulk
ꢀ
40, 41
45
ꢀ
Bulk
ꢀ
ꢀ
ꢀ
Bulk
50
Radial leads, kinked
Radial leads, kinked
Cardboard tape
Cardboard tape
Cassette packing
360-mm reel packing
Cassette packing
360-mm reel packing
AMMO packing
51
52
Radial leads, straight Cardboard tape
Radial leads, straight Cardboard tape
53
54
Radial leads, kinked
Cardboard tape
55
Radial leads, straight Cardboard tape
AMMO packing
(If no packing code is indicated, this corresponds to 40)
Example 1: B57164K0102J000
B57164K0102J052
Bulk
Cardboard tape, cassette packing
Example 2: B57881S0103F002
B57881S0103F251
Bulk
Cardboard tape, reel packing
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Mounting instructions
1
Soldering
1.1
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
max. 260 °C
max. 4 s
Iron soldering
max. 360 °C
max. 2 s
Bath temperature
Soldering time
Distance from thermistor
min. 6 mm
min. 6 mm
Under more severe soldering conditions the resistance may change.
1.1.1 Wave soldering
Temperature characteristic at component terminal with dual wave soldering
1.2
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3
SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The use of no-clean solder products is recommended. In any case
mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
SMD NTCs with AgPd termination are not approved for lead-free soldering.
Nickel barrier termination
Figure 1
SMD NTC thermistors, structure of nickel
barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metallization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is tested for all commonly-used soldering methods according to IEC
60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in sol-
vent is not recommended.
The following test and process conditions apply for nickel barrier termination.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
1.3.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder
Bath temperature (°C)
Dwell time (s)
3 ±0.3
SnPb 60/40
215 ±3
245 ±3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
3 ±0.3
1.3.2 Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder
Bath temperature (°C)
Dwell time (s)
10 ±1
SnPb 60/40
260 ±5
260 ±5
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
10 ±1
1.3.3 Reflow soldering
Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Profile feature
Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min
- Temperature max
- Time
Tsmin
Tsmax
100 °C
150 °C
150 °C
200 °C
tsmin to tsmax 60 ... 120 s
60 ... 120 s
3 °C/ s max.
217 °C
Average ramp-up rate
Liquidous temperature
Time at liquidous
Tsmax to Tp 3 °C/ s max.
TL
tL
183 °C
40 ... 150 s
215 °C ... 260 °C1)
10 ... 40 s
40 ... 150 s
235 °C ... 260 °C
10 ... 40 s
Peak package body temperature Tp
Time above (TP ꢀ5 °C)
tp
Average ramp-down rate
Time 25 °C to peak temperature
1) Depending on package thickness.
Tp to Tsmax 6 °C/ s max.
6 °C/ s max.
max. 8 minutes
max. 8 minutes
Notes:
All temperatures refer to topside of the package, measured on the package body
surface.
Number of reflow cycles: 3
Iron soldering should be avoided, hot air methods are recommended for repair
purposes.
Solder joint profiles for silver/nickel/tin terminations
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
1.3.4 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
A
B
C
0402/1005 0.6
0603/1608 1.0
0805/2012 1.3
1206/3216 1.8
0.6
1.0
1.2
1.2
1.7
3.0
3.4
4.5
2
Conductive adhesion
An alternative to soldering for silver-palladium terminated components is the gluing of thermistors
with conductive adhesives. The benefit of this method is that it involves no thermal stress. The
adhesives used must be chemically inert.
3
Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4
Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feed-
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 19 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Tensile strength: Test Ua1:
Value of applied force for Ua1 test:
Diameter (d) of
Force with tolerance of ±10%
corresponding round leads
≤ 0.25 mm
1.0 N
2.5 N
5.0 N
10.0 N
0.25 < ≤ 0.35 mm
0.35 < ≤ 0.50 mm
0.50 < ≤ 0.80 mm
Bending strength: Test Ub:
Two 90°-bends in opposite directions
Value of applied force for Ub test:
Diameter (d) of
Force with tolerance of ±10%
corresponding round leads
≤ 0.25 mm
0.5 N
1.25 N
2.5 N
5 N
0.25 < ≤ 0.35 mm
0.35 < ≤ 0.50 mm
0.50 < ≤ 0.80 mm
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 20 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
5
Sealing and potting
Sealing or potting processes can affect the reliability of the component.
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
As thermistors are temperature sensitive components it should be considered that molding can af-
fect the thermal surrounding and may influence e.g. the response time.
Extensive testing is encouraged in order to determine whether overmolding or potting influences
the functionality and/ or reliability of the component.
6
Cleaning
Cleaning processes can affect the reliability of the component.
If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on wa-
ter are not allowed. Washing processes may damage the product due to the possible static or
cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to re-
duced reliability and/ or lifetime.
7
Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
ꢀ25 °C up to 45 °C
Relative humidity (without condensation):
≤75% annual mean
<95%, maximum 30 days per annum
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
SMDs with AgPd termination:
6 months
SMDs with nickel barrier termination: 12 months
Leadless components:
Leaded components:
12 months
24 months
Please read Cautions and warnings and
Important notes at the end of this document.
Page 21 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
8
Placement and orientation of SMD NTC thermistors on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
c) Component orientation
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 22 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Cautions and warnings
General
See "Important notes" on page 2.
Storage
Store thermistors only in original packaging. Do not open the package prior to processing.
Storage conditions in original packaging: storage temperature ꢀ25 °C ... +45 °C, relative
humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the original packaging.
Solder thermistors within the time specified after shipment from EPCOS.
For leaded components this is 24 months, for SMD components with nickel barrier termination
12 months, for leadless components this is 12 months, for SMD components with AgPd
termination 6 months.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 23 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Mounting
Ensure that no thermo-mechanical stress occurs due to production processes (curing or
overmolding processes) when thermistors are sealed, potted or overmolded or during their
subsequent operation. The maximum temperature of the thermistor must not be exceeded.
Ensure that the materials used (sealing/potting compound and plastic material) are chemically
neutral.
Electrodes/contacts must not be scratched or damaged before/during/after the mounting
process.
Contacts and housing used for assembly with the thermistor must be clean before mounting.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand the temperature.
Avoid contamination of the thermistor surface during processing.
The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to
an environment with normal atmospheric conditions.
Tensile forces on cables or leads must be avoided during mounting and operation.
Bending or twisting of cables or leads directly on the thermistor body is not permissible.
Avoid using chemical substances as mounting aids. It must be ensured that no water or other
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based
substances (e.g. soap suds) must not be used as mounting aids for sensors.
The use of no-clean solder products is recommended. In any case mild, non-activated fluxes
should be used. Flux residues after soldering should be minimized.
Operation
Use thermistors only within the specified operating temperature range.
Use thermistors only within the specified power range.
Environmental conditions must not harm the thermistors. Only use the thermistors under
normal atmospheric conditions or within the specified conditions.
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals). For
measurement purposes (checking the specified resistance vs. temperature), the component
must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as Galden).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Bending or twisting of cables and/or wires is not permissible during operation of the sensor in
the application.
Be sure to provide an appropriate fail-safe function to prevent secondary product damage
caused by malfunction.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Display of ordering codes for EPCOS products
The ordering code for one and the same EPCOS product can be represented differently in data
Please read Cautions and warnings and
Important notes at the end of this document.
Page 24 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
sheets, data books, other publications, on the EPCOS website, or in order-related documents
such as shipping notes, order confirmations and product labels. The varying representations of
the ordering codes are due to different processes employed and do not affect the
specifications of the respective products. Detailed information can be found on the Internet
under www.epcos.com/orderingcodes
Please read Cautions and warnings and
Important notes at the end of this document.
Page 25 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Symbols and terms
Symbol
English
German
Fläche
A
Area
AWG
American Wire Gauge
Amerikanische Norm für Drahtquerschnitte
B
B value
B-Wert
B25/100
B value determined by resistance
measurement at 25 °C and 100 °C
B-Wert, ermittelt durch Widerstands-
messungen bei 25 °C und 100 °C
Cth
I
Heat capacitance
Current
Wärmekapazität
Strom
N
Number (integer)
Anzahl (ganzzahliger Wert)
P25
Pdiss
Pel
Maximum power at 25 °C
Power dissipation
Electrical power
Maximale Leistung bei 25 °C
Verlustleistung
Elektrische Leistung
Pmax
Maximum power within stated
temperature range
Maximale Leistung im
angegebenenTemperaturbereich
∆RB/RB
Resistance tolerance caused by
spread of B value
Insulation resistance
Parallel resistance
Widerstandstoleranz, die durch die
Streuung des B-Wertes verursacht wird
Isolationswiderstand
Rins
RP
Parallelwiderstand
RR
Rated resistance
Nennwiderstand
∆RR/RR
RS
Resistance tolerance
Series resistance
Widerstandstoleranz
Serienwiderstand
RT
Resistance at temperature T
(e.g. R25 = resistance at 25 °C)
Widerstand bei Temperatur T
(z.B. R25 = Widerstand bei 25 °C)
T
Temperature
Temperatur
∆T
t
Temperature tolerance
Time
Temperaturtoleranz
Zeit
TA
Tmax
Ambient temperature
Upper category temperature
Umgebungstemperatur
Obere Grenztemperatur
(Kategorietemperatur)
Untere Grenztemperatur
(Kategorietemperatur)
Tmin
Lower category temperature
Top
TR
Tsurf
Operating temperature
Rated temperature
Surface temperature
Betriebstemperatur
Nenntemperatur
Oberflächentemperatur
V
Voltage
Spannung
Vins
Vop
Vtest
Insulation test voltage
Operating voltage
Test voltage
Isolationsprüfspannung
Betriebsspannung
Prüfspannung
Please read Cautions and warnings and
Important notes at the end of this document.
Page 26 of 29
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Symbol
English
German
α
Temperature coefficient
Tolerance, change
Dissipation factor
Temperaturkoeffizient
Toleranz, Änderung
Wärmeleitwert
∆
δth
τc
τa
Thermal cooling time constant
Thermal time constant
Thermische Abkühlzeitkonstante
Thermische Zeitkonstante
Abbreviations / Notes
Symbol
English
German
Surface-mounted devices
Oberflächenmontierbares Bauelement
*
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-
codes, type designations etc.
code oder für die Typenbezeichnung.
Platzhalter für einen Buchstaben.
Alle Maße sind in mm angegeben.
+
To be replaced by a letter.
All dimensions are given in mm.
The commas used in numerical values Verwendete Kommas in Zahlenwerten
denote decimal points. bezeichnen Dezimalpunkte.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 27 of 29
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
Page 28 of 29
Important notes
7. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-
tries. Further information will be found on the Internet at www.epcos.com/trademarks.
Page 29 of 29
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